CN101275253A - Electroformed mold and manufacturing method therefor - Google Patents
Electroformed mold and manufacturing method therefor Download PDFInfo
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- CN101275253A CN101275253A CNA2008100891265A CN200810089126A CN101275253A CN 101275253 A CN101275253 A CN 101275253A CN A2008100891265 A CNA2008100891265 A CN A2008100891265A CN 200810089126 A CN200810089126 A CN 200810089126A CN 101275253 A CN101275253 A CN 101275253A
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Abstract
The invention discloses an electroformed mold, comprising an electroformed shell (6) having a forming surface (60) formed by electroform; a medium flowing passage (2) for cycling a heat medium so as to adjust temperature on the forming surface (60) formed in the electroformed shell (6); a back lining piece (71) adding lining for the electroformed shell (6); and a medium transport passage (74) respectively arranged on an upriver end (21) and a downriver end (22) for the heat medium flowing into or out of the medium flowing passage (2). A connection clamp (1) for connecting the medium flowing passage (2) and the medium transport passage (74) is embedded in the electroformed shell (6). The connection clamp (1) comprises a cavity formed inside, an opening hole, a section shape of which is basically identical to a radial section of the medium flowing passage (2) and a connection hole, a section shape of which is basically identical to an external radial section of a pipe piece of the medium transport passage (74). The opening hole is connected with the connection hole by the cavity.
Description
Technical field
The present invention relates to a kind of electroformed mold and manufacture method thereof of in injection molding and slush molding, using of being suitable for.More specifically, the present invention relates to a kind of electroformed mold, it has the molding surface of using galvanoplastics, and has and be used for heating and the refrigerative thermal medium passage that flows.
Background technology
Be formed into profile by electroforming, make electroformed mold.Can the shape of body surface be carried out transfer printing with high precision.Therefore, in recent years, electroformed mold has been used for the resin that moulding has accurate surface shape.
In addition, patent documentation 2 has disclosed a kind of like this electroformed mold, and it has mould housing 1097 and inserts 1095, and inserts 1095 is installed in the mould housing 1097 and constitutes molding surface 1971, as shown in figure 28.Molding surface 1971 is formed by the surface of electrotyping process shell (electroformed shell) 1972.The rear surface of electrotyping process shell 1972 is lined with backing spare 1973.Be formed for thermoregulator medium flowing passage 1974 along the interface between electrotyping process shell 1972 and the backing spare 1973.In addition, in mould housing 1097, be formed for thermoregulator other medium flowing passage 1975.When injecting resin,, the temperature of molding surface 1971 is raise fast via medium flowing passage 1974 and 1975 cyclic high-temperature steam.Therefore, in the minimizing resin 1976 shrink mark and lapping defect appear.In case finish resin injection,, molding surface 1971 cooled off fast via medium flowing passage 1974 and 1975 recirculated cooling waters.Then, from mould, take out resin 1976.In this electroformed mold, medium flowing passage 1974 is formed near the molding surface 1971.In view of the above, can rapid heating and be cooled to profile 1971.Heat-up time and cooling time are shorter.In addition, less have lapping defect and a shrink mark that non-uniform temperature causes.
When making this electroformed mold, make master mold earlier, its transfer surface conforms to molding surface.Then, by nickel deposited, copper etc. on the transfer surface of master mold, form the electrotyping process shell.On the surface of electrotyping process shell, will be set to meander-shaped by the solid that the low melting point parts form, solid is used to form the medium flowing passage.Subsequently, give electrotyping process shell lining with backing spare.Afterwards, by solid being heated to above the temperature of low melting point parts fusing point, making the solid fusing, thereby remove solid.
In addition, patent documentation 3 discloses: arrange the thin plate that nickel-chromium is made on molding surface; The chamber shaped material is set on the thin plate face; Form nickel electrotyping process layer thereon; Subsequently, by with chamber shaped material wash-out, between thin plate and nickel electrotyping process layer, form the medium flowing passage.
Patent documentation 1:JP-A-2004-195758
Patent documentation 2: Japanese Patent No.2656876
Patent documentation 3:JP-A-10-29215
Simultaneously, medium is transmitted pipe fitting be connected with the upstream side and the downstream side of medium flowing passage respectively, be used for thermal medium flows to the electrotyping process shell from the outside medium flowing passage, and it is outside from the medium flowing passage flow direction of electrotyping process shell to be used for thermal medium.Under medium transmitted pipe fitting and situation that the medium flowing passage is connected, need consider following situation: for example, medium flowing passage 96 was formed by patent documentation 1 disclosed pipe fitting 92, as shown in figure 29; Pipe fitting 92 transmits pipe fitting 97 with medium and links to each other; And the surface coverage of these parts has electrotyping process layer 932.Yet in this case, pipe fitting 92 and 97 bottom are the bottom recessed shape, shown in dash area among Figure 29.Therefore, the problem of existence is: the electrotyping process layer is difficult to be deposited on the part of representing with dash area.In view of the above, worry that can not make medium flowing passage pipe fitting 92 and medium transmit pipe fitting 97 by electrotyping process layer 932 reliably is connected each other, and, in having the bottom recessed shape 98 of electrotyping process layer, may not be formed with the gap, thereby thermal medium spills from this gap.
In addition, between medium flowing passage pipe fitting 92 and the porous plate 91 and between medium transmission pipe fitting 97 and the porous plate 91, do not form the electrotyping process layer.In view of the above, worry medium flowing passage pipe fitting 92 and medium transmit pipe fitting 97 can not with porous plate 91 secure fixation.
In addition, in the electroformed mold that discloses by patent documentation 1, steel pipe is arranged on the surface of porous plate.The surface coverage of each steel pipe has the electrotyping process film.Steel pipe has rigidity to a certain degree.Therefore, can avoid medium flowing passage Yin Qinei to press and be out of shape.Yet,, also be difficult to be arranged on the careful part of porous plate though pipe fitting is difficult to distortion.Even during with the pipe fitting bending, the spacing between the every pair of adjacent pipe is also bigger.Thereby, can not pipe fitting be set with higher density.Can not carry out temperature regulation fast.
In the electroformed mold that patent documentation 2 discloses, medium flowing passage 1974 is formed on the intersection between electrotyping process shell 1972 and the backing spare 1973.Therefore, because the difference of thermal expansivity between electrotyping process shell 1972 and the backing spare 1973, between the interface of the interface of electrotyping process shell 1972 and backing spare 1973, produce the gap.Therefore, worry that thermal medium leaks from medium flowing passage 1974.In view of the above, the disclosed electroformed mold of patent documentation 2 is relatively poor aspect wearing quality.
In the electroformed mold that patent documentation 3 discloses, form salient at the position that lamellar solid is set.The electrotyping process metal is concentrated and is deposited on salient.On the other hand, the solid periphery is a recess.The electrotyping process shell is difficult to be deposited on the recess.Therefore, the electrotyping process shell is thinner.Thereby, be deposited on the shell part on the solid periphery recess, can't guarantee to have enough rigidity.As a result, the injection pressure in worry moulding hole can make the medium flowing channel deformation.In addition, because form molding surface, be difficult to form molding surface with complicated shape by thin plate.
Summary of the invention
Finish the present invention under the circumstances.The purpose of this invention is to provide a kind of electroformed mold, can make medium flowing passage that is formed in the electrotyping process shell and the medium that is formed on electrotyping process shell outside transmit passage and reliably be connected, and be provided for the manufacture method of this electroformed mold.
In addition, finish the present invention under the circumstances.The purpose of this invention is to provide a kind of electroformed mold, it has durable medium flowing passage, and has good cooling characteristic, and, be provided for the manufacture method of this electroformed mold.
In order to address the above problem, according to a first aspect of the invention, provide a kind of electroformed mold, comprising: the electrotyping process shell, it has molding surface, and handles formation by electroforming; The medium flowing passage is used for circulating thermal medium, thereby regulates at the enterprising trip temperature of the molding surface that is formed at the electrotyping process shell; Backing spare is given electrotyping process shell lining with it; And medium transmits passage, is arranged on the outside of electrotyping process shell, and makes thermal medium flow to the medium flowing passage or flow out from the medium flowing passage.First electroformed mold is characterised in that, will be used for connecting the jockey that medium flowing passage and medium transmit passage and be embedded in the electrotyping process shell; Jockey comprises: chamber portion is formed on its inside; Open pore exposes from the electrotyping process shell, and the radial section shape of its cross-sectional shape and medium flowing passage is roughly the same; And connecting hole, its cross-sectional shape is roughly the same with the outer radial cross-sectional shape of the pipe fitting that constitutes each medium transmission passage; By chamber portion open pore and connecting hole are communicated with each other.
According to a second aspect of the invention, electroformed mold is characterised in that: locate to be provided with jockey in one of the upstream-side-end of medium flowing passage at least and end of downstream side.
