CN105489599B - Global illuminating formula LED filament - Google Patents
Global illuminating formula LED filament Download PDFInfo
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- CN105489599B CN105489599B CN201510916614.9A CN201510916614A CN105489599B CN 105489599 B CN105489599 B CN 105489599B CN 201510916614 A CN201510916614 A CN 201510916614A CN 105489599 B CN105489599 B CN 105489599B
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- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000000843 powder Substances 0.000 claims abstract description 20
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 15
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 21
- -1 potassium hydroxide silicon alkoxide Chemical class 0.000 claims description 13
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 229920003216 poly(methylphenylsiloxane) Polymers 0.000 claims description 9
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 8
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 7
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- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 5
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 5
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- 239000003963 antioxidant agent Substances 0.000 claims description 5
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- 239000005083 Zinc sulfide Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
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- RSNQKPMXXVDJFG-UHFFFAOYSA-N tetrasiloxane Chemical compound [SiH3]O[SiH2]O[SiH2]O[SiH3] RSNQKPMXXVDJFG-UHFFFAOYSA-N 0.000 claims description 3
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- 244000247747 Coptis groenlandica Species 0.000 description 2
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
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- 238000011161 development Methods 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
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- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
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- 230000017260 vegetative to reproductive phase transition of meristem Effects 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
This patent discloses a kind of LED filaments existing in the prior art, and in particular to a kind of global illuminating formula LED filament.Global illuminating formula LED filament, including strip transparent substrate, it is fixed on the metallic support at transparent substrate both ends, several blue-light LED chips are fixed on transparent substrate, the blue-light LED chip forms at least one column and goes here and there through the LED of transparent substrate, is concatenated between the adjacent blue-light LED chip in same LED string using conducting wire；Blue-light LED chip positioned at transparent substrate both ends uses conducting wire to connect with metallic support respectively；Red phosphor layer is also enclosed with outside the transparent substrate, the Red phosphor layer is mixed by red fluorescence powder and glue crosslinking agent.This patent overcomes that the angle of emergence existing in the prior art is small, the low technological deficiency of light emission rate, provides a kind of LED filament for realizing that full angle is luminous.
Description
Technical field
The present invention relates to a kind of LED filaments, and in particular to a kind of global illuminating formula LED filament.
Background technique
Luminous environment is one of indispensable important physical environmental factors of plant growth and development, is adjusted by light quality, control
Plant forms build up be facility cultivation field an important technology;Plant growth lamp more has the function of environmental protection and energy saving, LED
Plant lamp provides photosynthesis to plant, promotes plant growth, shortens the time of flowering of plant result, improves production.Existing
In generationization construction, plant growth lamp is the indispensable product of crops.
It is also more and more extensive in order to meet the application of the needs of different, especially plant growth lamp, still, due to being passed
Common LED of uniting combines, and manufacturing process is complicated, and power consumption is excessively high, appearance unsightly equal limitation, and LED conventional package product is not
It is easy to implement wide-angle to shine, is unfavorable for being widely used on a large scale in plant growth lighting, in the prior art in encapsulation LED core
When piece, use fluorescent powder and glue crosslinking agent mixture as encapsulation outer covering layer more.
Summary of the invention
The invention is intended to provide a kind of LED filament that can be realized full angle and shine.
Global illuminating formula LED filament in this programme, including strip transparent substrate, are fixed on transparent substrate both ends
Metallic support, several blue-light LED chips are fixed on transparent substrate, and the blue-light LED chip forms at least one column through transparent
The LED of substrate goes here and there, and is concatenated between the adjacent blue-light LED chip in same LED string using conducting wire；Indigo plant positioned at transparent substrate both ends
Light LED chip uses conducting wire to connect with metallic support respectively；
Red phosphor layer is also enclosed with outside the transparent substrate, the Red phosphor layer is by red fluorescence powder and glue
Connection agent mixes；The glue crosslinking agent is prepared by the raw material of following parts by weight: 72 parts of epoxy resin, polyphenylene oxide powder 18-
22 parts, 4 parts of methyl phenyl silicone oil, nano-zinc sulfide 0.2-0.4, mass concentration 30-40% nano-ceramic powder transparency liquid 6-
8, nano-titanium dioxide 4-5, benzoyl peroxide 0.1-0.2, maleic anhydride 0.4-0.5, silane coupling agent 0.1-0.2, chloroform
0.01-0.02 parts of antioxidant, 20-25 parts of curing agent.
