CN105563041A - Production technique of solder tip - Google Patents
Production technique of solder tip Download PDFInfo
- Publication number
- CN105563041A CN105563041A CN201610048049.3A CN201610048049A CN105563041A CN 105563041 A CN105563041 A CN 105563041A CN 201610048049 A CN201610048049 A CN 201610048049A CN 105563041 A CN105563041 A CN 105563041A
- Authority
- CN
- China
- Prior art keywords
- iron
- plating
- copper mold
- mold base
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
- B23K3/025—Bits or tips
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a production technique of a solder tip. The production technique comprises the following steps: (1) manufacturing a copper mold blank, namely firstly straightening a copper material, cutting off the copper material after straightening is ended, and then lathing the head of the cut-off copper material on a lathe; (2) polishing and deoiling the copper mold blank in order to remove burrs from the lathed head; (3) preparing an iron plating solution and afterwards electroplating a layer of iron on the surface of the copper mold blank, wherein the thickness of the iron coating at a working part of the copper mold blank is 0.4mm to 0.5mm, and the thickness of the iron coating at a non-working part of the copper mold blank is 0.1mm to 0.15mm; (4) correcting the dimension of the copper mold blank on which the iron coatings are entirely plated, and polishing; (5) plating a layer of nickel coating on the surface of each iron coating, wherein the thickness of the nickel coating is 5 to 10 micrometers; (6) plating a layer of chromium coating on the surface of the non-working part of the nickel coating and plating a layer of tin coating on the working part of the nickel coating, wherein the chromium plating time is longer than or equal to 5min. The production technique of the solder tip has the advantages of improving the quality of the solder tip and prolonging the service life of the solder tip.
Description
Technical field
The present invention relates to electric iron accessory technical field, is specifically a kind of production technology of electric soldering bit.
Background technology
Solder horn is the auxiliary products of electric iron, and it is integrated synthesis.Flatiron hair oil claims flatiron to chew or welds to chew, and is the auxiliary products of electric iron, electric welding table, and main material is that copper belongs to easily-consumed products.Each electric iron producer is furnished with the solder horn of different model, but basic configuration is pointed, the shape of a hoof, flatly chews shape, edge-shaped.The head of often kind of solder horn is substantially identical, and difference is solder horn body part size so that and oneself electric iron, electric welding table supporting.
The temperature of the working face of solder horn is generally at about 300 DEG C, and non-working surface is then higher, in continuous use procedure, and the cupric oxide of copper Surface Creation black, its internal layer is red cuprous oxide; In oxide growth process, volume due to oxide is greater than the volume of metal, when film thickens, its volume also increases, and result produces the internal stress that is parallel to metal covering direction and makes oxide-film depart from the tension on the vertical metal surface of metal in oxide-film, film is thicker, its internal stress is larger, and when having exceeded the intensity of film itself, oxide-film just there will be crack, if when tension is greater than the adhesive force of metal and film, oxide-film just peels off from metal.And due to copper different from oxide-film thermal coefficient of expansion, in the repetitive process of solder horn heating and cooling, also can make spalling of oxide film, the oxide-film as peeled off is doped in solder joint, will affect weldment quality.
So in order to solve the problem, at present to the method often adopting various metals compound during solder horn production and processing, improve the service life of solder horn, but still can there is following problem in process of production: the unqualified thickness reason of coating, the working portion coating of such as solder horn is too thin, not wear-resisting, not corrosion-resistant, and the part of inoperative is too thick, have impact on thermal conductivity; The unreasonable allocation of iron plating liquid, coating and Copper substrate bond strength low, there is crack in coating, cause quality of coating poor.
Summary of the invention
In view of the defect of above-mentioned prior art, the object of the invention is to: a kind of production technology that can improve the solder horn in solder horn service life is provided.