According to a third aspect of the invention we, electroformed mold is characterised in that: the profile of jockey is its right and wrong bottom, bottom surface recessed shape relatively.
According to a forth aspect of the invention, electroformed mold is characterised in that: the profile of medium flowing passage is its right and wrong bottom, bottom surface recessed shape relatively.
According to a fifth aspect of the invention, provide a kind of manufacture method that is used for electroformed mold, this electroformed mold has: the electrotyping process shell has molding surface and handles formation by electroforming; The medium flowing passage is used for circulating thermal medium, thereby regulates at the enterprising trip temperature of the molding surface that is formed at the electrotyping process shell; Backing spare is given electrotyping process shell lining with it; And medium transmits passage, is arranged on the outside of electrotyping process shell, and makes thermal medium flow to the medium flowing passage or flow out from the medium flowing passage.First manufacture method is characterised in that and comprises: the first electroforming step, on the transfer surface of master mold, form the electrotyping process layer, and transfer surface conforms to the shape of molding surface; The step that is provided with that flow passage forms part and jockey is set on the surface of electrotyping process layer, flow passage forms part and is used to form flow passage, flow passage forms process conductive processing on the part, and jockey comprises that the insertion flow passage forms the open pore of part, seals and be used to connect medium with sealing member and transmit the connecting hole of passage and the chamber portion that is used for open communication hole and connecting hole; The second electroforming step on the electrotyping process laminar surface that is provided with flow passage formation part and jockey, further forms the electrotyping process layer; And elution step, form part from electrotyping process layer wash-out flow passage, and form the medium flowing passage.
According to a sixth aspect of the invention, this manufacture method is characterised in that: form material with non-electroforming and cover the part of exposing from connecting hole in the sealing member.
In addition,, according to a seventh aspect of the invention, provide a kind of electroformed mold, have in order to realize purpose of the present invention: the electrotyping process shell, it has molding surface and handles formation by electroforming; Backing spare is given electrotyping process shell lining with it; And the medium flowing passage, it is formed in the electrotyping process shell and circulating thermal medium, thereby is adjusted to the temperature of profile.In second electroformed mold, the electrotyping process shell comprises: shape layer, and its surface is as molding surface; Temperature regulation section, it is configured to, and forms the medium flowing passage between first heat-conducting layer that same material is made and second heat-conducting layer; And enhancement layer, be formed at the opposite side of shape layer with respect to temperature regulation section.
According to an eighth aspect of the invention, electroformed mold is characterised in that: enhancement layer is by making with the shape layer identical materials.
According to a ninth aspect of the invention, electroformed mold is characterised in that: first heat-conducting layer and second heat-conducting layer are made of copper.
According to the tenth aspect of the invention, electroformed mold is characterised in that: enhancement layer and shape layer are made by nickel.
According to an eleventh aspect of the invention, provide a kind of manufacture method that is used for electroformed mold, this electroformed mold comprises the electrotyping process shell with molding surface.In the electrotyping process shell, form the medium flowing passage, be used for circulating temperature and regulate thermal medium.Second manufacture method is characterised in that comprising the steps: to carry out on the transfer surface of master mold electroforming handles, the step of deposition modeling layer and heat-conducting layer successively, and this transfer surface forms with the shape of molding surface and conforms to; And the flow passage formation part that on the surface of heat-conducting layer, is provided for forming the medium flowing passage, flow passage forms on the part through conductive processing; On the surface of heat-conducting layer, carry out further electroforming and handle, deposition heat-conducting layer and enhancement layer, thus form the electrotyping process shell; And remove flow passage from the electrotyping process shell and form part, form the medium flowing passage.
According to a twelfth aspect of the invention, this manufacture method is characterised in that: flow passage forms part and is made by polystyrene.
According to a thirteenth aspect of the invention, this manufacture method is characterised in that: flow passage forms part and is provided with micropore on its surface.
According to a fourteenth aspect of the invention, this manufacture method is characterised in that: flow passage forms part and has non-bottom recessed shape, wherein, when flow passage being set on the electrotyping process shell forming part, be formed on flow passage and form angle between part side and the electrotyping process shell surface more than or equal to 90 °.
According to a first aspect of the invention, by means of the jockey that is embedded in the electrotyping process shell, make medium flowing passage that is arranged in the electrotyping process shell and the medium that is arranged on electrotyping process shell outside transmit passage and be connected.The open pore of jockey leads to the medium flowing passage, and has the cross-sectional shape roughly the same with the radial section shape of medium flowing passage.Therefore, medium flowing passage and jockey are covered continuously by the electrotyping process shell.Thereby, jockey reliably is connected with the medium flowing passage.In addition, the radial section shape of the cross-sectional shape of connecting hole and medium transmission passage is roughly the same.Therefore, medium transmission passage can seamlessly be connected with connecting hole.In view of the above, by means of jockey, the medium flowing passage can transmit passage with medium and reliably be connected, thereby thermal medium can not leak.
According to a second aspect of the invention, jockey is arranged on the upstream-side-end of medium flowing passage and at least one place in the end of downstream side.Therefore, thermal medium can flow to the medium flowing passage and flow out to medium from the medium flowing passage from medium transmission passage swimmingly by jockey and transmit passage.
According to a third aspect of the invention we, relative its right and wrong bottom, bottom surface recessed shape of the profile of jockey.Under the situation that forms the electrotyping process layer on the on-plane surface, have such trend: promptly, the electrotyping process layer segment that is formed on each salient place of on-plane surface is thicker, and it is thinner to be formed on the electrotyping process layer segment at nonplanar each recess place.Therefore, if jockey has recessed bottom recessed shape, the electrotyping process metal is difficult to be deposited on the recessed shape of bottom.In view of the above, worry that the electrotyping process layer that is formed on the recessed shape of bottom is thinner.Therefore, the profile with jockey is set at non-bottom recessed shape.Thereby the electrotyping process metal is enhanced to the deposition of jockey.Thus, the formation of inhibition electrotyping process layer is bad.In addition, jockey can fix with the electrotyping process face that is formed on its bottom surface reliably.
According to a forth aspect of the invention, relative its right and wrong bottom, bottom surface recessed shape of the shape of medium flowing passage.Therefore, the electrotyping process layer that surrounds the medium flowing passage can deposit thereon preferably.Thereby the medium flowing passage can further be connected with electrotyping process layer (constituting its bottom surface) and jockey reliably.In view of the above, can effectively avoid thermal medium to leak.
According to a fifth aspect of the invention, flow passage is being formed under the state that part injects the jockey open pore, forming at flow passage on the surface of the surface of part and jockey and form the electrotyping process layer.Therefore, flow passage forms the electrotyping process layer that boundary portion between part and the jockey had adequate thickness and covers continuously.Thereby, when forming the medium flowing passage, the medium flowing passage reliably is connected with jockey by means of the electrotyping process layer by wash-out flow passage formation part.
In addition, seal with the connecting hole of sealing member jockey.Therefore, the connecting hole of jockey can be in order to avoid be sealed by the electrotyping process layer.In view of the above, when carrying out the second electroforming step, can keep the closed state of connecting hole.In step subsequently, can make medium transmit passage and reliably be connected with jockey.
According to a sixth aspect of the invention, the exposed portions serve of sealer is coated with non-electroforming material.Therefore, the electrotyping process layer is not deposited on the exposed portions serve of sealer.Thereby, take off sealer from connecting hole easily.
As mentioned above, the present invention can provide a kind of electroformed mold, can make medium flowing passage that is formed in the electrotyping process shell and the medium that is formed on electrotyping process shell outside transmit passage and reliably be connected.The present invention can also be provided for the manufacture method of this electroformed mold.
According to a seventh aspect of the invention, temperature regulation section constitutes, and forms the medium flowing passage between first heat-conducting layer and second heat-conducting layer.First heat-conducting layer and second heat-conducting layer are manufactured from the same material.So first heat-conducting layer firmly is connected each other with second heat-conducting layer.In view of the above, keep the resistance to air loss of medium flowing passage.Because the medium flowing passage is surrounded by first heat-conducting layer with high thermal conductivity and second heat-conducting layer, so, the temperature of medium can be conducted to molding surface fast.
In the electrotyping process shell, be formed with the position of medium flowing passage,,, form protrusion amount and the corresponding rib of medium flowing channel height along the length direction of medium flowing passage in backing spare one side.Because the effect of this rib is further enhanced the rigidity of whole electrotyping process shell.
With respect to temperature regulation section, at the opposite side formation enhancement layer of shape layer.Therefore, temperature regulation section is enhanced.Thereby, can guarantee the rigidity of whole electrotyping process shell.