Using technical solution of the present invention, have the following technical effect that
Using blue light excitated red fluorescent powder, the simulation sunlight for suitably facilitating plant growth is generated, LED chip light emitting is strong
Degree is big, and substrate uses transparent material, and a filament can be realized 360 degree of omnidirectionals and shine, can be driven by external power supply, controls
LED filament processed output size of current realizes that the light into plant growth wavelength is urged in sending, easy to promote and utilize.
Crossing obtained polyphenylene oxide material after the grafting of the raw materials such as maleic anhydride, nano-titanium dioxide, not only to maintain its excellent low
Dielectric, low-loss, high heat resistance performance, and the compatibility of itself and epoxy resin is improved, and improves conventional epoxies work
For the defect of encapsulating material, the nano-zinc sulfide of blending has good optical property, and light transmittance and refractive index are high, can be effective
The luminous intensity that goes out of lamps and lanterns is improved, the nano-ceramic powder transparency liquid of addition can effectively improve the mechanical property of material, improve fine and close
Degree and thermal stability, the glue crosslinking agent in the present invention as LED encapsulation material with excellent mechanical property and dielectric properties, it is resistance to
Heat, light aging, long service life are economical and practical.
Further, the methyl phenyl silicone oil is prepared by the raw material of following parts by weight: methyl phenyl siloxane mixing
20~30 parts of ring body, 20~30 parts of octamethylcy-clotetrasiloxane, 20~30 parts of tetramethyl-ring tetrasiloxane, tetramethyl divinyl
10~20 parts of disiloxane, 5~9 parts of potassium hydroxide silicon alkoxide, 1~5 part of organophosphorus ester.
Compared with prior art, Component Source is wide, easily obtains, and matches rationally；Preparation method is simple, is easily achieved, and
Using optimal synthetic technological condition, the methyl phenyl silicone oil being used in LED casting glue being prepared has property steady
Calmly, the advantages that adhesive property is good, refractive index is big, highly transparent is particularly suitable for industrialization.
Further, the glue crosslinking agent further includes 15~25 parts of methyl vinyl phenyl silicone oil, and methyl vinyl phenyl is organic
45~55 parts of silicone resin, 10~20 parts of aminomethyl phenyl organosilicon cross-linking agent, 4~10 parts of platinum catalyst, inhibitors 4~12 part.
With the aminomethyl phenyl organosilicon polymer with good heat resistance, weatherability, cold-resistant thermal impact and durability,
Cycloaliphatic epoxy resin is obtained instead of traditional heat resistance, weatherability and poor moisture resistance and easily xanthochromia, and each component scientific allocation is closed
Reason, the obtained LED glue crosslinking agent light transmittance of the present invention is high, index of refraction is big, and extensibility, tensile strength, adhesion strength are good, and service life
It is long.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of global illuminating of embodiment of the present invention formula LED filament.
Fig. 2 is the side structure schematic diagram of global illuminating of embodiment of the present invention formula LED filament.
Specific embodiment
Below by specific embodiment, the present invention is described in further detail:
Embodiment one
Embodiment is basic as shown in attached drawing 1,2: the present embodiment global illuminating formula LED filament includes strip transparent substrate
2, it is fixed on the metallic support 1 at transparent substrate both ends, multiple blue-light LED chips 3, multiple blue-ray LEDs are fixed on transparent substrate
Chip forms at least one column and goes here and there through the LED of transparent substrate, is connected between the blue-light LED chip of every LED string using conducting wire 5
Cascade；Blue-light LED chip positioned at transparent substrate both ends 4 is wired to bracket respectively；
Also be enclosed with Red phosphor layer 6 outside the transparent substrate, the Red phosphor layer by red fluorescence powder and
Glue crosslinking agent mixes.
