CN105543923A - Method and device for horizontal electroplating - Google Patents
Method and device for horizontal electroplating Download PDFInfo
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- CN105543923A CN105543923A CN201510992736.6A CN201510992736A CN105543923A CN 105543923 A CN105543923 A CN 105543923A CN 201510992736 A CN201510992736 A CN 201510992736A CN 105543923 A CN105543923 A CN 105543923A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
Abstract
The invention discloses a method and device for horizontal electroplating of a sheet substrate. According to the method and device, the width of the sheet substrate in the moving direction of the sheet substrate is more than 3 times that of each independent electroplating solution tank in the horizontal moving direction of the sheet substrate. Negative pole contact points of an electroplating power supply are placed outside the independent electroplating solution tanks, and the negative pole contact points of the electroplating power supply are not in direct contact with electroplating solutions, so that the short circuit caused by the negative poles, in the independent electroplating solution tanks, of the electroplating power supply and positive poles is avoided; direct current energy used for an electroplating process is fully utilized, and an electroplated layer can be made more uniform.
Description
Technical field
The present invention is about to sheet substrate carrying out horizontal electric plating method and equipment, particularly relates to and implement continuous horizontal electric plating method and equipment in sheet substrate.Electro-plating method of the present invention and equipment have Application Areas extensively and be applicable to the feature of scale operation.
Technical background
Over the past two decades, the use of renewable energy source is more and more subject to the attention in the world, wherein crystal silicon solar energy battery installation and use with every year on average 20% speed increase fast.
In the process of producing crystal silicon solar energy battery, the silver slurry being used as conductive electrode occupies produces more than 20% of crystal silicon solar energy battery total cost.Adopt cheap metal substitute part even all silver slurries, in reduction crystal silicon solar energy battery production cost, have significant meaning.
Metallic copper is one of method of replacing expensive silver slurry.But at high temperature, cupric ion is easy to be diffused in crystalline silicon, thus cause crystalline silicon minority carrier life time to reduce, namely reduce the photoelectric transformation efficiency of crystal silicon solar energy battery.Therefore, can only under cryogenic, metallic copper be deposited on crystal silicon solar energy battery, generate the electrode of crystal silicon solar energy battery.
In the production process of crystal silicon solar energy battery, there are two kinds of methods under the condition of low temperature, metallic copper can be deposited on crystal silicon solar energy battery surface, generate crystalline silicon solar battery electrode: low temperature physical deposition metal process and electroless plating metal process.So-called low temperature physical deposition metal process sputters and thermal evaporation method exactly.The disadvantage of low temperature physical deposition metal process to implement selectivity metal refining, must adopt mask technique, thus just add production cost.
The method of the electroless plating metal be widely used is electroplating technology.Relative to the technique of physical deposition metal, it is simple that electroplating technology not only has technique, but also have can the advantage of selectivity metal refining.Therefore the production cost of electroplating technology can be controlled very low, thus significantly can reduce the cost producing crystal silicon solar energy battery.Therefore, electroplating technology metal refining on crystal silicon solar energy battery is used to be a quite active at present technical research field.
The potential difference that patent CN101257059A produces after disclosing and utilizing crystal silicon solar energy battery to be subject to illumination, implements the method for electroplating technology metal refining, i.e. the method for photoinduction electroplating technology metal refining in the negative terminal surface of crystal silicon solar energy battery.Because the method lacks the positive electrode electronic contact technique reliably to crystal silicon solar energy battery, therefore the method can only be applied in laboratory.
Patent CN102083717A discloses a kind of positive electrode electronic contact method at crystal silicon solar energy battery, and electroplating technology metal refining is applied in scale operation crystal silicon solar energy battery process.But there are two shortcomings in the method.One is the negative terminal surface of crystal silicon solar energy battery, under the effect of upper metal spring roller, constantly rub with bottom roller, not only damage the negative terminal surface of crystal silicon solar energy battery, and destruction to a certain degree has also been caused to the metal electrode that the method by electroplating technology metal refining deposits.Another shortcoming is the limitation that the method has it to apply, and the method is only limitted to apply on the crystal silicon solar energy battery having silk screen printing aluminium back surface field.
In order to improve photoelectric transformation efficiency, the back of the body passivating technique of crystal silicon solar energy battery progressively replaces the aluminium back surface field technology of traditional crystal silicon solar energy battery.After employing back of the body passivating technique, the positive pole of crystal silicon solar energy battery also can use the method for electroplating technology metal refining to generate the electrode of crystal silicon solar energy battery.But the method for above disclosed two kinds of electroplating technology metal refinings can only implement electroplating technology metal refining on the negative pole of crystal silicon solar energy battery.Like this, if the electrode of the negative pole of crystal silicon solar energy battery and positive pole all needs the method adopting electroplating technology metal refining to generate electrode, just must implement the process of electroplating technology metal refining to its negative pole and positive pole respectively, be unfavorable for scale operation.
Summary of the invention
For the defect of above prior art, the invention provides a kind of method and apparatus to sheet substrate carrying out horizontal electroplating technology metal refining.
An object of the present invention seeks a kind of method and apparatus adopting electroplating technology metal refining on crystal silicon solar energy battery, the method and equipment are in the process using electroplating technology metal refining, the negative terminal surface of crystal silicon solar energy battery does not contact any solid, avoid the negative terminal surface of crystal silicon solar energy battery when implementing electroplating technology, due to other contacting solid surfaces and the damage that causes.
Another object of the present invention seeks a kind of method and apparatus adopting electroplating technology metal refining on crystal silicon solar energy battery, the method and equipment simultaneously to negative terminal surface and the positive electrode surface enforcement electroplating technology metal refining of crystal silicon solar energy battery, can simplify the metal electrode generating process of two-sided crystal silicon solar energy battery.
A further object of the present invention seeks a kind of method and apparatus adopting electroplating technology metal refining on crystal silicon solar energy battery, the method and equipment have suitability and practicality widely, namely, the method and equipment both can implement electroplating technology separately in the p-electrode of crystal silicon solar energy battery, also can electroplate in the n-type electrode of crystal silicon solar energy battery separately, or implement electroplating technology simultaneously on the p-type electrode and n-type electrode of crystal silicon solar energy battery.
Last object of the present invention is except seeking a kind of method and apparatus adopting electroplating technology metal refining on crystal silicon solar energy battery, seek the method and apparatus that suitability implements electroplating technology widely in other sheet substrate further, expand range of application of the present invention.
