CN105463557A - Electroplating clamp for rubber plugs and electroplating method adopting same - Google Patents
Electroplating clamp for rubber plugs and electroplating method adopting same Download PDFInfo
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- CN105463557A CN105463557A CN201610020389.5A CN201610020389A CN105463557A CN 105463557 A CN105463557 A CN 105463557A CN 201610020389 A CN201610020389 A CN 201610020389A CN 105463557 A CN105463557 A CN 105463557A
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- flange
- electroplating
- mould
- electroplating clamp
- mold cavity
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electroplating clamp for rubber plugs. The electroplating clamp comprises an electrode plate. One or more flanges matched with a mold cavity are formed on the electrode plate, gaps for electroplating solutions to flow are formed between the flanges and the mold cavity, through holes penetrating through the electrode plate are formed in the flanges in the axial direction of the flanges, and the flanges are arranged in the mold cavity in a suspended mode. According to the invention, the flanges matched with the mold cavity are formed on the electrode plate; in the electroplating process, the flanges are inserted into the mold cavity, the electroplating solutions are injected into the through holes and enter the gaps from the through holes, then deep holes in the cavity are electroplated, and the electroplating effect is better compared with the original process that the electroplating solutions cannot flow in the holes.
Description
Technical field
The present invention relates to product surface plated film field, particularly a kind of electroplating clamp of plug and the electro-plating method of this electroplating clamp of use.
Background technology
Plug refers to the bottle stopper of the bottleneck at a kind of medicinal glass bottle, it is generally made up of butyl material, after medicinal glass bottle perfusion, for improving cleanliness factor, chemical stability, resistance to air loss etc. the effect in bottle, the structure of general plug is a cover plate covering bottleneck, the below of cover plate is extended with the cock body fitted with the shape in bottleneck, is provided with the circular protrusion rib strengthening friction effect in the side of cock body simultaneously.
In prior art, produce the technique that this kind of plug generally adopts injection moulding, the utility model patent that application number is " 201020218053.8 " discloses a kind of chrome faced rubber plug mould, as can be seen from its claim, in order to avoid the sanitary index using releasing agent to affect plug, mould generally uses the processing method of electroplating surface, mould is electroplate with the chromium coating of one deck 0.5-1.5mm, but in the process of plating, technique is in the past generally adopt fixture that Die and mould plate is carried out clamping, then it is carried out to the plating on surface, but as can be seen from the structure and background document of plug, mould can offer for the shaping die cavity of cock body, but in electroplating technology, traditional technology adopts the mode of electrophoresis to electroplate mould, but electroplate liquid generally cannot flow in die cavity, therefore cavity lateral can only plate the electroplating film of thin layer, although complete plating by the look of it, but after mould repeatedly uses, its electrolytic coating will wears, the quality of injection moulding plug is caused to go wrong.
Summary of the invention
The object of this invention is to provide a kind of electroplating clamp strengthening a kind of plug of the electroplating effect of mold cavity; And adopt the electro-plating method of this kind of electroplating clamp.
Above-mentioned technical purpose of the present invention is achieved by the following technical programs: a kind of electroplating clamp of plug, comprise battery lead plate, described battery lead plate is formed with the flange that at least one matches with mold cavity, the gap of flow of the electrolyte of powering is formed between described flange and mold cavity, described flange is provided with the through hole of penetrating electrode plate along self axis, and described flange is unsettled being arranged in mold cavity.
As preferably, be provided with padded between described battery lead plate and mould, described flange to be unsettledly arranged in mold cavity by padded.
Further, by being provided with padded, thus achieve and make the unsettled effect in mold cavity of flange, thus avoid by battery lead plate insert in a mold time, flange contacts with the inwall in mold cavity, thus cannot electroplate this position at contact position electroplate liquid, after plating terminates, this position is in injection moulding process, plug is easy to stick in this position after shaping, thus affect the use of plug and mould, by being provided with padded, padded the height increasing flange, thus make flange depart from the contact with mold cavity, make that flange is unsettled to be arranged in mold cavity, prevent the contact of any position in flange and mold cavity, prevent mould after plating, plug moulding sticks together in this position.
