CN105489520A - Small sampling system-based wafer measuring sampling method - Google Patents
Small sampling system-based wafer measuring sampling method Download PDFInfo
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Abstract
The invention discloses a small sampling system-based wafer measuring sampling method. The method includes the following steps of: determining if a processing batch is a valuable batch, and determining if a type of the current processing batch firstly reaches the measurement station; determining if the valuable batch reaches the measurement station during a first reference time interval after the processing batch reaches the measurement station; further determining if the valuable batch reaches the measurement station during a second reference time interval before the processing batch reaches the measurement station; and newly building a group, adding the processing batch into the new-built group, and adding identifications that abandon current measurement into wafers in the processing batch. The beneficial effects of the technical scheme are that: a processing technology and processing devices can be monitored through the minimum sample size, so that the measurement efficiency can be improved; the number of samples is decreased, so that a cycle of each measurement step can be shortened; human cost is saved; the measurement capability can be improved; and sampling covers all the processing units in the processing technology, so that potential risks due to unbalanced sampling can be decreased.
Description
Technical field
The present invention relates to the quality management-control method of field of semiconductor processing, particularly relate to a kind of wafer based on little sampling system and measure the method for sampling.
Background technology
Semiconductor machining is used to the Treatment technique for processing manufacturing chip.It is by a series of photograph and chemical treatment step, is formed in gradually by electronic circuit on the chip of use semi-conducting material manufacturing.
Existing semiconductor machining line needs to do a large amount of measurement tasks to product, to ensure the stable of processing technology and process equipment.But a large amount of measurement tasks makes the process-cycle extend, and working ability will be limited by measurement capability, cause working (machining) efficiency to reduce.Meanwhile, owing to measuring the sampling rule restriction of itself, measurement is caused can not to realize expected effect completely.
By existing, based on batch and the measurement sampling system of equipment, can obtain and shorten the process-cycle, improve measurement capability and measure the benefits such as effect, but, this system uses a kind of fixing wafer selection rule, and this fixing wafer selection rule causes the imbalance that in processing technology, between each different process unit, wafer is chosen, and this imbalance causes some process unit possibly cannot by the potential risk monitored in time in some in period.
Summary of the invention
For the problems referred to above that the measurement method of sampling in existing semiconductor fabrication processes exists, a kind of wafer based on little sampling system being intended to be covered by wafer selection rule realization flexibly each process unit in processing technology is now provided to measure the method for sampling.
Concrete technical scheme is as follows:
A kind of wafer based on little sampling system measures the method for sampling, wherein, in the information of the current processing technology step completed, described processing batch is classified according to processing batch, and determine whether described processing batch is valuable batch by a presetting rule, further comprising the steps of:
Step 1, judge that whether first time arrives described measurement website to the current type arriving the described processing batch measuring website, if not, then goes to step 5 execution;
Step 2, judge after described processing batch time of advent the first reference time interval in whether have described valuable batch of arrival, if not, then go to step 5 execution;
Step 3, judge before described processing batch time of advent the second reference time interval in whether have described valuable batch of arrival, if not, then go to step 5 execution;
Step 4, a newly-built grouping, make the type of the corresponding described processing of newly-built grouping batch, described processing batch added newly-built grouping, adds and abandon current measurements and identify, go to step 1 execution to the wafer in described processing batch;
Step 5, by a little sampling system, described processing batch to be divided into groups, and judge whether to need to measure the wafer in described processing batch;
Step 6, go to described step 1 and perform.
Preferably, in described step 1, before first time arrives described measurement website to the type judging described processing batch, first judge that whether described processing batch carried out classification according to the parameter of processing batch, if not, then exit flow process.
Preferably, in described step 1, before whether first time arrives described measurement website to the type judging described processing batch, first judge whether described processing batch has the mark of not carrying out current measurement, if so, then exits flow process.
Preferably, described little sampling system comprises the following steps:
Step 51, obtain grouping information corresponding to the type of the described processing batch arriving measurement station point;
Step 52, measuring time of website and wafer number according to arriving, arriving the described processing batch measuring website be added into a new grouping by current, or
Integrate with the grouping that the type of already present and described processing batch is corresponding.
Preferably, at least a slice in described grouping valuable batch, not there is the wafer abandoning current measurement mark to measure.
