CN201819073U - Backlight module - Google Patents

Backlight module Download PDF

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Publication number
CN201819073U
CN201819073U CN2010205182183U CN201020518218U CN201819073U CN 201819073 U CN201819073 U CN 201819073U CN 2010205182183 U CN2010205182183 U CN 2010205182183U CN 201020518218 U CN201020518218 U CN 201020518218U CN 201819073 U CN201819073 U CN 201819073U
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CN
China
Prior art keywords
wiring board
led
module backlight
lamp plate
led lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2010205182183U
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Chinese (zh)
Inventor
王贺
张卓
章佳锋
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InfoVision Optoelectronics Kunshan Co Ltd
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InfoVision Optoelectronics Kunshan Co Ltd
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Priority to CN2010205182183U priority Critical patent/CN201819073U/en
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Publication of CN201819073U publication Critical patent/CN201819073U/en
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Abstract

The utility model discloses a backlight module which comprises an LED lamp panel as a backlight; the LED lamp panel comprises a circuit board and a plurality of LED wafers; the circuit board comprises an upper surface, a lower surface, a first side surface and a second side surface; the LED wafers are fixed on at least a surface in the upper and the lower surfaces of the circuit board, and extend and are arranged along the long edge of the circuit board; the lighting directions of the LED wafers are towards the normal direction of the first side surface; and the second side surface of the circuit board is fixedly connected with the backlight module. In the utility model adopting the LED lamp panel, more LED wafers can be installed according to the brightness requirements of the backlight in different zones without needing to add circuit boards, so that the use amount of circuit boards can be reduced, the cost is saved, and the space for the backlight module is greatly saved.