According to an eighth aspect of the invention, enhancement layer is by making with the shape layer identical materials.Therefore, temperature regulation section is sandwiched between the layer that same material makes.Thereby the thermal expansion difference between shape layer and the temperature regulation section is substantially equal to the thermal expansion difference between enhancement layer and the temperature regulation section.Thus, the thermal expansion difference of temperature regulation section both sides obtains well balanced.The distortion of electrotyping process shell is suppressed.
According to a ninth aspect of the invention, first heat-conducting layer and second heat-conducting layer are made of copper.Thereby the thermal distortion of medium flowing passage can conduct to molding surface fast.
According to the tenth aspect of the invention, shape layer and enhancement layer are made by nickel.Can obtain higher rigidity.Therefore, can further strengthen the rigidity of whole electrotyping process shell.In addition, the transferring rate of nickel system shape layer is higher.Can realize higher shape transferred thereon performance.
According to an eleventh aspect of the invention, can form electroformed mold.Because of the flow passage that adopts forms part is flexible, flexible, can be arranged to have structure more freely by its medium flowing passage that forms.So can form the medium flowing passage with high-density.
According to a twelfth aspect of the invention, flow passage formation part is made by polystyrene.Therefore, flow passage formation part has flexible.Thereby, can form the loop of medium flowing passage more neatly.In addition, polystyrene has a large amount of micropores.Thereby, can more effectively realize exasperate anchoring effect to metal.
According to a thirteenth aspect of the invention, be formed with a plurality of micropores on the surface of flow passage formation part.Therefore, metal enters the surface that flow passage forms part.Thereby, performance exasperate anchoring effect.In view of the above, the metal reliable attachment forms the surface of part to flow passage.Therefore, electroconductibility can be given the whole surface that flow passage forms part.
According to a fourteenth aspect of the invention, flow passage forms part and has non-bottom recessed shape, wherein, is formed on flow passage and forms angle between part side and the electrotyping process shell surface more than or equal to 90 °.Therefore, form the situation that part has bottom recessed shape (be formed on flow passage and form angle between part side and the electrotyping process shell surface less than 90 °) with flow passage and compare, the deposition of electrotyping process metal is enhanced.
As mentioned above, the present invention can provide a kind of electroformed mold, its medium flowing passage good endurance, and cooling performance is outstanding, and the present invention can also be provided for the manufacture method of this electroformed mold.
Description of drawings
Fig. 1 is the sectional view of diagram according to the electroformed mold of first embodiment of the invention;
Fig. 2 is the axonometric drawing of diagram according to the jockey of first embodiment;
Fig. 3 A and Fig. 3 B are the axonometric drawings of diagram jockey used according to the invention; Fig. 3 A illustrates a kind of cross section and is the trapezoid jockey, and wherein a pair of relative side is parallel to each other, and another is to then its bottom surface inclination relatively of side; Fig. 3 B illustrates another kind of cross section and is the trapezoid jockey, wherein two pairs of all its bottom surface inclinations relatively of relative side;
Fig. 4 is the orthographic plan of diagram according to the planar configuration of medium flowing passage of the present invention;
Fig. 5 is the sectional view of diagram according to master mold of the present invention;
Fig. 6 is shown in the situation explanatory view that forms the shape layer and first heat-conducting layer on the master mold transfer surface;
Fig. 7 is next step a explanatory view of Fig. 6, is shown in the situation that flow passage forms part is set on the first heat-conducting layer surface;
Fig. 8 is diagram forms part according to the flow passage of first embodiment a axonometric drawing;
Fig. 9 A and Fig. 9 B are that diagram is surveyed explanatory view according to the axle that flow passage used in the present invention forms part; Fig. 9 A diagram flow passage forms the rectangular situation in part cross section; Fig. 9 B diagram flow passage forms the part cross section and is the trapezoid situation;
Figure 10 is that diagram is arranged on the explanatory view that flow passage forms the part end according to the first embodiment jockey;
Figure 11 is next step a explanatory view of Figure 10, is shown in the situation that forms second heat-conducting layer and enhancement layer on the surface that flow passage forms part and jockey;
Figure 12 is next step a explanatory view of Figure 11, and diagram is removed the situation that screw and flow passage form part;
Figure 13 is the sectional view that diagram forms the situation of the electrotyping process shell that wherein is provided with the medium flowing passage;
Figure 14 is the explanatory view of diagram with the method for backing spare lining electrotyping process shell;
Figure 15 is next step a explanatory view of Figure 14, and diagram is with the method for backing spare lining electrotyping process shell;
Figure 16 is the sectional view of diagram according to the electroformed mold of second embodiment;
Figure 17 is the sectional view of diagram according to the electrotyping process shell of second embodiment;
Figure 18 is a sectional view, is shown in according to institute's use master mold in the manufacture method of the second embodiment electroformed mold;
Figure 19 is the method that forms the electrotyping process shell according to second embodiment on master mold;
Figure 20 is next step a explanatory view of Figure 19, and diagram forms the method for electrotyping process shell;
Figure 21 is next step a explanatory view of Figure 20, and diagram forms the method for electrotyping process shell;
Figure 22 is next step a explanatory view of Figure 21, and diagram is with the method for backing spare lining electrotyping process shell;
Figure 23 is next step a explanatory view of Figure 22, the method for diagram lining electrotyping process shell;
Figure 24 is diagram forms part according to the flow passage of second embodiment an axle survey explanatory view;
Figure 25 A and Figure 25 B are shown in the axle survey explanatory view that the flow passage that uses in the electroformed mold according to the present invention forms part; Figure 25 A diagram flow passage forms the rectangular situation in part cross section; Figure 25 B diagram flow passage forms the part cross section and is the trapezoid situation;
Figure 26 is the plane explanatory view of diagram according to the medium flowing passage of second embodiment;
Figure 27 is the sectional view of electrotyping process shell in the diagram prior art electroformed mold;
Figure 28 is the sectional view of diagram prior art electroformed mold;
Figure 29 is that the axle that illustrates the medium flowing passage that is connected with medium transmission pipe fitting in the prior art electroformed mold is surveyed explanatory view.
Embodiment
(first embodiment)
According to electroformed mold of the present invention, has the medium flowing passage that is formed in the electrotyping process shell.Preferably, the cross-sectional shape right and wrong bottom recessed shape of medium flowing passage is as semicircle, rectangle, square and trapezoidal etc.Non-bottom recessed shape is meant such shape, from above during projection medium flowing passage, do not have the bottom of being covered by its top and can not see from above.If the shape of medium flowing passage is the bottom recessed shape, during from top projection medium flowing passage, wherein some is covered by its top and can not see from the top, compared with the above case, under the situation of the shape right and wrong bottom of medium flowing passage recessed shape, can improve the deposition of electrotyping process metal.
Preferably, medium flowing width of channel scope is 5mm to 15mm.Under the situation of medium flowing passage width less than 5mm, the flow of thermal medium is less.Thereby worry can not realize the temperature regulation of medium flowing passage fast.Surpass under the situation of 15mm at the medium flowing passage width, the thrust that the worry moulding material is applied to molding surface can make the medium flowing channel deformation.
Jockey is connected with the medium flowing passage.Jockey is a kind of like this anchor clamps, is used for making the medium that is embedded in backing spare to transmit passage and is connected with medium flowing passage in being formed on the electrotyping process shell.
Jockey has: open pore, and the radial section shape of its cross-sectional shape and medium flowing passage is roughly the same; Connecting hole, its cross-sectional shape and pipe fitting outer radial cross-sectional shape are roughly the same; And chamber portion, open pore and connecting hole are communicated with each other.Jockey is embedded in the electrotyping process shell.Connecting hole is exposed in outside at the electrotyping process shell.
The profile of jockey is the relative non-bottom recessed shape of its bottom surface for example.Preferably, the shape of this jockey is jockey end face and its bottom surface parallel in shape.The example of this shape is: rectangular parallelepiped, wherein two pairs of opposite flanks 12,13 each (referring to Fig. 2) parallel to each other; The cross section is the trapezoid cubes, and wherein a pair of opposite flank 12 is parallel to each other, and another is to 13 relative bottom surfaces 16, opposite flank tilt (referring to Fig. 3 A); And the cross section is the trapezoid cubes, wherein two pairs of opposite flank 12,13 each relative bottom surfaces 16 inclinations (referring to Fig. 3 B).
Preferably, jockey is made such as the metal that comprises chromium and iron by heat-stable material.Under the situation that jockey is made by metallic substance, form jockey by for example mechanical workout.
Open pore and connecting hole can be formed at any surface of jockey.For example, open pore is formed at the side of jockey, and connecting hole is formed at the end face of jockey.Selectively, open pore and connecting hole also can so form, that is, open pore is formed at the side of jockey, and connecting hole is formed at the another side of jockey.