Preferably, described presetting rule is, by covering the current processing technology completed adopt the processing batch of maximum cavitys of process equipment to be set as valuable batch; Or
By covering the current processing technology completed adopt the processing batch of whole cavitys of process equipment to be set as valuable batch.
Preferably, before described step 51, judge whether first time arrives described measurement website for the type of described processing batch, if, a then newly-built grouping, makes the type of the corresponding described processing of current newly-built grouping batch, and described processing batch is added in current newly-built grouping.
Preferably, in described step 52, judge that described processing batch arrives the difference of grouping settling time corresponding to the type of time of measuring website and described processing batch and whether is less than or equal to one the 3rd reference time interval, if not, a then newly-built grouping, make the type of the corresponding described processing of current newly-built grouping batch, and described processing batch is added in current newly-built grouping.
Preferably, in described step 52, judge whether the wafer number sum in already present wafer number and described processing in the grouping that the type of described processing batch is corresponding batch is less than or equal to a reference value, if not, a then newly-built grouping, make the type of the corresponding described processing of current newly-built grouping batch, and described processing batch is added in current newly-built grouping.
Preferably, as described in the type of processing batch there is corresponding grouping; And
The difference that described processing batch arrives grouping settling time corresponding to the type of time of measuring website and described processing batch is less than or equal to one the 3rd reference time interval; And
Wafer number sum in the grouping that the type of described processing batch is corresponding in already present wafer number and described processing batch is less than or equal to a reference value; Then
Described processing batch is added in grouping corresponding to the type of described processing batch.
Preferably, judge whether described grouping has by checking mark, if so, then no longer measures in current measurement website the wafer in described grouping.
Preferably, after obtaining measurement, add by checking mark to the grouping at the wafer place by measuring; And
The processing batch be not sampled in grouping not by the wafer place of measurement is re-started grouping.
Preferably, grouping comprises the following steps again:
Step r1, by not by the processing that is not sampled in the grouping at wafer place that measures batch according to being added in a new grouping after the time-sequencing arriving current measurement website;
Step r2, judge the current measurement website of follow-up arrival, and whether the difference that the type processing batch consistent with grouping newly-built in described step r1 arrives newly-built in the time and described step r1 measuring website grouping settling time is less than or equal to one the 3rd reference time interval, if not, then the processing batch of described follow-up arrival current measurement website is added in new grouping;
Step r3, judge the wafer number of the processing batch of the current measurement website of described follow-up arrival, a reference value whether is less than or equal to wafer number sum already present in grouping newly-built in described step r1, if not, then the processing batch of described follow-up arrival current measurement website is added in new grouping;
Step r4, the processing batch of described follow-up arrival current measurement website is added into grouping newly-built in described step r1.
Preferably, described second reference time be spaced apart one the 3rd reference time interval and can the time variable sum of assignment.
Preferably, described processing is batch with the described processing batch unit type that the current processing technology completed adopts, and/or the described processing batch technical recipe that the current processing technology completed adopts numbering is as type number.
Preferably, described grouping adopts the numbering of the described processing batch in grouping, and makes the numbering of described processing batch according to arriving the sequence of time-sequencing of described measurement website as packet numbering.
Preferably, the settling time of described grouping is the time that the processing batch arriving described measurement website in all processing batch of described grouping the earliest arrives described measurement website.
Preferably, described first reference time is 4 hours.
Preferably, described second reference time is 12 hours.
Preferably, described 3rd reference time is 8 hours.
The beneficial effect of technique scheme is:
1, by minimum sample size, processing technology and process equipment are monitored, thus improve measurement efficiency;
2, owing to decreasing sample size, thus the cycle of each measurement step is shortened;
3, human cost is saved;
4, improve measurement capability;
5, sampling covers each process unit in processing technology, reduces the potential risk because imbalance of sampling causes.
Accompanying drawing explanation
Fig. 1 is the flow chart of steps that a kind of wafer based on little sampling system of the present invention measures the embodiment of the method for sampling;
Fig. 2 is the flow chart of steps that a kind of wafer based on little sampling system of the present invention measures the embodiment of the little sampling system sampling flow process of the method for sampling;
Fig. 3 is that a kind of wafer based on little sampling system of the present invention measures the method for sampling according to the flow chart of steps of measurement to the processing batch embodiment of again dividing into groups.
Embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described, but not as limiting to the invention.
As shown in Figure 1, the invention provides a kind of wafer based on little sampling system and measure the method for sampling, wherein, processing batch is classified in the information of the current processing technology step completed according to processing batch, and determine whether processing batch is valuable batch by a presetting rule, further comprising the steps of:
Step 1, judge the current type arriving the processing batch measuring website whether first time arrives to measure website, if not, then go to step 5 execution;
Step 2, judge to process in the first reference time interval after batch time of advent whether have valuable batch of arrival, if not, then go to step 5 execution;
Step 3, judge to process in the second reference time interval before batch time of advent whether have valuable batch of arrival, if not, then go to step 5 execution;
Step 4, a newly-built grouping, make the type of newly-built grouping correspondence processing batch, processing batch added newly-built grouping, adds and abandon current measurements and identify, go to step 1 execution to the wafer in processing batch;
Step 5, by a little sampling system, processing batch to be divided into groups, and judge whether to need to measure the wafer in processing batch;
Step 6, go to step 1 execution.
Technique scheme, the type being arrived to the processing batch measuring website first time judges, by judging whether have valuable batch to arrive in the second reference time in the first reference time after this processing batch and before this processing batch and measure that website determines whether abandoning to the current measurement arriving the processing batch measuring website.In one preferably execution mode, the judgement of valuable batch can in the following ways:
By covering the current processing technology completed adopt the processing batch of maximum cavitys of process equipment to be set as valuable batch; Or
By covering the current processing technology completed adopt the processing batch of whole cavitys of process equipment to be set as valuable batch.
Technique scheme is based on following discovery, in setting-up time, the changed condition of visual semiconductor processing equipment in time processing identical technical recipe setting is less, thus make semiconductor processing equipment be in controllable scope at the quality comparison of goods, thus, the representational processing batch of most by processing a certain process equipment in setting-up time measures, and can obtain in this time period the quality judging of the processing batch using the setting of same technical recipe.
Technique scheme, the processing of the maximum cavity of process equipment or whole cavitys will be covered batch as the valuable batch of i.e. representational processing batch of most in the course of processing, by measuring valuable batch, can reduce in the given time to the sampling of other processing batch adopting the setting of same technical recipe, thus decrease sample size, and and then shorten cycle of measurement step, because valuable batch covers each process unit (cavity) in processing technology, because this reducing the potential risk because imbalance of sampling causes.
In technique scheme, by manufacturing execution system (MESmanufacturingexecutionsystem) to processing batch in the current processing technology step completed information and formed with processing batch association record.In one preferably execution mode, processing can be included batch compile above-mentioned model in the record of the information of the current processing technology step completed, thus make the type of corresponding a kind of processing of each model batch.In preferably execution mode, the information of process equipment in model, can be comprised, the operation record etc. of processing each cavity batch on process equipment.In a kind of further execution mode, above-mentioned model can process batch unit type that the current processing technology completed adopts, and/or the processing batch technical recipe that the current processing technology completed adopts numbering is as the title of model.
In technique scheme, newly-builtly in step 4 be grouped in one and preferably can adopt an independently sequence in execution mode, for being in the numbering of all processing in this grouping batch according to reaching the time-sequencing measuring website in sequence.Further, the corresponding type of each grouping, a type can have multiple grouping, and in one preferably execution mode, each grouping may correspond to a model mentioned above, can the record of corresponding relation between Modling model and grouping in system.
On technique scheme basis, further, in step 1, before first time arrives and measure website the type judging to process batch, first judge to process batch and whether carried out classification according to the parameter of to process batch, if not, then exit flow process.When the parameter of processing batch did not carry out the book of final entry, when namely there is not this processing batch corresponding type in system, because grouping judgement cannot be carried out to processing batch according to classification of type, be therefore not suitable for employing technique scheme and sampled.
On technique scheme basis, further, before first time arrives and measure website the type judging to process batch, first judge to process batch whether to there is the mark of not carrying out current measurement, if so, then exit flow process.Under some particular cases, some processing batch does not need or cannot measure at current measurement website, system can be added these processing batch and do not carried out the mark of current measurement, will stop the process to this processing batch when sampling system determines the processing batch with the mark of not carrying out current measurement.
