CN105555049A - Modification method for PCB (Printed Circuit Board) - Google Patents
Modification method for PCB (Printed Circuit Board) Download PDFInfo
- Publication number
- CN105555049A CN105555049A CN201610049749.4A CN201610049749A CN105555049A CN 105555049 A CN105555049 A CN 105555049A CN 201610049749 A CN201610049749 A CN 201610049749A CN 105555049 A CN105555049 A CN 105555049A
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- described step
- glue
- pcb board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the field of circuit board production processing technologies, in particular to a modification method for a PCB (Printed Circuit Board). The method is characterized by comprising the following steps of (1) preparation before modification; (2) resistant plate welding; (3) successive cleaning; (4) welding spot check; (5) bonding; (6) lead processing; (7) de-painting; (8) outgoing line installation; (9) welding spot check; (10) paint repair; (11) lead cementation; (12) checking; and (13) photographing. The method adds a resistance plate, and an unreliable factor cannot be added in a resistance plate welding link, so that the damage risk of components due to inconsistent coefficients of thermal expansion among a printed circuit board substrate, the components and an adhesive is reduced to a larger extent.
Description
Technical field
The present invention relates to board production processing technique field, be specifically related to a kind of pcb board method of modifying.
Background technology
Printed substrate (PCB) is almost applied in all electronic equipments that we can see, little of electronic watch, calculator, general-purpose computer, large to computer, electronics, military issue weapons system etc., as long as there are the electronic devices and components such as integrated circuit, the electric interconnection between them all will use PCB.Printed substrate is that its manufacturing process is comparatively complicated by arranging the conductive pattern that is electrically connected between electronic devices and components and formed on insulating substrate.In order to improve the conductivity of printed substrate, weldability and non-oxidizability, require all will at the copper foil surface nickel plating of its conductive pattern and gold on higher printed substrate.
Due to the reason such as change in design, manufacture, in a lot of electronic and electrical equipment research institute, repacking work is almost inevitable.So-called repacking refers to as meeting new standard, to the amendment that the function of product is made.Be connected or components and parts change as changed the circuit caused due to design and state of the art, i.e. the increase and decrease of wire, the increase and decrease of components and parts or change and corresponding structural change brought with it.
Specify in aerospace standard QJ2940A-2001: " repacking of printed circuit board assembly refers to the change of connection performance.The change of this characteristic by cutting off printed conductor, increase components and parts and cut-out and be connected with increase wire (lead-in wire) and realize.The demand of the reason that repacking occurs printed circuit board assembly normally change in design and reliability, fail safe.For portioned product, this repacking is helpless, is also many times inevitable.Such as when a certain printed circuit board needs to carry out change in design, common selection has two kinds: one, is to realize change in design by the way of repacking.The advantage of this kind of way is apparent: the cycle is short, cost is low, easily realize.Shortcoming is repacking and will proves, as reequiped the fixed form, quality of welding spot, safe spacing etc. of rear components and parts through abundant by reequiping the risk brought.Repacking often association can go out many beyond thought situations, as the impact on peripheral devices, the performance of modified segment in various environmental experiment etc. its two, be making sheet again, again weld.The advantage of this way is that risk is controlled, can thoroughly solve by reequiping the series of problems brought; Shortcoming is then clearly: all components and parts all will have enough surpluses (in fact this be difficult to accomplish for a lot of expensive components and parts); The environmental test of having carried out all must re-start, and these 2 and phase of dragging of being caused by these two aspects factor are that a lot of research institute can not bear.
Summary of the invention
For above problem, the invention provides a kind of pcb board method of modifying, adopt the method for " installing resistance board additional ", major advantage is as follows: one, installs components and parts solder joint additional reliable.On resistance board, the resistive element installed additional can normal weld on pad, lead-out wire is welded on lead-out wire pad, and the solder joint formed when these solder joints and normal weld is as good as, therefore resistance board welding link can not increase unreliable factor.Its two, resistance board with repacking circuit board between bonding.Because two circuit boards are FR4 base material, therefore after bonding completing, the mismatch of the thermal coefficient of expansion of storeroom reduces greatly, it is inconsistent and cause component damage risk that this reduces thermal coefficient of expansion between printed circuit plate substrate, components and parts, cementation glue to a great extent, effectively can solve the problem in technical background.
