CN105486491A - LED light parameter test device and test method - Google Patents
LED light parameter test device and test method Download PDFInfo
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- CN105486491A CN105486491A CN201610038213.2A CN201610038213A CN105486491A CN 105486491 A CN105486491 A CN 105486491A CN 201610038213 A CN201610038213 A CN 201610038213A CN 105486491 A CN105486491 A CN 105486491A
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- heating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0207—Details of measuring devices
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- Analytical Chemistry (AREA)
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- General Physics & Mathematics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
Abstract
The invention discloses an LED light parameter test device comprising an integrating sphere, a temperature rising and reducing mechanism, a lamp base, a temperature controller and a temperature sensor. A bracket is installed in the integrating sphere. The temperature rising and reducing mechanism and the lamp base are arranged in the integrating sphere, and the temperature rising and reducing mechanism is connected with the bracket. The lamp base is connected with the temperature rising and reducing mechanism. The temperature rising and reducing mechanism is used for performing temperature rising and reducing processing on the lamp base. The lamp base is used for installing an LED lamp to be detected. The temperature sensor is used for sensing temperature of the lamp base. The temperature controller is electrically connected with the temperature rising and reducing mechanism and the temperature sensor. The temperature controller is used for controlling the temperature rising and reducing mechanism to perform temperature rising and reducing according to temperature of the lamp base sensed by the temperature sensor so that the lamp base is enabled to be maintained at temperature to be tested. According to the device, the lamp head part of the LED lamp is partially heated to temperature to be tested so that the LED lamp to be tested is enabled to be closer to the actual working condition, and the obtained light parameter test data are more real and accurate. Besides, energy consumption is reduced in the LED light parameter test process so that working efficiency is greatly enhanced.
Description
Technical field
The present invention relates to LED lamplight parameter detecting technical field, especially relate to a kind of LED lamplight parameter test device and method of testing.
Background technology
For the test of the optical parameter (comprising luminous flux, light efficiency, color and life-span) of LED (comprising LED integrated lamp and LED light engine), that LED is arranged in integrating sphere at present, then the whole region of heating and cooling device to integrating sphere is adopted to carry out heating and cooling process, to make accurately to control the temperature of LED, and by the relative photo parameter of integrating sphere measurement LED under equilibrium temperature condition.
The following defect of existence of prior art method of testing: first, it adopts heating and cooling device to carry out heating and cooling to the whole region of integrating sphere, namely all heating and cooling are carried out to the luminophor of LED and lamp holder, and then test the optical parameter of LED, the method is the LED light parameter tested out under pure theory state, and in LED actual working state the temperature of lamp socket higher than the temperature of lamp body, i.e. the not LED light parameter that tests out under actual working state of LED; Secondly, to the heating of whole integrating sphere region, waste energy, make testing cost higher; Secondly, when carrying out the test of optical parameter for LED in different temperatures, heating and cooling efficiency is low, makes the test duration longer.
Summary of the invention
Based on this, the invention reside in the defect overcoming prior art, provide a kind of LED lamplight parameter test device and method of testing, it can obtain the optical parameter of LED under actual working state, and test energy consumption is lower, and testing efficiency is high.
Its technical scheme is as follows:
A kind of LED lamplight parameter test device, comprising: integrating sphere, is equiped with support in described integrating sphere; Heating and cooling mechanism and lamp socket, described heating and cooling mechanism and described lamp socket are positioned at described integrating sphere, described heating and cooling mechanism is connected with described support, described lamp socket is connected with described heating and cooling mechanism, described heating and cooling mechanism is used for carrying out heating and cooling process to described lamp socket, and described lamp socket is for installing LED to be measured; And temperature inductor, described temperature inductor is for responding to the temperature of described lamp socket; Temperature controller, described temperature controller and described heating and cooling mechanism, described temperature inductor are electrically connected, and described temperature controller is used for sensing that the temperature of described lamp socket controls the heating and cooling action of described heating and cooling mechanism according to described temperature inductor.
The present invention also provides a kind of LED lamplight parameter test method, and it have employed above-mentioned LED lamplight parameter test device, comprises the steps: LED to be measured to be installed up in the lamp socket of integrating sphere; By heating and cooling mechanism described lamp socket heated up or be cooled to and treat testing temperature; The actual temperature of lamp socket is obtained by temperature inductor, and described actual temperature is fed back to temperature controller, described temperature controller controls described heating and cooling mechanism according to actual temperature and heats up or cooling process, treats that testing temperature is identical with the actual temperature realizing described lamp socket with described.
