CN105538819A - 一种耐高温硅胶板 - Google Patents
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Abstract
本发明公开了一种耐高温硅胶板，包括基体层、耐磨层及耐高温层，所述基体层内部为中空结构，所述中空结构上下面及基体层两面均设置有硅胶层，所述中空结构内部设置有耐高温填充材料，所述基体层、耐磨层及耐高温层通过粘接剂相粘接，并且所述粘接剂为金属基粘合剂，所述耐高温层采用耐火陶瓷纤维制成。通过上述方式，本发明一种耐高温硅胶板，可耐温度为650～800℃，大幅度提高了硅胶板的耐高温特性，可用于建筑装饰中作为装饰板，具有良好的耐火性。
Description
技术领域
本发明涉及硅胶板，特别是涉及一种耐高温硅胶板。
背景技术
硅胶板只是化工行业的简称，全称为薄层层析硅胶板，也叫高抗撕硅胶板。硅胶板是以高品质的薄层层析硅胶为原料，调入一定量的粘结剂喷制成，其板面一般为玻璃。
现有技术中硅胶板在医药、农药、中草药、有机化工产品及粮食、食品的微量杂质及主要成分的鉴定中已得到普遍应用，然后做为一种具有功能性的耐高温硅胶板，其应用并不多见。
发明内容
本发明主要解决的技术问题是提供一种耐高温硅胶板，可耐温度为650～800℃，大幅度提高了硅胶板的耐高温特性，可用于建筑装饰中作为装饰板，具有良好的耐火性。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种耐高温硅胶板，包括基体层、耐磨层及耐高温层，所述基体层内部为中空结构，所述中空结构上下面及基体层两面均设置有硅胶层，所述中空结构内部设置有耐高温填充材料，所述基体层、耐磨层及耐高温层通过粘接剂相粘接，并且所述粘接剂为金属基粘合剂，所述耐高温层采用耐火陶瓷纤维制成。
在本发明一个较佳实例中，所述基体层中空结构的厚度为5～8mm。
在本发明一个较佳实例中，所述硅胶层采用有机硅胶。
在本发明一个较佳实例中，所述硅胶层的厚度为2～4mm。
在本发明一个较佳实例中，所述耐高温填充材料由以下各原料组成：有机硅树脂、云母粉、滑石粉、硅微粒、氧化铝、氧化铁，各原料所占重量百分比为机硅树脂95～100%、云母粉25～25%、滑石粉4～8%、硅微粒10～15%、氧化铝5～10%、氧化铁1.5～2.5%。
在本发明一个较佳实例中，所述金属基粘合剂的厚度为0.5～0.7mm
本发明的有益效果是：本发明一种耐高温硅胶板，可耐温度为650～800℃，大幅度提高了硅胶板的耐高温特性，可用于建筑装饰中作为装饰板，具有良好的耐火性。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1是本发明的耐高温硅胶板一较佳实施例的结构示意图。
具体实施方式
下面将对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
请参阅图1，本发明实施例包括：
一种耐高温硅胶板，包括基体层1、耐磨层2及耐高温层3，所述基体层1内部为中空结构1-1，所述中空结构1-1上下面及基体层1两面均设置有硅胶层4，所述中空结构1内部还设置有耐高温填充材料5，所述基体层1、耐磨层2及耐高温层3通过粘接剂（图中未示出）相粘接，并且所述粘接剂（图中未示出）为金属基粘合剂，所述耐高温层3采用耐火陶瓷纤维制成。
进一步，所述基体层1中空结构1-1的厚度为5～8mm.
上述中，在基体层1内部设置中空结1-1，有效的将基体层两侧的高温进行一个真空隔绝，同时又在中空结构1-1填充耐高温填充材料5，除了在硅胶板外侧家耐高温层3以外，对硅胶板的基体层1再进行内部设计耐高温材料，有效的提高了硅胶板的耐高温温度。
进一步，所述硅胶层4采用有机硅胶并且所述硅胶层4的厚度为2～4mm。
进一步，所述耐高温填充材料由以下各原料组成：有机硅树脂、云母粉、滑石粉、硅微粒、氧化铝、氧化铁，各原料所占重量百分比为机硅树脂95～100%、云母粉25～25%、滑石粉4～8%、硅微粒10～15%、氧化铝5～10%、氧化铁1.5～2.5%。
进一步，所述金属基粘合剂的厚度为0.5～0.7mm，金属粘接剂同样具有耐高温的特性，可全面提高硅胶板的耐高温特性，不存在任何缺陷。
本发明的有益效果是：本发明一种耐高温硅胶板，可耐温度为650～800℃，大幅度提高了硅胶板的耐高温特性，可用于建筑装饰中作为装饰板，具有良好的耐火性。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本发明的专利保护范围内。
Claims (6)
1.一种耐高温硅胶板，其特征在于，包括基体层、耐磨层及耐高温层，所述基体层内部为中空结构，所述中空结构上下面及基体层两面均设置有硅胶层，所述中空结构内部设置有耐高温填充材料，所述基体层、耐磨层及耐高温层通过粘接剂相粘接，并且所述粘接剂为金属基粘合剂，所述耐高温层采用耐火陶瓷纤维制成。
2.根据权利要求1所述的耐高温硅胶板，其特征在于，所述基体层中空结构的厚度为5～8mm。
3.根据权利要求1所述的耐高温硅胶板，其特征在于，所述硅胶层采用有机硅胶。
4.根据权利要求1所述的耐高温硅胶板，其特征在于，所述硅胶层的厚度为2～4mm。
5.根据权利要求1所述的耐高温硅胶板，其特征在于，所述耐高温填充材料由以下各原料组成：有机硅树脂、云母粉、滑石粉、硅微粒、氧化铝、氧化铁，各原料所占重量百分比为机硅树脂95～100%、云母粉25～25%、滑石粉4～8%、硅微粒10～15%、氧化铝5～10%、氧化铁1.5～2.5%。
6.根据权利要求1所述的耐高温硅胶板，其特征在于，所述金属基粘合剂的厚度为0.5～0.7mm。
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| CN104527171A (zh) * | 2015-01-16 | 2015-04-22 | 南京禄浦材料科技有限公司 | 一种硅氟橡胶板及其制备方法 |
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