Handle by electroforming, form the electrotyping process shell.When carrying out the electroforming processing, utilize electrochemical reaction, in containing the electrolyte solution of metal ion, switch on, metal target is deposited on the transfer surface of master mold.
The electrotyping process shell has the shape layer of formation molding surface (molding surface).Preferably, shape layer is made by having high transfer printing performance and inflexible material such as nickel.
Preferably, temperature regulation section comprise first heat-conducting layer, second heat-conducting layer and be formed on first heat-conducting layer and second heat-conducting layer between the medium flowing passage, temperature regulation section is arranged in the shape layer and the molding surface opposing backside surface.In this case, the temperature that flows through the thermal medium of medium flowing passage is effectively conducted to molding surface.Therefore, can realize temperature regulation fast.
Preferably, first heat-conducting layer and second heat-conducting layer are made by identical materials.In this case, first heat-conducting layer and second heat-conducting layer firmly and are closely fitted each other.Avoid thermal medium to leak from the medium flowing passage that is formed between first heat-conducting layer and second heat-conducting layer.Preferably, first heat-conducting layer and second heat-conducting layer are made of such as copper by the high material of thermal conductivity.
Preferably, enhancement layer is formed in the temperature regulation section and the shape layer opposing backside surface, just, a side of backing spare is being set.In this case, temperature regulation section is strengthened, thereby, can guarantee that whole electrotyping process shell has enough rigidity.
Preferably, enhancement layer is by making with the shape layer same material.In this case, temperature regulation section by same material make the layer be clipped in the middle.In view of the above, the thermal expansion difference between thermal expansion difference between shape layer and the temperature regulation section and enhancement layer and the temperature regulation section is very approaching.Thereby the thermal expansion difference between the temperature regulation section both sides obtains balance.Suppress the distortion of electrotyping process shell.
The flow passage of process conductive processing forms part by being provided with on the surface of electrotyping process layer, and this flow passage of wash-out forms part after electroforming, forms the medium flowing passage.Preferably, medium flowing tunnel-shaped member is that flexible flexible flow passage forms part.In this case, the degrees of freedom of medium flowing channel loop generation type are improved.
Preferably, flow passage formation part has micropore on its surface.This is because when carrying out conductive processing on flow passage formation part, owing to the exasperate anchoring effect of micropore, electric-conductor is attached to the surface that flow passage forms part reliably.When flow passage forms part surface formation micropore, foam material is sneaked into resin material to foam.Selectively, also can make flow passage form the surperficial roughen of part by surface finish.Flow passage forms part can be elongate, for example, and monofilament rope, the perhaps many ropes that filament is weaved into.
Flow passage forms part and adopts by solvent and can dissolve or the material that melts through Gao Re is made.Preferably, flow passage formation part is made by polystyrene.Because polystyrene has a large amount of pores, so, because the exasperate anchoring effect can be attached to conducting film the surface that flow passage forms part reliably.
Preferably, the part of the flow passage formation relative electrotyping process layer of part (constituting its bottom surface) forms non-bottom recessed shape.In this case, when carrying out the second electroforming step, flow passage forms part and has non-bottom recessed shape as the boundary portion between the electrotyping process layer of flow passage formation part bottom surface.Therefore, the electrotyping process metal relatively easily is deposited in the boundary portion.Thereby flow passage forms part and is covered continuously by the electrotyping process layer that forms in the second electroforming step as the electrotyping process layer of its bottom surface.In view of the above, when forming the medium flowing passage by wash-out flow passage formation part, whole medium flowing passage is covered by the electrotyping process layer.Therefore, can avoid thermal medium to leak from the medium flowing passage.The example that flow passage forms the non-bottom recessed shape of part is semicircle (referring to Fig. 8), rectangle (referring to Fig. 9 A) and trapezoidal (referring to Fig. 9 B).
On flow passage formation part, carry out conductive processing, with deposition electrotyping process layer on the surface that forms part at flow passage.After the wash-out flow passage forms part, on the position that flow passage formation part once is set, form the medium flowing passage that is surrounded by the electrotyping process layer.Carry out conductive processing as follows: for example, will stick with paste by the silver that in tackiness agent, scatters the silver powder acquisition and put on the surface that flow passage forms part, and perhaps carry out silver mirror and handle by the silver mirror reaction depositing silver.
Jockey is arranged on flow passage and forms the part place.Jockey is arranged at least one place in the middle body between upstream side part, downstream side part and upstream side part and the downstream side part that flow passage forms part.The connecting hole that is formed in the jockey seals with the metal seal that contains chromium and/or iron.Preferably, cover the part of exposing from the sealer connecting hole with non-electrotyping process material.On the part that is coated with non-electrotyping process material, can not deposit the electrotyping process metal.Therefore, after the second electroforming step, take off sealing member easily.Non-electrotyping process material for example is a wax, and forms as thin slice or pasty state.
Preferably, sealer has locking portion, and the shape of locking portion and connecting hole shape are roughly the same.In this case, sealing member is remained in the connecting hole reliably.For example, have at connecting hole under the situation of threaded portion, locking portion has and the corresponding screw thread form in threaded portion.
On the electrotyping process layer, jockey is set, makes flow passage form part and be inserted in the open pore.In this state, further form the electrotyping process layer.So, on the surface of flow passage formation part and jockey, form the electrotyping process layer.
Subsequently, by means of solvent such as acetone or by means of heat, flow passage is formed the part wash-out.Form the medium flowing passage thus.Afterwards, take off sealing member from jockey.And, connecting hole is wherein opened wide.
The medium transmission parts that is connected with connecting hole is formed by for example pipe fitting, and is embedded in the backing spare.Pipe fitting is made by heat stable resin or metal.Preferably, the coupling end of pipe fitting (being the end that pipe fitting links to each other with jockey) is threaded.In addition, preferably, the connecting hole of jockey has the threaded portion, and this threaded portion can be connected threadably with the coupling end of pipe fitting.In this case, by being connected, pipe fitting is connected more reliably with jockey with the jockey engage thread.
In order to give the backing spare of electrotyping process shell lining, be shaped according to electrotyping process shell rear surface shape, and be arranged on the electrotyping process shell rear surface.The material of backing spare is heat stable resin, cement or such as the metallic substance of aluminium for example, can comprise electro-conductive material such as aluminium powder, fiber such as carbon fiber and reinforcement material such as plate.
Can form in the backing spare in order to give the lining face of electrotyping process shell lining by for example discharge.Selectively, also can be filled in the electrotyping process shell and the molding surface facing surfaces, form backing spare in order to give the lining face of electrotyping process shell lining by melting material with backing spare.
Electroformed mold is used for for example resin of moulding.By circulating thermal medium in the medium flowing passage, can regulate the temperature of electroformed mold as requested.Therefore, electroformed mold is suitable for the goods of the multiple shape of moulding, such as thin shape, elongated shape and meticulous appearance shape, and can prevent to produce lapping defect and shrink mark.
Below, with reference to description of drawings first embodiment of the present invention.
As depicted in figs. 1 and 2, comprise according to the electroformed mold 7 of present embodiment: electrotyping process shell 6, it has molding surface 60, and electrotyping process shell 6 is handled by electroforming and formed; Medium flowing passage 2, it is formed in the electrotyping process shell 6, and circulating thermal medium is to be adjusted to the temperature of profile 60; Backing spare 71 is given electrotyping process shell 6 linings with backing spare 71; And medium transmits passage 74, and it is embedded in the backing spare 71, and is arranged at each upstream-side-end and the end of downstream side 21 of medium flowing passage 2, so that thermal medium flows to medium flowing passage 2 or flows out from medium flowing passage 2.
The shape of jockey 1 is a rectangular parallelepiped, and its bottom 16 is opened wide.Angulation α between the side in bottom 16 and adjacent side 12 and 13, angulation β between another side in bottom 16 and adjacent side 12 and 13, angle [alpha] and angle beta are the right angles.Open pore 120 is formed in the side 12 of jockey 1.Connecting hole 110 is opened on end face 11.Open pore 120 openings such as semicircle.The cross-sectional shape of the end 21 of the cross-sectional shape of open pore 120 and medium flowing passage 2 is roughly the same.Connecting hole 110 openings such as circle.In the inner-wall surface of connecting hole 110, form threaded portion 111.Connecting hole 110 is opened in the electrotyping process shell 6, and is connected with threaded portion 742 engage thread of pipe fitting 741 in being embedded at backing spare 71.
As shown in Figure 4, medium flowing passage 2 is arranged in the electrotyping process layer 6 with meander-shaped.The medium transmission passage that is formed by pipe fitting links to each other with two ends 21 of medium flowing passage 2 by jockey 1, and two ends 21 correspond respectively to the upstream side 20 and the downstream side 29 of medium flowing passage 2.
