CN105531095B - Possesses the hot-runner device of thermal expansion compensator - Google Patents
Possesses the hot-runner device of thermal expansion compensator Download PDFInfo
- Publication number
- CN105531095B CN105531095B CN201480049557.2A CN201480049557A CN105531095B CN 105531095 B CN105531095 B CN 105531095B CN 201480049557 A CN201480049557 A CN 201480049557A CN 105531095 B CN105531095 B CN 105531095B
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- China
- Prior art keywords
- nozzle
- resin
- thermal expansion
- distribution plate
- flow distribution
- Prior art date
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Links
- 239000011347 resin Substances 0.000 claims abstract description 93
- 229920005989 resin Polymers 0.000 claims abstract description 93
- 238000009826 distribution Methods 0.000 claims abstract description 65
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 230000037303 wrinkles Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000002687 intercalation Effects 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2725—Manifolds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2725—Manifolds
- B29C2045/2729—Manifolds with thermal expansion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2725—Manifolds
- B29C2045/2733—Inserts, plugs, bushings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C2045/2791—Alignment means between nozzle and manifold
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The present invention provides a kind of hot flow path dress valving for possessing thermal expansion compensator.According to the hot runner valve door gear for possessing thermal expansion compensator of the present invention, the distortion of thermal expansion and the connecting portion of flow distribution plate and resin occurs for the flow distribution plate being heated at high temperature by compensating by heating wire, the resin leakage for preventing gap and causing, simultaneously, by keeping the mobility of resin well, the mechanism stable array between flow distribution plate and nozzle can be ensured with simple structure.
Description
Technical field
The present invention relates to a kind of hot flow path of flow distribution plate from molten resin to the die cavity of mould and nozzle including for injecting
Device, more specifically, be related to it is a kind of prevent because thermal expansion occurs for the flow distribution plate being heated at high temperature by heating wire and flow distribution plate and tree
The phenomenon of the connecting portion distortion of fat, to prevent gap and resin is revealed, thus, keeps the mobility of resin well,
And can ensure that the hot-runner device for possessing thermal expansion compensator of the mechanism stable array between flow distribution plate and nozzle.
Background technology
Typically, the hot-runner device for moulding plastic product, from the clamping cylinder of molten resin to flow distribution plate resin by injection
Raw material, resin stream of the resin raw material being injected into along the difference formation in flow distribution plate equably matches somebody with somebody to postpone to exist supplied to combination
The more than one nozzle of the bottom of flow distribution plate, so that, formed to being formed with for the framed of shaped article by core up and down
Molding space die cavity resin by injection.
In other words, the hot-runner device is the device that the resin of molten condition is injected into mould with liquid condition,
The mould is divided into upper core symmetrical above and below and lower core, and flow distribution plate is connected to being formed in bottom type in upper core
The molding space of core is that die cavity is uniformly injected into resin, possess in the bottom surface of the flow distribution plate it is multiple injection key elements nozzles come to
The die cavity resin by injection of lower mould, so that with high pressure to cavity filling resin.The resin filled if so is cured, then separates
The product of shaping is taken out after the mould of top and the bottom.
Herein, in the resin stream by difference for being internally formed the resin transfer for molten condition of the flow distribution plate,
The heater i.e. heating wire for setting by powering to generate heat around the resin stream is cured come resin.Also, it is formed with
Nozzle mounting hole and resin ostium, nozzle mounting hole are connected to the resin stream, for nozzle guide resin, resin stream
The cylinder for entering hole and injection moulding machine connects to supply molten resin to the resin stream.
Also, the nozzle is configured to its upper end and is connected with the mounting hole of the flow distribution plate and receives resin.The spray
Mouth is divided into pin type (pin type) nozzle and needle-free (pinless) nozzle, pin nozzle and the cylinder for receiving pressure-air
The lifting action linkage of piston, limits the entrance of cylinder, no pin nozzle is using resin because of the end with the nozzle of contacting dies
The phenomenon that the temperature difference in portion is cured and melted.
But, according to the hot-runner device of prior art, because the flow distribution plate manufactured by metal is by heater i.e. heating wire
It is heated at high temperature and produces thermal expansion phenomenon, it may occur that displacement, when displacement acts on the connecting portion of nozzle, occurs in nozzle
Skew (offset) phenomenon of heart distortion.