To achieve these goals, the invention discloses one to sheet substrate carrying out horizontal electric plating method and equipment.Disclosed in this invention a kind of be make independent electric bath groove be less than 3 times of width of this sheet substrate at its travel direction at the width moving horizontally direction along sheet substrate to sheet substrate carrying out horizontal electric plating method and equipment, the cathode contacts of electroplating power supply point is placed on the outside of independent electric bath groove.The of the present invention of optimization is make independent electric bath groove be less than the width of this sheet substrate at its travel direction at the width moving horizontally direction along sheet substrate to sheet substrate carrying out horizontal electric plating method and equipment.
One of advantage of the present invention is, due to independent electric bath groove width of the present invention is moving horizontally direction and is less than this sheet substrate travel direction width along sheet substrate, power cathode point of contact needed for electroplating technology is placed on the outside of independent electric bath groove, directly do not contact with electroplate liquid, avoid the negative electrode of electroplating power supply to cause short circuit in independent electric bath groove and between anode.This design of the present invention, not only can make full use of the direct current energy that electroplating technology uses, and can electrolytic coating be made evenly.
Another advantage of the present invention is in the process implementing electroplating technology metal refining of the present invention, the upper surface of sheet substrate can not with any solid contact.When horizontal electroplating technology metal refining method of the present invention is applied in crystal silicon solar energy battery negative pole (n-type surface of crystal silicon solar energy battery) surface deposition metal, namely, when sheet substrate is crystal silicon solar energy battery, this advantage of the present invention seems more outstanding.Such as, the main sensitive surface of current most of crystal silicon solar energy battery is negative pole, and the quality of the main sensitive surface of negative pole is directly connected to the photoelectric transformation efficiency of this crystal silicon solar energy battery.Due to electroplating technology metal refining method of the present invention make the negative terminal surface of crystal silicon solar energy battery not with any solid contact, the negative terminal surface that efficiently avoid crystal silicon solar energy battery may by what be damaged.
Another advantage of the present invention is, the present invention can be used in actual applications very flexibly to sheet substrate carrying out horizontal electric plating method and equipment.When sheet substrate is crystal silicon solar energy battery, of the present inventionly both can implement of the present invention to sheet substrate carrying out horizontal electric plating method in the negative terminal surface of crystal silicon solar energy battery to sheet substrate carrying out horizontal electric plating method and equipment, also can implement of the present invention to sheet substrate carrying out horizontal electric plating method on the positive pole of crystal silicon solar energy battery, more can implement of the present invention to sheet substrate carrying out horizontal electric plating method and equipment on the negative pole of crystal silicon solar energy battery and positive pole simultaneously.Therefore, one of them important advantage of the present invention is, of the present inventionly makes to implement electroplating technology metal refining on the positive pole and negative pole of crystal silicon solar energy battery to sheet substrate carrying out horizontal electric plating method and equipment simultaneously and becomes a reality.
Of the present invention to sheet substrate carrying out horizontal electric plating method and equipment, be highly suitable for the equipment with horizontal protrusive structure.It is simple that horizontal protrusive equipment makes material loading and blanking step become very, is more conducive to the automatization realizing whole production line.
Another advantage of the present invention is that the equipment to the plating of sheet substrate carrying out horizontal of the present invention is very simple.In enforcement electroplating technology metal refining procedure of the present invention, sheet substrate there is one deck electroplate liquid solution, rely on the deadweight of this electroplate liquid solution, sheet substrate can be made closely to be attached on its conductive roller of support, therefore can without the need for roller in the independent electric bath groove implementing electroplating technology metal refining method of the present invention, not only simplify device structure, and save the cost of equipment.
Certainly, of the present invention also have an advantage to be of the present inventionly namely be applicable to continuous plating process metal refining to sheet substrate carrying out horizontal electric plating method, is also applicable to gap electroplating technology metal refining.That is, adopt electroplating technology metal refining method of the present invention, no matter adopt continuous plating process metal refining, or adopt gap electroplating technology metal refining, the result produced can intercommunication.Such as, adopt the result of interval type electroplating technology metal refining of the present invention method in laboratory, without any modification, the horizontal protrusive equipment of scale operation can be applied to.
Accompanying drawing explanation
Fig. 1. the present invention implements the schematic cross-section of electroplating technology to sheet substrate carrying out horizontal electric plating method and equipment to crystal silicon solar energy battery lower surface.
Fig. 2. the present invention implements the schematic cross-section of photoinduction electroplating technology to sheet substrate carrying out horizontal electric plating method and equipment to the n-type electrode of crystal silicon solar energy battery upper surface.
Fig. 3. the present invention implements the schematic cross-section of electroplating technology simultaneously to the n-type electrode of crystal silicon solar energy battery and p-type electrode to sheet substrate carrying out horizontal electric plating method and equipment.
Fig. 4. the schematic cross-section that the present invention one of to apply sheet substrate carrying out horizontal electric plating method and equipment in sheet substrate.
Embodiment
With reference to accompanying drawing, can be described in further details the present invention.Obviously, these explanations are not intended to limit the invention.Do not deviating under the present invention's spirit and real situation thereof, those skilled in the art can make various other according to the present invention and combine accordingly, changes or amendment.These combine accordingly, change and revise all to belong in the protection domain of claims of the present invention.
Fig. 1 illustrates the embodiment that the present invention electroplates the lower surface carrying out horizontal of crystal silicon solar energy battery.In the present embodiment, sheet substrate 100 can be a common crystal silicon solar cell.The feature of so-called common crystal silicon solar cell is that one of them surface of this crystal silicon solar energy battery has positive metal electrode (type-p metal electrode), and there is negative metal electrode (N-shaped metal electrode) on another surface.In the present embodiment, sheet substrate 100 also can be a kind of back electrode crystal silicon solar energy battery (battery that such as Sunpower company produces).The feature of so-called back electrode crystal silicon solar energy battery is, the positive metal electrode (type-p metal electrode) of this crystal silicon solar energy battery and negative metal electrode (N-shaped metal electrode) are all on one of them surface of this crystal silicon solar energy battery.
If sheet substrate 100 is common crystal silicon solar cells, in the present embodiment, make the p-type electrode surface of this crystal silicon solar energy battery downward, contact conductive roller 200, or contact conductive roller 200 and non-conductive roller 300 simultaneously.If sheet substrate 100 is back electrode crystal silicon solar energy batteries, in the present embodiment, make the surface of the metal electrode of this crystal silicon solar (or will metallic surface be plated) downward, contact conductive roller 200, or contact conductive roller 200 and non-conductive roller 300 simultaneously.
The phase same-action of conductive roller 200 and non-conductive roller 300 supports crystal silicon solar energy battery 100.When conductive roller 200 and non-conductive roller 300 rotate, these two kinds of rollers also serve the effect of mobile crystal silicon solar energy battery 100 simultaneously.As shown in Figure 1, conductive roller 200 and non-conductive roller 300 can be the forms that is intervally arranged one by one.Also according to various application, the arrangement form of conductive roller 200 and non-conductive roller 300 can be adjusted flexibly.Such as, can to arrange between two conductive rollers 200 2 or more non-conductive roller 300.Equally, also can at the outer arrangement 2 of a non-conductive roller 300 or more conductive roller 200.