To achieve these goals, the technical solution used in the present invention is as follows: a kind of pcb board method of modifying, comprises the steps:
(1) prepare before dress: before dress, the instrument needed for repacking, material are got all the ready stand-by;
(2) resistance board welding: resistance board welding adopts flatiron, and uses scaling powder;
(3) clean successively: employing non-dust cloth dips alcohol and cleans by hand, until solder joint is answered shiny appearance, soaked well after cleaning, printed circuit board should remain without rosin, scolding tin residue;
(4) solder joint inspection;
(5) bonding: first to adopt glue at bonding plane bilateral gluing, then carry out a Post RDBMS process, after glue solidifies completely, adopt glue to be evenly applied to resistance board surrounding, glue covers resistance board top edge, then carries out the process of secondary Post RDBMS;
(6) wire process: measure the suitable line length from resistance board leading point to impact point, stripping head, to ward off tin for subsequent use;
(7) coating removal: select diluent as paint remover, this diluent is the mixed liquor of toluene, n-butanol, butyl acetate, dips a small amount of paint remover wiping target repeatedly pad surface, to reach coating removal effect with non-dust cloth;
(8) lead-out wire is installed: connecting line one end is welded in resistance board lead-out wire pad, one end is welded in target solder joint;
(9) solder joint is checked: whether inspection solder joint exists wrong weldering, and under 5 times of magnifying glasses, detects solder joint whether bright, wetting good;
(10) touch-up paint: to the anti-paint of the position such as resistance board, lead solder-joint coating three, and naturally dry 24h.
(11) wire cementation: carry out a glue consolidation process to lead-out wire outlet position, another lead-out wire carries out cementation every 1cm;
(12) check: whether inspection annexation is correct, and whether bonding colloid solidifies completely, whether there is holiday paint position, whether there is scolding tin residue and micelle;
(13) take pictures: printed circuit board panorama and local multi-angle picture after shooting repacking, for future reference.
Further, in described step (1), weld time is 2-3s.
Further, in described step (2), flatiron adopts the solder horn of OK037 type.
Further, the scaling powder in described step (2) adopts R type scaling powder.
Further, the glue used before (5) the Post RDBMS process of described step is HY914 epoxide-resin glue.
Further, the glue used after (5) the Post RDBMS process of described step is GD414 single-component room-temperature-vulsilicone silicone rubber.
Further, (5) Post RDBMS processing times of described step are 4-5h, and the secondary Post RDBMS processing time is 21-22h.
Further, in described step (6), wire adopts auspicious 0.15mm2 silver-jacketed wire of chatting about.
Further, described step (7) toluene, n-butanol, butyl acetate volume ratio be 2: 1: 1.
Further, described step (7) the wiping time need control at 5-15min.
Beneficial effect of the present invention:
The present invention adopts the method for " installing resistance board additional ", and major advantage is as follows: one, installs components and parts solder joint additional reliable.On resistance board, the resistive element installed additional can normal weld on pad, lead-out wire is welded on lead-out wire pad, and the solder joint formed when these solder joints and normal weld is as good as, therefore resistance board welding link can not increase unreliable factor.Its two, resistance board with repacking circuit board between bonding.Because two circuit boards are FR4 base material, therefore after bonding completing, the mismatch of the thermal coefficient of expansion of storeroom reduces greatly, and it is inconsistent and cause component damage risk that this reduces thermal coefficient of expansion between printed circuit plate substrate, components and parts, cementation glue to a great extent.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Embodiment:
A kind of pcb board method of modifying, comprises the steps:
(1) prepare before dress: before dress, the instrument needed for repacking, material are got all the ready stand-by;
(2) resistance board welding: resistance board welding adopts flatiron, and uses scaling powder;
(3) clean successively: employing non-dust cloth dips alcohol and cleans by hand, until solder joint is answered shiny appearance, soaked well after cleaning, printed circuit board should remain without rosin, scolding tin residue;
(4) solder joint inspection;
(5) bonding: first to adopt glue at bonding plane bilateral gluing, then carry out a Post RDBMS process, after glue solidifies completely, adopt glue to be evenly applied to resistance board surrounding, glue covers resistance board top edge, then carries out the process of secondary Post RDBMS;
(6) wire process: measure the suitable line length from resistance board leading point to impact point, stripping head, to ward off tin for subsequent use;
(7) coating removal: select diluent as paint remover, this diluent is the mixed liquor of toluene, n-butanol, butyl acetate, dips a small amount of paint remover wiping target repeatedly pad surface, to reach coating removal effect with non-dust cloth;
(8) lead-out wire is installed: connecting line one end is welded in resistance board lead-out wire pad, one end is welded in target solder joint;
(9) solder joint is checked: whether inspection solder joint exists wrong weldering, and under 5 times of magnifying glasses, detects solder joint whether bright, wetting good;
(10) touch-up paint: to the anti-paint of the position such as resistance board, lead solder-joint coating three, and naturally dry 24h.