As preferably, the shape of cross section of described flange is annular.
Further, by the shape of cross section of flange is arranged in annular, the flange of annular can better match with the die cavity on mould, facilitate electrolytic solution in the flowing of this position, the flange that annular is arranged simultaneously defines the position that through hole is arranged, and namely through hole is arranged with flange is concentric, therefore in electroplating process, electroplate liquid from recoiling in through hole in die cavity, thus can make the flowing also having electroplate liquid in the die cavity of mould, thus strengthens the thickness of the electroplating film of this position.
As preferably, between the medial surface of described through hole and the outer side of flange, be formed with acute angle.
Further, interior scarp is tilted to by being provided with in the front end of flange, thus more inside with the bottom angled of plug setting matches, by being provided with scarp, thus ensure that the spacing in the gap of the power supply flow of the electrolyte of the formation between flange with mold cavity is equal and consistent, by spacing all equal from top to bottom, thus the velocity of flow of electroplate liquid in die cavity is consistent, electroplate liquid is contacted with the sidewall of mold cavity more equably, thus strengthens the electroplating effect of motor plate, for the mould being exclusively used in injection moulding plug, the side of mold cavity is equal with the spacing between side, but when cavity bottom, because flange is the cavity bottom that straight cutting enters mould, cavity bottom is vertical with the flow direction of electroplate liquid, therefore the velocity of flow of cavity bottom to electroplate liquid serves the effect of obstruction, then the flow velocity of electroplate liquid when flowing through this position can reduce, have impact on the effect of plating, make the flow velocity of the flow velocity of electroplate liquid in die cavity and die surface inconsistent, cause the thickness of the electroplating film on mould larger, and die cavity flows through owing to not having a large amount of electroplate liquids, therefore it causes the thinner thickness of the electroplating film in die cavity, by the side of scarp and through hole is formed with acute angle, thus time in use, acute angle adds the gap length of the flange both sides of cavity bottom, acute angle makes electroplate liquid behind the knuckle position of cavity bottom, suddenly due to the lower thickness of flange, the space of this position is made to become large, thus produce current difference in this position, the electroplate liquid of flange hole inside is drawn and comes, accelerate the flowing of electroplate liquid.
As preferably, described flange is evenly distributed on plate body, and the gap length at adjacent described flange center is equal.
Further, in order to meet the quantity of mould upper impression, so flange can be provided with multiple on plate body, simultaneously in order to increase the distributed quantity of flange on plate body, namely the quantity of the plug after mold injection molding is increased, flange in the utility model adopts to be evenly distributed on plate body, simultaneously the central position of each flange is equal to the length of the central position of adjacent flange, namely every three close flanges can form the flange group of one group of equilateral triangle vibrational power flow, under identical area, the flange that the mode of equilateral triangle is arranged more.
As preferably, the spacing in described gap is 0.5-1mm.
Further, by the spacing in gap is adjusted to 0.5-1mm, now to flow through the speed in gap the most applicable for electroplate liquid, because in this gap size, in gap, the velocity of flow of electroplate liquid is consistent with the velocity of flow of electroplate liquid above mold cavity, namely electroplate liquid is formed with the consistency of thickness of the thickness of electroplating film and the electroplating film of mold cavity surface in die cavity, and when its mold injection, the wear-resistant and ageing-resistant effect of each position is identical; If the spacing in gap is less than 0.5mm, the velocity of flow of interstitial site will be caused too fast, the thickness of electroplating film is excessively thin, if the spacing in gap is greater than 1mm, the flowing of electroplate liquid will layering, and outer electroplate liquid of fitting with die cavity does not generally flow, and the electroplate liquid flowing in the middle of gap, the redox reaction efficiency of now mold cavity surface plating is lower, and the thickness of electroplating film is excessively thin, affects electroplating quality.
