CN209785920U - Heat sink and heat sink mold - Google Patents

Abstract

The utility model provides a heating panel and heating panel casting mould belongs to electrical components heat dissipation field. The cooling plate comprises a base body and a liquid cooling pipe arranged in the base body; the outer surface of the base body is used for mounting electronic components, and the liquid cooling pipe is used for introducing a cooling medium to cool the base body and the electronic components. The liquid cooling pipe of the cooling plate is integrally poured inside the base body of the cooling plate, and the liquid cooling pipe and the base body can be well fused in the base body cooling process, so that the thermal resistance between the liquid cooling pipe and the base body is greatly reduced. In addition, the heat dissipation plate casting mold facilitates a low-pressure casting process, and when the metal solution is cooled, cooling water is introduced into the liquid cooling pipe to accelerate the cooling and condensation speed of the metal solution, and the liquid cooling pipe can be prevented from deforming at high temperature. Therefore, the molding efficiency and the heat exchange efficiency of the heat radiating plate are high.

Description

Heat sink and heat sink mold

Technical Field

the utility model relates to an electrical components heat dissipation field particularly, relates to a heating panel and heating panel casting mould.

background

In the middle and late 20 th century, with the advent of solid-state circuit integrated circuits, electronic devices began to evolve toward small, ultra-small and micro-scale assembly. Due to the continuous development of microelectronic technologies such as very large scale integrated circuits (vlsi), Application Specific Integrated Circuits (ASIC), and Very High Speed Integrated Circuits (VHSIC), the packing density of microelectronic components and devices has been rapidly increased. The high density packaging of the sub-devices allows the heat flux density of the components and devices to also increase rapidly. Especially in on-board electronics. Because the on-board electronic devices are severely limited in size and weight, the packaging density is increased with the increasing complexity of the functions of the electronic devices.

currently, the heat dissipation density of high power devices in airborne electronics has reached tens of watts per square centimeter. The problem of failure due to overheating has gradually become a major cause of restricting the development of electronic technology. Therefore, how to quickly and effectively cool down the electronic device is more important. The cooling and heat dissipation modes of the current airborne electronic equipment mainly include: natural cooling, forced air cooling, forced liquid cooling, and the like. In the above cooling method, the forced liquid cooling using the heat dissipation plate is widely used. With the increase of cooling demand, the heat exchange efficiency of the existing heat dissipation plate is relatively low, and the electronic equipment with high assembly density is difficult to be effectively cooled.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a heat dissipation plate and a heat dissipation plate casting mold, wherein the heat dissipation plate can be used for effectively dissipating heat of electrical elements; the heat sink mold can be used for manufacturing the heat sink.

the utility model discloses a realize like this:

a heat sink comprises a base and a liquid cooling pipe; the liquid cooling pipe comprises a water inlet pipe, a water outlet pipe and a conveying assembly, the conveying assembly comprises a plurality of conveying pipes and connecting pipes, the conveying pipes are arranged in parallel at intervals, the end parts of the adjacent conveying pipes are connected through the connecting pipes, and the water inlet pipe and the water outlet pipe are respectively connected with the two ends of the conveying assembly;

The conveying assembly is arranged in the base body, and the connecting end of the water inlet pipe and the water outlet pipe is arranged outside the base body;

The connecting pipe is a U-shaped bent pipe, the conveying pipe is a straight pipe, and the connecting pipe is in threaded connection with the conveying pipe.

Further, the method comprises the following steps of; spiral grooves are formed in the inner walls of the water inlet pipe, the water outlet pipe and the conveying pipe.

Further, the method comprises the following steps of; the ratio of the pitch of the spiral groove to the inner diameter of the conveying pipe is 0.3-0.5; the ratio of the groove depth of the spiral groove to the inner diameter of the conveying pipe is 0.04-0.06.

Further, the method comprises the following steps of; the end parts of the water inlet pipe and the water outlet pipe are provided with quick change connectors.