As shown in Figure 1, electrotyping process layer 6 comprises: shape layer 61 is formed into profile 60 thereon; Temperature regulation section 66, it has first heat-conducting layer 62 and second heat-conducting layer 63, forms medium flowing passage 2 between two heat-conducting layers 62 and 63; And enhancement layer 64 is formed at the opposite side of shape layer 61 with respect to temperature regulation section 66.First heat-conducting layer 62 and second heat-conducting layer 63 are manufactured from the same material, and are the high copper electrotyping process layers of thermal conductivity.Shape layer 61 and enhancement layer 64 are manufactured from the same material, and are the high nickel system electrotyping process layers of rigidity and transferring rate.The thickness of shape layer 61, first heat-conducting layer 62, second heat-conducting layer 63 and enhancement layer 64 is respectively 3mm, 4mm, 4mm and 3mm.The cross-sectional shape of medium flowing passage 2 is semicircle.The diameter of section of medium flowing passage 2 is 8mm.Backing spare 71 is made of aluminum.
Electroformed mold 7 has patrix 721 and counterdie 722.Die cavity 720 is formed between patrix 721 and the counterdie 722.Two electrotyping process shells 6 that are lined with backing spare 71 are arranged in the die cavity 720 as core.A front surface that constitutes resin 3 in two electrotyping process shells 6, another electrotyping process shell 6 then constitutes the rear surface of resin 3.In patrix 721, counterdie 722 and backing spare 71, be equipped with the metal tube 75 that is used for circulating temperature adjusting thermal medium.
The following describes the manufacture method that is used for electroformed mold.At first, as shown in Figure 5, prepare master mold 5, its transfer surface 50 is shaped corresponding to the shape of molding surface 60.Master mold 5 is made by the epoxide resin material with electroconductibility.As shown in Figure 6, handle, form the shape layer 61 and first heat-conducting layer 62 successively by on master mold 5, carrying out electroforming.By master mold 5 being immersed in the electrolyte solution that comprises nickel ion and cupric ion and, carrying out electroforming and handle to the electrolyte solution energising.Like this, metal target is deposited on the transfer surface 50.Thereby, form the shape layer 61 and the heat-conducting layer made of copper 62 of nickel system successively.
Then, as shown in Figure 8, prepare to be used to form the flow passage formation part 4 of medium flowing passage.Use the monofilament (diameter is made as 8mm and by polystyrene) of cross section semicircular in shape to form part 4 as flow passage.When the polystyrene extrusion moulding was formed flow passage formation part 4, the surface that forms part 4 at flow passage formed a large amount of micropore 40.To stick with paste by the silver that distribution silver powder in tackiness agent obtains and put on flow passage formation part 4.Like this, the surface that makes flow passage form part 4 has electroconductibility.At this moment, because the exasperate anchoring effect (grappling effect) of micropore 40 makes silver stick with paste reliable attachment and forms part 4 in flow passage.
Then, as shown in Figure 7, flow passage is formed part 4 be arranged on first heat-conducting layer 62.As shown in Figure 7 and Figure 8, flow passage forms part 4 cross section semicircular in shape shapes.Make flow passage form the straight portion 43 and first heat-conducting layer, 62 adjacency of part 4.The arc sections 42 of cross section semicircular in shape is arranged to up.At this moment, as shown in Figure 4, on whole first heat-conducting layer 62, arrange that by meander-shaped flow passage forms part 4, makes straight portion place by predetermined space.
Then, prepare metal jockey 1, it has: open pore 120, and the radial section shape of its radial section shape and flow passage formation part 4 is roughly the same, as shown in Figure 2; Connecting hole 110, the outer radial cross-sectional shape of its radial section shape and pipe fitting 741 is roughly the same; And chamber portion 10, be used for connection opening hole 120 and connecting hole 110.Connecting hole 110 is circular ports.In the inwall of connecting hole 110, form threaded portion 111.Then, as shown in figure 10, metallic screw 15 (it is as the closure member with locking portion 151) is injected the connecting hole 110 of jockey 1.The locking portion 151 of screw 15 has threaded portion 150.Threaded portion 111 with threaded portion 150 precession connecting holes 110.The head 152 of screw 15 exposes from connecting hole 110.Cover the end face 11 of head 152 and jockey 1 with wax disk(-sc) 18.Then, inject in the end 41 that flow passage is formed part 4 under the state of open pore 120 of jockeies 1, jockey 1 is arranged on the surface of first heat-conducting layer 62.
Then, as shown in figure 11, handle by electroforming, on first heat-conducting layer 62 that is provided with flow passage formation part 4 and jockey 1, the additional successively enhancement layer 64 that forms second heat-conducting layer 63 made of copper and nickel system.Flow passage forms part 4 and is coated with the silver paste and has electroconductibility.Therefore, flow passage forms on the part 4 and also is formed with second heat-conducting layer 63 and enhancement layer 64.In addition, because jockey 1 is made of metal, so the part that is not covered by wax disk(-sc) 18 on the jockey 1 also is formed with second heat-conducting layer 63 and enhancement layer 64.Therefore, on the surface of master mold 5, formed electrotyping process shell 6, it comprises shape layer 61, first heat-conducting layer 62, second heat-conducting layer 63 and enhancement layer 64.
Then,, remove wax disk(-sc) 18, from connecting hole 110, take off screw 15 as Figure 12 and shown in Figure 13.Then, with solvent such as acetone flow passage is formed part 4 wash-outs.Like this, form medium flowing passage 2.
Then, as shown in figure 14, on the surface of the aluminum backing spare 71 that is formed with medium transfer port 740, carry out surface treatment (for example, cutting handle), make that the surface shape of the surface of backing spare 71 and electrotyping process shell 6 is approaching.Then, the master mold 5 that will be formed with electrotyping process shell 6 is immersed in the oil 81 with backing spare 7.Then, under the relative state of the machined surface 711 of backing spare 71 and electrotyping process shell 6, in oil 81, carry out discharge process.Subsequently, along with the distance between machined surface 711 and the electrotyping process shell 6 reduces, discharge appears between electrotyping process shell 6 and machined surface 711.Afterwards, as shown in figure 15, machined surface 711 is handled, made machined surface 711 be shaped corresponding to the surface shape of electrotyping process shell 6.Then, the tackiness agent with containing Resins, epoxy and aluminium powder makes machined surface 711 combine with the rear surface of electrotyping process shell 6.
Then, with master mold 5 demoulding from the electrotyping process shell 6.Then, the electrotyping process shell 6 that is lined with backing spare 71 is installed in the die cavity 720 between patrix 721 and the counterdie 722 as core.Then, pipe fitting 741 is injected in the hole 740 of backing spare 71, transmit passage 74 thereby form medium.In addition, the threaded portion 111 of connecting hole 110 of the threaded portion 742 precession jockeies 1 of pipe fitting 741 ends will be arranged at.Like this, obtain electroformed mold 7 according to present embodiment.
In the injection molding of for example thin resin 3, use this electroformed mold 7, as depicted in figs. 1 and 2.At first, transmitting passage 74 by medium, to make temperature be that 120 ℃ to 170 ℃ water vapor circulates in medium flowing passage 2.In addition, circulation in the same pipe fitting 75 of high-temperature water vapor in being embedded at backing spare 71, patrix 721 and counterdie 722.Therefore, after tens of seconds, molding surface 60 reaches the temperature approaching with steam temperature.Then, from geat 70 injecting resins of opening molding surface 60.Because electroformed mold 7 is heated to high temperature by water vapor, so, moulding hole 600 smooth and easy the flowing that the resin of injection is being surrounded by molding surface 60.Therefore, resin is filled up in moulding hole 600.In case resin injection is finished, replace water vapor, water coolant is supplied medium flowing passage 2 and pipe fitting 75.So after tens of seconds, molding surface 60 is cooled to the temperature approaching with the temperature of water coolant.Therefore, the resin in the moulding hole is cooled off and curing.Then, open mould, and therefrom take out resin 3.
As depicted in figs. 1 and 2, in the present embodiment,, the medium flowing passage 2 in the electrotyping process shell 6 is connected to each other with the medium transmission passage 74 that is formed by the pipe fitting 741 that is embedded in the backing spare 71 by jockey 1.Jockey 1 is embedded in the electrotyping process shell 6, and open pore 120 is towards medium flowing passage 2 openings, and has the radial section shape roughly the same with the radial section shape of medium flowing passage 2.Therefore, medium flowing passage 2 and jockey 1 are coated with electrotyping process shell 6 continuously.Thereby jockey 1 reliably is connected with medium flowing passage 2.Because it is roughly the same that the radial section shape of connecting hole 110 and medium transmit the radial section shape of pipe fitting 741, pipe fitting 741 can seamlessly be connected with connecting hole 110.In view of the above, medium flowing passage 2 can reliably be connected by means of jockey 1 with medium transmission pipe fitting 74.Thereby thermal medium can not transmit passage 74 from medium and spill.