If in this way, the position distortion of flow distribution plate and nozzle, can produce gap, tree in the connecting portion of flow distribution plate and nozzle
Fat can thus clearance leakage, and occur smoothly to supply the problem of flowing of molten resin and resin has some setbacks.
In order to solve described problem, as prior art, Republic of Korea's granted patent the 10-0669173rd discloses one
Plant " injection moulding machine ", it is proposed that by the sleeve pipe linked together with thermal expansion, also produced even if thermal expansion occurs inside device
The power of raw cushion effect etc. carrys out the scheme that anti-locking apparatus is damaged.
But, according to prior art to prevent technology that the position of the nozzle because of the thermal expansion of flow distribution plate distorts, exist
It is complicated, be difficult to, manufacturing expense rise, be difficult to maintenance the problem of.
The content of the invention
Technical problem
The present invention proposes that its object is to logical there is provided one kind to solve problem of the prior art as described above
The position deviation that overcompensation is produced by the thermal expansion of flow distribution plate in the connecting portion of nozzle, so as to stably keep nozzle
Position, and can ensure that the hot-runner device for possessing thermal expansion compensator to the reliability of product.
Another object of the present invention is to provide one kind to realize economical making and maintenance by simple structure
The hot-runner device for possessing thermal expansion compensator of the convenience of management.
Technical scheme
To reach the purpose, filled according to the hot flow path for possessing thermal expansion compensator of the preferably embodiment of the present invention
Put, including:Flow distribution plate, internally possesses resin stream and nozzle mounting hole, and resin stream is used to make resin transfer, and nozzle is installed
Hole is connected with the resin stream, and with the diameter of expansion;Nozzle, is formed as tube shape, and the upper end of the nozzle is connected to
The die cavity of the nozzle mounting hole of the flow distribution plate, lower end and mould is connected and resin by injection, is internally formed with and the resin
The resin channels of stream connection;And thermal expansion compensator, for compensating the nozzle distorted by the thermal expansion of the flow distribution plate
Position, it is characterised in that the thermal expansion compensator possesses thermal deformation seal cartridge, and the thermal deformation seal cartridge is formed as
Tube shape, and be more than the metal of the flow distribution plate and nozzle by coefficient of thermal expansion and be molded, with the resin stream and resin channels
Resin interface channel with identical diameter run through the thermal deformation seal cartridge inside, the thermal deformation seal cartridge,
Possess:Fixed flange part, is forcibly inserted into the inner face of the nozzle mounting hole;Pipe portion is deformed, it is downward from the fixed flange part
Extension, deformation-compensated gap is formed with the diameter reduced relative to the nozzle mounting hole;And nozzle assembled portion, from institute
State deformation pipe portion to extend downwards, be formed inside the upper end of the nozzle and be connected with resin channels, the nozzle assembled portion with
The mode of being forcibly inserted into is assembled in the setting groove for the diameter for having expansion to resin channels.
As the preferably feature of the present invention, the deformation pipe portion of the thermal deformation seal cartridge is formed as convex to the fixation
Edge has the cylinder tube shape of the thickness reduced, or formed in outer surface the shape of spiral or concavo-convex or wrinkle form so as to
Guided and deformed according to the thermal expansion of the flow distribution plate,
As other preferred features of the present invention, the thermal expansion compensator further comprises lid bushing, the lid bushing
It is the key element around the local tube shape in the outer surface of the thermal deformation seal cartridge, it is close less than the thermal deformation by coefficient of thermal expansion
The metal material of envelope bushing is formed.
As the present invention other preferred features, the lid bushing, including:Liner body portion, upper-end contact is in the warm
The lower end of the fixation flange part of deformable seal bushing, and form deformation-compensated gap in the outer surface of the deformation pipe portion;And
Insertion section, extends downwards, its lower end is assembled in the outside of the upper end of nozzle with inserted mode from the liner body portion.
Beneficial effect
According to the hot-runner device for possessing thermal expansion compensator of the present invention, sprayed by compensating because of the thermal expansion of flow distribution plate
The phenomenon of the position distortion of mouth, so as to prevent the connecting portion in flow distribution plate and nozzle from producing gap, and can be prevented because of tree in advance
Drawback caused by fat leakage.
