CN105552070A - Full-color paster indiction LED - Google Patents
Full-color paster indiction LED Download PDFInfo
- Publication number
- CN105552070A CN105552070A CN201510910251.8A CN201510910251A CN105552070A CN 105552070 A CN105552070 A CN 105552070A CN 201510910251 A CN201510910251 A CN 201510910251A CN 105552070 A CN105552070 A CN 105552070A
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- China
- Prior art keywords
- wafer
- led
- full
- pcb board
- gold thread
- Prior art date
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- Pending
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- 239000003292 glue Substances 0.000 claims abstract description 7
- 241000218202 Coptis Species 0.000 claims description 21
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000000084 colloidal system Substances 0.000 claims description 11
- 230000005284 excitation Effects 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 67
- 239000003086 colorant Substances 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 6
- 239000010931 gold Substances 0.000 abstract 6
- 229910052737 gold Inorganic materials 0.000 abstract 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000012913 prioritisation Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a full-color paster indiction LED, and the LED comprises a PCB, a first wafer, a second wafer, a third wafer, transparent glue, a first gold line, a second gold line, and a third gold line. Two ends of the first gold line are respectively fixedly connected with the first wafer and the bottom of the PCB. Two ends of the second gold line are respectively fixedly connected with the second wafer and the bottom of the PCB. Two ends of the third gold line are respectively fixedly connected with the third wafer and the bottom of the PCB. The transparent glue wraps the first, second and third wafers. The PCB is provided with die bonding regions, and the first, second and third wafers are respectively fixed in the die bonding regions through die bonding glue. The LED provided by the invention employs the PCB which is provided with four independent die bonding regions, wherein the die bonding regions can be used for placing a plurality of wafers. One LED can achieve three colors: red, blue and green, thereby reducing the cost of the LED.
Description
Technical field
The present invention relates to field of photoelectric technology, particularly a kind of full-color paster instruction led.
Background technology
Light-emitting diode (Light-EmittingDiode, LED) is a kind of can be the semiconductor electronic component of luminous energy by electric energy conversion.This electronic component occurred as far back as 1962, and can only send the ruddiness of low luminosity in early days, develop other monochromatic versions afterwards, the light that can send even to this day is throughout visible ray, infrared ray and ultraviolet, and luminosity also brings up to suitable luminosity.And purposes is also by the beginning as indicator light, display panel etc.; Along with the continuous progress of technology, light-emitting diode has been widely used in display, television set daylighting decoration and illumination.
Along with the continuation of industry develops, the leap of technology breaks through, and wideling popularize of application, the light efficiency of LED is also improving constantly, and price constantly drops.The appearance of new composite type tube core, also allows the power of single led pipe improve constantly.By the continuous effort research and development of the same trade, the breakthrough of novel optical design, the exploitation of new lamp kind, the situation that product is single is also expected in further torsion.The improvement of control software design, also makes LED illumination use more convenient.These changes progressively, have all embodied LED light-emitting diode having a extensive future in illumination application.
Full-color LED display screen (FullcolorLEDdisplayscreen): LED is exactly lightemittingdiode, the english abbreviation of light-emitting diode, is called for short LED.It is a kind of display mode by control RGB semiconductor light-emitting-diode, its general appearance is exactly be made up of the light-emitting diode of a lot of RGB tri-looks, each combination of pixels all has RGB diode, by often organizing the light on and off of pixel lamp to show the full-color picture of different colours.Be used for showing the display screen of the various information such as word, figure, image, animation, market, video, video signal.
In recent years, LED cost is more and more lower, and human cost is more and more higher, and to the manufacturing, factory is more and more unfavorable.In order to increase the competitiveness manufacturing factory, just need minimizing processing procedure and automated job to reduce human cost.Tradition direct plug-in type light emitting pipe is used for indicator light, and making technology is complicated, is unfavorable for client's automated job.
Summary of the invention
Technical problem to be solved by this invention overcomes the deficiencies in the prior art and provide a kind of full-color paster instruction led, the full-color paster indication LED that the present invention proposes, can simplification of flowsheet, facilitates client to realize automated job, reduce human cost.
The present invention is for solving the problems of the technologies described above by the following technical solutions:
According to the one full-color paster instruction led that the present invention proposes, comprise pcb board, the first wafer, the second wafer, wafer, transparent colloid, the first gold thread, the second gold thread and the 3rd gold thread; Wherein, the two ends of described first gold thread are fixedly connected with the bottom of described first wafer and pcb board respectively, the two ends of the second gold thread are fixedly connected with the bottom of described second wafer and pcb board respectively, the two ends of the 3rd gold thread are fixedly connected with the bottom of described wafer and pcb board respectively, transparent colloid is coated in the first wafer, the second wafer and wafer, pcb board is provided with die bond region, and described first wafer, the second wafer, wafer are separately fixed in die bond region by die bond adhesive glue.