In addition, 12, the 13 relative bottom surfaces 16, side of jockey 1 form non-bottom recessed shape.Therefore, strengthened the deposition of electrotyping process course side 12,13.Thereby, can suppress the electrotyping process layer thickness and reduce.In addition, because first heat-conducting layer 62 and jockey 1 are coated with second heat-conducting layer 63 and enhancement layer 64 continuously, so jockey 1 energy secure fixation is in first heat-conducting layer 62.
Similar with jockey 1, medium flowing passage 2 has non-bottom recessed shape.Therefore, strengthened the deposition of electrotyping process metal boundary portion and between as first heat-conducting layer 62 of its bottom surface to medium flowing passage 2 sides.Therefore, the medium flowing passage 2 and first heat-conducting layer 62 are coated with second heat-conducting layer 63 and enhancement layer 64 (second heat-conducting layer 63 and enhancement layer 64 are the electrotyping process layer) continuously, make medium flowing passage 2 reliably be connected each other with first heat-conducting layer 62.
In addition, the flow passage that is used to form the medium flowing passage is formed the open pore 120 of the end 41 reeve jockeies 1 of part 4, and, under this state, form at flow passage and carry out electroforming on the surface of the surface of part 4 and jockey 1 and handle with the be tightly connected connecting hole 110 of anchor clamps 1 of screw 15.Therefore, by means of second heat-conducting layer 63 and the enhancement layer 64 that comprise the electrotyping process metal, make flow passage form part 4 and reliably be connected each other with jockey 1.In addition, the connecting hole 110 of jockey 1 is sealed by screw 15.Therefore, in jockey 1, do not deposit the electrotyping process metal.
Because the head 152 of screw 15 is coated with wax disk(-sc) 18, on the head 152 of screw 15, do not deposit the electrotyping process metal.So, be easy to take off screw 15 from connecting hole 110.Thereby jockey 1 can be easily and is arranged on reliably on the medium flowing passage 2.
As Fig. 4 and shown in Figure 7, form part 4 by between first heat-conducting layer 62 and second heat-conducting layer 63, arranging solvable flow passage, the wash-out flow passage forms part 4 subsequently, forms medium flowing passage 2.Flow passage forms part 4 flexible bending and bendings.Therefore, be arranged in stepped portion 601 even flow passage is formed part 4, flow passage forms between part 4 and the stepped portion 601 can not form the gap yet.In addition, in flow passage forms part, can also form and have less curved portions portion.Like this, can reduce flow passage and form spacing between the part.In view of the above,, medium flowing passage 2 can be formed meander-shaped by making medium flowing passage 2 warpages at bend 25 places, thereby, with the straight portion of narrower pitch arrangement medium flowing passage 2.
Incidentally, in the present embodiment, use tackiness agent that preformed backing spare is combined with the electrotyping process layer.Yet also the back lining materials that blending epoxy material (as heat stable resin) and aluminium powder can be obtained injects the rear surface side of electrotyping process layer, thereby forms backing spare.
Can be used for the moulding resin component according to electroformed mold of the present invention, for example vehicle component and household electrical appliance component.
(second embodiment)
According to formed electrotyping process shell in the electroformed mold of the present invention, have: shape layer, its surface is as molding surface; Temperature regulation section wherein is formed with the medium flowing passage between first heat-conducting layer and second heat-conducting layer; And enhancement layer, form relative with shape layer.
Shape layer, first heat-conducting layer, second heat-conducting layer and enhancement layer are all handled by electroforming and are formed.When carrying out the electroforming processing, utilize electrochemical reaction, give the electrolyte solution that contains metal ion energising, metal target is deposited on the transfer surface of master mold.
First heat-conducting layer is made by identical metal with second heat-conducting layer.First heat-conducting layer and second heat-conducting layer can be made by the highly heat-conductive material that comprises copper and aluminium.
Preferably, the thickness of first heat-conducting layer and second heat-conducting layer is in 3mm to 5mm scope.Under the situation of thickness less than 3mm of first heat-conducting layer and second heat-conducting layer, worry that the pressure (for example injection pressure) of moulding material can make the medium flowing channel deformation.Thickness at first heat-conducting layer and second heat-conducting layer surpasses under the situation of 5mm, and electroforming is handled and costed a lot of money the time.Preferably, first heat-conducting layer and second heat-conducting layer have same thickness, with the thermal expansion of balance electrotyping process shell.
Have a kind of like this trend: when carrying out the electroforming processing on on-plane surface, compare with the electrotyping process film on being deposited on salient, the electrotyping process film that is deposited on the recess is thinner.Even in this case, preferably, first heat-conducting layer and second heat-conducting layer separately the thickness of thin part also in 3mm to 5mm scope.
Preferably, the thermal expansivity of the thermal expansivity of enhancement layer and shape layer about equally.In this case, the thermal expansion difference between shape layer and the temperature regulation section almost approximates the thermal expansion difference between enhancement layer and the temperature regulation section.In view of the above, make the thermal expansion difference of temperature regulation section both sides obtain balance.Thereby, suppress the distortion of electrotyping process shell.
In the electrotyping process shell, shape layer is the layer in the face of molding surface.Preferably, shape layer is made by the good nickel of transferring rate.Selectively, shape layer also can be made by iron or chromium.Enhancement layer is by making with shape layer material identical materials, for example, and nickel, iron or chromium.
Preferably, the thickness of shape layer and enhancement layer is in 2mm to 5mm scope.Under the situation of thickness less than 2mm of shape layer and enhancement layer, the rigidity of medium flowing passage is lower.Therefore, the pressure (for example, injection pressure) of worry moulding material can make the medium flowing channel deformation.Thickness at shape layer and enhancement layer surpasses under the situation of 5mm, and the cost long time is handled in electroforming.Preferably, even under the situation of the membrane thickness unevenness of shape layer and enhancement layer, shape layer and enhancement layer separately the thickness of thin part also in 3mm to 5mm scope.Preferably, shape layer and enhancement layer have approaching thickness, with the thermal expansion of balance electrotyping process shell.
Being used for thermoregulator medium flowing passage is formed between first heat-conducting layer and second heat-conducting layer.On the molding surface of electrotyping process shell,, the medium flowing passage is arranged to meander-shaped by being bent into the almost parallel shape.Preferably, the medium flowing channel cross-section forms non-bottom recessed shape, wherein, is formed on flow passage and forms angle between part side and the electrotyping process shell surface more than or equal to 90 °.The situation that forms the bottom recessed shape with the medium flowing channel cross-section is compared, and under situation of the present invention, the electrotyping process metal is easy to be deposited on the interface between the medium flowing passage and first heat-conducting layer.The example of non-bottom recessed shape is semicircle, rectangle and trapezoidal.
Preferably, the medium flowing width of channel is in 5mm to 15mm scope.Under the situation of medium flowing width of channel less than 5mm, worry can not realize the temperature regulation of medium flowing passage fast.Surpass under the situation of 15mm in the medium flowing width of channel, worry to reduce the intensity of medium flowing passage.
When forming the medium flowing passage, the flow passage that uses the surface to have micropore forms part.Preferably, flow passage form part by can flexible warpage or crooked material make.The monofilament that can utilize this material to make constitutes flow passage and forms part, and also many filaments this material can being made are woven to and constitute flow passage formation part.Utilization can perhaps be utilized by the fusible material of heating by the material of dissolution with solvents, forms flow passage and forms part.This material is polystyrene or wax for example.
Preferably, consider the deposition of electrotyping process metal, heat-conducting layer and be arranged in the cross-sectional shape right and wrong bottom recessed shape that flow passage on the heat-conducting layer forms boundary portion between the part, for example semicircle (referring to Figure 24), rectangle (referring to Figure 25 A), square and trapezoidal (referring to Figure 25 B).The surface that forms part at flow passage is formed with under the situation of micropore, the material that uses the material that contains micropore in himself such as polystyrene to form part as flow passage.
On flow passage formation part, carry out conductive processing, to form the electrotyping process shell on the surface that forms part at flow passage.Conductive processing can be carried out as follows: for example, will stick with paste on the surface that is applied to flow passage formation part by the silver that distribution silver powder in tackiness agent obtains, and perhaps carry out the silver mirror processing of depositing silver by silver mirror reaction.
In order to give the backing spare of electrotyping process shell lining,, and be arranged on the rear surface of electrotyping process shell according to the shape shaping of electrotyping process shell rear surface.The material of backing spare is heat stable resin, cement or such as the metallic substance of aluminium for example, can comprise electro-conductive material such as aluminium powder, fiber such as carbon fiber and strongthener such as thin plate.