Further, the method comprises the following steps of; the base body is provided with a mounting hole.

Further, the method comprises the following steps of; the spiral directions of the spiral grooves on the adjacent conveying pipes are opposite.

Further, the method comprises the following steps of; the liquid cooling pipe is made of stainless steel materials.

A heat dissipation plate casting mold is used for casting a heat dissipation plate and comprises a bottom plate, two panels arranged in parallel at intervals and two side plates arranged in parallel at intervals, wherein the bottom plate, the panels and the side plates are detachably connected with each other and form a rectangular shell-shaped structure;

The bottom plate is provided with a liquid injection pipe, a first pipeline and a second pipeline, and the liquid injection pipe, the first pipeline and the second pipeline are communicated with the cavity of the heat dissipation plate casting mold.

Further, the method comprises the following steps of; the device also comprises a connecting piece;

The connecting piece includes the V type piece that two symmetries set up, the V type piece with the curb plate can be dismantled and be connected.

Further, the method comprises the following steps of; the end parts of the first pipeline and the second pipeline are provided with conical connectors.

The utility model has the advantages that:

The liquid cooling pipe of the heat dissipation plate is integrally cast in the base body of the heat dissipation plate, and the liquid cooling pipe and the base body can be well fused in the base body cooling process; so that the thermal resistance between the liquid cooling pipe and the substrate is greatly reduced. In addition, the heat dissipation plate casting mold facilitates a low-pressure casting process, and when the metal solution is cooled, cooling water is introduced into the liquid cooling pipe to accelerate the cooling and condensation speed of the metal solution, and the liquid cooling pipe can be prevented from deforming at high temperature. Therefore, the molding efficiency and the heat exchange efficiency of the heat radiating plate are high.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural view of a heat dissipating plate according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a liquid cooling pipe provided in an embodiment of the present invention;

FIG. 3 is a cross-sectional view of a delivery tube provided by an embodiment of the present invention;

FIG. 4 is a schematic structural view of a mold according to an embodiment of the present invention;

fig. 5 is a top view of fig. 4 provided by an embodiment of the present invention;

FIG. 6 is a schematic view of a liquid-cooled tube according to an embodiment of the present invention installed in a mold;

fig. 7 is a partially enlarged view of fig. 6 according to the embodiment of the present invention.

icon: 100-a heat sink; 110-a substrate; 120-liquid cooling tubes; 121-a water inlet pipe; 122-water outlet pipe; 123-delivery pipe; 1231-helical groove; 124-connecting pipe; 125-quick change coupler; 130-casting; 131-a first conduit; 132-a second conduit; 133-liquid injection pipe; 134-a bottom plate; 135-side plate; 136-a panel; 137-V shaped block.

Detailed Description

to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and do not indicate or imply that the equipment or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

in the present disclosure, unless otherwise expressly stated or limited, the first feature may comprise both the first and second features directly contacting each other, and also may comprise the first and second features not being directly contacting each other but being in contact with each other by means of further features between them. Also, the first feature being above, on or above the second feature includes the first feature being directly above and obliquely above the second feature, or merely means that the first feature is at a higher level than the second feature. A first feature that underlies, and underlies a second feature includes a first feature that is directly under and obliquely under a second feature, or simply means that the first feature is at a lesser level than the second feature.

example 1:

Referring to fig. 1, the present embodiment provides a heat dissipation plate 100, which can be used for mounting electronic components and effectively dissipating heat from the electronic components. The heat sink 100 includes a base 110 and a liquid cooling pipe 120 disposed inside the base 110; the outer surface of the base 110 is used for mounting electronic components, and the liquid cooling pipe 120 is used for introducing a cooling medium to cool the base 110 and the electronic components.

with continuing reference to fig. 1 and with reference to fig. 2, the liquid cooling tube 120 includes a water inlet tube 121, a water outlet tube 122, a plurality of delivery tubes 123 and a plurality of connecting tubes 124. A plurality of delivery pipes 123 are arranged in parallel at intervals, and one ends of the adjacent delivery pipes 123 are connected by a connection pipe 124 so that the connection pipe 124 and two delivery pipes 123 connected to the connection pipe 124 are U-shaped. The liquid cooling tube 120 in this embodiment is made of stainless steel, and in other embodiments, other metal materials with high heat conduction efficiency, such as copper alloy, may be used.