As the further prioritization scheme of one of the present invention full-color paster instruction led, the thickness of described pcb board is 1.0mm.
As the further prioritization scheme of one of the present invention full-color paster instruction led, the bottom of described pcb board is provided with the pad that can realize front welding and side welding.
As the further prioritization scheme of one of the present invention full-color paster instruction led, described first wafer is red wafer, second wafer is green wafer, wafer is blue light wafer, the excitation wavelength of described red wafer is 620-650 nanometer, the excitation wavelength of described green wafer is 515-530 nanometer, and the excitation wavelength of described blue light wafer is 465-475 nanometer.
As the further prioritization scheme of one of the present invention full-color paster instruction led, described transparent colloid is made up of adhesive, and adhesive is epoxy resin or silica gel, or the mixture of epoxy resin and silica gel.
The present invention adopts above technical scheme compared with prior art, has following technique effect:
(1), compared with indication LED direct insertion with tradition, the full-color paster indication LED that the present invention proposes, can simplification of flowsheet, facilitates client to realize automated job, reduces human cost;
(2) compared with traditional devices, the present invention adopts pcb board to be provided with four independently die bond regions, can place many wafers, and a LEDs device can realize red, blue, green three kinds of colors, reduce further LED cost;
(3) the pcb board thickness that the present invention adopts is about about 1.0mm, the pad design of bottom, can realize front luminescence and lateral emitting simultaneously;
(4) more traditional TOP indication LED, paster of the present invention adopts Lens structure, and lighting angle is less, about about 20 degree.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Reference numeral in figure is interpreted as: 1-red wafer, 2-green wafer, 3-blue light wafer, 4-PCB plate, 5-transparent colloid, 6-first gold thread, 7-second gold thread, 8-the 3rd gold thread.
Embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail:
As shown in Figure 1, a kind of full-color paster instruction led, is characterized in that, comprise pcb board 4, first wafer, the second wafer, wafer, transparent colloid 5, first gold thread 6, second gold thread 7 and the 3rd gold thread 8; Wherein, the two ends of described first gold thread are fixedly connected with the bottom of described first wafer and pcb board respectively, the two ends of the second gold thread are fixedly connected with the bottom of described second wafer and pcb board respectively, the two ends of the 3rd gold thread are fixedly connected with the bottom of described wafer and pcb board respectively, transparent colloid is coated in the first wafer, the second wafer and wafer, pcb board is provided with die bond region, and described first wafer, the second wafer, wafer are separately fixed in die bond region by die bond adhesive glue.
The thickness of described pcb board is 1.0mm.
The bottom of described pcb board is provided with the pad that can realize front welding and side welding.
Described first wafer is red wafer 1, second wafer is green wafer 2, and wafer is blue light wafer 3, and the excitation wavelength of described red wafer is 620-650 nanometer, the excitation wavelength of described green wafer is 515-530 nanometer, and the excitation wavelength of described blue light wafer is 465-475 nanometer.
Described transparent colloid is made up of adhesive, and adhesive is epoxy resin or silica gel, or the mixture of epoxy resin and silica gel.
In first wafer, the second wafer, wafer, colloid lens is by a moulded section, 20 degree of lighting angles can be realized, described first wafer, the second wafer, wafer are separately fixed in the die bond region of PCB by die bond adhesive glue, the thickness of pcb board is about 1.0mm, and the pad of bottom design can realize front welding and side welding.
Manufacture method of the present invention is: be fixed on PCB by the first red wafer, the second green wafer and blue light wafer, carry out bonding wire, then by adhesive moulded section in the first wafer, the second wafer and wafer, baking-curing is shaped.
In addition to the implementation, the present invention can also have other execution modes, and all employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop in the protection range of application claims.
Claims (5)
1. a full-color paster instruction led, is characterized in that, comprise pcb board, the first wafer, the second wafer, wafer, transparent colloid, the first gold thread, the second gold thread and the 3rd gold thread; Wherein, the two ends of described first gold thread are fixedly connected with the bottom of described first wafer and pcb board respectively, the two ends of the second gold thread are fixedly connected with the bottom of described second wafer and pcb board respectively, the two ends of the 3rd gold thread are fixedly connected with the bottom of described wafer and pcb board respectively, transparent colloid is coated in the first wafer, the second wafer and wafer, pcb board is provided with die bond region, and described first wafer, the second wafer, wafer are separately fixed in die bond region by die bond adhesive glue.