By simple structure, economy it can make and popularize, and by ensuring the convenience of maintenance, can improve pair
The reliability of product, so that effective effect on industrial circle is also expected very much.
The feature and advantage of the present invention can will be clear and definite by referring to the detailed description of accompanying drawing.Also, this specification and power
The term or word that are used in sharp claimed range shall not be construed as the implication on common dictionary, and based on inventor with optimal
Method illustrate the invention of oneself and can suitably define the principle of the concept of term, should be interpreted that meet the present invention technology think
The implication and concept thought.
Brief description of the drawings
Fig. 1 is the section for illustrating an embodiment of the hot-runner device for possessing thermal expansion compensator according to the present invention
Figure.
Fig. 2 is the enlarged view of the main part for illustrating compensator to the effect of the thermal expansion of the flow distribution plate according to Fig. 1.
Fig. 3 is for illustrating cutting for the other embodiment of the hot-runner device for possessing thermal expansion compensator according to the present invention
Face figure.
Fig. 4 is the enlarged view of the main part for illustrating compensator to the effect of the thermal expansion of Fig. 1 flow distribution plate.
Symbol description
10:Flow distribution plate 11:Resin stream
20:Nozzle 21:Resin stream
30:Thermal expansion compensator 31:Resin interface channel
Embodiment
Hereinafter, with reference to the accompanying drawings of according to the present invention the hot-runner device for possessing thermal expansion compensator be as follows.First,
It should be noted that marking identical reference marks to identical inscape or component in figure.When illustrating the present invention, omit to correlation
Known function or illustrating for structure fog to prevent idea of the invention.
Fig. 1 is the section for illustrating an embodiment of the hot-runner device for possessing thermal expansion compensator according to the present invention
Figure, Fig. 2 is the enlarged view of the main part for illustrating compensator to the effect of the thermal expansion of the flow distribution plate according to Fig. 1.
In figure, hot-runner device of the invention, including:Flow distribution plate 10, resin is received from injection moulding machine (omitting diagram),
By the internal difference of resin stream 11 and resin is guided to nozzle 20;Nozzle 20, is incorporated into the bottom of the flow distribution plate 10,
To the die cavity resin by injection by the mould that core is constituted up and down;Thermal expansion compensator 30, for connecting the flow distribution plate 10 and spray
The key element of mouth 20, is that compensation conjugates to keep the compensation of the phase of nozzle 20 to want because of caused by the thermal expansion of the flow distribution plate 10
Element.
Below, it is described with reference to the hot runner valve for possessing thermal expansion compensator of the preferably embodiment according to the present invention
The structure of door gear.
First, the hot-runner device for possessing thermal expansion compensator of the invention, is generally comprised:Flow distribution plate 10, from being molded into
Type machine receives resin, and multiple nozzles are provided with below;Nozzle 20, is incorporated into below the flow distribution plate 10, receives resin simultaneously
Resin by injection inside to the die cavity of mould;Thermal expansion compensator 30, causes for compensating because of the thermal expansion of the flow distribution plate 10
Flow distribution plate 10 and nozzle 20 connecting portion between addendum modification.
First, the injection machine that uses is the equipment it spued with predetermined pressure after molten resin in the present invention, can be by public affairs
Know that technology is implemented, therefore, detailed description will be omitted.
The resin stream 11 disagreed is internally formed for making the resin transfer of molten condition in flow distribution plate 10, described
The heating wire (omitting diagram) generated heat by powering is buried around resin stream 11 to be cured with the resin of resistance to movement.
Also, nozzle mounting hole 13, the nozzle mounting hole and resin stream are formed with below the flow distribution plate 10
11 connections, for setting nozzle 20, now, the nozzle mounting hole 13 possesses the diameter expanded to the resin stream 11.
Flow distribution plate 10 with above-mentioned structure can be implemented by known technology, therefore detailed description will be omitted.
The upper end of nozzle 20 is connected to the nozzle mounting hole 13 of the flow distribution plate 10 to receive resin, the bottom of nozzle
It is connected with the die cavity of mould, is made up of this, the resin received from the flow distribution plate 10 is guided to die cavity.