On technique scheme basis, further, little sampling system comprises the following steps:
Step 51, obtain grouping information corresponding to the type of the processing batch arriving measurement station point;
Step 52, measuring time of website and wafer number according to arriving, arriving the processing batch measuring website be added into a new grouping by current, or
Integrate with already present grouping corresponding to type with processing batch.
The above-mentioned grouping mentioned is as set of samples, at least there is in each grouping one valuable batch, namely cover the current processing technology completed adopt the processing batch of maximum cavitys of process equipment, or cover the current processing technology completed adopt the processing batch of whole cavitys of process equipment.
On technique scheme basis, further, system to grouping in valuable batch at least a slice do not have abandon current measure mark wafer measure.The quantity extracting wafer in valuable batch is selectable value, can be determined according to actual conditions.
On technique scheme basis, further, before step 51, first time arrives and measures website the type judging to process batch, if so, then and a newly-built grouping, make the type of current newly-built grouping correspondence processing batch, and processing batch is added in current newly-built grouping.
On technique scheme basis, further, in step 52, judge to process the difference batch arriving grouping settling time corresponding with the type of to process batch time of measuring website and whether be less than or equal to one the 3rd reference time interval, if not, a then newly-built grouping, makes the type of current newly-built grouping correspondence processing batch, and processing batch to be added in current newly-built grouping.
The object arranging the 3rd reference time interval to make in same grouping to arrive at first the processing batch that measures website to arrive the processing batch measuring website meet in the time range set with last, thus only need to carry out sampling to certain processing batch in grouping can judge the quality of whole grouping, to realize the object reducing hits.
On technique scheme basis, further, in step 52, whether the wafer number sum in grouping corresponding to type judging to process batch in already present wafer number and processing batch is less than or equal to a reference value, if not, a then newly-built grouping, makes the type of current newly-built grouping correspondence processing batch, and processing batch to be added in current newly-built grouping.
The object arranging reference value avoids wafer number in grouping too much, cause sample cannot cover actual sample completely, the reference value of a wafer number can be set according to actual conditions, make sample can cover actual sample comparatively accurately, the quantity of sampling can be reduced again simultaneously.
In the replaceable execution mode of one, can in step 52, in grouping corresponding to type judging to process batch, whether already present processing batch size+1 is less than or equal to a reference value, if not, a then newly-built grouping, make the type of current newly-built grouping correspondence processing batch, and processing batch is added in current newly-built grouping.This replacement execution mode, with the judgement of quantity to processing batch, replaces the judgement of the quantity to wafer, with processing batch for the system of sample unit in more realistic needs.
On technique scheme basis, further, there is corresponding grouping in the type as processing batch; And the difference that processing batch arrives grouping settling time corresponding with the type of to process batch time of measuring website is less than or equal to one the 3rd reference time interval; And the wafer number sum in the grouping corresponding to type of processing batch in already present wafer number and processing batch is less than or equal to a reference value; Then processing batch is added in grouping corresponding to the type of processing batch.
In the replaceable execution mode of one, there is corresponding grouping in the type as processing batch; And the difference that processing batch arrives grouping settling time corresponding with the type of to process batch time of measuring website is less than or equal to one the 3rd reference time interval; And already present processing batch size+1 is less than or equal to a reference value in the grouping corresponding to type of processing batch; Then processing batch is added in grouping corresponding to the type of processing batch.
In one preferably embodiment, can adopt settling time of grouping and arrive the processing batch measuring website the earliest in all processing in grouping batch and arrive the time measuring website.
On technique scheme basis, further, before to the wafer sampling in each grouping, first can judge whether grouping has by checking mark, if so, then no longer measures in current measurement website the wafer in grouping.Grouping, as having by checking mark, namely represents in this grouping and has had wafer to be sampled and the measurement that have passed current measurement website, therefore can no longer sample to other wafers in grouping.
On technique scheme basis, further, after the wafer be sampled in a grouping obtains measurement, add by checking mark to the grouping at the wafer place by measuring; And the processing batch be not sampled in the grouping not by the wafer place of measurement is re-started grouping.