Description

A kind of module backlight
Technical field
The utility model relates to the photoelectric display technical field, particularly a kind of module backlight.
Background technology
In recent years, along with the fast development of flat panel display, LCD is because of having that volume is little, in light weight, image quality is high and driving voltage is low etc. that advantage is widely used in various information, communication and the consumer products.Because liquid crystal itself does not have the characteristics of luminescence in the display panels of LCD, thereby for adjusting the display brightness of LCD, need to give the display panels of LCD that one light supply apparatus is provided, as module backlight, thereby be used for providing the light beam that brightness is abundant and be evenly distributed to display panels.Along with the fast development of backlight technology in the module backlight, LED-backlit progressively enters industrialization, thereby replaces the main flow that cathode fluorescent tube (CCFL) becomes backlight in the module backlight gradually.Compare with the CCFL backlight, the LED-backlit source has the following advantages: at first, LED has tangible power savings advantages; Secondly, the LED volume is little and light direction is good, can reduce the thickness of LGP in the traditional backlight source significantly, even can be without LGP; In addition, the mercury in the CCFL is the high and a kind of material very big to environmental hazard of cost, and from the angle of environmental protection, it also will be a corollary that LED substitutes CCFL gradually.
Adopt at present LED as the display panels of backlight module backlight in, the LED wafer is gone up formation LED lamp plate by attaching to flexible print circuit board (FPC) or printed circuit board (PCB) (PCB), thereby is applied to as backlight in the module backlight of display panels.Fig. 1 a is the front view of existing LED lamp plate, and Fig. 1 b is the vertical view of existing LED lamp plate, and Fig. 1 c is the left view of existing LED lamp plate.Shown in Fig. 1 a, Fig. 1 b and Fig. 1 c, the LED lamp plate comprises wiring board 101 and a plurality of LED wafer 102.Wiring board 101 is a cuboid, and it has long limit 11 and minor face 12.Wherein, wiring board 101 can be FPC or PCB.LED wafer 102 is attached at the upper surface of wiring board 101 equally spacedly, thereby forms the LED lamp plate.Wherein, the light emission direction of LED wafer 102 is perpendicular to plane, wiring board 101 place, and the light emission direction of LED wafer 102 is perpendicular to the upper surface or the lower surface of wiring board 101.
After this LED lamp plate is fixed to the side of module backlight, it is the side place planes overlapping of wiring board 101 lower surfaces and the module backlight of LED lamp plate, the light emission direction of LED wafer 102 that is positioned at wiring board 101 upper surfaces is vertical with the plane, side place of module backlight, this light emission direction is the incidence surface of LGP in the module backlight simultaneously, thereby forms the LED-backlit module of side-light type.
After this LED lamp plate is fixed to the bottom surface of module backlight, wiring board 101 lower surfaces that are the LED lamp plate overlap with the bottom surface of module backlight, the light emission direction of LED wafer 102 is vertical with the bottom surface of module backlight, this light emission direction is the lower surface of LGP in the module backlight simultaneously, thereby forms the LED-backlit module of straight-down negative.
In the prior art, no matter be the module backlight of side-light type or straight-down negative, because the light emission direction of LED lamp plate is perpendicular to the upper surface or the lower surface of wiring board 101, and, a surface in the upper and lower surface need overlap with the plane, side place or the bottom surface of module backlight, therefore, it can only install LED wafer 102 in another surface in upper and lower surface.In the prior art, when needing more LED wafer 102 to satisfy the optical brightness demand of backlight in the module backlight, usually can only adopt the number that increases wiring board 101 and then reach the purpose that increases LED wafer 102 quantity, but increased the quantity of wiring board 101 like this, cause the cost of LED lamp plate to increase, also caused the waste of material simultaneously.And the quantity that increases wiring board 101 will inevitably cause the increase of module overall volume backlight, thereby influences the overall volume of LCD.
The utility model content
Shortcoming based on LED lamp panel structure in the module backlight of prior art display panels, the utility model provides a kind of module backlight that adopts the LED wafer of lateral emitting, and it can install the quantity that more a plurality of LED wafers need not to increase wiring board according to the back light source brightness demand.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of module backlight, it comprises the LED lamp plate as backlight, described LED lamp plate comprises wiring board and a plurality of LED wafer, described wiring board comprises the upper and lower surface and first and second sides, described a plurality of LED wafer is fixed in the wiring board upper and lower surface at least one surface, and extends along the long limit of wiring board and to arrange;
The light emission direction of described LED wafer is towards the normal direction of first side;
Described wiring board is fixedlyed connected with described module backlight by second side.
Module backlight of the present utility model uses this LED lamp plate, can be according to the back light source brightness demand, more a plurality of LED wafers are installed under the situation that does not increase circuit board quantity, therefore, can reduce the usage quantity of wiring board, save cost, and saved LED lamp plate shared space of LED lamp plate in module backlight greatly.
Description of drawings
Fig. 1 a is the front view of existing LED lamp plate;
Fig. 1 b is the vertical view of the LED lamp plate shown in Fig. 1 a;
Fig. 1 c be the LED lamp plate shown in Fig. 1 a left view;
Fig. 2 a, Fig. 2 b and Fig. 2 c are respectively front view, vertical view and the left views of the LED lamp plate of the utility model embodiment one;
Fig. 3 a and Fig. 3 b are respectively the front view and the left views of the LED lamp plate of the utility model embodiment two; And
Fig. 4 a and Fig. 4 b are respectively the front view and the left views of the LED lamp plate of the utility model embodiment three.
The specific embodiment