Wherein in an embodiment, described heating and cooling mechanism comprises heating-up mechanism and cooling mechanism, described heating-up mechanism is connected with described cooling mechanism, and described heating-up mechanism is used for carrying out hyperthermic treatment to described lamp socket, and described cooling mechanism is used for described lamp socket cooling process.
Wherein in an embodiment, described heating-up mechanism comprises heating cylinder, and described heating cylinder two ends are connected to the first end cap and the second end cap, and described lamp socket is installed in described first end and covers and be arranged in described heating cylinder; Described cooling mechanism comprises interior cooling mechanism and outer cooling mechanism, and it is inner that described interior cooling mechanism is positioned at described heating cylinder, and it is outside that described outer cooling mechanism is positioned at described heating cylinder, and described interior cooling mechanism, described outer cooling mechanism are connected with described second end cap.
Wherein in an embodiment, described interior cooling mechanism comprises inner radiator and internal fan, and described internal fan is connected with described inner radiator, and described inner radiator is connected with the second end cap; Described outer cooling mechanism comprises outer heating radiator and external fan, and described external fan is connected with described outer heating radiator, and described outer heating radiator is connected with the second end cap.
Wherein in an embodiment, described inner radiator and/or described outer heating radiator comprise several controllable silicon heat radiator are stacked and form.
Wherein in an embodiment, between described outer heating radiator and described second end cap, be provided with cooling piece.
Wherein in an embodiment, described outer heating radiator comprises the first outer heating radiator and the second outer heating radiator that are set up in parallel, and described external fan is arranged between described first outer heating radiator and described second outer heating radiator.
Wherein in an embodiment, described first outer heating radiator and described second outer heating radiator comprise several controllable silicon heat radiator are stacked and form, described first outer heating radiator, described second outer heating radiator are all connected with heat-conducting copper pipe, described heat-conducting copper pipe runs through controllable silicon heat radiator described in several, and described heat-conducting copper pipe is connected with controllable silicon heat radiator described in several.
Wherein in an embodiment, described first outer heating radiator, described second outer heating radiator are all connected with two heat-conducting copper pipes, and two described heat-conducting copper pipes are set up in parallel, the shape and described heat-conducting copper pipe takes the shape of the letter U.
Below in conjunction with technique scheme, principle of the present invention, effect are further illustrated:
1, above-mentioned LED lamplight parameter test device, be heated to treat testing temperature to lamp socket by heating and cooling mechanism, the driving of LED and driving adjacent component are just heated to treat testing temperature by lamp socket, relative to prior art to LED Omnidirectional heating mode, the present invention to LED to be measured carry out optical parameter detect time, just be heated to treat testing temperature to LED lamp head part, LED light projector face portion is not heated.In addition, the optical parameter due to LED to be measured is subject to the impact of LED junction temperature to a great extent, and LED junction temperature is relevant to thermal source, and the thermal source often rectification circuit of LED lamp head part or other adjacent assembly circuits produces.So visible, LED lamp holder part is locally heated to and treats testing temperature by apparatus of the present invention, can make LED to be measured closing to reality duty more, the optical parameter test data true and accurate more obtained by integrating sphere.Secondly, because the present invention is relative to the omnibearing type of heating of prior art, adopts and spot heating mode is carried out to lamp socket, heating and cooling space can be made to diminish, the energy consumption of LED lamplight parameter testing like this reduces, and is convenient to LED rapid temperature rise and drop to be measured, and work efficiency improves greatly.
2, heating-up mechanism and cooling mechanism are provided separately, and the temperature of lamp socket is responded in real time by temperature sensor, control heating-up mechanism heating and cooling corresponding to cooling mechanism by temperature controller, the temperature of lamp socket just can be realized fast to be adjusted to treat testing temperature, work efficiency is higher.
3, lamp socket is installed in first end cover and be arranged in heating cylinder, interior cooling mechanism is located at heating cylinder inside, it is outside that outer cooling mechanism is located at described heating cylinder, and interior cooling mechanism, outer cooling mechanism are connected with the second end cap.So, when the action of heating cylinder electrified regulation, just heat up being positioned at the lamp socket that first end covers; When cooling mechanism energising heat radiation, cooling mechanism and outer cooling mechanism just synchronization action in it, to reduce the temperature of lamp socket.Visible, heating-up mechanism and cooling mechanism combine by the present invention, and structure is comparatively simple, and conveniently can realize the heating and cooling process of lamp socket.
Accompanying drawing explanation
Fig. 1 is LED lamplight parameter test device structural representation described in the embodiment of the present invention;
Fig. 2 is the connection circuit figure of LED lamplight parameter test device temperature controller and heating and cooling mechanism described in the embodiment of the present invention;
Fig. 3 is the structural representation of the heating and cooling mechanism of LED lamplight parameter test device described in the embodiment of the present invention;
Fig. 4 is the axial, cross-sectional view of the heating and cooling mechanism of LED lamplight parameter test device described in the embodiment of the present invention;
Fig. 5 is the process flow diagram of LED lamplight parameter test method described in the embodiment of the present invention.
Description of reference numerals:
10, integrating sphere, 11, support, 20, heating and cooling mechanism, 21, heating-up mechanism, 211, heating cylinder, 22, cooling mechanism, 221, interior cooling mechanism, 2211, inner radiator, 2212, internal fan, 222, outer cooling mechanism, 2221, outer heating radiator, 2221a, first outer heating radiator, 2221b, second outer heating radiator, 2222, external fan, 2223, heat-conducting copper pipe, 23, first end cap, 24, second end cap, 25, cooling piece, 26, 12V input end, 27, 220V input end, 28, connecting link, 281, mounting hole, 30, lamp socket, 40, temperature controller, 41, mains electricity input end, 42, 12V output terminal, 43, 220V output terminal, 44, K type incoming end, 50, temperature inductor.
Embodiment
Below embodiments of the invention are described in detail:
As shown in Figure 1, LED lamplight parameter test device of the present invention, comprises integrating sphere 10, heating and cooling mechanism 20 and lamp socket 30, temperature controller 40 and temperature inductor 50.
Support 11 is equiped with in described integrating sphere 10.Described heating and cooling mechanism 20 is positioned at described integrating sphere 10 with described lamp socket 30, and described heating and cooling mechanism 20 is connected with described support 11.Described lamp socket 30 is connected with described heating and cooling mechanism 20, and described heating and cooling mechanism 20 is for carrying out heating and cooling process to described lamp socket 30, and described lamp socket 30 is for installing LED to be measured.Described temperature inductor 50 is for responding to the temperature of described lamp socket 30.Described temperature controller 40 is electrically connected with described heating and cooling mechanism 20, described temperature inductor 50, temperature controller 40, for sensing that the temperature of described lamp socket 30 controls the heating and cooling of described heating and cooling mechanism 20 according to described temperature inductor 50, treats testing temperature to make described lamp socket 30 remain on.
Above-mentioned LED lamplight parameter test device, be heated to treat testing temperature by heating and cooling mechanism 20 pairs of lamp sockets 30, the driving of LED and driving adjacent component are just heated to treat testing temperature by lamp socket 30, relative to prior art to LED Omnidirectional heating mode, the present invention to LED to be measured carry out optical parameter detect time, just LED lamp head part be locally heated to and treat testing temperature, LED light projector face portion is not heated.In addition, the optical parameter due to LED to be measured is subject to the impact of LED junction temperature to a great extent, and LED junction temperature is relevant to thermal source, and the thermal source often rectification circuit of LED lamp head part or other adjacent assembly circuits produces.So visible, LED lamp holder part is heated to treat testing temperature by apparatus of the present invention, can make LED to be measured closing to reality duty more, the optical parameter test data true and accurate more obtained by integrating sphere 10.Secondly, because the present invention is relative to the omnibearing type of heating of prior art, adopts and spot heating mode is carried out to lamp socket 30, heating and cooling space is diminished, the energy consumption of LED lamplight parameter testing like this reduces, and is convenient to LED rapid temperature rise and drop to be measured, and work efficiency improves greatly.
Refer to Fig. 2, described heating and cooling mechanism 20 comprises heating-up mechanism 21 and cooling mechanism 22.Described heating-up mechanism 21 is connected with described cooling mechanism 22, and described heating-up mechanism 21 is for carrying out hyperthermic treatment to described lamp socket 30, and described cooling mechanism 22 is for process of lowering the temperature to described lamp socket 30.Cooling mechanism 22 is provided with 12V input end 26, and heating-up mechanism 21 is provided with 220V input end 27, correspondingly on temperature controller 40 is provided with mains electricity input end 41,12V output terminal 42,220V output terminal 43 and the K type incoming end 44 for being connected with temperature inductor 50.Respectively 12V output terminal 42 and 12 input end is electrical connected by wire, 220V output terminal 43 and 220V input end 27 are electrical connected, K type incoming end 44 is connected with temperature inductor 50, temperature controller 40 just can give heating-up mechanism 21 respectively, cooling mechanism 22 is powered, and according to lamp socket 30 temperature that temperature inductor 50 senses, the hyperthermic treatment of corresponding control heating-up mechanism 21 or control cooling mechanism 22 are lowered the temperature and are processed.Visible, heating-up mechanism 21 and cooling mechanism 22 are provided separately, and respond to the temperature of lamp socket 30 in real time by temperature sensor, control heating-up mechanism 21 heating and cooling corresponding to cooling mechanism 22 by temperature controller 40, just the temperature of lamp socket 30 can be realized fast to be adjusted to treat testing temperature, work efficiency is higher.