(11) wire cementation: carry out a glue consolidation process to lead-out wire outlet position, another lead-out wire carries out cementation every 1cm;
(12) check: whether inspection annexation is correct, and whether bonding colloid solidifies completely, whether there is holiday paint position, whether there is scolding tin residue and micelle;
(13) take pictures: printed circuit board panorama and local multi-angle picture after shooting repacking, for future reference.
Wherein, in described step (1), weld time is 2-3s.
Wherein, in described step (2), flatiron adopts the solder horn of OK037 type.
Wherein, the scaling powder in described step (2) adopts R type scaling powder.
Wherein, the glue used before (5) the Post RDBMS process of described step is HY914 epoxide-resin glue.
Wherein, the glue used after (5) the Post RDBMS process of described step is GD414 single-component room-temperature-vulsilicone silicone rubber.
Wherein, (5) Post RDBMS processing times of described step are 4-5h, and the secondary Post RDBMS processing time is 21-22h.
Wherein, in described step (6), wire adopts auspicious 0.15mm2 silver-jacketed wire of chatting about.
Wherein, described step (7) toluene, n-butanol, butyl acetate volume ratio be 2: 1: 1.
Wherein, described step (7) the wiping time need control at 5-15min.
The present invention reequips principle: generally speaking, and the product quality through repacking can not decline, and should not there is hidden danger, even product quality is more excellent.According to the relevant regulations in QJ2940A-2001, printed circuit board repacking should follow following principle: on any one piece of printed circuit board assembly in any 25cm2 area, and repacking sum should be no more than 2 places; Only components and parts can be increased when not changing printed circuit board physical dimension; Components and parts wire should overlap with corresponding insulating material; Lead-in wire lengthening should be restricted, to prevent vibration problem subsequently; Add first adhesive spots on long lead, should 15mm be not more than from components and parts to the distance of the solder joint of wire.
Based on above-mentioned, the present invention adopts the method for " installing resistance board additional ", and major advantage is as follows: one, installs components and parts solder joint additional reliable.On resistance board, the resistive element installed additional can normal weld on pad, lead-out wire is welded on lead-out wire pad, and the solder joint formed when these solder joints and normal weld is as good as, therefore resistance board welding link can not increase unreliable factor.Its two, resistance board with repacking circuit board between bonding.Because two circuit boards are FR4 base material, therefore after bonding completing, the mismatch of the thermal coefficient of expansion of storeroom reduces greatly, and it is inconsistent and cause component damage risk that this reduces thermal coefficient of expansion between printed circuit plate substrate, components and parts, cementation glue to a great extent.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a pcb board method of modifying, is characterized in that: comprise the steps:
(1) prepare before dress: before dress, the instrument needed for repacking, material are got all the ready stand-by;
(2) resistance board welding: resistance board welding adopts flatiron, and uses scaling powder;
(3) clean successively: employing non-dust cloth dips alcohol and cleans by hand, until solder joint is answered shiny appearance, soaked well after cleaning, printed circuit board should remain without rosin, scolding tin residue;
(4) solder joint inspection;
(5) bonding: first to adopt glue at bonding plane bilateral gluing, then carry out a Post RDBMS process, after glue solidifies completely, adopt glue to be evenly applied to resistance board surrounding, glue covers resistance board top edge, then carries out the process of secondary Post RDBMS;
(6) wire process: measure the suitable line length from resistance board leading point to impact point, stripping head, to ward off tin for subsequent use;
(7) coating removal: select diluent as paint remover, this diluent is the mixed liquor of toluene, n-butanol, butyl acetate, dips a small amount of paint remover wiping target repeatedly pad surface, to reach coating removal effect with non-dust cloth;
(8) lead-out wire is installed: connecting line one end is welded in resistance board lead-out wire pad, one end is welded in target solder joint;
(9) solder joint is checked: whether inspection solder joint exists wrong weldering, and under 5 times of magnifying glasses, detects solder joint whether bright, wetting good;
(10) touch-up paint: to the anti-paint of the position such as resistance board, lead solder-joint coating three, and naturally dry 24h;
(11) wire cementation: carry out a glue consolidation process to lead-out wire outlet position, another lead-out wire carries out cementation every 1cm;
(12) check: whether inspection annexation is correct, and whether bonding colloid solidifies completely, whether there is holiday paint position, whether there is scolding tin residue and micelle;
(13) take pictures: printed circuit board panorama and local multi-angle picture after shooting repacking, for future reference.