Specifically, the delivery pipe 123 is screwed with the connection pipe 124; and, the connection screw threads of both ends of the delivery pipe 123 are rotated in opposite directions, so that the delivery pipe 123 can be screwed with the connection pipes 124 of both ends when the delivery pipe 123 is rotated, thereby improving the assembling efficiency. The inlet pipe 121 and the outlet pipe 122 are connected to the delivery pipe 123 through a connection pipe 124. The ends of the inlet pipe 121 and the outlet pipe 122 are also provided with quick change couplings 125.

Referring to fig. 3, in order to improve the heat exchange efficiency, a spiral groove 1231 is formed on the inner wall of the delivery pipe 123; in this embodiment, the ratio of the pitch of the spiral groove 1231 to the inner diameter of the delivery pipe 123 is 0.4; the ratio of the groove depth of the spiral groove 1231 to the inner diameter of the delivery pipe 123 is 0.5. The spiral groove 1231 is formed on the inner wall of the duct 123, which enhances the disturbance of the boundary layer fluid and the mixing of the boundary layer fluid and the main flow fluid, thereby enhancing the heat transfer process and improving the heat exchange efficiency.

The base 110 of the heat dissipation plate 100 is a plate-shaped structure integrally cast in the mold 130; during casting, the liquid cooling tube 120 is placed in the cavity, so that the liquid cooling tube 120 and the substrate 110 are integrated after the substrate 110 is molded. Also, a plurality of mounting holes are provided on the surface of the base 110 for mounting electronic components.

The heat dissipation plate 100 is used as follows:

when the electronic components need to be radiated, a cooling medium is introduced through the water inlet pipe 121 of the liquid cooling pipe 120, and the cooling medium spirally flows in the conveying pipe 123. Moreover, due to the opposite spiral directions of the adjacent delivery pipes 123, the cooling medium can be fully heat exchanged with the base body 110 through the pipe wall of the liquid cooling pipe 120; after the cooling medium flows out through the water outlet pipe 122 to take away part of the heat, the temperature of the electronic component is kept within the normal temperature.

Example 2:

Referring to fig. 4 to 7, this embodiment provides a method for manufacturing a heat sink and a mold used in the method, and the method and the mold can be used to manufacture the heat sink 100 of embodiment 1. The method specifically comprises the following steps:

a. manufacturing a liquid cooling pipe 120; the liquid cooling pipe 120 comprises a water inlet pipe 121, a water outlet pipe 122 and a conveying assembly, the conveying assembly comprises a plurality of conveying pipes 123 and connecting pipes 124, the plurality of conveying pipes 123 are arranged in parallel at intervals, one end of each adjacent conveying pipe 123 is connected through the corresponding connecting pipe 124, so that the conveying pipes 123 form a continuous fluid channel, and the water inlet pipe 121 and the water outlet pipe 122 are respectively connected with two ends of the conveying assembly;

spiral grooves 1231 are arranged on the inner walls of the water inlet pipe 121, the water outlet pipe 122 and the conveying pipe 123;

b. Making a mold 130, the structure of the mold 130 referring to fig. 4 and 5; the casting mold 130 is a plate-shaped structure, which includes a hollow cavity; the upper end of the casting mould 130 is provided with an opening, and the lower end of the casting mould 130 is provided with a liquid injection pipe 133, a first pipeline 131 and a second pipeline 132; the casting mold 130 further comprises a connector;