As preferably, the spacing in described gap is 0.7mm.
Further, the gap of 0.7mm is a preferred size, and the gap of 0.7mm has met general required electroplating effect, if be greater than 0.7mm, the thickness of plated film will be caused blocked up, cause the raw-material waste of electroplate liquid; If simultaneously the size in gap is less than 0.7mm, electroplating film will clogging gap, and the thickness of the electroplating film after production is just excessively thin.
Use an electro-plating method for this electroplating clamp, electro-plating method comprises the steps:
Step one, prepare electroplating clamp according to claim 1;
Step 2, the flange on described electroplating clamp is inserted in the mold cavity of plug;
Step 3, by adjustment electroplating clamp position, flange is remained between the inwall of die cavity, and does not contact with the contact internal walls of die cavity;
Step 4, described mould and electroplating clamp are put into electric bath groove, then inject electroplate liquid in the through hole of mould;
Step 5, to power to described battery lead plate, thus form metallic membrane on the surface of the surface of mould and the die cavity of mould.
Further, in the present invention, adopt the using method of this kind of electroplating clamp, by the flange on electroplating clamp being inserted in the mold cavity of plug, then can by the size of padded of adjustment, or the height of the battery lead plate in adjustment electric bath groove and right position, thus make the flange being less than die cavity be positioned at die cavity, do not contact with die cavity, then the battery lead plate be fixed on mould is placed in electric bath groove together with mould, then electroplate liquid is filled with in electric bath groove, electroplate liquid is fully contacted with battery lead plate with mould, then electroplate liquid is injected in through hole, make electroplate liquid by the gap between flange and die cavity, achieve the flowing of electroplate liquid on mold cavity, thus electroplate liquid is constantly flowed in die cavity, then battery lead plate is powered, along with the continuous flowing of electroplate liquid in mold cavity, make the mold cavity surface of mould constantly generate metallic membrane, strengthen electroplating effect.
As preferably, described electroplate liquid is containing polytetrafluoroethylene granule.
Further, general mould adopts the metals such as chromium plating, in the utility model, adopt and add polytetrafluoroethylene granule in electroplate liquid, thus in electroplating process, polytetrafluoroethylene granule is also attached in the die cavity of mould, thus in the die cavity of mould, define the electrolytic coating of one deck wear-resistant type, serve good abrasion resistant effect, electroplate liquid simultaneously containing polytetrafluoroethylene granule is difficult to flowing, by being provided with the flange stretching into die cavity, thus serving the flowing strengthened containing polytetrafluoro electroplate liquid dimly, strengthening its electroplating effect.
As preferably, in described step 5, the current density of power supply is 6 peaces/square decimeter, electroplating time 3-7 minute.
Further, the current density of power supply is 6 peaces/square decimeter, if lower than this parameter, redox reaction when electroplating will be caused not thorough, simultaneously as high and this parameter, surface quality in the mold cavity of plating can decline, can be too high due to current density, produces wrinkling on the surface of die cavity, if electroplating time was lower than 3 minutes simultaneously, electrolytic coating will be caused thinner, if electroplating time was higher than 7 minutes, the problem that electrolytic coating is blocked up will be caused.
In sum, the present invention has following beneficial effect: by being formed with the flange matched with mold cavity on plate body, thus in electroplating process, flange is inserted in the die cavity of mould, inject electroplate liquid in through hole, now electroplate liquid enters in gap in through hole simultaneously, then electroplates hole darker in die cavity, cannot flow in hole compared to original electroplate liquid, electroplating effect is now better; Be provided with padded further, serve and make flange be suspended in the hole of die cavity, prevent flange from contacting with the hole on die cavity, strengthen its electroplating effect, the front end of flange is provided with scarp simultaneously, then the side of scarp and through hole is formed with acute angle, then accelerates the electroplate liquid flowing of this position, strengthens electroplating effect; Simultaneously by being provided with padded on plate body, achieving flange suspension and being arranged in mould; Then the utility model is by being limited in 0.5-1mm by the size in gap between flange and inwall, improves the molding effect of electroplating film.