The purpose of this utility model is to provide a kind of both can have been increased in the module backlight the LED number of wafers and then increase optical brightness in the module backlight, simultaneously can save the module backlight that the LED lamp plate is taken up space in the module backlight again, it adopts a wiring board can reach the requirement of the more a plurality of LED wafers of installation, thereby make that in the lamp plate of the more a plurality of LED wafers of needs the quantity that need not increase wiring board promptly can realize the placement in the circuit board of more a plurality of LED wafers.In addition, the utility model provides a kind of quantity and position of the LED wafer that can distribute by the needs of regional luminance in the module backlight, and two surfaces up and down that are implemented in wiring board of the LED wafer by side emitting increase the purpose of LED wafers, thereby can reduce the quantity of wiring board, save cost, and save the space in the module backlight greatly.
For making the purpose of this utility model, technical scheme and advantage clearer, below with reference to the accompanying drawing embodiment that develops simultaneously, the utility model is further described.
Embodiment one
Fig. 2 a, Fig. 2 b and Fig. 2 c are the structural representations of LED lamp plate among the utility model first embodiment, and this LED lamp plate is applied in the module backlight.Wherein, Fig. 2 a is the front view of LED lamp plate in the present embodiment; Fig. 2 b is the vertical view of LED lamp plate in the present embodiment; Fig. 2 c is the left view of the LED lamp plate shown in Fig. 2 a; Shown in Fig. 2 a, Fig. 2 b and Fig. 2 c, module backlight of the present utility model comprises the LED lamp plate as backlight, and wherein the LED lamp plate comprises wiring board 201 and is fixed at least one lip-deep a plurality of LED wafer 202 in wiring board 201 upper and lower surfaces.Wiring board 201 can be FPC or PCB.
Wiring board 201 is a cuboid, and it has upper and lower surface and four sides.Upper and lower surface is a rectangle, and it has long limit 21 and minor face 22.Wherein, two sides that comprise long limit 21 are called first side 211 and second side 212.
LED wafer 202 extends on the long limit 21 of wiring board 201 upper edge wiring boards 201 arranges.Wherein, the light emission direction of LED wafer 202 is towards the normal direction of first side 211 at 21 places, wiring board 201 long limits.
In the present embodiment, the upper and lower surface of wiring board 201 all is provided with a plurality of LED wafers 202 equidistantly, and LED wafer 202 is identical in the position of the upper and lower surface of wiring board 201 correspondence, quantity, and promptly LED wafer 202 is arranged on two surfaces up and down of wiring board 201 symmetrically.
In the present embodiment, shown in Fig. 2 c, the light emission direction of LED wafer 202 is parallel to wiring board plane, 201 place and perpendicular to the arragement direction of LED wafer (wiring board 201 long limit bearing of trends) in the LED lamp plate, be the normal direction of the light emission direction of LED wafer 202 towards first side 211 at 21 places, wiring board 201 long limits, the light-emitting area that is arranged in the LED wafer 202 of LED lamp plate wiring board 201 upper and lower surfaces all is positioned at the same side, the light emission direction that is a plurality of LED wafers 202 is identical, one side and not luminous towards second side 212 of the LED wafer 202 of upper and lower surface in the LED lamp plate.
When being applied to the LED lamp plate in the present embodiment in the side type module backlight, second side 212,21 places, long limit in the LED lamp plate is fixed to the side of module backlight, simultaneously, shown in Fig. 2 c, the light-emitting area of LED wafer 202 is positioned at first side 211 near place, LED lamp plate wiring board 201 long limit in the LED lamp plate, and LED wafer light emission direction is towards the normal direction of first side 211 at 21 places, wiring board 201 long limits.In the present embodiment, the LED wafer 202 that is positioned at wiring board 201 upper and lower surfaces can provide backlight simultaneously, and then not increasing under the situation that the LED lamp plate taken up space, has improved the light-source brightness in the module backlight.
When being applied to LED lamp plate of the present utility model in the down straight aphototropism mode set, second side 212 of LED lamp plate is fixed to the bottom surface of module backlight, simultaneously, shown in Fig. 2 c, the light-emitting area of LED wafer 202 is positioned at first side 211 near place, LED lamp plate wiring board 201 long limit in the LED lamp plate, and the light emission direction of LED wafer is towards the normal direction of first side 211 at 21 places, wiring board 201 long limits.In the present embodiment, the LED wafer 202 that is positioned at wiring board 201 upper and lower surfaces can provide backlight simultaneously, and then not increasing under the situation that the LED lamp plate taken up space, has improved the light-source brightness in the module backlight.
Be lateral emitting owing to be positioned at the LED wafer 202 of LED lamp plate upper and lower surface in the present embodiment, its light emission direction is towards the normal direction of first side 211 at 21 places, wiring board 201 long limits, and the LED lamp plate is fixedlyed connected with module backlight by second side 212 at its 21 places, long limit, therefore no matter the LED lamp plate is applied to side type, or in the module backlight of straight-down negative the time, the light-emitting area of LED wafer 202 that is positioned at wiring board 201 upper and lower surfaces of LED lamp plate all can not blocked by wiring board 201, therefore, LED lamp plate in the utility model can all be provided with the LED wafer 202 of lateral emitting by the upper and lower surface at wiring board, to be implemented under the prerequisite that does not increase wiring board, increase the purpose of LED wafer 202 quantity.Like this, not only can strengthen the intensity of light source in the module backlight greatly, and can save the space in the module backlight greatly, provide cost savings simultaneously.
Embodiment two
Fig. 3 a and Fig. 3 b are the structural representations of LED lamp plate among second embodiment in the utility model, and this LED lamp plate is applied in the module backlight.Wherein, Fig. 3 a is the front view of LED lamp plate in the present embodiment; Fig. 3 b is the left view shown in Fig. 3 a.Fig. 3 b shows the light emission direction of LED wafer among Fig. 3 a simultaneously, the light-emitting area of LED wafer 302 is positioned near first side 311, place, LED lamp plate wiring board 301 long limit in the LED lamp plate, be the normal direction of the light emission direction of LED wafer 302, and the light emission direction of LED wafer 302 of wiring board 301 upper and lower surfaces that is positioned at the LED lamp plate is all towards same direction towards first side 311 at place, the long limit of LED lamp plate wiring board 301.