Independent electric bath groove 400 is not more than the width 3 times at its travel direction of crystal silicon solar energy battery 100 at the width of the travel direction along crystal silicon solar energy battery 100.Prioritization scheme of the present invention is, as shown in Figure 1, independent electric bath groove 400 is not more than the width of the travel direction of crystal silicon solar energy battery 100 at the width of the travel direction along crystal silicon solar energy battery 100.
In independent electric bath groove 400, the liquid level 510 of electroplate liquid 500 is controlled in and does not exceed conductive roller 200, or does not exceed non-conductive roller 300.Or the liquid level 510 of electroplate liquid 500 is controlled in and does not exceed conductive roller 200 and non-conductive roller 300 in independent electric bath groove 400 simultaneously.The present invention program optimized is, in independent electric bath groove 400 between under conductive roller 200 and non-conductive roller 300 are sentenced to the maximum 1 to 5 millimeters of the liquid level 510 of electroplate liquid 500.See Fig. 1, the distance 520 between independent electric bath groove 400 highest point and crystal silicon solar energy battery 100 determines the size of the down magnetism of electroplate liquid 500 pairs of transistor solar cells 100.Obviously, this distance 520 is larger, and the magnetism of electroplate liquid 500 pairs of crystal silicon solar energy batteries 100 is larger.The liquid level 510 of independent electric bath groove 400 electrolyte inside 500 is controlled under the object lower than conductive roller 200 and non-conductive roller 300 makes the capillary effect of crystal silicon solar energy battery 100 at electroplate liquid 500, can be close on conductive roller 200 and non-conductive roller 300, guarantee that crystal silicon solar energy battery 100 can be moved reposefully.
Anode 600 in electroplating technology can by being placed on shown in Fig. 1 in independent electric bath groove 400, and in the below of crystal silicon solar energy battery 100.According to various different application, the anode 600 in electroplating technology also can be placed on other place, such as, at crystal silicon solar energy battery 100 lower side.
When crystal silicon solar energy battery 100 to turn left from the right side of Fig. 1 side move time, with reference to Fig. 1, first the lower surface of crystal silicon solar energy battery 100 touches conductive roller 200, after touching conductive roller 200, under the effect of power supply 700 negative pole, the lower surface of crystal silicon solar energy battery 100 is exactly the cathode surface in electroplating technology.When crystal silicon solar energy battery 100 continues to be turned left after side moves, crystal silicon solar energy battery 100 enters the top of independent electric bath groove 400.If there is no system fluctuation, due in independent electric bath groove 400 liquid level 510 of electroplate liquid 500 lower than the height of conductive roller 200 and non-conductive roller 300, so the lower surface of crystal silicon solar energy battery 100 may not reach electroplate liquid 500.Electroplate liquid 500 is touched in order to the lower surface of crystal silicon solar energy battery 100 can be made, electroplate liquid 500 can be made to produce one 100 times at crystal silicon solar energy battery gush, the fluctuation that electroplating device self vibration also can be utilized to produce, makes electroplate liquid 500 touch the lower surface of crystal silicon solar energy battery 100.Once electroplate liquid 500 touches the lower surface of crystal silicon solar energy battery 100, under the surface tension effects of electroplate liquid 500, electroplate liquid 500 will soak rapidly the lower surface of the crystal silicon solar energy battery 100 above plating tank 400.
After electroplate liquid 500 touches crystal silicon solar energy battery 100 lower surface, under the effect of power supply 700, metal ion in electroplate liquid 500 generates solid metal obtain electronics on the conductive area of crystal silicon solar energy battery 100 lower surface after, is deposited on the conductive area of crystal silicon solar energy battery 100 lower surface.On the other hand, be dissolved in electroplate liquid 500 after the anode 600 in independent electric bath groove 400 loses electronics, thus in this system, complete the redox reaction of a complete electroplating technology.
Fig. 1 illustrates a kind of simple electroplating power supply method of attachment of the present invention, and namely the negative pole of electroplating power supply 700 is connected all conductive rollers 200, the positive pole of electroplating power supply 700 connects all anodes 600, forms an independent electroplating technology system.In other applications, can selectively using wherein certain or certain several conductive roller 200 and certain or certain several anode 600 as an independently electroplating technology system.Such as, the negative pole of electroplating power supply 700 can be connected to separately rightmost conductive roller 200 in Fig. 1, the positive pole of electroplating power supply 700 be connected to separately the anode 600 in Fig. 1 in rightmost independence electric bath groove 400, by that analogy.Like this, each independent electric bath groove 400 just defines an independently electroplating technology system, and whole horizontal electric plating method of the present invention and equipment are just containing more than one independent electroplating technology system, there is multiple independent electroplating technology system in other words.The advantage of this method of attachment can control each separately, or the rate of deposition of every several independent electric bath groove.
With reference to Fig. 1, conductive roller 200 of the present invention is in the outside of independent electric bath groove 400, in electroplating process, does not directly contact with electroplate liquid 500, efficiently avoid the short circuit between conductive roller 200 and anode 600.This design of the present invention, electric field in independent electric bath groove 400 can not only be made evenly, in other words, make electrolytic coating at crystal silicon solar energy battery 100 lower surface evenly, and can also effectively avoid on power cathode (conductive roller 200) to generate unnecessary electrolytic coating.
Fig. 2 illustrates the present invention and implements photoinduction plating (LightInducedPlating) embodiment to the n-type electrode of crystal silicon solar energy battery.In the present embodiment, sheet substrate 100 is common crystal silicon solar energy batteries, namely, one of them surface of this crystal silicon solar energy battery 100 is the positive pole (p-type electrode) of this crystal silicon solar energy battery 100, and another surface is the negative pole (n-type electrode) of this crystal silicon solar energy battery 100.Further, in the present embodiment, the upper surface of crystal silicon solar energy battery 100 is n-type electrode faces of this crystal silicon solar energy battery 100.In other words, in fig. 2, when light source 800 pairs of crystal silicon solar energy batteries 100 irradiate, crystal silicon solar energy battery 100 is direct current energy the light energy conversion of light source 800, wherein, the upper surface of crystal silicon solar energy battery 100 is negative poles of this direct current energy, and the lower surface of crystal silicon solar energy battery 100 is positive poles of this direct current energy.