Accompanying drawing explanation
Fig. 1 is structural representation one of the present invention;
Fig. 2 is diagrammatic cross-section of the present invention;
Fig. 3 is the portion of A shown in Fig. 2 enlarged diagram.
In figure, 0, battery lead plate; 1, mould; 11, mold cavity; 2, flange; 3, through hole; 4, gap; 5, padded.
Embodiment
Be described in further detail to accompanying drawing 3 couples of the present invention below in conjunction with accompanying drawing 1.
This specific embodiment is only explanation of the invention; it is not limitation of the present invention; those skilled in the art can make to the present embodiment the amendment not having creative contribution as required after reading this specification sheets, as long as but be all subject to the protection of patent law in right of the present invention.
As shown in figures 1 and 3, a kind of electroplating clamp of plug, comprise battery lead plate 0, battery lead plate 0 is formed with the flange 2 that at least one matches with mold cavity 11, the gap 4 of flow of the electrolyte of powering is formed between flange 2 and mold cavity 11, flange 2 is provided with the through hole 3 of penetrating electrode plate 0 along self axis, flange 2 is arranged in mold cavity 11 in unsettled, by being formed with the flange 2 matched with mold cavity 11 on plate body, thus in electroplating process, flange 2 is inserted in the die cavity of mould 1, inject electroplate liquid in through hole 3 simultaneously, now electroplate liquid enters in gap 4 in through hole 3, then hole darker in die cavity is electroplated, cannot flow in hole compared to original electroplate liquid, electroplating effect is now better, be provided with padded 5 further, serve and make flange 2 be suspended in the hole of die cavity, prevent flange 2 from contacting with the hole on die cavity, strengthen its electroplating effect, the front end of flange 2 is provided with scarp simultaneously, then the side of scarp and through hole 3 is formed with acute angle, then accelerates the electroplate liquid flowing of this position, strengthens electroplating effect, simultaneously by being provided with padded 5 on plate body, achieving flange 2 suspension and being arranged in mould 1, then the utility model is by being limited in 0.5-1mm by the size in gap 4 between flange 2 and inwall, improves the molding effect of electroplating film.
As shown in Figure 1, padded 5 is provided with between battery lead plate 0 and mould 1, flange 2 is unsettledly arranged in mold cavity 11 by padded 5, by being provided with padded 5, thus achieve and make the unsettled effect in mold cavity 11 of flange 2, thus avoid when battery lead plate 0 is inserted in mould 1, flange 2 contacts with the inwall in mold cavity 11, thus cannot electroplate this position at contact position electroplate liquid, after plating terminates, this position is in injection moulding process, plug is easy to stick in this position after shaping, thus affect the use of plug and mould 1, by being provided with padded 5, increase the height of flange 2 for padded 5, thus make flange 2 depart from the contact with mold cavity 11, make that flange 2 is unsettled to be arranged in mold cavity 11, prevent the contact of any position in flange 2 and mold cavity 11, prevent mould 1 after plating, plug moulding sticks together in this position.
As shown in Figure 3, the shape of cross section of flange 2 is annular, by the shape of cross section of flange 2 is arranged in annular, the flange 2 of annular can better match with the die cavity on mould 1, facilitate electrolytic solution in the flowing of this position, the flange 2 that annular is arranged simultaneously defines the position that through hole 3 is arranged, namely through hole 3 is arranged with flange 2 is concentric, therefore in electroplating process, electroplate liquid can from recoil in through hole 3 in die cavity, thus make the flowing also having electroplate liquid in the die cavity of mould 1, thus strengthen the thickness of the electroplating film of this position.