In the present embodiment, the upper and lower surface of wiring board 301 all is provided with a plurality of LED wafers 302 equidistantly, and LED wafer 302 extends on the long limit of wiring board 301 upper edge wiring boards 301 arranges.Different with embodiment one is, the LED wafer 302 that is positioned at wiring board 301 upper surfaces is provided with for staggered at interval with the position of the LED wafer 302 that is positioned at wiring board 301 lower surfaces.That is, shown in Fig. 3 a, the space between per two the adjacent LED wafers 302 at wiring board 301 upper surfaces is corresponding with LED wafer 302 positions that are positioned at wiring board 301 lower surfaces.Similarly, the space between per two the adjacent LED wafers 302 at wiring board 301 lower surfaces is corresponding with LED wafer 302 positions that are positioned at wiring board 301 upper surfaces.This staggered interval is provided with the mode of LED wafer 302, not only can make full use of the space length of wiring board 301, can make the heat radiation of LED lamp plate when work more evenly, rapidly simultaneously.
Similarly, be lateral emitting owing to be positioned at the LED wafer 302 of LED lamp plate upper and lower surface in the present embodiment, and the LED lamp plate is fixedlyed connected with module backlight by second side 312 at its place, long limit, therefore no matter the LED lamp plate is applied to side type, or in the module backlight of straight-down negative the time, the light-emitting area that is arranged in the LED wafer of LED lamp plate wiring board 301 upper and lower surfaces all can not blocked by wiring board 301, therefore, LED lamp plate in the utility model can all be provided with by the upper and lower surface at wiring board towards the luminous LED wafer of the normal direction of first side 311, to be implemented under the prerequisite that does not increase wiring board, increase the purpose of LED number of wafers.Like this, not only can strengthen the intensity of light source in the module backlight greatly, and can save the space in the module backlight greatly, provide cost savings simultaneously.In addition, can make the heat radiation of LED lamp plate when working more evenly, rapidly simultaneously staggered the setting at interval of the LED wafer of wiring board 301 upper and lower surfaces in the present embodiment.
Embodiment three
Fig. 4 a and Fig. 4 b are the structural representations of LED lamp plate among the utility model embodiment three, and this LED lamp plate is applied in the module backlight.Wherein, Fig. 4 a is the front view of LED lamp plate in the present embodiment; Fig. 4 b is the left view shown in Fig. 4 a.Wherein, Fig. 4 b shows the light emission direction of LED wafer among Fig. 4 a simultaneously, the light-emitting area of LED wafer 402 is positioned at first side 411 near place, LED lamp plate wiring board 401 long limit in the LED lamp plate, and promptly LED wafer light emission direction is towards the normal direction of first side 411 at place, LED lamp plate wiring board 301 long limit.And the light-emitting area of LED wafer 402 of wiring board 401 upper and lower surfaces that is positioned at the LED lamp plate is all towards same direction.The LED lamp plate is fixedlyed connected with module backlight by second side 412 at its place, long limit.
Shown in Fig. 4 a and Fig. 4 b, in the present embodiment, can be according to quantity and position that LED lamp onboard led wafer 402 is set for the size of backlight zones of different intensity of illumination in the module backlight, promptly the spacing between the two adjacent LED wafers 402 is not identical entirely.In the zone of the stronger intensity of illumination of needs, can suitably increase the quantity of LED wafer 402 or dwindle the spacing between the adjacent LED wafer 402 or LED wafer 402 is set simultaneously on two surfaces up and down of this area L ED lamp plate wiring board 401.In the zone that does not need intense light irradiation intensity, then can suitably reduce the quantity of LED wafer 402 or increase between the adjacent LED wafer 402 spacing or only in the upper surface of this area L ED lamp plate wiring board 401 or lower surface a surface LED wafer 402 is set.
In the present embodiment, the quantity and the position that are arranged on the LED wafer on wiring board 401 surfaces are provided with according to the required intensity of illumination of zones of different in the module backlight, and need not as embodiment one or two, with LED wafer 402 according to certain rule along the length direction of wiring board 401 at wiring board 401 upper and lower surface spaced sets.
For example, shown in Fig. 4 a, can be according to the needs of intensity of illumination, the upper surface of certain section regional location of wiring board 401 is provided with a plurality of LED wafers 402 equally spacedly light source is provided in the LED lamp plate, and the lower surface of corresponding wiring board 401 is not provided with LED wafer 402; Perhaps, can be in the LED lamp plate lower surface of certain section regional location of wiring board 401 a plurality of LED wafers 402 are set equally spacedly light source are provided, and the upper surface of corresponding wiring board 401 is not provided with LED wafer 402; Perhaps, can be in the zone of the big intensity of illumination of needs, on two surfaces up and down of the wiring board 401 of correspondence LED wafer 402 is set simultaneously.
Like this, can satisfy in the module backlight zones of different the quantity and the shared space of LED lamp plate of LED wafer 402 saved in the requirement of light-source brightness simultaneously.
From above technical scheme as can be known, module backlight of the present utility model, both can increase in the module backlight the LED number of wafers and then increase optical brightness in the module backlight, can save simultaneously LED lamp plate shared space of LED in module backlight again, it adopts a wiring board can reach the requirement of the more a plurality of LED wafers of installation, thereby make that in the lamp plate of the more a plurality of LED wafers of needs the quantity that need not increase wiring board both can realize the placement in the circuit board of more a plurality of LED wafers.
The utility model also provide a kind of can by in the module backlight for the distribute module backlight of LED number of wafers and position of the needs of backlight zones of different brightness.
Module backlight of the present utility model can reduce the quantity of wiring board, saves cost, and has saved the space in the module backlight greatly.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all within spirit of the present utility model and principle, any modification of being made, be equal to replacement, improvement etc., all should be included within the scope of the utility model protection.