Overline grouping is carried out to the processing batch be not sampled in the grouping not by the wafer place of measurement, too much scrapping at goods can be avoided.Wafer occurs measuring unsanctioned reason, it may be the accidental change of processing environment in the process equipment used due to the current production technology completed, this accidental change may recover again normal in wafer fabrication processes subsequently, also be likely that processing environment in the process equipment used due to the current production technology completed there occurs some changes that cannot recover voluntarily, this change needs manual intervention could recover normal.The wafer measurement caused based on the accidental change of processing environment is not passed through, may because the recovery of processing environment normally makes the quality of wafer meet the requirements in processing thereafter batch, therefore, can not namely not judge that processing in whole grouping is batch all defective by measuring because of the wafer in certain processing in grouping batch.Meanwhile, the processing batch be not sampled in grouping is re-started and divides into groups and sample to be conducive to judging that the processing environment of the process equipment that the current production technology completed uses which kind of occurs and changes, be conducive to the monitoring to process equipment.
On technique scheme basis, further, grouping can comprise the following steps again:
Step r1, by not by the processing that is not sampled in the grouping at wafer place that measures batch according to being added in a new grouping after the time-sequencing arriving current measurement website; It is envisaged that owing to being in same grouping before these processing be not sampled batch, and the processing be sampled batch is not added into new grouping, and therefore, the processing batch in this new grouping must meet:
In newly-built grouping, the type of each processing batch is consistent, and the difference of each processing batch arrival measurement time of website and the settling time of newly-built grouping is less than or equal to the 3rd reference time interval in newly-built grouping, and the wafer number sum in newly-built grouping in each processing batch is less than or equal to above-mentioned reference value, or
In newly-built grouping, the type of each processing batch is consistent, and each processing batch arrives the difference measuring the time of website and the settling time of newly-built grouping and is less than or equal to the 3rd reference time interval in newly-built grouping, and process batch size sum in newly-built grouping and be less than or equal to above-mentioned reference value.
Namely newly-built grouping still meets above-described method.
Step r2, judge the current measurement website of follow-up arrival, and whether the difference that the type processing batch consistent with grouping newly-built in step r1 arrives newly-built in the time and step r1 measuring website grouping settling time is less than or equal to the 3rd reference time interval, if not, then the processing batch of current for follow-up arrival measurement website is added in new grouping;
Step r3, judge the wafer number of the processing batch of the current measurement website of follow-up arrival, a reference value whether is less than or equal to wafer number sum already present in grouping newly-built in step r1, if not, then the processing batch of current for follow-up arrival measurement website is added in new grouping;
In the replaceable execution mode of one, in grouping newly-built in step r3, determining step r1, whether already present processing batch size+1 sum is less than or equal to a reference value, if not, then the processing batch of current for follow-up arrival measurement website is added in new grouping;
Step r4, the processing batch of current for follow-up arrival measurement website is added into grouping newly-built in step r1.
Again divide into groups still to adopt above-described method, whole system is consistent.Also can adopt the grouping of not regrouping by measuring because of wafer in grouping simultaneously and carry out resampling with above-described identical method, and according to being judged the quality of grouping by the measurement of the wafer of resampling.
On technique scheme basis, further, the second reference time interval can adopt the 3rd above-mentioned reference time interval and can the time variable sum of assignment.By utilizing the resource of both having deposited in system that too much definition can be avoided to cause the wasting of resources fully, and the relation between the second reference time and the 3rd reference time can be expressed intuitively.
One is preferably in embodiment, and the first reference time can adopt 4 hours.
One is preferably in embodiment, and the second reference time can adopt 12 hours.
One is preferably in embodiment, and the 3rd reference time can adopt 8 hours.
Each reference time can be chosen according to actual conditions and needs, and the occurrence in the various embodiments described above only in order to illustrate, does not form restriction.
On technique scheme basis, further, system can set priority to each processing batch in a grouping, and the processing batch preferential sampling high to priority.In one preferably execution mode, can by covering the current processing technology completed adopt the processing batch of whole cavitys of process equipment to be set as limit priority, and by processing batch priority from high to low, according to covering the current processing technology completed adopt the number of cavities of process equipment to sort from more to less.
The foregoing is only preferred embodiment of the present invention; not thereby embodiments of the present invention and protection range is limited; to those skilled in the art; should recognize and all should be included in the scheme that equivalent replacement done by all utilizations specification of the present invention and diagramatic content and apparent change obtain in protection scope of the present invention.