As shown in Figure 3, acute angle is formed between the medial surface of through hole 3 and the outer side of flange 2, interior scarp is tilted to by being provided with in the front end of flange 2, thus more inside with the bottom angled of plug setting matches, by being provided with scarp, thus ensure that the spacing in the gap 4 of the power supply flow of the electrolyte of the formation between flange 2 with mold cavity 11 is equal and consistent, by spacing all equal from top to bottom, thus the velocity of flow of electroplate liquid in die cavity is consistent, electroplate liquid is contacted with the sidewall of mold cavity 11 more equably, thus strengthen the electroplating effect of motor plate, for the mould 1 being exclusively used in injection moulding plug, the side of mold cavity 11 is equal with the spacing between side, but when cavity bottom, because flange 2 is cavity bottoms that straight cutting enters mould 1, cavity bottom is vertical with the flow direction of electroplate liquid, therefore the velocity of flow of cavity bottom to electroplate liquid serves the effect of obstruction, then the flow velocity of electroplate liquid when flowing through this position can reduce, have impact on the effect of plating, make the flow velocity on the flow velocity of electroplate liquid in die cavity and mould 1 surface inconsistent, cause the thickness of the electroplating film on mould 1 larger, and die cavity flows through owing to not having a large amount of electroplate liquids, therefore it causes the thinner thickness of the electroplating film in die cavity, by the side of scarp and through hole 3 is formed with acute angle, thus time in use, acute angle adds gap 4 size of flange 2 both sides of cavity bottom, acute angle makes electroplate liquid behind the knuckle position of cavity bottom, suddenly due to the lower thickness of flange 2, the space of this position is made to become large, thus produce current difference in this position, the electroplate liquid of flange 2 through hole 3 inside is drawn and comes, accelerate the flowing of electroplate liquid.
As depicted in figs. 1 and 2, flange 2 is evenly distributed on plate body, the gap length at adjacent ribs 2 center is equal, in order to meet the quantity of mould 1 upper impression, so flange 2 can be provided with multiple on plate body, simultaneously in order to increase the distributed quantity of flange 2 on plate body, namely the quantity of the plug after mould 1 injection moulding is increased, flange 2 in the utility model adopts to be evenly distributed on plate body, simultaneously the central position of each flange 2 is equal to the length of the central position of adjacent flange 2, namely every three close flanges 2 can form the flange 2 groups of one group of equilateral triangle vibrational power flow, under identical area, the flange 2 that the mode of equilateral triangle is arranged more.
As shown in Figure 3, the spacing in gap 4 is 0.5-1mm, by the spacing in gap 4 is adjusted to 0.5-1mm, now to flow through the speed in gap 4 the most applicable for electroplate liquid, because in this gap 4 size, in gap 4, the velocity of flow of electroplate liquid is consistent with the velocity of flow of electroplate liquid above mold cavity 11, and namely electroplate liquid is formed with the consistency of thickness of the thickness of electroplating film and the electroplating film of mold cavity surface in die cavity, and when its mould 1 injection moulding, the wear-resistant and ageing-resistant effect of each position is identical, if the spacing in gap 4 is less than 0.5mm, the velocity of flow of position, gap 4 will be caused too fast, the thickness of electroplating film is excessively thin, if the spacing in gap 4 is greater than 1mm, the flowing of electroplate liquid will layering, outer electroplate liquid of fitting with die cavity does not generally flow, and the electroplate liquid flowing in the middle of gap 4, the redox reaction efficiency of now mold cavity surface plating is lower, the thickness of electroplating film is excessively thin, affect electroplating quality, the spacing in gap 4 is 0.7mm, the gap 4 of 0.7mm is a preferred size, the gap 4 of 0.7mm has met general required electroplating effect, if be greater than 0.7mm, the thickness of plated film will be caused blocked up, cause the raw-material waste of electroplate liquid, if simultaneously the size in gap 4 is less than 0.7mm, electroplating film will clogging gap 4, and the thickness of the electroplating film after production is just excessively thin.