The phase same-action of conductive roller 200 and non-conductive roller 300 supports crystal silicon solar energy battery 100.When conductive roller 200 and non-conductive roller 300 rotate, these two kinds of rollers also serve the effect of mobile crystal silicon solar energy battery 100 simultaneously.As shown in Figure 2, conductive roller 200 and non-conductive roller 300 can be the forms that is intervally arranged one by one.Also according to various application, the arrangement form of conductive roller 200 and non-conductive roller 300 can be adjusted flexibly.Such as, can to arrange between two conductive rollers 200 2 or more non-conductive roller 300.Equally, also can at one, or arrange outside several non-conductive roller 300 2 or more conductive roller 200.
Independent electric bath groove 400 is not more than the width 3 times of crystal silicon solar energy battery 100 at its travel direction at the width of the travel direction along crystal silicon solar energy battery 100.Prioritization scheme of the present invention is, as shown in Figure 2, independent electric bath groove 400 is not more than the width of crystal silicon solar energy battery 100 at its travel direction at the width of the travel direction along crystal silicon solar energy battery 100.
In independent electric bath groove 400, the liquid level 510 of electroplate liquid 500 is controlled in and does not exceed conductive roller 200, or non-conductive roller 300.Or the liquid level 510 of electroplate liquid 500 is controlled in and does not exceed conductive roller 200 and non-conductive roller 300 in independent electric bath groove 400 simultaneously.Prioritization scheme of the present invention is, in independent electric bath groove 400 between under conductive roller 200 and non-conductive roller 300 are sentenced to the maximum 1 to 5 millimeters of the liquid level 510 of electroplate liquid 500.See Fig. 2, the distance 520 between independent electric bath groove 400 and crystal silicon solar energy battery 100 determines the down magnetism of electroplate liquid 500 pairs of transistor solar cells 100.Obviously, this distance 520 is larger, and the magnetism of electroplate liquid 500 pairs of crystal silicon solar energy batteries 100 is larger.The liquid level 510 of electroplate liquid 500 in independent electric bath groove 400 is controlled under the object lower than conductive roller 200 and non-conductive roller 300 makes the capillary effect of crystal silicon solar energy battery 100 at electroplate liquid 500, can be close on conductive roller 200 and non-conductive roller 300, guarantee that crystal silicon solar energy battery 100 and conductive roller 200 have good electronics to contact and can be moved reposefully.
In the present embodiment, as shown in Figure 2, the Anodic 610 in electroplating technology is placed on the top of crystal silicon solar energy battery, and contacts with the plating liquid level 530 on crystal silicon solar energy battery 100 upper surface.Anodic 610 can be different shape, such as, and square Anodic, rectangle Anodic, and cylindrical Anodic.The Anodic optimized is cylindrical Anodic, and this cylindrical Anodic can rotate along crystal silicon solar energy battery 100 travel direction, also can rotate by inverse crystal silicon solar energy battery 100 travel direction.Rotating the advantage of Anodic 610 is, under the condition kept in touch with the plating liquid level 530 on crystal silicon solar energy battery 100 upper surface, not only can avoid producing electroplate liquid 500 crystallisate on Anodic 610, can also effectively utilize Anodic 610.
Electroplate liquid 500 can be transported to crystal silicon solar energy battery 100 upper surface by various method.The simplest method is the upper surface directly being sprayed to crystal silicon solar energy battery 100 by pipeline 900, is formed in the plating liquid level 530 on crystal silicon solar energy battery 100.Also can make otherwise on crystal silicon solar energy battery 100, to form plating liquid level 530, such as, spray and spray pattern.Further, electroplate liquid 500 can first spray on Anodic 610, by trickling to the upper surface of crystal silicon solar energy battery 100 after Anodic 610 again.The advantage of such design to guarantee Anodic 610 and the contact of electroplating liquid level 530 to greatest extent.Certainly, according to the needs of other various application, electroplate liquid 500 also directly can spray the upper surface of crystal silicon solar energy battery 100.
With reference to Fig. 2, under the irradiation of light source 800, crystal silicon solar energy battery 100 produces direct current, and wherein, its upper surface is the negative pole of this battery, and lower surface is the positive pole of this battery.Crystal silicon solar energy battery 100 from the right side of Fig. 2 toward left side mobile after, first the lower surface of crystal silicon solar energy battery 100 touches conductive roller 200.After the lower surface of crystal silicon solar energy battery 100 touches conductive roller 200, and there is plating liquid level 530 in the upper surface of transistor solar cell 100, and after Anodic 610 touches this plating liquid level 530, at the upper surface of crystal silicon solar energy battery 100, the i.e. cathode surface of crystal silicon solar energy battery 100, starts photoinduction plating occurs.In other words, the metal ion in electroplate liquid 500 generates solid metal obtain electronics on the conductive area of crystal silicon solar energy battery 100 upper surface after, is deposited on the conductive area of crystal silicon solar energy battery 100 upper surface.On the other hand, Anodic 610 is dissolved in electroplate liquid 500 after losing electronics, thus in this system, complete the redox reaction of a complete electroplating technology.
In the present embodiment, the effect of the electroplate liquid 500 in independent electric bath groove 400 is not intended for the electroplating medium in electroplating technology, but the surface tension effects utilizing it to produce, crystal silicon solar energy battery 100 can be close on conductive roller 200 and non-conductive roller 300, guarantee that crystal silicon solar energy battery 100 can be moved reposefully.See Fig. 2, the distance 520 between independent electric bath groove 400 and crystal silicon solar energy battery 100 determines the size of the down magnetism of electroplate liquid 500 pairs of transistor solar cells 100.Obviously, this distance 520 is larger, and the magnetism of electroplate liquid 400 pairs of crystal silicon solar energy batteries 100 is larger.When crystal silicon solar energy battery 100 enters the top of independent electric bath groove 400.If do not have system fluctuation, because in independent electric bath groove 400, the liquid level 510 of electroplate liquid 500 is lower than the height of conductive roller 200 and non-conductive roller 300, the lower surface of crystal silicon solar energy battery 100 may not reach electroplate liquid 500.Electroplate liquid 500 is touched in order to the lower surface of crystal silicon solar energy battery 100 can be made, electroplate liquid 500 can be made to produce one 100 times at crystal silicon solar energy battery gush, the fluctuation that electroplating device self vibration also can be utilized to produce, makes electroplate liquid 500 touch the lower surface of crystal silicon solar energy battery 100.Once electroplate liquid 500 touches the lower surface of crystal silicon solar energy battery 100, under the surface tension effects of electroplate liquid 500, electroplate liquid 500 will soak rapidly the lower surface of the crystal silicon solar energy battery 100 above plating tank 400, like this, rely on surface tension, crystal silicon solar energy battery 100 can be moved reposefully.