The nozzle 20 is the tube shape for being internally formed with the resin channels 21 extended vertically through, and resin can be in resin channels
Interior movement, the diameter of nozzle is tapered into towards following, in the hot line 27 of the outer surface winding heating of nozzle, to prevent along internal tree
The resin that fat passage 21 is moved is cured.
The nozzle 20 constituted as described above is suitably designed deformation according to the form or big I of products formed, can be by known
Technology is implemented, therefore detailed description will be omitted.
As shown in Figures 1 and 2, thermal expansion compensator 30 is the key element of the technical characteristics with the present invention, swollen by heat
The high material of swollen rate and be molded, i.e., the thermal coefficient of expansion of thermal expansion compensator is more than the thermal expansion of the flow distribution plate 10 and nozzle 20
Coefficient.
The thermal expansion compensator 30 of the present embodiment, including:Thermal deformation seal cartridge (gasket bushing) 31, it is pipe
Shape, for making that there is identical diameter with the resin stream 11 of the flow distribution plate 10 and the resin channels 21 of the nozzle 20
Resin interface channel 31a runs through;Lid bushing (cover bushing) 35, around the outer surface of the thermal deformation seal cartridge 31,
Formed by the metal of low thermal expansion, i.e., the thermal coefficient of expansion of lid bushing is less than the thermal expansion system of the thermal deformation seal cartridge 31
Number.
Thermal deformation seal cartridge 31, including:Fixed flange part 31b, is assembled in the flow distribution plate in the way of being forcibly inserted into
The inner face of 10 nozzle mounting hole 13;Pipe portion 31c is deformed, is extended downwards from the fixed flange part 31b, with relative to described
The diameter that nozzle mounting hole 13 reduces forms deformation-compensated gap g;Nozzle assembled portion 31d, it is downward from the deformation pipe portion 31c
Extension, is formed inside the upper end of the nozzle 20 and is connected with resin channels 21, and have to be forcibly inserted into mode and be assembled in
The setting groove 23 for the diameter expanded relative to the resin channels 21.
As illustrated, the fixed flange part 31b is formed in the nozzle mounting hole 13 with being forcibly inserted into mode
The key element of portion upper end, deformation pipe portion 31c is thick described in thickness ratio.By being formed as thicker, the flow distribution plate 10 is by thermal expansion deformation
When, it is that fixed flange part 31b is not easy to deform in thicker part, so that, it can keep being tightly inserted into nozzle peace
Fill the state in hole 13.
Flange part 31b is fixed described in the thickness ratio of the deformation pipe portion 31c thin, thus, in thermal expansion, described point of guiding
Stream plate 10 is swimmingly deformed.The deformation pipe portion 31c forms deformation-compensated gap g in outer surface to compensate by the flow distribution plate 10
Thermal expansion and the displacement that produces, now, the deformation-compensated gap g be with due regard to the coefficient of thermal expansion of the flow distribution plate 10 and
Set, be typically set at 0.1 to 3mm scope.
On the one hand, the deformation pipe portion 31c, as shown in figure 3, it is preferred that forming screw thread or concavo-convex or wrinkle form in outer surface
Shape, thus, can be prevented when being deformed because of the thermal expansion of the flow distribution plate 10 damage.
As illustrated, the nozzle assembled portion 31d is Intercalation in forming the setting groove in the upper end of the nozzle 20
23 composition.Now, the setting groove 23 is connected with resin channels 21, with the diameter expanded to resin channels 21, the spray
Mouth assembled portion 31d is assembled in the setting groove 23 to be forcibly inserted into mode.
Preferably, the nozzle assembled portion 31d is mutually assembled with the setting groove 23 with section-differential insert structure.
Reference picture 2 illustrates the hot-fluid for possessing thermal expansion compensator according to one embodiment of the invention constituted as described above
The effect of duct device, in the state of not occurring thermal expansion shown in the left hand view A such as Fig. 2, the He of resin stream 11 of flow distribution plate 10
The resin channels 21 of nozzle 29 and the resin interface channel 31a of thermal deformation seal cartridge 31 remain configured to the shape on a straight line
State.