Refer to Fig. 3 and 4, described heating-up mechanism 21 comprises heating cylinder 211.Described heating cylinder 211 two ends are connected to the first end cap 23 and the second end cap 24.Heating cylinder 211 sidewall being connected with connecting link 28, connecting link 28 being provided with the mounting hole 281 for being connected with support 11.Described lamp socket 30 to be installed on described first end cap 23 and to be arranged in described heating cylinder 211.Described cooling mechanism 22 comprises interior cooling mechanism 221 and outer cooling mechanism 222.It is inner that described interior cooling mechanism 221 is positioned at described heating cylinder 211, and it is outside that described outer cooling mechanism 222 is positioned at described heating cylinder 211, and described interior cooling mechanism 221, described outer cooling mechanism 222 are connected with described second end cap 24.When heating cylinder 211 electrified regulation action, just the lamp socket 30 be positioned on the first end cap 23 can be heated up; When cooling mechanism 22 is energized heat radiation, cooling mechanism 221 and outer cooling mechanism 222 just synchronization action in it, to reduce the temperature of lamp socket 30.Visible, heating-up mechanism 21 and cooling mechanism 22 combine by the present invention, and structure is comparatively simple, and conveniently can realize the heating and cooling process of lamp socket 30.
Wherein, described interior cooling mechanism 221 comprises inner radiator 2211 and internal fan 2212.Described internal fan 2212 is connected with described inner radiator 2211, and described inner radiator 2211 is connected with the second end cap 24.Described inner radiator 2211 comprises several controllable silicon heat radiator is stacked and forms.Described outer cooling mechanism 222 comprises outer heating radiator 2221 and external fan 222, and described external fan 222 is connected with described outer heating radiator 2221, and described outer heating radiator 2221 is connected with the second end cap 24.Described outer heating radiator 2221 comprises the first outer heating radiator 2221a and the second outer heating radiator 2221b that are set up in parallel.Described external fan 222 is arranged between described first outer heating radiator 2221a and described second outer heating radiator 2221b.Described first outer heating radiator 2221a and described second outer heating radiator 2221b comprises several controllable silicon heat radiator is stacked and forms.
In addition, described first outer heating radiator 2221a, described second outer heating radiator 2221b are all connected with heat-conducting copper pipe 2223.Described heat-conducting copper pipe 2223 runs through controllable silicon heat radiator described in several, and described heat-conducting copper pipe 2223 is connected with controllable silicon heat radiator described in several.Described first outer heating radiator 2221a, described second outer heating radiator 2221b are all connected with two heat-conducting copper pipes, 2223, two described heat-conducting copper pipes 2223 and are set up in parallel, the shape and described heat-conducting copper pipe 2223 takes the shape of the letter U.Cooling piece 25 is provided with between described outer heating radiator 2221 and described second end cap 24.So, be convenient to realize heat and transmit to the outer cooling mechanism 222 being positioned at heating cylinder 211 outside by being positioned at heating cylinder 211 inside cooling mechanism 221, can by the heat Quick diffusing of lamp socket 30.
Refer to Fig. 5, the present invention also provides a kind of LED lamplight parameter test method, and it have employed above-mentioned LED lamplight parameter test device, comprises the steps:
Step S101, LED to be measured is installed up in the lamp socket 30 of integrating sphere 10;
Step S102, to be heated up by heating and cooling mechanism 20 or to lower the temperature, treating testing temperature so that described lamp socket 30 is heated up or to be cooled to;
Step S103, obtained the actual temperature of lamp socket 30 by temperature inductor 50, and described actual temperature is fed back to temperature controller 40;
Step S104, described temperature controller 40 judge actual temperature whether with treat that testing temperature is identical, if different, then enter step S102, if identical, then enter step S105;
Step S105, obtained the optical parameter treating LED under testing temperature at lid by integrating sphere 10.