c. installing a liquid cooling pipe 120; referring to fig. 6 and 7, the liquid cooling pipe 120 is placed in the cavity, and the liquid cooling pipe 120 is fixed to the mold 130 by a connector; the water inlet pipe 121 is connected with the first pipeline 131, and the water outlet pipe 122 is connected with the second pipeline 132;

d. Pouring; injecting an aluminum alloy solution into the liquid injection pipe 133 by means of low-pressure casting or differential pressure casting; during casting, the liquid cooling pipe 120 is supplied with cooling water through the first pipe 131, and the cooling water is allowed to flow out through the second pipe 132. And ensures that the casting temperature is between 700 and 750 ℃, and preferably 700 ℃. e. Demolding; the connection of the connector to the mold 130 is disconnected and then the mold is opened.

further, when cooling water is introduced for cooling, the inlet water temperature of the first pipeline 131 is controlled to be 15-25 ℃, and the outlet water temperature flowing out of the second pipeline 132 is kept between 35-45 ℃ by controlling the water flow of the first pipeline 131.

by introducing cooling water into the liquid cooling pipe 120, the cooling rate of the metal solution in the cavity can be increased, and the casting defect caused by the large difference between the internal cooling rate and the external cooling rate can be reduced. In addition, the cooling speed of the metal solution in the cavity can be effectively controlled by controlling the water inlet temperature and the water outlet temperature, so that the casting defects are reduced.

The mold 130 used in the above method is a flat shell structure formed by connecting a plurality of plates, and mainly includes a bottom plate 134, two parallel and spaced apart panels 136, and two parallel and spaced apart side plates 135. The bottom plate 134, the face plate 136 and the side plate 135 are detachably connected to each other; thereby facilitating demolding. The middle part of the bottom plate 134 is provided with a liquid injection pipe 133, the two ends of the bottom plate are vertically provided with a first pipeline 131 and a second pipeline 132, and the first pipeline 131 and the second pipeline 132 penetrate through the bottom plate 134 and extend into the cavity. The ends of the first and second pipes 131 and 132 are each provided with a conical connector to facilitate connection with the liquid cooling pipe 120.

The mould 130 is further provided with a connecting piece comprising two symmetrically arranged V-shaped blocks 137, the two V-shaped blocks 137 are fixed on the side plate 135 by screws, and the two V-shaped openings are oppositely arranged.

During pouring, the casting mold 130 is vertically fixed, and the liquid cooling pipe 120 is vertically arranged in the cavity; the two V-shaped blocks 137 clamp and fix the liquid cooling pipe 120; the ends of the inlet pipe 121 and the outlet pipe 122 of the liquid cooling pipe 120 are both provided with conical connecting holes, the inlet pipe 121 is sleeved at the end of the first pipeline 131, and the outlet pipe 122 is sleeved at the end of the second pipeline 132. Under the action of the self gravity of the liquid cooling pipe 120, the connector is tightly connected with the connecting hole, so that the cooling water in the liquid cooling pipe 120 is prevented from leaking into the metal solution.

When the metal solution is solidified, the liquid cooling pipe 120 is integrated with the metal solution, and the heat radiating plate 100 is molded. At this time, the two panels 136 of the mold 130 are disconnected from the side plates 135 and the bottom plate 134, and the screws for connecting the V-shaped blocks 137 to the side plates 135 are removed, so that the mold can be removed. The V-shaped block 137 remains in the heat radiating plate 100 without being taken out.

finally, a screw hole is formed on the surface of the molded heat sink 100 for mounting and fixing an electronic component.

The advantages of the method provided by the embodiment are as follows:

1. Low pressure casting is used to cause a low pressure on the surface of the molten metal, which is forced into the cavity of the mold 130 from the bottom up by the pressure. The obtained liquid cooling plate has compact, uniform and pure structure, the inside of the liquid cooling plate is not easy to generate bubbles, and the liquid cooling pipe 120 is in full contact with the inner surface of the whole liquid cooling plate substrate 110, so that the heat exchange performance is not influenced.