In use, the metallic support at transparent substrate both ends is connect with power positive cathode respectively, two metallic supports and company
The LED string electrical connection being made of blue-light LED chip between metallic support is connect, due to concatenated characteristic and LED after energization
Luminous intensity only with it is current related, whole blue-light LED chips issue the identical blue light of brightness, since substrate is transparent, complete
Illumination all can be obtained into range, Red phosphor layer is enclosed with outside transparent substrate, Red phosphor layer not only wraps up thoroughly
Bright substrate, also wraps up whole blue-light LED chips, and the blue light that blue-light LED chip issues obtains after the optical filtering of Red phosphor layer
To the white light for being similar to sunlight required for plant illumination, wherein the red fluorescence powder wavelength in Red phosphor layer is usually
In two wavelength bands of 610-680nm or 420-480nm.
Transparent substrate material can be simple glass, preferred hardness height, the transparent sapphire material good to blue light translucency
As baseplate material, pad can be set on transparent substrate to facilitate fixed blue-light LED chip and welding lead, transparent substrate
Cut lengths are preferably arranged to 1~6cm of length, 0.6~50mm of width, thickness control within the scope of 0.2 to 3 millimeter, preferably set
Set the mechanical strength for guaranteeing filament with a thickness of 0.4~2mm and preferable light transmittance.
Connection between blue-light LED chip and with metallic support is using plain conductors such as gold thread, copper wire, in connection,
Conductor length had better not be set as shortest straight line, and should be winding arc or fold-line-shaped etc. as shown in Figure 1, due to
It after the Red phosphor layer for wrapping up semifixed form, needs to heat in subsequent solidification process, glass or gold in heating process
Belong to bracket and be easy to happen deformation, may cause exceptionally straight filament and break, therefore the conducting wire of welding should be ensured that comparable have more than needed
Length.
The manufacturing method of above-mentioned omnidirectional's plant growth lamp LED filament of the present invention includes the following steps:
Step 1. makes strip transparent substrate as filament carrier, and transparent substrate two sides are respectively fixedly connected with metal branch
Frame；Strip transparent substrate can use sapphire crystal cutting production, by the sapphire crystal of bulk be divided into length 1~
The strip of 6cm, 0.6~50mm of width, thickness control at 0.2 to 3 millimeter, (pad).Metallic support usually uses aluminium or copper etc.
It is made, every root long bar shaped substrate needs two metallic supports, is separately mounted to substrate two sides, the length of metal substrate guarantees
Extend transparent substrate, as subsequent electrode connection points.
Step 2. fixes multiple blue-light LED chips on the transparent substrate, and multiple blue-light LED chips, which form at least one column, to be run through
The LED of transparent substrate goes here and there, according to the size of the width of substrate and blue-light LED chip, can be arranged on the transparent substrate a column or
Multiple row LED string, cascade ensure that the luminous uniformity of LED light, utilize conducting wire between the blue-light LED chip of every LED string
Connect into cascade；Blue-light LED chip positioned at transparent substrate both ends is wired to metallic support respectively, and conducting wire can be with
Using gold thread or copper wire etc..
Step 3. is uniformly mixed with the red fluorescence powder of about 0.1%~15% weight ratio with transparent silica gel or transparent mould sealing
It closes, and bubble is vacuumized and gone to mixture colloid；
Light granule proliferation, such as resin and PC engineering plastics can be preferably mixed in step 3 in mixture colloid
The weight ratio of grain etc., incorporation light granule proliferation is normally controlled in 0.05-10%, and being preferable to provide is 0.25%~5%.Plant is raw
For long lamp LED filament by the same blue chip of light granule proliferation, the mixed lights such as red fluorescence powder determine that botany growth institute's light requirement is special
Property, it improves the light transmittance of Red phosphor layer, improve uniformity of luminance by increasing scattering angle, realization is urged to be needed into plant growth
The wavelength wanted and omnibearing luminous, simultaneously as the incorporation light granule proliferation of light granule proliferation can also improve mixture colloid
Mixing machinery intensity.
