CN105470149B - Surface mount elements processing method - Google Patents
Surface mount elements processing method Download PDFInfo
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- CN105470149B CN105470149B CN201510977398.9A CN201510977398A CN105470149B CN 105470149 B CN105470149 B CN 105470149B CN 201510977398 A CN201510977398 A CN 201510977398A CN 105470149 B CN105470149 B CN 105470149B
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- surface mount
- mount elements
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Abstract
This application discloses a kind of surface mount elements processing methods, surface mount elements are reprinted to carrier, and the surface mount elements are uniformly arranged；It is reprinted described in plastic packaging to the surface mount elements on the carrier, forms plastic-sealed body, there is electrode, the leads ends of the electrode to expose from the surface of the plastic-sealed body on the surface mount elements；The surface mount elements are detached with carrier, divide the plastic-sealed body, form the individually surface mount elements with plastic package structure.The leads ends of surface mount elements plastic packaging, electrode being exposed, being used when for connecting; plastic-sealed body plays protective effect to surface mount elements, avoids since surface mount elements are with hypotelorism between adjacent devices, caused short circuit; when avoiding soldered ball connection simultaneously, the tin pollution electrode in soldered ball makes its short circuit.
Description
Technical field
The present disclosure relates generally to semiconductor applications, and in particular to the surface mount elements in semiconductor fabrication, especially patch
Element processing method.
Background technology
The electrode section of surface mount elements is typically not no protective layer in the prior art, and the spacing between electrode is smaller,
Short circuit is easily generated between device attachment followed by adjacent devices.Also, electrode needs to connect by soldered ball in connection, and soldered ball
It can generally use tin ball, tin " can be climbed " along electrode, stain side, it is made to be easy to happen short circuit.
Invention content
In view of drawbacks described above in the prior art or deficiency, it is intended to provide a kind of surface mount elements processing method, by patch member
Part is reprinted to carrier, and the surface mount elements are uniformly arranged；It is reprinted described in plastic packaging to the surface mount elements on the carrier, is formed
There is on the surface mount elements plastic-sealed body electrode, the leads ends of the electrode to expose from the surface of the plastic-sealed body；By the patch
Piece element is detached with carrier, divides the plastic-sealed body, forms the individually surface mount elements with plastic package structure.
At least one of surface mount elements processing method of the present invention has the beneficial effect that：By surface mount elements plastic packaging, electrode draws
Foot exposes, and is used when for connecting, plastic-sealed body plays protective effect to surface mount elements, avoids since surface mount elements are with phase
Hypotelorism between adjacent device, caused short circuit, while when avoiding soldered ball connection, the tin pollution electrode in soldered ball keeps its short
Road.
Description of the drawings
By reading a detailed description of non-restrictive embodiments in the light of the attached drawings below, the application's is other
Feature, objects and advantages will become more apparent upon：
Fig. 1 is the flow chart of surface mount elements processing method of the present invention；
Fig. 2 is the schematic diagram that surface mount elements are reprinted in surface mount elements processing method of the present invention；
Fig. 3 A, the schematic diagram that 3B, 4,5 are each step in an embodiment of the present invention；
Fig. 6,7,8 are the schematic diagram of each step in another embodiment of the invention.
Specific implementation mode
The application is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining related invention, rather than the restriction to the invention.It also should be noted that in order to
Convenient for description, is illustrated only in attached drawing and invent relevant part.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
It should be noted that although describing the operation of the method for the present invention with particular order in the accompanying drawings, this is not required that
Or imply and must execute these operations according to the particular order, it could the realization phase or have to carry out operation shown in whole
The result of prestige.On the contrary, the step of describing in flow chart, which can change, executes sequence.Additionally or alternatively, it is convenient to omit certain
Multiple steps are merged into a step and executed, and/or a step is decomposed into execution of multiple steps by step.
The present invention discloses a kind of processing method of surface mount elements, and this method as shown in Figure 1 includes：
Step 10, surface mount elements 1 are reprinted.Specifically as shown in Fig. 2,3A, 3B and 6, surface mount elements 1 are reprinted and arrive carrier
2, and surface mount elements 1 are uniformly arranged；Multiple surface mount elements 1 are reprinted on carrier 2 in the step, effect when batch production
Rate can be very high, and reprints to use and manually reprint, and is more preferably reprinted using machinery, can obtain high reprinting and imitate
Rate, and can guarantee that surface mount elements 1 can be uniform on carrier 2.