In this case, if the flow distribution plate 10 produces thermal expansion by heating wire continuous heating, such as Fig. 2 right part of flg
Shown in B, on the basis of the nozzle 20, the resin stream 11 of flow distribution plate 10 is conjugated towards side.
Now, the thermal deformation seal cartridge 31 of the thermal expansion compensator 30 of the present invention is constituted, as illustrated, corresponding deformation pipe
Portion 31c is deformed according to the thermal expansion deformation amount of the flow distribution plate 10, thus, keep in the same old way the nozzle 20 position it is same
When, compensate the displacement produced by the thermal expansion of the flow distribution plate 10.
I.e. described thermal deformation seal cartridge 31 can stably connect the resin stream 11 that keeps the flow distribution plate 10 and described
The resin channels 21 of nozzle 20, so as to prevent gap, and can prevent resin from revealing.
Fig. 3 is for illustrating cutting for the other embodiment of the hot-runner device for possessing thermal expansion compensator according to the present invention
Face figure, Fig. 4 is enlarged view of the main part of the compensator to the effect of the thermal expansion of Fig. 3 flow distribution plate, and the present embodiment possesses heat
The hot-runner device of expansion appliance and the structure of an above-mentioned embodiment are similar, and wherein supplementary features are, this implementation
The hot-runner device for possessing thermal expansion compensator of example, in the appearance for the thermal deformation seal cartridge 31 for constituting thermal expansion compensator 30
Face is additional to set lid bushing 35.
That is the present embodiment is technically characterized in that, the outer surface of thermal deformation seal cartridge 31 is served as a contrast by the lid of low thermal expansion
Set 35 is surrounded, i.e., the coefficient of thermal expansion of lid bushing is less than the thermal coefficient of expansion of thermal deformation seal cartridge 31, so that, improve thermal deformation close
The mechanical stability of bushing 31 is sealed, and can be suppressed because being damaged caused by drastically deforming.
Illustrate that the thermal deformation seal cartridge 31 and lid bushing 35 of the present embodiment are as follows.
First, thermal deformation seal cartridge 31, including:Fixed flange 31b, the flow distribution plate is assembled in be forcibly inserted into mode
The inner face of 10 nozzle mounting hole 13;Pipe portion 31c is deformed, is extended downwards from the fixed flange part 31b, with to the nozzle
The diameter that mounting hole 13 reduces, so that, form deformation-compensated gap g;Nozzle assembled portion 31d, it is downward from the deformation pipe portion 31c
Extension, is formed inside the upper end of the nozzle 20 and is connected to resin channels 21, be forcibly inserted into mode be assembled in relative to
The resin channels 21 have the setting groove 23 of the diameter of expansion.
The structure of the structure of thermal deformation seal cartridge 31 with said structure and an above-mentioned embodiment is similar, because
This, detailed description will be omitted.
Then, lid bushing 35 is the structure of the characteristic of the present embodiment, and the lid bushing 35 is close around the thermal deformation
The key element of the local tube shape of the outer surface of bushing 31 is sealed, is formed by the metal material of low thermal expansion, i.e. thermal expansion system
Thermal coefficient of expansion of the number less than the thermal deformation seal cartridge 31.
As described in Fig. 3 and Fig. 4, the lid bushing 35, including:Liner body portion 35a, upper end seals with the thermal deformation and served as a contrast
The fixation flange part 31b of set 31 lower end in contact, and deformation-compensated gap g is formed with the outer surface in the deformation pipe portion 31c
Mode set;Insertion section 35b, extends downwards from the liner body portion 35a, and lower end insertion is assembled in outside the upper end of nozzle
Face.
On the one hand, the liner body portion 35a preferably has the diameter reduced to the nozzle mounting hole 13 so that described
The outside in liner body portion and the inner face of the nozzle mounting hole 13 can form gap c when assembling.The gap is used in shunting
Plate 10 occurs to make the liner body portion 35a to deform in the horizontal direction during thermal expansion.
The lid bushing 35 is contacted with the flow distribution plate 10 with nozzle 20 respectively, preferably by the good metal material of thermal conductivity
It is made, and is made up of the coefficient of thermal expansion metal lower than the thermal deformation seal cartridge 31.As one, when thermal deformation sealing
Bushing 13 by Copper fabrication when, the lid bushing 35 is made up of the alloy material containing copper component, and the lid bushing 35 is in lateral branch
Support the thermal deformation seal cartridge 31 and damaged to prevent the thermal deformation seal cartridge 31 from occurring drastically to deform, also, it is described
Lid bushing also does the effect for strengthening the flow distribution plate 10 and the connecting portion of nozzle 20.