Technical solution of the present invention is: a kind of production technology of solder horn, comprise the following steps: (1) makes copper mold base, first carry out stretching to copper material, stretchingly rear copper material to be cut off, then in bed head turnery processing is carried out to the copper material after cutting off; (2) polishing is carried out to copper mold base, process of deoiling, remove turning occipital burr; (3) prepare iron plating liquid, at copper mold base electroplating surface one deck iron after having prepared, the thickness of the plating iron layer of copper mold base working portion has been 0.4-0.5mm, and the thickness of the plating iron layer of copper mold base inoperative part is 0.1-0.15mm; (4) the copper mold base of plating iron layer is carried out Dimension correction, and do polishing; (5) at plated surface one deck nickel coating of plating iron layer, the thickness of nickel coating is 5-10 μm; (6) plate one deck chromium coating at the inoperative part surface of nickel coating, plate one deck tin coating at the working portion of nickel coating, the time of wherein chromium plating is more than or equal to 5 minutes;
Further, in step (3), iron plating liquid comprises the FeCl that concentration is 350-450g/L
24H
2o and concentration are the HCl of 1.0-1.5mg/L.
Further, described iron plating liquid also comprises MnCl
2additive, the PH of iron plating liquid is 1.5-2.0, and the temperature of iron plating liquid is for being more than or equal to 70 degree.
Further, electroplate liquid adopts power of alterating and direct current to carry out plating iron, and the current density of described electroplate liquid when electroplating is 5-25A/ (dm)
2.
Further, after plating iron, be heated to 200 DEG C to remaining electroplate liquid, the heat time is 1-2 minute, is then taken out by copper mold base.
Further, in step (5), when zinc-plated, first copper mold base immersed rosin, on the plank being stained with scolding tin, after taking-up, be repeatedly ground to each face all-tin plating of copper mold base working portion.
Apply the production technology of a kind of solder horn provided by the present invention, its beneficial effect is: the thickness of the plating iron layer of copper mold base working portion is 0.4-0.5mm, wear-resisting, corrosion-resistant effect can be played, the thickness of the plating iron layer of copper mold base inoperative part is 0.1-0.15mm, the plating iron layer of inoperative part plays the effect of transition zone, so the plating iron layer of 0.1-0.15mm thickness can not affect thermal conductivity; Iron plating liquid comprises the FeCl that concentration is 350-450g/L
24H
2o and concentration are the HCl of 1.0-1.5mg/L, and iron plating liquid also comprises MnCl
2additive, the PH of iron plating liquid is 1.5-2.0, and the temperature of iron plating liquid is for being more than or equal to 70 degree, because the concentration of iron plating liquid can affect conductance, improve iron plating liquid concentration and crystallization can be made thicker, stress diminishes, hardness is low, hydrogeneous few, PH is the good conductivity of the iron plating liquid of 1.5-2.0, makes plating iron layer soft tough, the iron plating liquid temperature being more than or equal to 70 degree makes ion motion speed fast, iron plating liquid internal resistance diminishes, and plating speed is fast, and crystal becomes large.
Detailed description of the invention
For more intuitively, intactly understanding technical scheme of the present invention, existing just to carry out nonrestrictive feature description as follows:
A production technology for solder horn, comprises the following steps: (1) makes copper mold base, first carries out stretching to copper material, stretchingly to cut off copper material afterwards, then carries out head turnery processing to the copper material after cutting off in bed; (2) polishing is carried out to copper mold base, process of deoiling, remove turning occipital burr; (3) prepare iron plating liquid, at copper mold base electroplating surface one deck iron after having prepared, the thickness of the plating iron layer of copper mold base working portion has been 0.4-0.5mm, and the thickness of the plating iron layer of copper mold base inoperative part is 0.1-0.15mm; (4) the copper mold base of plating iron layer is carried out Dimension correction, and do polishing; (5) at plated surface one deck nickel coating of plating iron layer, the thickness of nickel coating is 5-10 μm; (6) plate one deck chromium coating at the inoperative part surface of nickel coating, plate one deck tin coating at the working portion of nickel coating, the time of wherein chromium plating is more than or equal to 5 minutes.