Step 20, plastic packaging surface mount elements.As shown in Fig. 4, Fig. 7, in this step, plastic packaging is reprinted onto the carrier 2
Surface mount elements form it into plastic-sealed body.The method of plastic packaging can be there are many form, even sealing machine when for chip package
It can be used for being packaged the surface mount elements of the present invention, the purpose of encapsulation here is exactly that encapsulating material is made to seal surface mount elements
Dress, especially wants the surrounding of the electrode 11 on plastic packaging surface mount elements, certainly, in order to complete the connection of electrode 11, electrode 11 draws
Foot exposes from the surface of plastic-sealed body.Leads ends expose number can be determines according to actual conditions as shown in the figure
, only expose a joint face of leads ends, can also be to expose one section of leads ends shown in figure.
Surface mount elements by this step are the surface mount elements for being already formed with plastic-sealed body, the plastic packaging member that below step refers to
Part is the surface mount elements for having plastic-sealed body.The mode of injection molding may be used in above-mentioned plastic packaging.
Step 30, divide surface mount elements.Surface mount elements are detached with carrier 2, divide plastic-sealed body, being formed individually has plastic packaging
The surface mount elements of structure.In this step, can be that surface mount elements first detach to (surface mount elements described herein are with carrier 2
Plastic packaging has the surface mount elements of plastic-sealed body), it is being split, can also be first to divide plastic-sealed body, then detach with carrier 2.Single tool
There are the surface mount elements of plastic package structure as shown in Figure 5 and Figure 8.
Optionally, above-mentioned surface mount elements can be 0201 device or 01005 device.
In above-mentioned steps 10, surface mount elements are uniformly arranged on the carrier 2 at each interval, have interval be in order to
Surface mount elements will not be damaged when step 30 is divided.
It illustrates how to reprint with two embodiments below and places surface mount elements, and how to be moulded according to different laying methods
Envelope.
Embodiment 1：
Raised electrode 11 on surface mount elements, when surface mount elements are reprinted to carrier 2, electrode 11 is towards carrier 2
Loading end.As shown in figs.3 a and 3b.It is front with 11 place face of electrode, by being just placed into facing towards loading end for surface mount elements
On carrier 2, the electrode 11 of protrusion is supported on loading end.
When this mode is placed, a kind of plastic packaging mode can be：Above surface mount elements, with the direction in vertical bearing face
Inject plastic packaging glue 3, surface mount elements described in plastic packaging.3 complete plastic packaging electrode 11 of plastic packaging glue can be avoided in this way, need not subsequently gone
Except plastic packaging glue 3 makes electrode 11 expose.
Another plastic packaging mode is：From the gap injection plastic packaging glue 3 between 2 loading end of surface mount elements and carrier.It is above-mentioned convex
The electrode 11 risen is supported in loading end, gap is formed between patch member and loading end, from the direction for being parallel to loading end, along sky
Gap injects plastic packaging glue 3, surface mount elements described in plastic packaging.
Both the above mode can form the structure such as Fig. 4, after subsequent singulation, electrode 11 can be made only to expose leads ends
Joint face, as shown in Figure 5.
Certainly, expose one section of leads ends if it is desired to realizing, groove 21 can be set on loading end, it as shown in Figure 3B, should
The electrode 11 of protrusion is supported in groove 21 by the electrode 11 of 21 respective protrusions of groove, and this method can make in groove 21
Part leads ends not by plastic packaging, to expose.Certainly it is also avoided that during plastic packaging, operation shakiness makes plastic packaging glue 3 penetrate into
The joint face of leads ends, therefore yields can be improved.In order to clearly show groove 21 in Fig. 3 B, by surface mount elements dotted line table
Show.
Embodiment 2：
There is projected electrode 11, when surface mount elements are reprinted to carrier 2, electrode 11 is backwards to the carrier 2 on surface mount elements
Loading end.As shown in Figure 6.It is front with 11 place face of electrode, opposite another side is the back side, by the back side of surface mount elements
It is placed on carrier towards loading end.
In this modes of emplacement, from the surrounding of electrode 11 injection plastic packaging glue 3, plastic packaging surface mount elements when injection molding.It is formed such as
Structure shown in Fig. 7.Can be avoided from surrounding injection completely will be in 11 plastic packaging to mould-injection of electrode.
