CN105551952A - 芯片深沟腐蚀装置 - Google Patents
芯片深沟腐蚀装置 Download PDFInfo
- Publication number
- CN105551952A CN105551952A CN201510970093.5A CN201510970093A CN105551952A CN 105551952 A CN105551952 A CN 105551952A CN 201510970093 A CN201510970093 A CN 201510970093A CN 105551952 A CN105551952 A CN 105551952A
- Authority
- CN
- China
- Prior art keywords
- chip
- acid tank
- connecting rod
- driving mechanism
- linear reciprocation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007797 corrosion Effects 0.000 title abstract description 17
- 238000005260 corrosion Methods 0.000 title abstract description 17
- 239000002253 acid Substances 0.000 claims abstract description 55
- 230000007246 mechanism Effects 0.000 claims abstract description 16
- 230000004308 accommodation Effects 0.000 claims description 20
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 239000007788 liquid Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510970093.5A CN105551952B (zh) | 2015-12-21 | 2015-12-21 | 芯片深沟腐蚀装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510970093.5A CN105551952B (zh) | 2015-12-21 | 2015-12-21 | 芯片深沟腐蚀装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105551952A true CN105551952A (zh) | 2016-05-04 |
CN105551952B CN105551952B (zh) | 2018-10-19 |
Family
ID=55831066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510970093.5A Active CN105551952B (zh) | 2015-12-21 | 2015-12-21 | 芯片深沟腐蚀装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105551952B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107887292A (zh) * | 2016-09-30 | 2018-04-06 | 宫朝光 | 硅片化学减薄设备 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201272743Y (zh) * | 2008-05-28 | 2009-07-15 | 深圳泰美克晶体技术有限公司 | 一种石英晶片腐蚀机 |
CN201347468Y (zh) * | 2009-01-21 | 2009-11-18 | 深圳泰美克晶体技术有限公司 | 一种石英晶片腐蚀机的驱动系统 |
CN101728240A (zh) * | 2009-09-30 | 2010-06-09 | 耿彪 | 一种多功能抛动旋转机构 |
CN201785494U (zh) * | 2010-09-08 | 2011-04-06 | 绿华能源科技(杭州)有限公司 | 用于制作硅片的花篮机构 |
CN203624977U (zh) * | 2013-12-26 | 2014-06-04 | 潍坊达而高电子技术有限公司 | 慢提拉机构 |
CN203648915U (zh) * | 2013-12-25 | 2014-06-18 | 浙江工贸职业技术学院 | 摇杆式超声波清洗机 |
CN104889095A (zh) * | 2015-05-11 | 2015-09-09 | 北京泰拓精密清洗设备有限公司 | 多功能清洗机构、清洗工艺及模块化组合式清洗工作站 |
-
2015
- 2015-12-21 CN CN201510970093.5A patent/CN105551952B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201272743Y (zh) * | 2008-05-28 | 2009-07-15 | 深圳泰美克晶体技术有限公司 | 一种石英晶片腐蚀机 |
CN201347468Y (zh) * | 2009-01-21 | 2009-11-18 | 深圳泰美克晶体技术有限公司 | 一种石英晶片腐蚀机的驱动系统 |
CN101728240A (zh) * | 2009-09-30 | 2010-06-09 | 耿彪 | 一种多功能抛动旋转机构 |
CN201785494U (zh) * | 2010-09-08 | 2011-04-06 | 绿华能源科技(杭州)有限公司 | 用于制作硅片的花篮机构 |
CN203648915U (zh) * | 2013-12-25 | 2014-06-18 | 浙江工贸职业技术学院 | 摇杆式超声波清洗机 |
CN203624977U (zh) * | 2013-12-26 | 2014-06-04 | 潍坊达而高电子技术有限公司 | 慢提拉机构 |
CN104889095A (zh) * | 2015-05-11 | 2015-09-09 | 北京泰拓精密清洗设备有限公司 | 多功能清洗机构、清洗工艺及模块化组合式清洗工作站 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107887292A (zh) * | 2016-09-30 | 2018-04-06 | 宫朝光 | 硅片化学减薄设备 |
Also Published As
Publication number | Publication date |
---|---|
CN105551952B (zh) | 2018-10-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 201405 Room 101, 88 Tong Fu Road, Fengxian District, Shanghai. Applicant after: SHANGHAI STN ELECTROMECHANICAL EQUIPMENT Co.,Ltd. Address before: 201713 5-572, room 45, Lane 16, Xiang Ning Bang Road, Zhujiajue Town, Qingpu District, Shanghai. Applicant before: SHANGHAI STN ELECTROMECHANICAL EQUIPMENT Co.,Ltd. |
|
CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201405 Room 101, 88 Tong Fu Road, Fengxian District, Shanghai. Patentee after: Shanghai Tiniu Technology Co.,Ltd. Address before: 201405 Room 101, 88 Tong Fu Road, Fengxian District, Shanghai. Patentee before: SHANGHAI STN ELECTROMECHANICAL EQUIPMENT Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder |