CN105483612B - A kind of HTHU heaters of the PVD board aluminium room with insulation anti-misoperation device - Google Patents
A kind of HTHU heaters of the PVD board aluminium room with insulation anti-misoperation device Download PDFInfo
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- CN105483612B CN105483612B CN201410471268.3A CN201410471268A CN105483612B CN 105483612 B CN105483612 B CN 105483612B CN 201410471268 A CN201410471268 A CN 201410471268A CN 105483612 B CN105483612 B CN 105483612B
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- metal
- hthu
- ceramic insulation
- ring
- lifting ring
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Abstract
The invention provides a kind of HTHU heaters of the PVD board aluminium room with insulation anti-misoperation device, specifically, the circle of increase by one cylindrical protrusions at the screw hole for the ceramic insulation piece for ensureing to insulate between metal lifting ring and metal screws, this is arranged between metal lifting ring and metal screws with raised ceramic insulation piece, make metal lifting ring and metal screws completely isolated, so during the use of board, even if the position of metal lifting ring is slightly offset, due to the setting of projection, metal screws will not also touch metal lifting ring, enter without causing heater to be grounded, so as to avoid wafer adhesion, avoid the problem of scrapping.
Description
Technical field
The present invention relates to a kind of HTHU heaters of the PVD board aluminium room with insulation anti-misoperation device, in particular it relates to
In the insulation fool-proof design of the lifting ring of sputtering machine table.
Background technology
The aluminium room (Al Chamber) of AMAT (company of Applied Materials) PVD (physical vapour deposition (PVD)) board is currently used
High temperature high evenness heater (HTHU heater), in use, it is necessary to ensure HTHU heater elevating lever and chamber
Body wall keeps insulation.
However, as shown in Figures 2 and 3, there is no anti-misoperation device in the insulating Design of prior art, therefore in installation process very
Heater ground connection is easily caused, so as to cause wafer temperature to raise, can be bonded on metal pressure ring after aluminium melting, therefore, transmit
During, the position for making it on robotic arm because the opportunity of dropping of wafer is different is not fixed, and then causes wafer position inclined
Move.
Therefore, it is necessary to increase anti-misoperation device in insulating Design, to reduce the aluminium adhesion caused by heater is grounded, and then
Reduce thus caused wafer position and scrap problem caused by offseting.
The content of the invention
For defect present in prior art and deficiency, it is an object of the invention to provide one kind to have insulation anti-misoperation device
PVD board aluminium room HTHU heaters.This purpose of the present invention is achieved through the following technical solutions：
A kind of HTHU heaters of the PVD board aluminium room with insulation anti-misoperation device, in PVD board aluminium room, metal liter
Wafer is fixed on metal by drop module by metal lifting ring and metal lifter rod lifting metal HTHU heaters, metal pressure ring
On HTHU heaters, by ensureing HTHU heater insulations with lower component in board：Teflon thermal insulating disc, ceramic insulation ring, pottery
Porcelain heat shield and ceramic insulation block, wherein, Teflon thermal insulating disc and ceramic insulation ring are located at wire chamber body wall and metal HTHU
Between heater, ensure to insulate between heater and wire chamber body wall；Ceramic insulation block is located at metal lifting ring and lifted with metal
Between module, ensure to insulate between metal lifting ring and metal lifting module；Ceramic insulation piece is located at metal lifting ring and metal
Between screw, ensure to insulate between metal lifting ring and metal screws, specifically, at the screw hole of ceramic insulation piece there is a circle
Cylindrical protrusions, the projection are hollow structure, the insertion that to form internal diameter consistent of its hollow space and the hole on ceramic insulation piece top
Hole.
Further, the exterior contour of ceramic insulation piece can be circular or square that its external dimensions is more than metal screws
Nut.
Further, the height of the cylindrical protrusions and the consistency of thickness of metal lifting ring.
Further, the through hole internal diameter depends on the diameter of metal screws.
The insulation fool-proof design of the present invention effectively can prevent heater to be grounded, the metal during installation or use
Screw position is slightly offset, and will not also cause heater to be grounded, and so as to effectively prevent aluminium from melting posterior synechia wafer, is effectively reduced brilliant
The skew of circle position, reduce and scrap problem caused by wafer position is offset.
Below in conjunction with the accompanying drawings, the embodiment of the present invention is described in further detail.Led for affiliated technology
For the technical staff in domain, from detailed description of the invention, above and other objects, features and advantages of the invention will be aobvious
And it is clear to.
Brief description of the drawings
Fig. 1 is PVD board HTHU aluminium cell structure figures；
Fig. 2 is that insulating Design installs and uses figure in the prior art；
Fig. 3 is the enlarged drawing of insulating Design in the prior art；
The insulation fool-proof design that Fig. 4 is the present invention installs and uses figure；
Fig. 5 is the enlarged drawing of the insulation fool-proof design of the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, below in conjunction with the accompanying drawings and embodiment, it is right
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, not
For limiting the present invention.
Fig. 1 is the structural representation of the HTHU heaters of PVD board aluminium room.Wherein wafer 2 is fixed on gold by metal pressure ring 1
Belong on HTHU heaters 3, ensureing the part of the insulation of HTHU heaters 3 in board has Teflon thermal insulating disc 8, ceramic insulation ring 7, pottery
Porcelain heat shield 12 and ceramic insulation block 13, Teflon thermal insulating disc 8 and ceramic insulation ring 7 are located at wire chamber body wall 6 and metal
Between HTHU heaters 3, ensure to insulate between heater 3 and wire chamber body wall 6.Metal lifting module 14 passes through metal lifting ring
The 4 and lifting metal HTHU of metal elevating lever 10 heaters 3, and need to equally ensure metal elevating lever 10 and metal in use
Cavity wall 6 insulate.And in the prior art, metal lifting ring 4 is easily grounded during the use of board.As shown in Fig. 2
Ceramic insulation block 13 is located between metal lifting ring 4 and metal lifting module 14, ensures metal lifting ring 4 and metal lifting module
Insulated between 14, ceramic insulation piece 12 ensures metal lifting ring 4 and metal between metal lifting ring 4 and metal screws 11
Insulated between screw 11, as shown in figure 3, ceramic insulation piece 12 is loop configuration, it is merely capable of ensureing the upper of metal screws 11
Portion insulate with metal lifting ring 4, and in use, as long as metal lifting ring 4 is slightly offset, will be connect with metal screws 11
Touch, so as to cause metal lifting ring 4 to be grounded, after metal lifting ring 4 is grounded, pole cap 9 is lifted by metal elevating lever 10 and metal
Metal HTHU heaters 3 are caused to be grounded, heater 3 causes the temperature of wafer 2 to raise after being grounded, metal pressure will be bonded at after aluminium melting
On ring 1, in transmit process, the opportunity that wafer 2 drops not can determine that, therefore cause the position of wafer 2 to offset, so as to cause wafer
Scrap problem.
And in the present invention, as shown in figure 5, the circle of increase by one convexes to form the fool proof of the present invention at ceramic insulation piece screw hole
Design, during installation, metal screws 11 are had into raised ceramic insulation piece 12 ' through this, are then then passed through the He of metal lifting ring 4
Ceramic insulation block 13 is installed in metal lifting module, and such metal screws are complete by ceramic insulation piece 12 ' with metal lifting ring 4
Isolation, even if the position of metal lifting ring 4 is slightly offset, due to the setting of projection, metal screws 11 will not also touch metal
Lifting ring 4, enter without causing heater 3 to be grounded, so as to avoid the adhesion of wafer 2, avoid the problem of scrapping.
The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to these embodiments, in the present invention
Application range in can carry out various changes.Although simply illustrating the preferred embodiments of the present invention above, institute
Category those skilled in the art will be apparent that in the range of not departing from novelty and advantage of the invention substantially, can be to showing
Example property embodiment carries out various modifications.