Fig. 2 illustrates a kind of ball bearing made method of attachment of the present invention, and namely all conductive rollers 200 are joined together, and all Anodics 610 are joined together.In other applications, can selectively wherein certain or certain several conductive roller 200 and certain or certain several Anodic 610 connect into an independently electroplating technology system.Such as, conductive roller 200 rightmost in Fig. 2 can be connected separately with Anodic 610 rightmost in Fig. 2, by that analogy.Like this, each conductive roller 200 forms an independently electroplating technology system with each Anodic 610, namely more than one independent electroplating technology system can be there is in horizontal electric plating method of the present invention and equipment, in other words, multiple independent electroplating technology system can be there is of the present invention to sheet substrate carrying out horizontal electric plating method.
Further, in some other application of the present invention, in order to accelerate the speed of photoinduction electroplating technology metal refining, or in order to reduce photoinduction electroplating technology metal refining to the requirement of the illuminance of light source 800, the method of electroplating technology metal refining of the present invention also can add a direct supply between conductive roller 200 and Anodic 610, formed electrochemistry assist under photoinduction electroplating technology.Electrochemistry fill-in light induction electroplating technology will obtain more detailed description in next embodiment.
Fig. 3 illustrates the present invention simultaneously to the p-type electrode of crystal silicon solar energy battery and the schematic cross-section of n-type electrode enforcement electroplating technology.
In Fig. 3 embodiment, sheet substrate 100 is common crystal silicon solar energy batteries, namely one of them surface of this crystal silicon solar energy battery 100 is the positive pole (p-type electrode) of this crystal silicon solar energy battery 100, and another surface is the negative pole (n-type electrode) of this crystal silicon solar energy battery 100.Further, in the present embodiment, the upper surface of crystal silicon solar energy battery 100 is n-type electrode faces of this crystal silicon solar energy battery 100, and is the main lighting surface of this crystal silicon solar energy battery 100.The p-type electrode surface of this crystal silicon solar energy battery 100 is downward, contact conductive roller 200, or contacts non-conductive roller 300, or contacts conductive roller 200 and non-conductive roller 300 simultaneously.In figure 3, when light source 800 pairs of crystal silicon solar energy batteries 100 irradiate, crystal silicon solar energy battery 100 is direct current energy the light energy conversion of light source 800, wherein, the upper surface of crystal silicon solar energy battery 100 is negative poles of this direct current energy, and the lower surface of crystal silicon solar energy battery 100 is positive poles of this direct current energy.
The phase same-action of conductive roller 200 and non-conductive roller 300 supports crystal silicon solar energy battery 100.When conductive roller 200 and non-conductive roller 300 rotate, these two kinds of rollers also serve the effect of mobile crystal silicon solar energy battery 100 simultaneously.As shown in Figure 3, conductive roller 200 and non-conductive roller 300 can be the forms that is intervally arranged one by one.Also according to various application, the arrangement form of conductive roller 200 and non-conductive roller 300 can be adjusted flexibly.Such as, can to arrange between two conductive rollers 200 2 or more non-conductive roller 300.Equally, also can at the outer arrangement 2 of one or several non-conductive roller 300 or more conductive roller 200.
Independent electric bath groove 400 is not more than the width 3 times of crystal silicon solar energy battery 100 at its travel direction at the width of the travel direction along crystal silicon solar energy battery 100.Prioritization scheme of the present invention is, as shown in Figure 3, independent electric bath groove 400 is not more than the width of crystal silicon solar energy battery 100 at its travel direction at the width of the travel direction along crystal silicon solar energy battery 100.
In independent electric bath groove 400, the liquid level 510 of electroplate liquid 500 is controlled in and does not exceed conductive roller 200, or non-conductive roller 300.Or the liquid level 510 of electroplate liquid 500 is controlled in and does not exceed conductive roller 200 and non-conductive roller 300 in independent electric bath groove 400 simultaneously.The present invention program optimized is, in independent electric bath groove 400 between under conductive roller 200 and non-conductive roller 300 are sentenced to the maximum 1 to 5 millimeters of the liquid level 510 of electroplate liquid 500.See Fig. 3, the distance 520 between independent electric bath groove 400 and crystal silicon solar energy battery 100 determines the size of the down magnetism of electroplate liquid 500 pairs of transistor solar cells 100.Obviously, this distance 520 is larger, and the magnetism of electroplate liquid 500 pairs of crystal silicon solar energy batteries 100 is larger.The liquid level 510 of electroplate liquid 500 in independent electric bath groove 400 is controlled under the object lower than conductive roller 200 and non-conductive roller 300 makes the capillary effect of crystal silicon solar energy battery 100 at electroplate liquid 500, can be close on conductive roller 200 and non-conductive roller 300, guarantee that the lower surface of crystal silicon solar energy battery 100 and conductive roller 200 have good electronics to contact, and can be moved reposefully.
In order to realize implementing plating in the p-type surface of crystal silicon solar energy battery 100 and n-type surface simultaneously, the present invention placed anode in two sides up and down of crystal silicon solar energy battery 100, Anodic 610 and lower anode 620.Lower anode 620 by being placed in independent electric bath groove 400 shown in Fig. 3, also according to various different application, can be placed on other place, such as, at crystal silicon solar energy battery 100 lower side lower anode 620.Anodic 610 is placed on the top of crystal silicon solar energy battery, and contacts with the plating liquid level 530 on crystal silicon solar energy battery 100 upper surface.Anodic 610 can be different shape, such as, and square Anodic, rectangle Anodic, and cylindrical Anodic.The Anodic optimized is cylindrical anode, and this cylindrical anode can be rotated along crystal silicon solar energy battery 100 travel direction, also can rotate by inverse crystal silicon solar energy battery travel direction.The advantage of rotating Anodic 610 is, is keeping, under the condition contacted with the plating liquid level 530 on crystal silicon solar energy battery 100 upper surface, not only can avoiding producing electroplate liquid 500 crystallization on Anodic 610, can also effectively utilizing Anodic 610.
When crystal silicon solar energy battery 100 to turn left from the right side of Fig. 3 side move time, with reference to Fig. 3, first the lower surface of crystal silicon solar energy battery 100 touches conductive roller 200.After touching conductive roller 200, under the effect of power supply 700 negative pole, the lower surface of crystal silicon solar energy battery 100 is exactly the cathode surface in electroplating technology relative to lower anode 620.When crystal silicon solar energy battery 100 continues to be turned left after side moves, crystal silicon solar energy battery 100 enters the top of independent electric bath groove 400.If there is no system fluctuation, due in independent electric bath groove 400 height 510 of electroplate liquid 500 liquid level lower than the height of conductive roller 200 and non-conductive roller 300, so the lower surface of crystal silicon solar energy battery 100 may not reach electroplate liquid 500.Electroplate liquid 500 is touched in order to the lower surface of crystal silicon solar energy battery 100 can be made, electroplate liquid 500 can be made below crystal silicon solar energy battery 100 to produce one gush, the fluctuation that electroplating device self vibration also can be utilized to produce, makes electroplate liquid 500 touch the lower surface of crystal silicon solar energy battery 100.Once electroplate liquid 500 touches the lower surface of crystal silicon solar energy battery 100, under the surface tension effects of electroplate liquid 500, electroplate liquid 500 will soak rapidly the lower surface of the crystal silicon solar energy battery 100 above plating tank 400.