Meanwhile, a kind of electro-plating method using this electroplating clamp, electro-plating method comprises the steps:
Step one, prepare electroplating clamp according to claim 1;
Step 2, the flange 2 on electroplating clamp is inserted in the mold cavity 11 of plug;
Step 3, by adjustment electroplating clamp position, flange 2 is remained between the inwall of die cavity, and does not contact with the contact internal walls of die cavity;
Step 4, mould 1 and electroplating clamp are put into electric bath groove, then inject electroplate liquid in the through hole 3 of mould 1;
Step 5, to power to battery lead plate 0, thus form metallic membrane on the surface of the die cavity of the surface of mould 1 and mould 1.
Further, in the present invention, adopt the using method of this kind of electroplating clamp, by the flange 2 on electroplating clamp is inserted in the mold cavity 11 of plug, then can by the size adjusting padded 5, or the height of the battery lead plate 0 in adjustment electric bath groove and right position, thus make the flange 2 being less than die cavity be positioned at die cavity, do not contact with die cavity, then the battery lead plate 0 be fixed on mould 1 is placed in electric bath groove together with mould 1, then electroplate liquid is filled with in electric bath groove, electroplate liquid is fully contacted with battery lead plate 0 with mould 1, then electroplate liquid is injected in through hole 3, make electroplate liquid by the gap 4 between flange 2 and die cavity, achieve the flowing of electroplate liquid on mold cavity 11, thus electroplate liquid is constantly flowed in die cavity, then battery lead plate 0 is powered, along with the continuous flowing of electroplate liquid in mold cavity 11, make the mold cavity surface of mould 1 constantly generate metallic membrane, strengthen electroplating effect, electroplate liquid is containing polytetrafluoroethylene granule, general mould 1 adopts the metals such as chromium plating, in the utility model, adopt and add polytetrafluoroethylene granule in electroplate liquid, thus in electroplating process, polytetrafluoroethylene granule is also attached in the die cavity of mould 1, thus in the die cavity of mould 1, define the electrolytic coating of one deck wear-resistant type, serve good abrasion resistant effect, electroplate liquid simultaneously containing polytetrafluoroethylene granule is difficult to flowing, by being provided with the flange 2 stretching into die cavity, thus serving the flowing strengthened containing polytetrafluoro electroplate liquid dimly, strengthening its electroplating effect.
In step 5, the current density of power supply is 6 peaces/square decimeter, electroplating time 3-7 minute, the current density of power supply is 6 peaces/square decimeter, if lower than this parameter, redox reaction when electroplating will be caused not thorough, simultaneously as high and this parameter, surface quality in the mold cavity 11 of plating can decline, can be too high due to current density, produces wrinkling on the surface of die cavity, if electroplating time was lower than 3 minutes simultaneously, electrolytic coating will be caused thinner, if electroplating time was higher than 7 minutes, the problem that electrolytic coating is blocked up will be caused.
Claims (10)
1. the electroplating clamp of a plug, comprise battery lead plate, it is characterized in that: described battery lead plate is formed with the flange that at least one matches with mold cavity, the gap of flow of the electrolyte of powering is formed between described flange and mold cavity, described flange is provided with the through hole of penetrating electrode plate along self axis, and described flange is unsettled being arranged in mold cavity.
2. the electroplating clamp of plug according to claim 1, is characterized in that: be provided with padded between described battery lead plate and mould, and described flange to be unsettledly arranged in mold cavity by padded.
3. the electroplating clamp of a kind of plug according to claim 1, is characterized in that: the shape of cross section of described flange is annular.
4. the electroplating clamp of a kind of plug according to claim 3, is characterized in that: be formed with acute angle between the medial surface of described through hole and the outer side of flange.
5. the electroplating clamp of a kind of plug according to claim 1, is characterized in that: described flange is evenly distributed on plate body, and the gap length at adjacent described flange center is equal.