2. During the casting process, cooling water with a certain flow rate is introduced from the first pipe 131, and flows through the liquid cooling pipe 120 and then flows out from the second pipe 132. In this way, on the one hand, the cooling speed in the cavity can be adjusted; on the other hand, the liquid cooling pipe 120 can be effectively protected, and the liquid cooling pipe 120 is prevented from being bent and deformed or even generating cracks due to high temperature during casting.

3. The whole liquid cooling pipe 120 is made of high-quality high-melting-point stainless steel, so that the problem of corrosion of part of coolant to cooling pipelines inside the liquid cooling plate is solved.

4. The spiral groove 1231 is formed in the liquid cooling pipe 120, a rotary flow path is added when fluid flows through the spiral groove 1231, the retention time in the pipe is prolonged, meanwhile, the disturbance of boundary layer fluid and the mixing of the boundary layer fluid and main flow fluid are enhanced, the heat transfer process is enhanced, and the heat exchange efficiency of the liquid cooling plate is higher.

5. Before casting, the inner and outer walls of all the pipes are cleaned by stainless steel cleaning agents, oxide layers, surface dirt and dust are removed, the surface smoothness is improved, the stainless steel pipes and aluminum alloy liquid can be fully wetted during casting, and the generation of air holes is reduced. The liquid cooling pipe 100 is fully contacted with the substrate 110, the heat transfer resistance is small, and the heat exchange efficiency is high.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A heat dissipation plate is characterized by comprising a base body and a liquid cooling pipe; the liquid cooling pipe comprises a water inlet pipe, a water outlet pipe and a conveying assembly, the conveying assembly comprises a plurality of conveying pipes and connecting pipes, the conveying pipes are arranged in parallel at intervals, the end parts of the adjacent conveying pipes are connected through the connecting pipes, and the water inlet pipe and the water outlet pipe are respectively connected with the two ends of the conveying assembly;

The conveying assembly is arranged in the base body, and the connecting end of the water inlet pipe and the water outlet pipe is arranged outside the base body;

The connecting pipe is a U-shaped bent pipe, the conveying pipe is a straight pipe, and the connecting pipe is in threaded connection with the conveying pipe.

2. The heat dissipating plate of claim 1, wherein: spiral grooves are formed in the inner walls of the water inlet pipe, the water outlet pipe and the conveying pipe.

3. The heat dissipating plate of claim 2, wherein:

The ratio of the pitch of the spiral groove to the inner diameter of the conveying pipe is 0.3-0.5; the ratio of the groove depth of the spiral groove to the inner diameter of the conveying pipe is 0.04-0.06.

4. The heat dissipating plate of claim 1, wherein: the end parts of the water inlet pipe and the water outlet pipe are provided with quick change connectors.

5. the heat dissipating plate of claim 1, wherein: the base body is provided with a mounting hole.

6. The heat dissipating plate of claim 1, wherein: the spiral directions of the spiral grooves on the adjacent conveying pipes are opposite.

7. The heat dissipating plate of claim 1, wherein: the liquid cooling pipe is made of stainless steel materials.

8. A heat dissipation plate mold for casting a heat dissipation plate, comprising:

the heat dissipation plate casting mold comprises a bottom plate, two panels arranged in parallel at intervals and two side plates arranged in parallel at intervals, wherein the bottom plate, the panels and the side plates are detachably connected with each other and form a rectangular shell-shaped structure;

the bottom plate is provided with a liquid injection pipe, a first pipeline and a second pipeline, and the liquid injection pipe, the first pipeline and the second pipeline are communicated with the cavity of the heat dissipation plate casting mold.

9. a heat radiating plate mold according to claim 8, wherein: the device also comprises a connecting piece;

The connecting piece includes the V type piece that two symmetries set up, the V type piece with the curb plate can be dismantled and be connected.

10. a heat radiating plate mold according to claim 8, wherein:

the end parts of the first pipeline and the second pipeline are provided with conical connectors.