After electroplate liquid 500 touches crystal silicon solar energy battery 100 lower surface, under the effect of power supply 700, metal ion in electroplate liquid 500 generates solid metal obtain electronics on the conductive area of crystal silicon solar energy battery 100 lower surface after, is deposited on the conductive area of crystal silicon solar energy battery 100 lower surface.On the other hand, be dissolved in electroplate liquid 500 after the lower anode 620 in independent electric bath groove 400 loses electronics, thus form the redox reaction of a complete electroplating technology at the lower surface of transistor solar cell 100.
Meanwhile, see Fig. 3, under the irradiation of light source 800, crystal silicon solar energy battery 100 produces direct current, and wherein, its upper surface is the negative pole of this battery, and lower surface is the positive pole of this battery.If the lower surface of crystal silicon solar energy battery 100 continues movement of turning left after touching conductive roller 200, the electroplate liquid 500 flowed out by shower 900 is by the upper surface of wetting transistor solar cell 100, and Anodic 610 touches this plating liquid level 530.After Anodic 610 touches this plating liquid level 530, even without electroplating power supply 710, namely Anodic 610 is directly connected with conductive roller 200, at the conductive area of crystal silicon solar energy battery 100 upper surface, the i.e. cathode surface conductive area of crystal silicon solar energy battery 100, starts photoinduction plating occurs.In other words, the metal ion in electroplate liquid 500 generates solid metal obtain electronics on the conductive area of crystal silicon solar energy battery 100 upper surface after, is deposited on the conductive area of crystal silicon solar energy battery 100 upper surface.On the other hand, Anodic 610 is dissolved in electroplate liquid 500 after losing electronics, thus forms the redox reaction of a complete electroplating technology at the upper surface of crystal silicon solar energy battery 100.
In fact, Fig. 3 illustrates a kind of electrochemistry fill-in light induction electroplating technique.In the process implementing pure photoinduction electroplating technology, the photo-irradiation intensity of light source 800 determines the generated output of crystal silicon solar energy battery 100.In some cases, in order to reach designed rate of deposition, will require to use the light source with high light illumination.After increasing the intensity of illumination of light source 800, the shortcoming of pure photoinduction electroplating technology just displays.Such as, after the high-power light irradiation apparatus of use, not only increase electric cost, generally also need to cool with certain refrigerating unit the heat produced by high-power light irradiation apparatus.These pure photoinduction electroplating technologies can assist photoinduced electroplating technology to solve by electrochemistry of the present invention.
Fig. 3 illustrates the method for electrochemistry fill-in light of the present invention induction electroplating technology, namely between Anodic 610 and conductive roller 200, has added a direct supply 710.Direct supply 710 auxiliary under, the rate of deposition of crystal silicon solar energy battery 100 upper surface is the superposition of the electromotive force that the electromotive force that produces under the irradiation of light source 800 of crystal silicon solar energy battery 100 and direct supply 710 provide, so just greatly reduce the requirement of the intensity of illumination to light source 800, in other words, the shortcoming of pure photoinduction electroplating technology is overcome.Therefore, the advantage of electrochemistry fill-in light induction electroplating technique of the present invention is a simplified application method of the present invention and production cost.
Fig. 3 illustrates a kind of simple electroplating power supply method of attachment of the present invention, and namely the negative pole of electroplating power supply 700 connects all conductive rollers 200, and the positive pole of electroplating power supply 700 connects all lower anodes 620; Be connected with the positive pole of electroplating power supply 710 after all Anodics 610 are connected, the negative pole of electroplating power supply 710 is connected with all conductive rollers 200.Like this, control the output rating of electroplating power supply 700, just can control the lower surface rate of deposition of crystal silicon solar energy battery 100.On the other hand, control the intensity of illumination of light source 800 and the output rating of electroplating power supply 710, just can control the upper surface rate of deposition of crystal silicon solar energy battery 100.In other words, horizontal electro-plating method of the present invention and equipment can control respectively to the rate of deposition of the upper surface of crystal silicon solar energy battery 100 and lower surface rate of deposition.
In other applications, also can use and only use an electroplating power supply, the negative pole of this electroplating power supply be connected all conductive rollers 200, the positive pole of this electroplating power supply is connected all Anodics 610 and all lower anodes 610.
In other application, can selectively wherein certain or certain several conductive roller 200 and certain or certain several Anodic 610, or lower anode 620 connects separately, forms an independently electroplating technology system.Such as, the negative pole of electroplating power supply 700 can be connected to separately rightmost conductive roller 200 in Fig. 3, the positive pole of electroplating power supply 700 is connected to separately the lower anode 620 in Fig. 3 in rightmost independence electric bath groove 400, the positive pole of electroplating power supply 710 is connected with rightmost side Anodic 610, the conductive roller 200 of the negative pole rightmost side of electroplating power supply 710 connects, by that analogy.Like this, each independent electric bath groove 400 and corresponding Anodic 610 and lower anode 620 form an independently electroplating technology system, namely, in horizontal electric plating method of the present invention and equipment, more than one independent electroplating technology system can be there is simultaneously, namely there is multiple independent electroplating technology system simultaneously.The advantage of multiple independent electroplating system is the rate of deposition that can control separately each stage.
Except crystal silicon solar energy battery, the application of the present invention to sheet substrate carrying out horizontal electric plating method and equipment can also expand to other sheet substrate.With reference to accompanying drawing 4, in the embodiment of some electroplating technology metal refining methods of the present invention, sheet substrate 100 is conductors.
The phase same-action of conductive roller 200 and non-conductive roller 300 is support slice substrates 100.When conductive roller 200 and non-conductive roller 300 rotate, these two kinds of rollers also serve the effect of mobile sheet substrate 100 simultaneously.As shown in Figure 4, conductive roller 200 and non-conductive roller 300 can be the forms that is intervally arranged one by one.Also according to various application, the arrangement form of conductive roller 200 and non-conductive roller 300 can be adjusted flexibly.Such as, can to arrange between two conductive rollers 200 2 or more non-conductive roller 300.Equally, also can to arrange outside a non-conductive roller 300 2 or more conductive roller 200.
Independent electric bath groove 400 is not more than the width 3 times of sheet substrate 100 at its travel direction at the width of the travel direction along sheet substrate 100.Prioritization scheme of the present invention is, as shown in Figure 4, independent electric bath groove 400 is not more than the width of sheet substrate 100 at its travel direction at the width of the travel direction along sheet substrate 100.