2. a kind of pcb board method of modifying according to claim 1, is characterized in that: in described step (1), weld time is 2-3s.
3. a kind of pcb board method of modifying according to claim 1, is characterized in that: in described step (2), flatiron adopts the solder horn of OK037 type.
4. a kind of pcb board method of modifying according to claim 1, is characterized in that: the scaling powder in described step (2) adopts R type scaling powder.
5. a kind of pcb board method of modifying according to claim 1, is characterized in that: the glue used before (5) the Post RDBMS process of described step is HY914 epoxide-resin glue.
6. a kind of pcb board method of modifying according to claim 1, is characterized in that: the glue used after (5) the Post RDBMS process of described step is GD414 single-component room-temperature-vulsilicone silicone rubber.
7. a kind of pcb board method of modifying according to claim 1, is characterized in that: (5) Post RDBMS processing times of described step are 4-5h, and the secondary Post RDBMS processing time is 21-22h.
8. a kind of pcb board method of modifying according to claim 1, is characterized in that: in described step (6), wire adopts auspicious 0.15mm2 silver-jacketed wire of chatting about.
9. a kind of pcb board method of modifying according to claim 1, is characterized in that: described step (7) toluene, n-butanol, butyl acetate volume ratio be 2: 1: 1.
10. a kind of pcb board method of modifying according to claim 1, is characterized in that: described step (7) the wiping time need control at 5-15min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610049749.4A CN105555049A (en) | 2016-01-25 | 2016-01-25 | Modification method for PCB (Printed Circuit Board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610049749.4A CN105555049A (en) | 2016-01-25 | 2016-01-25 | Modification method for PCB (Printed Circuit Board) |
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| Publication Number | Publication Date |
|---|---|
| CN105555049A true CN105555049A (en) | 2016-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610049749.4A Pending CN105555049A (en) | 2016-01-25 | 2016-01-25 | Modification method for PCB (Printed Circuit Board) |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106170186A (en) * | 2016-08-19 | 2016-11-30 | 北海市蕴芯电子科技有限公司 | A kind of LED lamp circuit board manufacturing method |
| CN106211626A (en) * | 2016-08-19 | 2016-12-07 | 北海市蕴芯电子科技有限公司 | A kind of circuit board processing method of electronic platform balance |
| CN106255343A (en) * | 2016-08-19 | 2016-12-21 | 北海市蕴芯电子科技有限公司 | A kind of circuit board preparation method with LED electric wall clock table |
| CN106238844A (en) * | 2016-08-01 | 2016-12-21 | 安徽贝莱电子科技有限公司 | A kind of welding procedure of electronic module |
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| CN104519672A (en) * | 2014-12-19 | 2015-04-15 | 胜华电子（惠阳）有限公司 | Repair method for PCB (printed circuit board) circuits |
| US20150226789A1 (en) * | 2014-02-11 | 2015-08-13 | Foresite, Inc. | Test board and method for qualifying a printed circuit board assembly and/or repair process |
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2016
- 2016-01-25 CN CN201610049749.4A patent/CN105555049A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20150226789A1 (en) * | 2014-02-11 | 2015-08-13 | Foresite, Inc. | Test board and method for qualifying a printed circuit board assembly and/or repair process |
| CN104519672A (en) * | 2014-12-19 | 2015-04-15 | 胜华电子（惠阳）有限公司 | Repair method for PCB (printed circuit board) circuits |
Non-Patent Citations (1)
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| 李祥琛等: "《一种印制电路板改装工艺方法》", 《电子工艺技术》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106238844A (en) * | 2016-08-01 | 2016-12-21 | 安徽贝莱电子科技有限公司 | A kind of welding procedure of electronic module |
| CN106170186A (en) * | 2016-08-19 | 2016-11-30 | 北海市蕴芯电子科技有限公司 | A kind of LED lamp circuit board manufacturing method |
| CN106211626A (en) * | 2016-08-19 | 2016-12-07 | 北海市蕴芯电子科技有限公司 | A kind of circuit board processing method of electronic platform balance |
| CN106255343A (en) * | 2016-08-19 | 2016-12-21 | 北海市蕴芯电子科技有限公司 | A kind of circuit board preparation method with LED electric wall clock table |
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Application publication date: 20160504 |
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