In step (3), iron plating liquid comprises the FeCl that concentration is 350-450g/L
24H
2o and concentration are the HCl of 1.0-1.5mg/L.Iron plating liquid also comprises MnCl
2additive, the PH of iron plating liquid is 1.5-2.0, and the temperature of iron plating liquid is for being more than or equal to 70 degree.Electroplate liquid adopts power of alterating and direct current to carry out plating iron, and the current density of electroplate liquid when electroplating is 5-25A/ (dm)
2, electroplate liquid adopts power of alterating and direct current that the bond strength of plating iron layer and matrix can be made to improve, and deposition velocity is very fast, and plating iron ability improves, and crystal is finer and closely woven, and microcrack reduces, and coating surface fineness is good, and corrosion resistance is high.After plating iron, be heated to 200 DEG C to remaining electroplate liquid, the heat time is 1-2 minute, and then taken out by copper mold base, the hydrogen content in coating is significantly reduced, and microcrack is eliminated substantially.
In step (5), when zinc-plated, first copper mold base immersed rosin, on the plank being stained with scolding tin, after taking-up, be repeatedly ground to each face all-tin plating of copper mold base working portion.
The production technology of a kind of solder horn provided by the present invention, the thickness of the plating iron layer of copper mold base working portion is 0.4-0.5mm, wear-resisting, corrosion-resistant effect can be played, the thickness of the plating iron layer of copper mold base inoperative part is 0.1-0.15mm, the plating iron layer of inoperative part plays the effect of transition zone, so the plating iron layer of 0.1-0.15mm thickness can not affect thermal conductivity; Iron plating liquid comprises the FeCl that concentration is 350-450g/L
24H
2o and concentration are the HCl of 1.0-1.5mg/L, and iron plating liquid also comprises MnCl
2additive, the PH of iron plating liquid is 1.5-2.0, and the temperature of iron plating liquid is for being more than or equal to 70 degree, because the concentration of iron plating liquid can affect conductance, improve iron plating liquid concentration and crystallization can be made thicker, stress diminishes, hardness is low, hydrogeneous few, PH is the good conductivity of the iron plating liquid of 1.5-2.0, makes plating iron layer soft tough, the iron plating liquid temperature being more than or equal to 70 degree makes ion motion speed fast, iron plating liquid internal resistance diminishes, and plating speed is fast, and crystal becomes large.
Claims (6)
1. a production technology for solder horn, is characterized in that comprising the following steps:
(1) make copper mold base, first carry out stretching to copper material, stretchingly rear copper material to be cut off, then in bed head turnery processing is carried out to the copper material after cutting off;
(2) polishing is carried out to copper mold base, process of deoiling, remove turning occipital burr;
(3) prepare iron plating liquid, at copper mold base electroplating surface one deck iron after having prepared, the thickness of the plating iron layer of copper mold base working portion has been 0.4-0.5mm, and the thickness of the plating iron layer of copper mold base inoperative part is 0.1-0.15mm;
(4) the copper mold base of plating iron layer is carried out Dimension correction, and do polishing;
(5) at plated surface one deck nickel coating of plating iron layer, the thickness of nickel coating is 5-10 μm;
(6) plate one deck chromium coating at the inoperative part surface of nickel coating, plate one deck tin coating at the working portion of nickel coating, the time of wherein chromium plating is more than or equal to 5 minutes.
2. the production technology of a kind of solder horn according to claim 1, is characterized in that: in step (3), and iron plating liquid comprises the FeCl that concentration is 350-450g/L
24H
2o and concentration are the HCl of 1.0-1.5mg/L.
3. the production technology of a kind of solder horn according to claim 2, is characterized in that: described iron plating liquid also comprises MnCl
2additive, the PH of iron plating liquid is 1.5-2.0, and the temperature of iron plating liquid is for being more than or equal to 70 degree.