Lining face in order to the backing spare of giving electrotyping process shell lining can form by for example discharge.By tackiness agent being applied on the lining face of overdischarge, giving electrotyping process shell lining with backing spare, thereby backing spare is combined with the electrotyping process shell.Selectively, also can be filled in the electrotyping process shell by melting material with backing spare with the molding surface facing surfaces on, give electrotyping process shell lining with backing spare.
By thermal medium is circulated in the medium flowing passage, temperature that can the free adjustment electroformed mold.Therefore, electroformed mold is suitable for moulding and has difform goods, such as thin shape, elongate and meticulous appearance shape, and is suitable for avoiding forming lapping defect and shrink mark.
Below, with reference to description of drawings second embodiment of the present invention.
As Figure 16 and shown in Figure 17, comprise according to the electroformed mold 1007 of present embodiment: electrotyping process shell 1001, it has molding surface 1010, and handles by electroforming and to form; Backing spare 1071 is given electrotyping process shell 1001 linings with it; And medium flowing path 10 02, it is formed in the electrotyping process shell 1001, and circulating thermal medium is to be adjusted to the temperature of profile 1010.Electrotyping process shell 1001 comprises: shape layer 1011, and its surface is as molding surface 1010; Temperature regulation section 1016, it is configured to, and between first heat-conducting layer 1012 and second heat-conducting layer 1013 that same material is made, is formed with medium flowing path 10 02; And enhancement layer 1014, be formed at the opposite side of shape layer 1011 with respect to temperature regulation section 1016.
First heat-conducting layer 1012 is the electrotyping process layers that become by the copper with thermal conductive resin with second heat-conducting layer 1013.Shape layer 1011 and enhancement layer 1014 all are the electrotyping process layers of being made by the nickel with high stiffness and transferring rate.The thickness of shape layer 1011, first heat-conducting layer 1012, second heat-conducting layer 1013 and enhancement layer 1014 is respectively 3mm, 4mm, 4mm and 3mm.The cross-sectional shape of medium flowing path 10 02 is semicircle.The diameter in medium flowing path 10 02 cross section is 8mm.Backing spare 1071 is made of aluminum, obtains tackiness agent by blending epoxy material (as heat stable resin) and aluminium powder, with this tackiness agent backing spare 1071 is combined with electrotyping process shell 1001.
Then, the following describes the manufacture method that is used for electroformed mold.
At first, as shown in figure 18, prepare master mold 1005, its transfer surface 1050 forms with the shape of molding surface 1010 and conforms to.Master mold 1005 is made by the epoxide resin material with electroconductibility.As shown in figure 19, handle, form the shape layer 1011 and first heat-conducting layer 1012 successively by on master mold 1005, carrying out electroforming.By master mold 1005 is immersed in the electrolyte solution that contains nickel ion and cupric ion, and, carries out electroforming and handle to the electrolyte solution energising.Thereby metal target is deposited on the transfer surface 1050.The shape layer 1011 of nickel deposited system and heat-conducting layer made of copper 1012 like this, successively.
Then, as shown in figure 24, prepare to be used to form the flow passage formation part 1004 of medium flowing passage, be formed with micropore 1040 in its surface.Use the monofilament (diameter is made as 8mm and by polystyrene) of cross section semicircular in shape to form part 1004 as flow passage.In tackiness agent, scatter silver powder and obtain the silver paste, silver is stuck with paste put on flow passage formation part 1004.Therefore, the surface that makes flow passage form part 1004 has electroconductibility.
Then, as shown in figure 20, flow passage is formed part 1004 be arranged on first heat-conducting layer 1012.Flow passage forms part 1004 cross section semicirculars in shape.Make flow passage form the straight portion 1041 and first heat-conducting layer, 1012 adjacency of part 1004.The arc sections 1042 of cross section semicircular in shape is arranged to up.At this moment, as shown in figure 26, on whole first heat-conducting layer 1012, arrange that by meander-shaped flow passage forms part 1004, makes straight portion place by predetermined space.
Then, as shown in figure 21, handle, on first heat-conducting layer 1012 that is furnished with flow passage formation part 1004, form the enhancement layer 1014 of second heat-conducting layer 1013 made of copper and nickel system successively by carrying out electroforming.Flow passage forms part 1004 and is coated with the silver paste and has electroconductibility.In view of the above, the electrotyping process metal deposition forms on the surface of part 1004 at flow passage.Thereby, form second heat-conducting layer 1013 and enhancement layer 1014.Therefore, on the surface of master mold 1005, form electrotyping process shell 1001, it comprises shape layer 1011, first heat-conducting layer 1012, second heat-conducting layer 1013 and enhancement layer 1014.Subsequently, with solvent flow passage is formed part 1004 wash-outs.Like this, just formed medium flowing path 10 02.Subsequently, as shown in figure 26, influent stream pipe 1021 is connected with end of downstream side with the upstream-side-end of medium flowing path 10 02 respectively with outflow tube 1022.
Afterwards, as shown in figure 22, on the surface of aluminum backing spare 1071, carry out surface treatment (for example, cutting handle), make the surface of backing spare 1071 approach the surface shape of electrotyping process shell 1001.Subsequently, reduce distance between machined surface 1711 and the electrotyping process shell 1001 gradually.Then, between electrotyping process shell 1001 and machined surface 1711, produce discharge.Afterwards, as shown in figure 23, machined surface 1711 is further handled, made machined surface 1711 be configured as and conform to the surface shape of electrotyping process shell 1001.Then, use the tackiness agent that obtains by blending epoxy and aluminium powder, make the surface bonding of machined surface 1711 and electrotyping process shell 1001.Then, with master mold 1005 demoulding from the electrotyping process shell 1001.Subsequently, the electrotyping process shell 1001 that is lined with backing spare 1071 is installed in the die cavity 1720 between patrix 1721 and the counterdie 1722 as core.Like this, obtained electroformed mold 1007 according to present embodiment.
As shown in figure 16, in the injection molding of for example thin resin 1003, use electroformed mold 1007.At first, temperature is 120 ℃ to 170 ℃ a water vapor in medium flowing path 10 02 and pipe fitting 1075.After tens of seconds, molding surface 1010 reaches and the approximately equalised temperature of steam temperature.Subsequently, from geat 1070 injecting resins at molding surface 1010 split sheds.Because electroformed mold 1007 is heated to comparatively high temps by water vapor, so, moulding hole 1100 smooth and easy the flowing that the resin of injection is being surrounded by molding surface 1010.Therefore, resin is filled up in moulding hole 1100.In case resin injection is finished, replace water vapor, water coolant is supplied medium flowing path 10 02 and pipe fitting 1075.So, molding surface 1010 is cooled to and the approximately equalised temperature of the temperature of water coolant.Therefore, the resin in the moulding hole is cooled off and curing.Subsequently, open mould, therefrom take out resin 1003.
In the present embodiment, medium flowing path 10 02 is formed between first heat-conducting layer 1012 and second heat-conducting layer 1013.First heat-conducting layer 1012 is become by the same material copper with second heat-conducting layer 1013.Therefore, first heat-conducting layer 1012 and second heat-conducting layer 1013 firmly and are closely fitted each other.In view of the above, between first heat-conducting layer 1012 and second heat-conducting layer 1013, guarantee the resistance to air loss of medium flowing path 10 02.Because medium flowing path 10 02 is surrounded by first heat-conducting layer 1012 and second heat-conducting layer 1013, so, the temperature of medium can be conducted to molding surface 1010 rapidly.
In electrotyping process shell 1001, be formed with in the part of medium flowing path 10 02,, form the rib 1019 that extends along the length direction of medium flowing path 10 02 at the part place of backing spare 1,071 one sides.Further strengthen the rigidity of whole electrotyping process shell by means of rib 1019.
With respect to temperature regulation section 1016, form enhancement layer 1014 at shape layer 1011 opposite sides.Therefore, temperature regulation section 1016 is strengthened, thereby, can guarantee the rigidity of whole electrotyping process shell 1001.
When forming the medium flowing passage, use flexible flexible flow passage to form part 1004.Therefore, flow passage can be formed part 1004 and be arranged as the formation free shape.Thereby, can carry out bending to the tunnel-shaped member 1004 that flows with less bending, its straight portion can be arranged with less spacing.Even flow passage forms part 1004 and is arranged in step-like portion, between flow passage formation part 1004 and step-like portion, can not form the gap yet.In view of the above, medium flowing path 10 02 can form arbitrary shape, thereby its straight portion can form arbitrary shape with higher density.
Flow passage forms part 1004 and is made by polystyrene, wherein forms a plurality of micropores 1040.Therefore, silver is stuck with paste and is entered the surface portion that flow passage forms part 1004.Thereby, performance exasperate anchoring effect.Thus, the whole surface that can make flow passage form part 1004 has electroconductibility.