The external member that the transparent substrate that step 2 obtains and metallic support form is put into filament mold by step 4., to mold
Mixture colloid obtained in middle injection step 3 takes out solidification, forms filament clad.
The fixed metallic support for welding line and transparent substrate external member can be put into the lamp of well in advance by step 4 using fixture
In silk mold, under the action of mold or dispenser, the mixture colloid containing red fluorescence powder that injection step 3 obtains, to
After mixture colloid slightly solidifies, the semi-finished product for having wrapped up mixture colloid are taken out using fixture, are planted after being heating and curing
The LED light wire type product of object growth lamp.
Embodiment two
The glue crosslinking agent further includes that the raw material of following parts by weight is prepared: 72 parts of epoxy resin, polyphenylene oxide powder 18-22
Part, 4 parts of methyl phenyl silicone oil, nano-zinc sulfide 0.2-0.4, mass concentration 30-40% nano-ceramic powder transparency liquid 6-8,
Nano-titanium dioxide 4-5, benzoyl peroxide 0.1-0.2, maleic anhydride 0.4-0.5, silane coupling agent 0.1-0.2, chloroform are anti-
0.01-0.02 parts of oxygen agent, 20-25 parts of curing agent.
The preparation method comprises the following steps:
(1) polyphenylene oxide powder is first subjected to pre-irradiation processing, radiation parameter are as follows: using electron accelerator as irradiation bomb,
It is irradiated processing using β ray under room temperature, normal pressure, air atmosphere, pre-irradiation dosage range is 20kGy, obtains pre-irradiation polyphenyl
Ether material；
(2) by the polyphenylene oxide material and maleic anhydride, silane coupling agent, nano-titanium dioxide, benzoyl peroxide first after pre-irradiation
Acyl, antioxidant put into blender high speed together and are uniformly mixed, and then put into extruding pelletization in double screw extruder together,
Obtain grafted polyphenylene ether material；
(3) grafted polyphenylene ether, bisphenol A type epoxy resin and the other residues in addition to curing agent DDS for preparing step (2)
Material is put into chloroform together, is warming up to 120 DEG C, and 1.5h is mixed, and is then cooled to 100 DEG C, puts into curing agent DDS, after
Continuous to be stirred sizing material heat preservation after 20min and handle through vacuum defoamation, the sizing material after deaeration pours into mold, in 150 DEG C of items
It is fully cured under part to obtain the final product.
Glue crosslinking agent obtained by the present embodiment, measured performance indicator are as follows:
Refractive index: 1.530；Light transmittance: 85.4%；Tensile strength: 47.4MPa.
Ultraviolet resistance burn-in test: test condition:, selecting the ultraviolet lamp of UVB313 model by 60 ± 5 DEG C of specimen surface temperature,
Irradiation intensity is 1.5kwh/m2, and irradiation time is respectively 0h, 720h, 1500h, 2000h, the yellowness index of sequentially determining material
With the variation of visible light transmittance, test result are as follows:
Irradiation time 720h, 1500h, 2000h, yellowness index are respectively 1.2,2.2,3.4, it is seen that light transmission rate variation
Rate -4.3%, -6.8%, -10.8%.
Embodiment three
The preparation method of the methyl phenyl silicone oil is as follows:
Parts by weights meter weighs component are as follows: and 30 parts of aminomethyl phenyl mixed methylcyclosiloxane, 30 parts of octamethylcy-clotetrasiloxane, tetramethyl
20 parts of cyclotetrasiloxane, 10 parts of tetramethyl divinyl disiloxane, 5 parts of potassium hydroxide silicon alkoxide, 5 parts of organophosphorus ester.
Then, methyl phenyl silicone oil is prepared: (1) by aminomethyl phenyl mixed methylcyclosiloxane, octamethylcy-clotetrasiloxane, tetramethyl-ring
Tetrasiloxane, tetramethyl divinyl disiloxane are added in reactor, under the conditions of temperature is 60 DEG C, pressure is -0.1MPa
It is dehydrated 2h；(2) dewatered mixture is warming up to 180 DEG C, potassium hydroxide silicon alkoxide catalysis is added, be 185 DEG C in temperature
Under conditions of balanced reaction 8h；(3) to after completion of the reaction, be proportionally added into reactor in organophosphorus ester and 2.5h,
Then heating abjection low-molecular material, filtering can be obtained methyl phenyl silicone oil.