The invention is not limited in embodiment described above, applicable position can be changed to use, to the technology of this area
It is clear and definite to carry out various modification and deformation in the thought and scope of the present invention for personnel.And, it is considered that it is such
Variation or modification are come under in scope of the presently claimed invention.
Claims (3)
1. a kind of hot-runner device for possessing thermal expansion compensator, including:
Flow distribution plate, internally possesses resin stream and nozzle mounting hole, and resin stream is used to making resin transfer, nozzle mounting hole with
The resin stream connection, and with the diameter of expansion;
Nozzle, is formed as tube shape, and the upper end of the nozzle is connected to the nozzle mounting hole of the flow distribution plate, lower end and mould
Die cavity is connected and resin by injection, is internally formed with the resin channels being connected with the resin stream;And
Thermal expansion compensator, the position for compensating the nozzle distorted by the thermal expansion of the flow distribution plate, it is characterised in that
The thermal expansion compensator possesses thermal deformation seal cartridge, and the thermal deformation seal cartridge is formed as tube shape, and by heat
Expansion rate is more than the metal of the flow distribution plate and nozzle and is molded, and has identical diameter with the resin stream and resin channels
Resin interface channel run through the inside of the thermal deformation seal cartridge, the thermal deformation seal cartridge possesses:Fixed flange
Portion, is forcibly inserted into the inner face of the nozzle mounting hole;Pipe portion is deformed, is extended downwards from the fixed flange part, with relative
Deformation-compensated gap is formed in the diameter of nozzle mounting hole reduction;And nozzle assembled portion, from it is described deformation pipe portion to
Lower extension, is formed inside the upper end of the nozzle and is connected with resin channels, and the nozzle assembled portion is to be forcibly inserted into mode
The setting groove for the diameter that there is expansion to resin channels is assembled in,
The thermal expansion compensator further comprises lid bushing, and the lid bushing is the appearance around the thermal deformation seal cartridge
The key element of the local tube shape in face, the metal material by coefficient of thermal expansion less than the thermal deformation seal cartridge is formed.
2. the hot-runner device according to claim 1 for possessing thermal expansion compensator, it is characterised in that the thermal deformation is close
The deformation pipe portion of envelope bushing is formed as the cylinder tube shape for having the thickness reduced to the fixed flange part, or in outer surface
The shape for forming spiral or concavo-convex or wrinkle form deforms to be guided according to the thermal expansion of the flow distribution plate.
3. the hot-runner device according to claim 1 for possessing thermal expansion compensator, it is characterised in that the lid bushing,
Including:
Liner body portion, upper-end contact is in the lower end of the fixation flange part of the thermal deformation seal cartridge, and in the deformation tube
The outer surface in portion forms deformation-compensated gap;And
Insertion section, extends downwards from the liner body portion, and lower end is assembled in the outside of the upper end of nozzle with inserted mode.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0108166 | 2013-09-09 | ||
KR1020130108166A KR101452133B1 (en) | 2013-09-09 | 2013-09-09 | Hot Runner System |
PCT/KR2014/008306 WO2015034281A1 (en) | 2013-09-09 | 2014-09-04 | Hot runner system including thermal expansion compensation device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105531095A CN105531095A (en) | 2016-04-27 |