Both examples above is optional two ways, and surface mount elements are prepared for processing, above-mentioned using the present invention
The surface mount elements that mode is processed can avoid surface mount elements with the short circuit between adjacent devices, at the same avoid soldered ball connection when,
Tin pollution electrode 11 in soldered ball makes its short circuit.Above-mentioned mould-injection can be rubber.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.People in the art
Member should be appreciated that invention scope involved in the application, however it is not limited to technology made of the specific combination of above-mentioned technical characteristic
Scheme, while should also cover in the case where not departing from the inventive concept, it is carried out by above-mentioned technical characteristic or its equivalent feature
Other technical solutions of arbitrary combination and formation.Such as features described above has similar work(with (but not limited to) disclosed herein
Can technical characteristic replaced mutually and the technical solution that is formed.
Claims (1)
1. a kind of surface mount elements processing method, which is characterized in that
Surface mount elements are reprinted to carrier, and the surface mount elements are uniformly arranged at each interval；
It is reprinted described in plastic packaging to the surface mount elements on the carrier, forms plastic-sealed body, raised electricity on the surface mount elements
The leads ends of pole, the electrode are exposed from the surface of the plastic-sealed body；
The surface mount elements are detached with carrier, divide the plastic-sealed body, form the individually surface mount elements with plastic package structure；
Wherein, it is described by the surface mount elements reprint to carrier when, loading end of the electrode towards the carrier；
Above the surface mount elements, plastic packaging glue is injected with the direction of the vertical loading end, surface mount elements described in plastic packaging；
The electrode supporting of the protrusion forms gap in the loading end between patch member and the loading end, from flat
Row injects plastic packaging glue in the direction of the loading end, along the gap, surface mount elements described in plastic packaging；
There is the groove that the electrode of the corresponding protrusion is formed on the loading end, by the electrode supporting of the protrusion in described
In groove；
Alternatively, by the surface mount elements reprint to carrier when, the electrode backwards to the carrier loading end, from the electrode
Surrounding injects plastic packaging glue, surface mount elements described in plastic packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510977398.9A CN105470149B (en) | 2015-12-22 | 2015-12-22 | Surface mount elements processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510977398.9A CN105470149B (en) | 2015-12-22 | 2015-12-22 | Surface mount elements processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105470149A CN105470149A (en) | 2016-04-06 |
| CN105470149B true CN105470149B (en) | 2018-07-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510977398.9A Active CN105470149B (en) | 2015-12-22 | 2015-12-22 | Surface mount elements processing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103311205A (en) * | 2013-05-16 | 2013-09-18 | 华天科技（西安）有限公司 | Encapsulating piece for preventing chip salient point from being short-circuited and manufacturing process thereof |
| CN104465598A (en) * | 2014-12-19 | 2015-03-25 | 江苏长电科技股份有限公司 | Metal lead frame high thermal conductivity flip chip packaging structure and technological method thereof |
| CN104505386A (en) * | 2014-12-30 | 2015-04-08 | 中国科学院微电子研究所 | Lateral-interconnection package on package structure |
| CN104538375A (en) * | 2014-12-30 | 2015-04-22 | 华天科技（西安）有限公司 | Fan-out PoP packaging structure and manufacturing method thereof |
| CN105097568A (en) * | 2015-07-30 | 2015-11-25 | 南通富士通微电子股份有限公司 | Semiconductor lamination packaging method |
| CN105161451A (en) * | 2015-07-30 | 2015-12-16 | 南通富士通微电子股份有限公司 | Semiconductor stacked packaging method |
-
2015
- 2015-12-22 CN CN201510977398.9A patent/CN105470149B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311205A (en) * | 2013-05-16 | 2013-09-18 | 华天科技（西安）有限公司 | Encapsulating piece for preventing chip salient point from being short-circuited and manufacturing process thereof |
| CN104465598A (en) * | 2014-12-19 | 2015-03-25 | 江苏长电科技股份有限公司 | Metal lead frame high thermal conductivity flip chip packaging structure and technological method thereof |
| CN104505386A (en) * | 2014-12-30 | 2015-04-08 | 中国科学院微电子研究所 | Lateral-interconnection package on package structure |
| CN104538375A (en) * | 2014-12-30 | 2015-04-22 | 华天科技（西安）有限公司 | Fan-out PoP packaging structure and manufacturing method thereof |
| CN105097568A (en) * | 2015-07-30 | 2015-11-25 | 南通富士通微电子股份有限公司 | Semiconductor lamination packaging method |
| CN105161451A (en) * | 2015-07-30 | 2015-12-16 | 南通富士通微电子股份有限公司 | Semiconductor stacked packaging method |
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| CN105470149A (en) | 2016-04-06 |
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Address after: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Applicant after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Applicant before: Fujitsu Microelectronics Co., Ltd., Nantong |
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