Flow passage forms the curved portions 1042 that part 1004 has the cross section semicircular in shape.Therefore, when flow passage is formed part 1004 and is arranged on first heat-conducting layer 1012, form at flow passage and to form non-bottom recessed shape 1411 in the part 1004, wherein be formed on flow passage and form the circular arc side surface of part 1004 and the angle between first heat-conducting layer 1021 more than or equal to 90 °.In view of the above, the situation that has bottom recessed shape (promptly being formed on above-mentioned angle between the two less than 90 °) with flow passage formation part 1004 is compared, and can improve the electrotyping process metal deposition that forms part place between part 1004 and the electrotyping process shell 1001 at flow passage.
In the present embodiment, with tackiness agent preformed backing spare is combined with the electrotyping process layer.Yet, also blending epoxy material (as heat-stable material) and the resulting backing spare material of aluminium powder can be annotated rear surface side to the electrotyping process layer, form backing spare.
Can be used for the moulding resin component according to electroformed mold of the present invention, such as vehicle component and household electrical appliance component.
Claims (14)
1. electroformed mold comprises:
The electrotyping process shell, it has molding surface and handles formation by electroforming;
The medium flowing passage is used for circulating thermal medium, thereby the enterprising trip temperature of the described molding surface in being formed at described electrotyping process shell is regulated;
Backing spare is given described electrotyping process shell lining with it; And
Medium transmits passage, is arranged on the outside of described electrotyping process shell, and makes thermal medium flow to described medium flowing passage or flow out from described medium flowing passage;
Wherein, be used for connecting the jockey that described medium flowing passage and described medium transmit passage and be embedded in described electrotyping process shell;
Described jockey comprises:
Chamber portion is formed on described jockey inside;
Open pore exposes from described electrotyping process shell, and the radial section shape of its cross-sectional shape and described medium flowing passage is roughly the same; And
Connecting hole, its cross-sectional shape is roughly the same with the shape in the outer radial cross section of the pipe fitting that constitutes described medium transmission passage; And
Wherein, by described chamber portion described open pore and described connecting hole are communicated with each other.
2. electroformed mold according to claim 1 wherein is provided with described jockey in one of the upstream-side-end of described medium flowing passage and end of downstream side at least.
3. electroformed mold according to claim 1, the profile of wherein said jockey is its right and wrong bottom, bottom surface recessed shape relatively.
4. electroformed mold according to claim 1, the profile of wherein said medium flowing passage is its right and wrong bottom, bottom surface recessed shape relatively.
5. manufacture method that is used for electroformed mold, described electroformed mold has:
The electrotyping process shell has molding surface and handles formation by electroforming;
The medium flowing passage, it is used for circulating thermal medium, thus the enterprising trip temperature of the described molding surface in being formed at described electrotyping process shell is regulated;
Backing spare is given described electrotyping process shell lining with it; And
Medium transmits passage, is arranged on the outside of described electrotyping process shell, and makes thermal medium flow to described medium flowing passage or flow out from described medium flowing passage; Described manufacture method comprises:
The first electroforming step forms the electrotyping process layer on the transfer surface of master mold, described transfer surface is configured as with the shape of described molding surface and conforms to;
The step that is provided with that flow passage forms part and jockey is set on the surface of described electrotyping process layer, described flow passage forms part and is used to form described flow passage, described flow passage forms on the part through conductive processing, and, described jockey comprises: open pore, wherein insert described flow passage and form part; Connecting hole, with the sealing member sealing, described connecting hole is used to connect described medium and transmits passage; And chamber portion, be used to be communicated with described open pore and described connecting hole;
The second electroforming step on the surface of the described electrotyping process layer that is provided with described flow passage formation part and described jockey, further forms the electrotyping process layer; And
Elution step forms part from the described flow passage of described electrotyping process layer wash-out, and forms described medium flowing passage.
6. the manufacture method that is used for electroformed mold according to claim 5 wherein covers the part that described sealing member exposes from described connecting hole with non-electroforming material.
7. electroformed mold has: the electrotyping process shell, and it has molding surface and handles by electroforming and forms; Backing spare is given described electrotyping process shell lining with it; And the medium flowing passage, it is formed in the described electrotyping process shell, and is used for circulating thermal medium, thereby regulates the temperature of described molding surface,
Wherein said electrotyping process shell comprises:
Shape layer, its surface is as described molding surface;
Temperature regulation section, it is configured to, and between first heat-conducting layer that is manufactured from the same material and second heat-conducting layer, forms described medium flowing passage; And
Enhancement layer is formed at described shape layer opposite side with respect to described temperature regulation section.
8. electroformed mold according to claim 7, wherein said enhancement layer is by making with described shape layer material identical materials.
9. electroformed mold according to claim 7, wherein said first heat-conducting layer and described second heat-conducting layer are made of copper.
10. electroformed mold according to claim 7, wherein said enhancement layer and described shape layer are made by nickel.
11. a manufacture method that is used for electroformed mold, described electroformed mold comprises: the electrotyping process shell, and it has molding surface; The medium flowing passage is formed in the described electrotyping process shell, is used for the thermal medium that circulating temperature is regulated, and described manufacture method comprises:
On the transfer surface of master mold, carry out electroforming and handle, deposition modeling layer and heat-conducting layer successively, described transfer surface is configured as with the shape of described molding surface and conforms to;
Flow passage is set on the surface of described heat-conducting layer forms part, described flow passage forms process conductive processing on the part, is used to form the medium flowing passage;
On the surface of described heat-conducting layer, carry out further electroforming and handle, deposition heat-conducting layer and enhancement layer, thus form the electrotyping process shell; And
Remove described flow passage from described electrotyping process shell and form part, form described medium flowing passage.
12. the manufacture method that is used for electroformed mold according to claim 11, wherein said flow passage forms part and is made by polystyrene.
13. the manufacture method that is used for electroformed mold according to claim 11, wherein said flow passage forms part and is provided with micropore on its surface.
14. the manufacture method that is used for electroformed mold according to claim 11, wherein said flow passage forms part and has non-bottom recessed shape, wherein, when described flow passage being set forming part, be formed on angle between the surface that described flow passage forms the side of part and described electrotyping process shell more than or equal to 90 ° on described electrotyping process shell.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007085101A JP2008238720A (en) | 2007-03-28 | 2007-03-28 | Electroforming mold and its manufacturing method |
| JP2007-085101 | 2007-03-28 | ||
| JP2007-085188 | 2007-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101275253A true CN101275253A (en) | 2008-10-01 |
Family
ID=39910614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100891265A Pending CN101275253A (en) | 2007-03-28 | 2008-03-28 | Electroformed mold and manufacturing method therefor |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2008238720A (en) |
| CN (1) | CN101275253A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102277598A (en) * | 2011-07-18 | 2011-12-14 | 河南理工大学 | Method for manufacturing core mold for use in electroforming of flared micro hole array |
| CN105463557A (en) * | 2016-01-13 | 2016-04-06 | 盛州橡塑胶（苏州）有限公司 | Electroplating clamp for rubber plugs and electroplating method adopting same |
| CN106584714A (en) * | 2015-10-14 | 2017-04-26 | Ktx株式会社 | Mold and manufacturing method thereof |
| CN114959806A (en) * | 2022-06-02 | 2022-08-30 | 江苏理工学院 | Array through hole electroforming processing device and two-dimensional material modification method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110027139B (en) * | 2019-03-12 | 2021-06-22 | 湖北民族大学 | Mold preparation method, mold heating system and heating control method |
-
2007
- 2007-03-28 JP JP2007085101A patent/JP2008238720A/en not_active Withdrawn
-
2008
- 2008-03-28 CN CNA2008100891265A patent/CN101275253A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102277598A (en) * | 2011-07-18 | 2011-12-14 | 河南理工大学 | Method for manufacturing core mold for use in electroforming of flared micro hole array |
| CN102277598B (en) * | 2011-07-18 | 2013-07-31 | 河南理工大学 | Method for manufacturing core mold for use in electroforming of flared micro hole array |
| CN106584714A (en) * | 2015-10-14 | 2017-04-26 | Ktx株式会社 | Mold and manufacturing method thereof |
| CN106584714B (en) * | 2015-10-14 | 2019-01-11 | Ktx株式会社 | Metal mould for formation and its manufacturing method |
| CN105463557A (en) * | 2016-01-13 | 2016-04-06 | 盛州橡塑胶（苏州）有限公司 | Electroplating clamp for rubber plugs and electroplating method adopting same |
| CN114959806A (en) * | 2022-06-02 | 2022-08-30 | 江苏理工学院 | Array through hole electroforming processing device and two-dimensional material modification method |
| CN114959806B (en) * | 2022-06-02 | 2024-05-07 | 江苏理工学院 | Array through hole electroforming device and two-dimensional material modification method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008238720A (en) | 2008-10-09 |
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