CN105531095B true CN105531095B (en) | 2017-08-22 |
Family
ID=51998049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201480049557.2A Expired - Fee Related CN105531095B (en) | 2013-09-09 | 2014-09-04 | Possesses the hot-runner device of thermal expansion compensator |
Country Status (5)
Country | Link |
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US (1) | US20160214296A1 (en) |
JP (1) | JP6187840B2 (en) |
KR (1) | KR101452133B1 (en) |
CN (1) | CN105531095B (en) |
WO (1) | WO2015034281A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101678280B1 (en) * | 2014-11-14 | 2016-11-21 | 김혁중 | Manufacturing method of frp core |
IT201700076433A1 (en) * | 2017-07-07 | 2019-01-07 | INJECTION GROUP WITH SHUTTER PIN, FOR INJECTION MOLDING OF PLASTIC MATERIAL, WITH THE ABILITY TO RECOVER THERMAL EXPANSION AND TO AVOID PLASTIC MATERIAL LEAKAGE | |
KR102011214B1 (en) | 2018-03-09 | 2019-10-14 | 김혁중 | Hot Runner Valve System |
WO2019190295A1 (en) * | 2018-03-30 | 2019-10-03 | 김혁중 | Hot runner valve apparatus for a multi-cavity mold |
DE102018208638A1 (en) * | 2018-05-30 | 2019-12-05 | Ford Global Technologies, Llc | Angular system for injection molding |
JP7099119B2 (en) * | 2018-07-20 | 2022-07-12 | セイコーエプソン株式会社 | Injection molding equipment and injection molding method |
CN110513551B (en) * | 2019-09-03 | 2021-03-02 | 拓洪管道材料(昆山)有限公司 | Self-adaptive pipeline sealing device |
FI129842B (en) | 2019-12-30 | 2022-09-30 | Sjor Oy | Injection mould for plastic products and method of using an injection mould |
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EP1300232A1 (en) * | 2001-10-04 | 2003-04-09 | Quaser S.r.L | Hot-runner - injector nozzle assembly for plastic material injection molds |
CN1646293A (en) * | 2002-02-04 | 2005-07-27 | 标准模具有限公司 | Thermal seal between manifold and nozzle |
CN202448296U (en) * | 2011-10-19 | 2012-09-26 | 哈希斯热流道科技(苏州)有限公司 | Mould injection device with automatic nozzle centering device |
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JPH05116184A (en) * | 1991-10-25 | 1993-05-14 | Sony Corp | Injection-molding die nozzle |
JPH10166393A (en) * | 1996-12-16 | 1998-06-23 | Sekisui Chem Co Ltd | Die for injection-molding |
CA2205978C (en) * | 1997-05-23 | 2005-01-18 | Jobst Ulrich Gellert | Connector bushing for injection molding manifolds |
US7189071B2 (en) * | 2003-02-12 | 2007-03-13 | Mold-Masters Limited | Telescopic manifold nozzle seal |
KR100791909B1 (en) * | 2006-04-10 | 2008-01-07 | 유도실업주식회사 | The moving protector of nozzle so as to minimise the probability of error due to thermal expansion |
KR200458611Y1 (en) * | 2009-11-03 | 2012-03-07 | 핫몰드 엔지니어링주식회사 | The thermal expansibility absorbing device for spraying resin that use of an injection molding machine |
KR101410016B1 (en) * | 2012-01-20 | 2014-06-27 | 주식회사 유도 | Thermal Expansivity Preventing Device of Hotrunner System |
-
2013
- 2013-09-09 KR KR1020130108166A patent/KR101452133B1/en active IP Right Grant
-
2014
- 2014-09-04 JP JP2016540809A patent/JP6187840B2/en not_active Expired - Fee Related
- 2014-09-04 WO PCT/KR2014/008306 patent/WO2015034281A1/en active Application Filing
- 2014-09-04 US US14/917,361 patent/US20160214296A1/en not_active Abandoned
- 2014-09-04 CN CN201480049557.2A patent/CN105531095B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1300232A1 (en) * | 2001-10-04 | 2003-04-09 | Quaser S.r.L | Hot-runner - injector nozzle assembly for plastic material injection molds |
CN1646293A (en) * | 2002-02-04 | 2005-07-27 | 标准模具有限公司 | Thermal seal between manifold and nozzle |
CN202448296U (en) * | 2011-10-19 | 2012-09-26 | 哈希斯热流道科技(苏州)有限公司 | Mould injection device with automatic nozzle centering device |
Also Published As
Publication number | Publication date |
---|---|
US20160214296A1 (en) | 2016-07-28 |
CN105531095A (en) | 2016-04-27 |
JP6187840B2 (en) | 2017-08-30 |
KR101452133B1 (en) | 2014-10-16 |
WO2015034281A1 (en) | 2015-03-12 |
JP2016532583A (en) | 2016-10-20 |
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