2. one according to claim 1 full-color paster instruction led, it is characterized in that, the thickness of described pcb board is 1.0mm.
3. one according to claim 1 full-color paster instruction led, is characterized in that, the bottom of described pcb board is provided with the pad that can realize front welding and side welding.
4. one according to claim 1 full-color paster instruction led, it is characterized in that, described first wafer is red wafer, second wafer is green wafer, wafer is blue light wafer, the excitation wavelength of described red wafer is 620-650 nanometer, and the excitation wavelength of described green wafer is 515-530 nanometer, and the excitation wavelength of described blue light wafer is 465-475 nanometer.
5. one according to claim 1 full-color paster instruction led, it is characterized in that, described transparent colloid is made up of adhesive, and adhesive is epoxy resin or silica gel, or the mixture of epoxy resin and silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510910251.8A CN105552070A (en) | 2015-12-10 | 2015-12-10 | Full-color paster indiction LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510910251.8A CN105552070A (en) | 2015-12-10 | 2015-12-10 | Full-color paster indiction LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105552070A true CN105552070A (en) | 2016-05-04 |
Family
ID=55831162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510910251.8A Pending CN105552070A (en) | 2015-12-10 | 2015-12-10 | Full-color paster indiction LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105552070A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1667844A (en) * | 2004-03-08 | 2005-09-14 | 诠兴开发科技股份有限公司 | Side emitting type colored light-emitting diode packaging arrangement |
| CN101069292A (en) * | 2005-06-24 | 2007-11-07 | Lg伊诺特有限公司 | Light emitting device package and mauufacture method of light emitting device package |
| CN201318636Y (en) * | 2008-11-26 | 2009-09-30 | 广州硅芯电子科技有限公司 | LED-IC packaged lamp |
| CN201420989Y (en) * | 2009-05-14 | 2010-03-10 | 石飞跃 | Dodging LED neon lamp |
| CN101743647A (en) * | 2007-07-12 | 2010-06-16 | 罗姆股份有限公司 | Semiconductor light-emitting device |
| CN101828136A (en) * | 2007-10-16 | 2010-09-08 | 皇家飞利浦电子股份有限公司 | The side-emitting led light source that is used for application backlight |
| CN201819073U (en) * | 2010-09-02 | 2011-05-04 | 昆山龙腾光电有限公司 | Backlight module |
| CN201893338U (en) * | 2010-11-03 | 2011-07-06 | 熊周成 | LED (Light-Emitting Diode) packaging structure and LED light-emitting display module |
| CN201956351U (en) * | 2011-03-23 | 2011-08-31 | 东莞市翌唐新晨光电科技有限公司 | Full-color LED encapsulation structure |
-
2015
- 2015-12-10 CN CN201510910251.8A patent/CN105552070A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1667844A (en) * | 2004-03-08 | 2005-09-14 | 诠兴开发科技股份有限公司 | Side emitting type colored light-emitting diode packaging arrangement |
| CN101069292A (en) * | 2005-06-24 | 2007-11-07 | Lg伊诺特有限公司 | Light emitting device package and mauufacture method of light emitting device package |
| CN101743647A (en) * | 2007-07-12 | 2010-06-16 | 罗姆股份有限公司 | Semiconductor light-emitting device |
| CN101828136A (en) * | 2007-10-16 | 2010-09-08 | 皇家飞利浦电子股份有限公司 | The side-emitting led light source that is used for application backlight |
| CN201318636Y (en) * | 2008-11-26 | 2009-09-30 | 广州硅芯电子科技有限公司 | LED-IC packaged lamp |
| CN201420989Y (en) * | 2009-05-14 | 2010-03-10 | 石飞跃 | Dodging LED neon lamp |
| CN201819073U (en) * | 2010-09-02 | 2011-05-04 | 昆山龙腾光电有限公司 | Backlight module |
| CN201893338U (en) * | 2010-11-03 | 2011-07-06 | 熊周成 | LED (Light-Emitting Diode) packaging structure and LED light-emitting display module |
| CN201956351U (en) * | 2011-03-23 | 2011-08-31 | 东莞市翌唐新晨光电科技有限公司 | Full-color LED encapsulation structure |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160504 |
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| RJ01 | Rejection of invention patent application after publication |