Above-mentioned LED lamplight parameter test method, be heated to treat testing temperature by heating and cooling mechanism 20 pairs of lamp sockets 30, the driving of LED and driving adjacent component are just heated to treat testing temperature by lamp socket 30, relative to prior art to LED Omnidirectional heating mode, the present invention's LED to be measured is when carrying out optical parameter and detecting, just LED lamp head part is locally heated to and treats testing temperature, LED light projector face portion is not heated, make LED to be measured closing to reality duty more, the optical parameter test data true and accurate more obtained by integrating sphere 10.Secondly, the present invention adopts and carries out spot heating mode to lamp socket 30, and heating and cooling space is diminished, and the energy consumption of LED lamplight parameter testing like this reduces, and is convenient to LED rapid temperature rise and drop to be measured, and work efficiency improves greatly.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this instructions is recorded.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a LED lamplight parameter test device, is characterized in that, comprising:
Integrating sphere, is equiped with support in described integrating sphere;
Heating and cooling mechanism and lamp socket, described heating and cooling mechanism and described lamp socket are positioned at described integrating sphere, described heating and cooling mechanism is connected with described support, described lamp socket is connected with described heating and cooling mechanism, described heating and cooling mechanism is used for carrying out heating and cooling process to described lamp socket, and described lamp socket is for installing LED to be measured; And
Temperature inductor, described temperature inductor is for responding to the temperature of described lamp socket;
Temperature controller, described temperature controller and described heating and cooling mechanism, described temperature inductor are electrically connected, and described temperature controller is used for sensing that the temperature of described lamp socket controls the heating and cooling action of described heating and cooling mechanism according to described temperature inductor.
2. LED lamplight parameter test device according to claim 1, it is characterized in that, described heating and cooling mechanism comprises heating-up mechanism and cooling mechanism, described heating-up mechanism is connected with described cooling mechanism, described heating-up mechanism is used for carrying out hyperthermic treatment to described lamp socket, and described cooling mechanism is used for described lamp socket cooling process.
3. LED lamplight parameter test device according to claim 2, it is characterized in that, described heating-up mechanism comprises heating cylinder, and described heating cylinder two ends are connected to the first end cap and the second end cap, and described lamp socket is installed in described first end and covers and be arranged in described heating cylinder;
Described cooling mechanism comprises interior cooling mechanism and outer cooling mechanism, and it is inner that described interior cooling mechanism is positioned at described heating cylinder, and it is outside that described outer cooling mechanism is positioned at described heating cylinder, and described interior cooling mechanism, described outer cooling mechanism are connected with described second end cap.
4. LED lamplight parameter test device according to claim 3, is characterized in that, described interior cooling mechanism comprises inner radiator and internal fan, and described internal fan is connected with described inner radiator, and described inner radiator is connected with the second end cap; Described outer cooling mechanism comprises outer heating radiator and external fan, and described external fan is connected with described outer heating radiator, and described outer heating radiator is connected with the second end cap.
5. LED lamplight parameter test device according to claim 4, is characterized in that, described inner radiator and/or described outer heating radiator comprise several controllable silicon heat radiator is stacked and form.
6. LED lamplight parameter test device according to claim 4, is characterized in that, is provided with cooling piece between described outer heating radiator and described second end cap.
7. LED lamplight parameter test device according to claim 4, it is characterized in that, described outer heating radiator comprises the first outer heating radiator and the second outer heating radiator that are set up in parallel, and described external fan is arranged between described first outer heating radiator and described second outer heating radiator.
8. LED lamplight parameter test device according to claim 7, it is characterized in that, described first outer heating radiator and described second outer heating radiator comprise several controllable silicon heat radiator are stacked and form, described first outer heating radiator, described second outer heating radiator are all connected with heat-conducting copper pipe, described heat-conducting copper pipe runs through controllable silicon heat radiator described in several, and described heat-conducting copper pipe is connected with controllable silicon heat radiator described in several.
9. LED lamplight parameter test device according to claim 8, is characterized in that, described first outer heating radiator, described second outer heating radiator are all connected with two heat-conducting copper pipes, and two described heat-conducting copper pipes are set up in parallel, the shape and described heat-conducting copper pipe takes the shape of the letter U.
10. a LED lamplight parameter test method, is characterized in that, have employed the LED lamplight parameter test device as described in any one of claim 1 to 9, comprises the steps:
LED to be measured is installed up in the lamp socket of integrating sphere;
By heating and cooling mechanism described lamp socket heated up or be cooled to and treat testing temperature;
The actual temperature of lamp socket is obtained by temperature inductor, and described actual temperature is fed back to temperature controller, described temperature controller controls described heating and cooling mechanism according to actual temperature and heats up or cooling process, treats that testing temperature is identical with the actual temperature realizing described lamp socket with described.
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| CN201610038213.2A CN105486491B (en) | 2016-01-20 | 2016-01-20 | A kind of LED lamplight parameter test device and test method |
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