The present embodiment light transmittance refractive index storage stability solidified body bonding force indicates as follows:
What has been described above is only an embodiment of the present invention, and the common sense such as well known specific structure and characteristic are not made herein in scheme
Excessive description.It, without departing from the structure of the invention, can be with it should be pointed out that for those skilled in the art
Several modifications and improvements are made, these also should be considered as protection scope of the present invention, these all will not influence what the present invention was implemented
Effect and patent practicability.The scope of protection required by this application should be based on the content of the claims, in specification
The records such as specific embodiment can be used for explaining the content of claim.
Claims (3)
1. global illuminating formula LED filament, it is characterised in that: including strip transparent substrate, be fixed on transparent substrate both ends
Metallic support, several blue-light LED chips are fixed on transparent substrate, and the blue-light LED chip forms at least one column through transparent
The LED of substrate goes here and there, and is concatenated between the adjacent blue-light LED chip in same LED string using conducting wire；Indigo plant positioned at transparent substrate both ends
Light LED chip uses conducting wire to connect with metallic support respectively；Red phosphor layer is also enclosed with outside the transparent substrate, it is described red
Color phosphor powder layer is mixed by red fluorescence powder and glue crosslinking agent；The glue crosslinking agent is prepared by the raw material of following parts by weight:
72 parts of epoxy resin, 18-22 parts of polyphenylene oxide powder, 4 parts of methyl phenyl silicone oil, nano-zinc sulfide 0.2-0.4, mass concentration exist
Nano-ceramic powder transparency liquid 6-8, nano-titanium dioxide 4-5, the benzoyl peroxide 0.1-0.2, maleic anhydride of 30-40%
0.4-0.5, silane coupling agent 0.1-0.2,0.01-0.02 parts of chloroform antioxidant, 20-25 parts of curing agent；The system of the glue crosslinking agent
Preparation Method are as follows: (1) polyphenylene oxide powder is first subjected to pre-irradiation processing, radiation parameter are as follows: using electron accelerator as irradiation bomb,
It is irradiated processing using β ray under room temperature, normal pressure, air atmosphere, pre-irradiation dosage range is 20kGy, obtains pre-irradiation polyphenyl
Ether material；(2) by after pre-irradiation polyphenylene oxide material and maleic anhydride, silane coupling agent, nano-titanium dioxide, benzoyl peroxide,
Chloroform antioxidant puts into blender high speed together and is uniformly mixed, and then puts into double screw extruder to squeeze out together and make
Grain, obtains grafted polyphenylene ether material；(3) grafted polyphenylene ether, epoxy resin and the other residues in addition to curing agent for preparing step (2)
Material is put into together in chloroform antioxidant, is warming up to 120 DEG C, and 1.5h is mixed, and is then cooled to 100 DEG C, puts into curing agent,
Continue to keep the temperature sizing material after being stirred 20min and handle through vacuum defoamation, the sizing material after deaeration pours into mold, at 150 DEG C
Under the conditions of it is fully cured to obtain the final product.
2. global illuminating formula LED filament according to claim 1, it is characterised in that: the methyl phenyl silicone oil by with
The raw material of lower parts by weight is prepared: 20~30 parts of methyl phenyl siloxane mixed methylcyclosiloxane, octamethylcy-clotetrasiloxane 20~30
Part, 20~30 parts of tetramethyl-ring tetrasiloxane, 10~20 parts of tetramethyl divinyl disiloxane, potassium hydroxide silicon alkoxide 5~9
Part, 1~5 part of organophosphorus ester.
3. global illuminating formula LED filament according to claim 2, it is characterised in that: the glue crosslinking agent further includes methyl
15~25 parts of vinyl phenyl silicone oil, 45~55 parts of methyl vinyl phenyl organic siliconresin, aminomethyl phenyl organosilicon cross-linking agent
10~20 parts, 4~10 parts of platinum catalyst, inhibitors 4~12 part.
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