6. the electroplating clamp of a kind of plug according to claim 1, is characterized in that: the spacing in described gap is 0.5-1mm.
7. the electroplating clamp of a kind of plug according to claim 6, is characterized in that: the spacing in described gap is 0.7mm.
8. use an electro-plating method for this electroplating clamp, described electro-plating method comprises the steps: step one, prepares electroplating clamp according to claim 1;
Step 2, the flange on described electroplating clamp is inserted in the mold cavity of plug;
Step 3, by adjustment electroplating clamp position, flange is remained between the inwall of die cavity, and does not contact with the contact internal walls of die cavity;
Step 4, described mould and electroplating clamp are put into electric bath groove, then inject electroplate liquid in the through hole of mould;
Step 5, to power to described battery lead plate, thus form metallic membrane on the surface of the surface of mould and the die cavity of mould.
9. the electro-plating method of this electroplating clamp of use according to claim 8, is characterized in that: described electroplate liquid is containing polytetrafluoroethylene granule.
10. the electro-plating method of this electroplating clamp of use according to claim 8, is characterized in that: in described step 5, and the current density of power supply is 6 peaces/square decimeter, electroplating time 3-7 minute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610020389.5A CN105463557B (en) | 2016-01-13 | 2016-01-13 | A kind of electroplating clamp of plug and the electro-plating method using the electroplating clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610020389.5A CN105463557B (en) | 2016-01-13 | 2016-01-13 | A kind of electroplating clamp of plug and the electro-plating method using the electroplating clamp |
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| CN105463557A true CN105463557A (en) | 2016-04-06 |
| CN105463557B CN105463557B (en) | 2017-12-12 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101275253A (en) * | 2007-03-28 | 2008-10-01 | 丰田合成株式会社 | Electroformed mold and manufacturing method therefor |
| CN101514476A (en) * | 2008-02-22 | 2009-08-26 | 新光电气工业株式会社 | Plating jig and plating method for electronic component by using the same |
| KR20120009321A (en) * | 2010-07-23 | 2012-02-01 | 김규태 | Plating for rack conncetion structure |
| US8236151B1 (en) * | 2009-10-30 | 2012-08-07 | Cypress Semiconductor Corporation | Substrate carrier for wet chemical processing |
| CN103789815A (en) * | 2014-02-26 | 2014-05-14 | 陈谦 | Forming method and device of metal ions via passing through deposition and bilateral constraint |
| KR20150002426U (en) * | 2013-12-13 | 2015-06-23 | 대덕전자 주식회사 | Clamp for panel holder |
| CN205347615U (en) * | 2016-01-13 | 2016-06-29 | 盛州橡塑胶（苏州）有限公司 | Electroplate plate electrode of plug mould |
-
2016
- 2016-01-13 CN CN201610020389.5A patent/CN105463557B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101275253A (en) * | 2007-03-28 | 2008-10-01 | 丰田合成株式会社 | Electroformed mold and manufacturing method therefor |
| CN101514476A (en) * | 2008-02-22 | 2009-08-26 | 新光电气工业株式会社 | Plating jig and plating method for electronic component by using the same |
| US8236151B1 (en) * | 2009-10-30 | 2012-08-07 | Cypress Semiconductor Corporation | Substrate carrier for wet chemical processing |
| KR20120009321A (en) * | 2010-07-23 | 2012-02-01 | 김규태 | Plating for rack conncetion structure |
| KR20150002426U (en) * | 2013-12-13 | 2015-06-23 | 대덕전자 주식회사 | Clamp for panel holder |
| CN103789815A (en) * | 2014-02-26 | 2014-05-14 | 陈谦 | Forming method and device of metal ions via passing through deposition and bilateral constraint |
| CN205347615U (en) * | 2016-01-13 | 2016-06-29 | 盛州橡塑胶（苏州）有限公司 | Electroplate plate electrode of plug mould |
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|---|---|
| CN105463557B (en) | 2017-12-12 |
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