Claims (20)
1. the wafer based on little sampling system measures the method for sampling, it is characterized in that, described processing batch is classified in the information of the current processing technology step completed according to processing batch, and determine whether described processing batch is valuable batch by a presetting rule, further comprising the steps of:
Step 1, judge that whether first time arrives described measurement website to the current type arriving the described processing batch measuring website, if not, then goes to step 5 execution;
Step 2, judge after described processing batch time of advent the first reference time interval in whether have described valuable batch of arrival, if not, then go to step 5 execution;
Step 3, judge before described processing batch time of advent the second reference time interval in whether have described valuable batch of arrival, if not, then go to step 5 execution;
Step 4, a newly-built grouping, make the type of the corresponding described processing of newly-built grouping batch, described processing batch added newly-built grouping, adds and abandon current measurements and identify, go to step 1 execution to the wafer in described processing batch;
Step 5, by a little sampling system, described processing batch to be divided into groups, and judge whether to need to measure the wafer in described processing batch;
Step 6, go to described step 1 and perform.
2. measure the method for sampling based on the wafer of little sampling system as claimed in claim 1, it is characterized in that, in described step 1, before first time arrives described measurement website to the type judging described processing batch, first judge that whether described processing batch carried out classification according to the parameter of processing batch, if not, then flow process is exited.
3. measure the method for sampling based on the wafer of little sampling system as claimed in claim 1, it is characterized in that, in described step 1, before first time arrives described measurement website to the type judging described processing batch, first judge whether described processing batch has the mark of not carrying out current measurement, if so, then flow process is exited.
4. measure the method for sampling based on the wafer of little sampling system as claimed in claim 1, it is characterized in that, described little sampling system comprises the following steps:
Step 51, obtain grouping information corresponding to the type of the described processing batch arriving measurement station point;
Step 52, measuring time of website and wafer number according to arriving, arriving the described processing batch measuring website be added into a new grouping by current, or
Integrate with the grouping that the type of already present and described processing batch is corresponding.
5. measure the method for sampling based on the wafer of little sampling system as claimed in claim 1, it is characterized in that, at least a slice in described grouping valuable batch, not there is the wafer abandoning current measurement mark and measure.
6. as claimed in claim 1 based on little sampling system wafer measure the method for sampling, it is characterized in that, described presetting rule is, by covering the current processing technology completed adopt the processing batch of maximum cavitys of process equipment to be set as valuable batch; Or
By covering the current processing technology completed adopt the processing batch of whole cavitys of process equipment to be set as valuable batch.
7. measure the method for sampling based on the wafer of little sampling system as claimed in claim 4, it is characterized in that, before described step 51, judge whether first time arrives described measurement website for the type of described processing batch, if, a then newly-built grouping, makes the type of the corresponding described processing of current newly-built grouping batch, and described processing batch is added in current newly-built grouping.
8. measure the method for sampling based on the wafer of little sampling system as claimed in claim 4, it is characterized in that, in described step 52, judge that described processing batch arrives the difference of grouping settling time corresponding to the type of time of measuring website and described processing batch and whether is less than or equal to one the 3rd reference time interval, if not, a then newly-built grouping, makes the type of the corresponding described processing of current newly-built grouping batch, and described processing batch is added in current newly-built grouping.
9. measure the method for sampling based on the wafer of little sampling system as claimed in claim 4, it is characterized in that, in described step 52, judge whether the wafer number sum in already present wafer number and described processing in the grouping that the type of described processing batch is corresponding batch is less than or equal to a reference value, if not, a then newly-built grouping, makes the type of the corresponding described processing of current newly-built grouping batch, and described processing batch is added in current newly-built grouping.
10. measure the method for sampling based on the wafer of little sampling system as claimed in claim 4, it is characterized in that, as described in the type of processing batch there is corresponding grouping; And
The difference that described processing batch arrives grouping settling time corresponding to the type of time of measuring website and described processing batch is less than or equal to one the 3rd reference time interval; And
Wafer number sum in the grouping that the type of described processing batch is corresponding in already present wafer number and described processing batch is less than or equal to a reference value; Then
Described processing batch is added in grouping corresponding to the type of described processing batch.
11. measure the method for sampling based on the wafer of little sampling system as claimed in claim 5, it is characterized in that, judge whether described grouping has by checking mark, if so, then no longer measures in current measurement website the wafer in described grouping.