Claims (9)

1. module backlight, it comprises the LED lamp plate as backlight, described LED lamp plate comprises wiring board and a plurality of LED wafer, described wiring board comprises the upper and lower surface and first and second sides, it is characterized in that, described a plurality of LED wafer is fixed at least one surface in the wiring board upper and lower surface, and extends along the long limit of wiring board and to arrange;
The light emission direction of described LED wafer is towards the normal direction of first side;
Described wiring board is fixedlyed connected with described module backlight by second side.
2. module backlight as claimed in claim 1 is characterized in that, first side of described wiring board and second side are two sides at place, the long limit of described wiring board.
3. module backlight as claimed in claim 2 is characterized in that, second side of described wiring board is connected with the side of module backlight.
4. module backlight as claimed in claim 2 is characterized in that, second side of described wiring board is connected with the bottom surface of module backlight.
5. as claim 3 or 4 described modules backlight, it is characterized in that the upper and lower surface of described wiring board all has a plurality of LED wafers.
6. module backlight as claimed in claim 5 is characterized in that, described LED wafer is corresponding in the upper and lower surface spaced set and the position of described wiring board.
7. module backlight as claimed in claim 5 is characterized in that, described LED wafer is at the upper and lower surface spaced set of described wiring board but interlaced interval, position.
8. module backlight as claimed in claim 5 is characterized in that, described LED wafer is provided with at the upper and lower surface non-equidistance of described wiring board.
9. module backlight as claimed in claim 8 is characterized in that, the position of described LED wafer and quantity are provided with according to the demand for backlight zones of different intensity of illumination in the described module backlight.
CN2010205182183U 2010-09-02 2010-09-02 Backlight module Expired - Lifetime CN201819073U (en)

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Application Number Priority Date Filing Date Title
CN2010205182183U CN201819073U (en) 2010-09-02 2010-09-02 Backlight module

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Application Number Priority Date Filing Date Title
CN2010205182183U CN201819073U (en) 2010-09-02 2010-09-02 Backlight module

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CN201819073U true CN201819073U (en) 2011-05-04

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105552070A (en) * 2015-12-10 2016-05-04 江苏稳润光电有限公司 Full-color paster indiction LED
CN110286520A (en) * 2019-05-29 2019-09-27 深圳市赛时达光电科技有限公司 Quantum dot backlight and display device with it

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105552070A (en) * 2015-12-10 2016-05-04 江苏稳润光电有限公司 Full-color paster indiction LED
CN110286520A (en) * 2019-05-29 2019-09-27 深圳市赛时达光电科技有限公司 Quantum dot backlight and display device with it
CN110286520B (en) * 2019-05-29 2022-11-25 深圳赛时达科技有限公司 Quantum dot backlight source and display device with same

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C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 215301 No. 1, Longteng Road, Kunshan, Jiangsu

Patentee after: InfoVision Optoelectronics(Kunshan)Co.,Ltd.

Address before: 215301 No. 1, Longteng Road, Kunshan, Jiangsu

Patentee before: INFOVISION OPTOELECTRONICS (KUNSHAN) Co.,Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20110504