In independent electric bath groove 400, the liquid level 510 of electroplate liquid 500 is controlled in and does not exceed conductive roller 200, or non-conductive roller 300.Or the liquid level 510 of electroplate liquid 500 is controlled in and does not exceed conductive roller 200 and non-conductive roller 300 in independent electric bath groove 400 simultaneously.The present invention program optimized is, in independent electric bath groove 400 between under conductive roller 200 and non-conductive roller 300 are sentenced to the maximum 1 to 5 millimeters of the liquid level 510 of electroplate liquid 500.See Fig. 4, the distance 520 between independent electric bath groove 400 and sheet substrate 100 determines the size of the down magnetism of electroplate liquid 500 pairs of sheet substrate 100.Obviously, this distance 520 is larger, and the magnetism of electroplate liquid 500 pairs of sheet substrate 100 is larger.The liquid level 510 of electroplate liquid 500 in independent electric bath groove 400 is controlled under the object lower than conductive roller 200 and non-conductive roller 300 makes the capillary effect of sheet substrate 100 at electroplate liquid 500, can be close on conductive roller 200 and non-conductive roller 300, guarantee that sheet substrate 100 and conductive roller have good electronics to contact and can be moved reposefully.
In order to realize implementing plating to the upper surface of sheet substrate 100 and lower surface simultaneously, the present invention placed anode in two sides up and down of sheet substrate 100, Anodic 610 and lower anode 620.Lower anode 620 by being placed in independent electric bath groove 400 shown in Fig. 4, also according to various different application, can be placed on other place, such as, at sheet substrate 100 lower side lower anode 620.Anodic 610 is placed on the top of sheet substrate, and contacts with the plating liquid level 530 on sheet substrate 100 upper surface.Anodic 610 can be different shape, such as, and square Anodic, rectangle Anodic, and cylindrical Anodic.The Anodic 610 optimized is cylindrical Anodics, and this cylindrical Anodic can rotate along sheet substrate 100 travel direction, also can rotate by inverse sheet substrate travel direction.The advantage of rotating Anodic 610 is, is keeping, under the condition contacted with the plating liquid level 530 on sheet substrate 100 upper surface, not only can avoiding producing electroplate liquid 500 crystallization on Anodic 610, can also effectively utilizing Anodic 610.
When sheet substrate 100 to turn left from the right side of Fig. 4 side move time, with reference to Fig. 4, first the lower surface of sheet substrate 100 touches conductive roller 200.After touching conductive roller 200, under the negative pole effect of power supply 720 and power supply 710, sheet substrate 100 is exactly the cathode surface in electroplating technology relative to lower anode 620 and Anodic 610.When sheet substrate 100 continues to be turned left after side moves, sheet substrate 100 enters the top of independent electric bath groove 400.If there is no system fluctuation, due in independent electric bath groove 400 height 510 of electroplate liquid 500 liquid level lower than the height of conductive roller 200 and non-conductive roller 300, so the lower surface of sheet substrate 100 may not reach electroplate liquid 500.Electroplate liquid 500 is touched in order to the lower surface of sheet substrate 100 can be made, electroplate liquid 500 can be made below sheet substrate 100 to produce one gush, the fluctuation that electroplating device self vibration also can be utilized to produce, makes the lower surface of electroplate liquid 500 Contact Thin plate base 100.Once electroplate liquid 500 touches the lower surface of sheet substrate 100, under the surface tension effects of electroplate liquid 500, electroplate liquid 500 will soak rapidly the lower surface of the sheet substrate 100 above independent electric bath groove 400.
After electroplate liquid 500 touches sheet substrate 100 lower surface, under the effect of power supply 720, metal ion in electroplate liquid 500 generates solid metal obtain electronics on the conductive area of sheet substrate 100 lower surface after, is deposited on the conductive area of sheet substrate 100 lower surface.On the other hand, be dissolved in electroplate liquid 500 after the lower anode 620 in independent electric bath groove 400 loses electronics, thus form the redox reaction of a complete electroplating technology at the lower surface of sheet substrate 100.
Meanwhile, see Fig. 4, under the effect of power supply 710, the upper surface of sheet substrate 100 is the negative poles in this electroplating technology relative to Anodic 610.If the lower surface of sheet substrate 100 continues movement of turning left after touching conductive roller 200, the electroplate liquid 500 flowed out by shower 900 is by the upper surface of wetting sheet substrate 100, and Anodic 610 touches this plating liquid level 530, at this moment, start to electroplate at sheet substrate 100 upper surface.In other words, the metal ion in electroplate liquid 500 generates solid metal obtain electronics on the conductive area of sheet substrate 100 upper surface after, is deposited on the conductive area of sheet substrate 100 upper surface.On the other hand, Anodic 610 is dissolved in electroplate liquid 500 after losing electronics, thus forms the redox reaction of a complete electroplating technology at the upper surface of sheet substrate 100.
Fig. 4 illustrates a kind of simple electroplating power supply method of attachment of the present invention, namely electroplating power supply 720 with 710 negative pole be connected all conductive rollers 200, the positive pole of electroplating power supply 720 connects all lower anodes 620, and all Anodics 610 are connected to the positive pole of electroplating power supply 710.Like this, control the output rating of electroplating power supply 720, just can control the lower surface rate of deposition of sheet substrate 100.On the other hand, the output rating of electroplating power supply 710, just can control the upper surface rate of deposition of sheet substrate 100.In other words, horizontal electro-plating method of the present invention and equipment can control rate of deposition and the lower surface rate of deposition of the upper surface of sheet substrate 100 respectively.
Or, in the application of the present invention that some simplify, an electroplating power supply can be used, plating is implemented simultaneously to the upper surface of sheet substrate 100 and lower surface, namely can electroplating power supply 710, or the positive pole of electroplating power supply 720 connects all Anodics 610 and lower anode 620, electroplating power supply 710, or the negative pole of electroplating power supply 720 connects all conductive rollers 200.
In other applications, can selectively wherein certain or certain several conductive roller 200 and certain or certain several Anodic 610, or lower anode 620 connects separately, forms one and independently electroplates system.Such as, the negative pole of electroplating power supply 720 can be connected to separately rightmost conductive roller 200 in Fig. 4, the positive pole of electroplating power supply 720 is connected to separately the lower anode 620 in Fig. 4 in rightmost independence electric bath groove 400, the negative pole of electroplating power supply 710 is connected to separately rightmost conductive roller 200 in Fig. 4, the positive pole of electroplating power supply 710 is connected to separately rightmost Anodic 610 in Fig. 4, by that analogy.Like this, each independent electric bath groove 400 and corresponding Anodic 610 and lower anode 620 form an independently electroplating system, that is, in horizontal electric plating method of the present invention and equipment, can there is more than one independent electroplating system simultaneously.The advantage of multiple independent electroplating system is the rate of deposition that can control separately each stage.