12. measure the method for sampling based on the wafer of little sampling system as claimed in claim 5, it is characterized in that, after obtaining measurement, add by checking mark to the grouping at the wafer place by measuring; And
The processing batch be not sampled in grouping not by the wafer place of measurement is re-started grouping.
13. measure the method for sampling based on the wafer of little sampling system as claimed in claim 12, it is characterized in that, grouping comprises the following steps again:
Step r1, by not by the processing that is not sampled in the grouping at wafer place that measures batch according to being added in a new grouping after the time-sequencing arriving current measurement website;
Step r2, judge the current measurement website of follow-up arrival, and whether the difference that the type processing batch consistent with grouping newly-built in described step r1 arrives newly-built in the time and described step r1 measuring website grouping settling time is less than or equal to one the 3rd reference time interval, if not, then the processing batch of described follow-up arrival current measurement website is added in new grouping;
Step r3, judge the wafer number of the processing batch of the current measurement website of described follow-up arrival, a reference value whether is less than or equal to wafer number sum already present in grouping newly-built in described step r1, if not, then the processing batch of described follow-up arrival current measurement website is added in new grouping;
Step r4, the processing batch of described follow-up arrival current measurement website is added into grouping newly-built in described step r1.
14. measure the method for sampling based on the wafer of little sampling system as claimed in claim 8, it is characterized in that, described second reference time is spaced apart one the 3rd reference time interval and can the time variable sum of assignment.
15. measure the method for sampling based on the wafer of little sampling system as claimed in claim 1, it is characterized in that, described processing is batch with the described processing batch unit type that the current processing technology completed adopts, and/or the described processing batch technical recipe that the current processing technology completed adopts numbering is as type number.
16. measure the method for sampling based on the wafer of little sampling system as claimed in claim 1, it is characterized in that, described grouping adopts the numbering of the described processing batch in grouping, and makes the numbering of described processing batch according to arriving the sequence of time-sequencing of described measurement website as packet numbering.
17. measure the method for sampling based on the wafer of little sampling system as claimed in claim 4, it is characterized in that, settling time of described grouping is the time that the processing batch arriving described measurement website in all processing batch of described grouping the earliest arrives described measurement website.
18. measure the method for sampling based on the wafer of little sampling system as claimed in claim 1, and it is characterized in that, described first reference time is 4 hours.
19. measure the method for sampling based on the wafer of little sampling system as claimed in claim 1, and it is characterized in that, described second reference time is 12 hours.
20. measure the method for sampling based on the wafer of little sampling system as claimed in claim 1, and it is characterized in that, described 3rd reference time is 8 hours.
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| CN108646696A (en) * | 2018-07-12 | 2018-10-12 | 武汉新芯集成电路制造有限公司 | Automatically process the system and method for batch products to be detected |
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| US20050033467A1 (en) * | 2003-08-04 | 2005-02-10 | Purdy Matthew A. | Dynamic metrology sampling methods, and system for performing same |
| US20050049737A1 (en) * | 2003-08-27 | 2005-03-03 | Chin-Hsiang Lin | Defect analysis sampling control |
| CN101718989A (en) * | 2008-10-09 | 2010-06-02 | 联华电子股份有限公司 | Sampling inspection method |
| CN103943523A (en) * | 2013-01-21 | 2014-07-23 | 中芯国际集成电路制造(上海)有限公司 | Sampling measuring method in semiconductor production process |
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| US20050033467A1 (en) * | 2003-08-04 | 2005-02-10 | Purdy Matthew A. | Dynamic metrology sampling methods, and system for performing same |
| US20050049737A1 (en) * | 2003-08-27 | 2005-03-03 | Chin-Hsiang Lin | Defect analysis sampling control |
| CN101718989A (en) * | 2008-10-09 | 2010-06-02 | 联华电子股份有限公司 | Sampling inspection method |
| CN103943523A (en) * | 2013-01-21 | 2014-07-23 | 中芯国际集成电路制造(上海)有限公司 | Sampling measuring method in semiconductor production process |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108646696A (en) * | 2018-07-12 | 2018-10-12 | 武汉新芯集成电路制造有限公司 | Automatically process the system and method for batch products to be detected |
| CN108646696B (en) * | 2018-07-12 | 2020-04-10 | 武汉新芯集成电路制造有限公司 | System and method for automatically processing batch products to be detected |
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