4. the production technology of a kind of solder horn according to claim 3, is characterized in that: electroplate liquid adopts power of alterating and direct current to carry out plating iron, and the current density of described electroplate liquid when electroplating is 5-25A/ (dm)
2.
5. the production technology of a kind of solder horn according to claim 4, is characterized in that: after plating iron, is heated to 200 DEG C to remaining electroplate liquid, and the heat time is 1-2 minute, is then taken out by copper mold base.
6. the production technology of a kind of solder horn according to claim 1, it is characterized in that: in step (5), when zinc-plated, first copper mold base immersed rosin, on the plank being stained with scolding tin, after taking-up, be repeatedly ground to each face all-tin plating of copper mold base working portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610048049.3A CN105563041A (en) | 2016-01-18 | 2016-01-18 | Production technique of solder tip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610048049.3A CN105563041A (en) | 2016-01-18 | 2016-01-18 | Production technique of solder tip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105563041A true CN105563041A (en) | 2016-05-11 |
Family
ID=55873959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610048049.3A Pending CN105563041A (en) | 2016-01-18 | 2016-01-18 | Production technique of solder tip |
Country Status (1)
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|---|---|
| CN (1) | CN105563041A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109352116A (en) * | 2018-12-09 | 2019-02-19 | 雷然 | A kind of solder horn and its production technology |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB509599A (en) * | 1937-12-13 | 1939-07-13 | Igranic Electric Co Ltd | Improvements in or relating to electrically heated devices such as soldering irons, flat irons or the like |
| CN85107407A (en) * | 1985-10-10 | 1987-05-27 | 交通部水运规划设计院 | The plating bath of brush plating iron-based combined plating |
| CN2700038Y (en) * | 2004-06-17 | 2005-05-18 | 袁忠 | Welding head |
| CN101372743A (en) * | 2007-08-20 | 2009-02-25 | 曾云发 | Ultralong service-life electric soldering iron welding nozzle fabrication technique |
| JP3191800U (en) * | 2014-04-28 | 2014-07-10 | タカヤマジャパン株式会社 | Soldering iron tip |
| CN104690513A (en) * | 2015-02-26 | 2015-06-10 | 陈爱华 | Solder tip production process |
| CN104842036A (en) * | 2015-05-19 | 2015-08-19 | 北京控制工程研究所 | High-heat-transmission solder tip suitable for soldering in small spaces |
-
2016
- 2016-01-18 CN CN201610048049.3A patent/CN105563041A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB509599A (en) * | 1937-12-13 | 1939-07-13 | Igranic Electric Co Ltd | Improvements in or relating to electrically heated devices such as soldering irons, flat irons or the like |
| CN85107407A (en) * | 1985-10-10 | 1987-05-27 | 交通部水运规划设计院 | The plating bath of brush plating iron-based combined plating |
| CN2700038Y (en) * | 2004-06-17 | 2005-05-18 | 袁忠 | Welding head |
| CN101372743A (en) * | 2007-08-20 | 2009-02-25 | 曾云发 | Ultralong service-life electric soldering iron welding nozzle fabrication technique |
| JP3191800U (en) * | 2014-04-28 | 2014-07-10 | タカヤマジャパン株式会社 | Soldering iron tip |
| CN104690513A (en) * | 2015-02-26 | 2015-06-10 | 陈爱华 | Solder tip production process |
| CN104842036A (en) * | 2015-05-19 | 2015-08-19 | 北京控制工程研究所 | High-heat-transmission solder tip suitable for soldering in small spaces |
Non-Patent Citations (1)
| Title |
|---|
| 蔚然: "《四化迷传经记》", 30 September 1983, 工人出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109352116A (en) * | 2018-12-09 | 2019-02-19 | 雷然 | A kind of solder horn and its production technology |
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Application publication date: 20160511 |