Claims (14)
1. to a sheet substrate carrying out horizontal electric plating method, it is characterized in that below the sheet substrate be plated, have the independent electric bath groove of more than two or two at least along sheet substrate travel direction; Each independent electric bath groove is less than 3 times of length of this sheet substrate at its travel direction at the width of sheet substrate travel direction; Meanwhile, outside two sides of each independent electric bath groove, conductive roller is had.
2. according to claim 1ly it is characterized in that sheet substrate carrying out horizontal electric plating method, the independent electric bath groove of optimization is less than the length of this sheet substrate at its travel direction at the width of sheet substrate travel direction.
3. according to claim 1 and 2 to sheet substrate carrying out horizontal electric plating method, it is characterized in that only can having lower anode in the below of sheet substrate, separately electrochemistry plating implemented to the lower surface of sheet substrate; Also only can there is Anodic above sheet substrate, separately electrochemistry plating be implemented to the upper surface of sheet substrate, or photoinduction plating, or electrochemistry fill-in light induction plating; Can also the below of this sheet substrate and above have lower anode and Anodic simultaneously, electrochemistry plating is implemented respectively to the lower surface of this sheet substrate and upper surface, or photoinduction plating, or electrochemistry fill-in light induction plating simultaneously.
4. according to claim 3ly it is characterized in that sheet substrate carrying out horizontal electric plating method, the electroplate liquid of lower surface contact in independent electric bath groove of this sheet substrate, meanwhile, has lower anode in independent electric bath groove; Above the upper surface of this sheet substrate, there is spray electroplate liquid device, make electroplate liquid soak the upper surface of sheet substrate, and make electroplate liquid keep flowing at the upper surface of sheet substrate, meanwhile, the electroplate liquid liquid level of Anodic contact on sheet substrate upper surface.
5. according to claim 1, described in 2,3 and 4 to sheet substrate carrying out horizontal electric plating method, it is characterized in that, this sheet substrate is crystal silicon solar energy battery.
6. according to claim 1, described in 2,3 and 4 to sheet substrate carrying out horizontal electric plating method, it is characterized in that, the method can be an independent electroplating technology system, or can there is multiple independent electroplating technology system simultaneously.
7., to an equipment for sheet substrate carrying out horizontal plating, comprising:
Below sheet substrate, have the independent electric bath groove of more than two or two at least along sheet substrate travel direction, and each independent electric bath groove is less than 3 times of length of this sheet substrate at its travel direction at the width of sheet substrate travel direction;
Conductive roller is had outside two sides of each independent electric bath groove;
Sheet substrate is by the rotation of conductive roller, or simultaneously by the rotation of conductive roller and non-conductive roller, the opposite side from the side of electroplating device to electroplating device moves.
8. the equipment to the plating of sheet substrate carrying out horizontal according to claim 7, it is characterized in that, the independent electric bath groove of optimization is less than the length of this sheet substrate at its travel direction at the width of sheet substrate travel direction.
9. the equipment to the plating of sheet substrate carrying out horizontal according to claim 7 and 8, it is characterized in that, above described sheet substrate, there is electroplate liquid flusher, make electroplate liquid soak the upper surface of sheet substrate, and remain on the electroplate liquid liquid level on sheet substrate upper surface; Described sheet substrate lower surface is by the natural fluctuation of the electroplate liquid liquid level in independent electric bath groove, or the electroplate liquid liquid fluctuating produced by an external force, or is soaked the lower surface of sheet substrate by the existing electroplate liquid of sheet substrate lower surface.
10. the equipment to the plating of sheet substrate carrying out horizontal according to claim 7, is characterized in that there is Anodic above described sheet substrate, this Anodic and the plating solution contacts on sheet substrate upper surface; Below sheet substrate, have lower anode, and this lower anode is in independent electric bath groove; Or have Anodic and lower anode above and below sheet substrate, wherein, the electroplate liquid liquid level of Anodic contact on sheet substrate upper surface, lower anode is in independent electric bath groove class simultaneously.
11. equipment to the plating of sheet substrate carrying out horizontal according to claim 7, it is characterized in that, above described sheet substrate, or there is illumination apparatus in the below of sheet substrate, for implementing photoinduction plating to the n-type surface of crystal silicon solar energy battery, or electrochemistry fill-in light induction plating is implemented to crystal silicon solar energy battery n-type surface.
12. according to claim 7 and 8 to sheet substrate carrying out horizontal plating equipment, it is characterized in that there is the container of the electroplate liquid overflowed from independent electric bath groove as water conservancy diversion in the below of independent electric bath groove.
13. equipment to the plating of sheet substrate carrying out horizontal according to claim 10, it is characterized in that, the described electroplate liquid liquid fluctuating produced by an external force is provided with electroplate liquid device of up gushing in independent electric bath groove, promotes that electroplate liquid soaks the lower surface of sheet substrate.
14. equipment to the plating of sheet substrate carrying out horizontal according to claim 12, is characterized in that, described Anodic is the cylindrical Anodic rotated.
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| CN114990659A (en) * | 2022-06-08 | 2022-09-02 | 苏州晶洲装备科技有限公司 | Horizontal electroplating device, electroplating method and application of crystalline silicon photovoltaic cell |
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| CN102660761A (en) * | 2012-05-11 | 2012-09-12 | 无锡尚德太阳能电力有限公司 | Solar cell film plating equipment and film plating method |
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| KR101575068B1 (en) * | 2014-09-16 | 2015-12-07 | 주식회사 호진플라텍 | Plating equipment for solar cell substrate using light-induced plating and forward bias plating jointly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102660761A (en) * | 2012-05-11 | 2012-09-12 | 无锡尚德太阳能电力有限公司 | Solar cell film plating equipment and film plating method |
| CN102912397A (en) * | 2012-09-27 | 2013-02-06 | 奥特斯维能源（太仓）有限公司 | Electrofacing method of economical solar cell |
| CN103710734A (en) * | 2012-10-04 | 2014-04-09 | 国际商业机器公司 | Electrodeposition apparatus and method for processing of thin film solar panels |
| KR101575068B1 (en) * | 2014-09-16 | 2015-12-07 | 주식회사 호진플라텍 | Plating equipment for solar cell substrate using light-induced plating and forward bias plating jointly |
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| CN114990659A (en) * | 2022-06-08 | 2022-09-02 | 苏州晶洲装备科技有限公司 | Horizontal electroplating device, electroplating method and application of crystalline silicon photovoltaic cell |
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