Claims (4)
1. a kind of HTHU heaters of the PVD board aluminium room with insulation anti-misoperation device, in PVD board aluminium room, metal lifting
Wafer is fixed on metal HTHU by module by metal lifting ring and metal lifter rod lifting metal HTHU heaters, metal pressure ring
On heater, by ensureing HTHU heater insulations with lower component in board：Teflon thermal insulating disc, ceramic insulation ring, ceramics every
Backing and ceramic insulation block, wherein, Teflon thermal insulating disc and ceramic insulation ring are located at wire chamber body wall and metal HTHU heating
Between device, ensure to insulate between heater and wire chamber body wall；Ceramic insulation block is located at metal lifting ring and metal lifting module
Between, ensure to insulate between metal lifting ring and metal lifting module；Ceramic insulation piece is located at metal lifting ring and metal screws
Between, ensure to insulate between metal lifting ring and metal screws, it is characterised in that
There are a circle cylindrical protrusions at the screw hole of the ceramic insulation piece, projection is hollow structure, its hollow space and
The screw hole on ceramic insulation piece top forms the consistent through hole of internal diameter.
2. HTHU heaters according to claim 1, it is characterised in that the exterior contour of ceramic insulation piece is circular or side
Shape, its external dimensions are more than the nut of metal screws.
3. HTHU heaters according to claim 1, it is characterised in that the height of the cylindrical protrusions lifts with metal
The consistency of thickness of ring.
4. HTHU heaters according to claim 1, it is characterised in that the through hole internal diameter depends on metal screws
Diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410471268.3A CN105483612B (en) | 2014-09-16 | 2014-09-16 | A kind of HTHU heaters of the PVD board aluminium room with insulation anti-misoperation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410471268.3A CN105483612B (en) | 2014-09-16 | 2014-09-16 | A kind of HTHU heaters of the PVD board aluminium room with insulation anti-misoperation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105483612A CN105483612A (en) | 2016-04-13 |
| CN105483612B true CN105483612B (en) | 2018-04-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410471268.3A Active CN105483612B (en) | 2014-09-16 | 2014-09-16 | A kind of HTHU heaters of the PVD board aluminium room with insulation anti-misoperation device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1812072A (en) * | 2005-01-27 | 2006-08-02 | 联华电子股份有限公司 | Up-down needle mechanism and baseplate bearing device for process reaction chamber |
| CN101471277A (en) * | 2007-12-27 | 2009-07-01 | 周星工程股份有限公司 | Electrostatic chuck and apparatus for treating substrate including the same |
| CN101533797A (en) * | 2008-03-11 | 2009-09-16 | 东京毅力科创株式会社 | Mounting base structure and heat processing apparatus |
| CN202996792U (en) * | 2012-11-01 | 2013-06-12 | 修建东 | Transistor bonding sheet heating device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4680350B2 (en) * | 2000-06-26 | 2011-05-11 | 東京エレクトロン株式会社 | Single wafer processing equipment |
-
2014
- 2014-09-16 CN CN201410471268.3A patent/CN105483612B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1812072A (en) * | 2005-01-27 | 2006-08-02 | 联华电子股份有限公司 | Up-down needle mechanism and baseplate bearing device for process reaction chamber |
| CN101471277A (en) * | 2007-12-27 | 2009-07-01 | 周星工程股份有限公司 | Electrostatic chuck and apparatus for treating substrate including the same |
| CN101533797A (en) * | 2008-03-11 | 2009-09-16 | 东京毅力科创株式会社 | Mounting base structure and heat processing apparatus |
| CN202996792U (en) * | 2012-11-01 | 2013-06-12 | 修建东 | Transistor bonding sheet heating device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105483612A (en) | 2016-04-13 |
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Address after: 215123 333 Xinghua street, Suzhou Industrial Park, Jiangsu Patentee after: Warship chip manufacturing (Suzhou) Limited by Share Ltd Address before: 215025 Xinghua street, Suzhou Industrial Park, Suzhou, Jiangsu 333 Patentee before: Hejian Technology (Suzhou) Co., Ltd. |
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