CN105463557B - A kind of electroplating clamp of plug and the electro-plating method using the electroplating clamp - Google Patents
A kind of electroplating clamp of plug and the electro-plating method using the electroplating clamp Download PDFInfo
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- CN105463557B CN105463557B CN201610020389.5A CN201610020389A CN105463557B CN 105463557 B CN105463557 B CN 105463557B CN 201610020389 A CN201610020389 A CN 201610020389A CN 105463557 B CN105463557 B CN 105463557B
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- flange
- mould
- electroplating
- electroplating clamp
- electroplate liquid
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
Abstract
The invention discloses a kind of electroplating clamp of plug, including battery lead plate, formed with least one flange being engaged with mold cavity on the battery lead plate, gap formed with power supply flow of the electrolyte between the flange and mold cavity, the axially arranged through hole that has penetrating electrode plate of the flange along itself, the flange are in vacantly to be arranged in mold cavity.By on plate body formed with the flange being engaged with mold cavity, so as in electroplating process, by in the die cavity of flange insertion mould, simultaneously to injecting electroplate liquid in through hole, now electroplate liquid is entered in gap out of through hole, then hole deeper in die cavity is electroplated, can not be flowed compared to original electroplate liquid in hole, electroplating effect now is more preferable.
Description
Technical field
The present invention relates to product surface plated film field, the electroplating clamp of more particularly to a kind of plug and the electroplating clamp is used
Electro-plating method.
Background technology
Plug refers to that it is typically made up of butyl material, in medicine in a kind of bottle stopper of the bottleneck of medicinal glass bottle
After vial perfusion, for improving the cleanliness factor in bottle, chemical stability, air-tightness etc. and other effects, the structure of general plug
For a cover plate for covering bottleneck, the cock body to be fitted with the shape in bottleneck is extended with below cover plate, while in cock body
Side is provided with the circular protrusion rib for strengthening friction effect.
In the prior art, the technique that this kind of plug typically uses injection molding, Application No. are produced
The utility model patent of " 201020218053.8 " discloses a kind of rubber stopper mould of chrome-faced, can from its claim
To find out, in order to avoid influenceing the sanitary index of plug using releasing agent, mould typically uses the process of electroplating surface,
One layer of 0.5-1.5mm chromium coating is electroplate with mould, but during electroplating, conventional technique is usually will using fixture
Die and mould plate carries out clamping, and the plating on surface is then carried out to it, but as can be seen that mould from the structure of plug and background paper
Tool can offer the die cavity for cock body shaping, but in electroplating technology, traditional handicraft is carried out by the way of electrophoresis to mould
Plating, electroplate liquid can not be flowed typically in die cavity, therefore a thin layer of electroplating film can only be plated in cavity lateral, although
Have been completed plating by the look of it, but after mould is used for multiple times, its electrodeposited coating will wears, cause mould-injection
The quality of plug goes wrong.
The content of the invention
It is an object of the invention to provide a kind of a kind of electroplating clamp of the plug for the electroplating effect for strengthening mold cavity;And adopt
With the electro-plating method of this kind of electroplating clamp.
The present invention above-mentioned technical purpose technical scheme is that：A kind of electroplating clamp of plug,
Including battery lead plate, formed with least one flange being engaged with mold cavity, the flange and mould type on the battery lead plate
Gap formed with power supply flow of the electrolyte between chamber, the axially arranged through hole that has penetrating electrode plate of the flange along itself, institute
It is in vacantly to be arranged in mold cavity to state flange.
Preferably, being provided with padded part between the battery lead plate and mould, the flange is vacantly set by padded part
In mold cavity.
Further, by being provided with padded part, it is achieved thereby that make effect of the flange vacantly in mold cavity, so as to
Avoid when battery lead plate is inserted in a mold, flange is in contact with the inwall in mold cavity, so that in contact position electroplate liquid
The position can not be electroplated, after plating terminates, in injection moulding process, plug is easy to stick in after shaping for the position
This position, so as to influence the use of plug and mould, by being provided with padded part, padded part increases the height of flange, so that
Flange departs from the contact with mold cavity, flange is vacantly arranged in mold cavity, prevents flange and appointing in mold cavity
The contact of what position, prevents mould after plating, plug moulding sticks together in the position.
Preferably, the shape of cross section of the flange is in annular.
Further, it is in annular by the way that the shape of cross section of flange is set, the flange of annular can preferably and mould
Die cavity on tool is engaged, and facilitates flowing of the electrolyte in the position, while the flange that annular is set defines through hole setting
Position, i.e. through hole is arranged concentrically with flange, therefore in electroplating process, and electroplate liquid can recoil to die cavity out of through hole
It is interior, so that also having the flowing of electroplate liquid in the die cavity of mould, so as to strengthen the thickness of the electroplating film of the position.
Preferably, formed with acute angle between the medial surface of the through hole and the lateral surface of flange.
Further, by being provided with inwardly angled inclined plane in the front end of flange, so as to the bottom more with plug
Inwardly angled setting is engaged, by being provided with inclined plane, so as to ensure that the confession of the formation between flange and mold cavity
The spacing in the gap of electroplate liquid flowing is equal and consistent, by spacing all equal from top to bottom, so as to which electroplate liquid is in type
The flowing velocity of intracavitary is consistent, electroplate liquid is more uniformly in contact with the side wall of mold cavity, so as to strengthen motor
The electroplating effect of plate；For being exclusively used in being molded the mould of plug, the spacing between the side and side of mold cavity is
It is equal, but in cavity bottom, because flange is the cavity bottom that straight cutting enters mould, the flowing of cavity bottom and electroplate liquid
Direction is vertical, therefore cavity bottom serves the effect of obstruction to the flowing velocity of electroplate liquid, and then electroplate liquid is flowing through this
Flow velocity during position can reduce, and have impact on the effect of plating, make the flow velocity of flow velocity and die surface of the electroplate liquid in die cavity not
Unanimously, cause the thickness of the electroplating film on mould larger, and die cavity is because not substantial amounts of electroplate liquid flows through, therefore it causes die cavity
The thinner thickness of interior electroplating film, by by the side of inclined plane and through hole formed with acute angle, so as in use when, it is sharp
Angle adds the gap length of the flange both sides of cavity bottom, and acute angle makes electroplate liquid behind the knuckle position by cavity bottom,
Suddenly because the thickness of flange is thinning, the space of the position is set to become big, so as to produce current difference in the position, by flange hole
The electroplate liquid in portion is drawn, and accelerates the flowing of electroplate liquid.
Preferably, the flange is evenly distributed on plate body, the gap length at the adjacent flange center is equal.
Further, in order to meet the quantity of mould upper impression, thus flange can be provided with plate body it is multiple, simultaneously
In order to increase distributed quantity of the flange on plate body, that is, increase the quantity of the plug after mold injection molding, in the utility model
Flange using being evenly distributed on plate body, while the center to the center of adjacent flange of each flange
Length is equal, i.e., every three close flanges can form the flange group of one group of equilateral triangle structure setting, identical
Area under, flange that the mode of equilateral triangle is set it is more.
Preferably, the spacing in the gap is 0.5-1mm.
Further, by the way that the spacing in gap is adjusted into 0.5-1mm, now electroplate liquid flow through gap speed it is most suitable
Close, because in this gap size, the flowing velocity of electroplate liquid and the flowing velocity of electroplate liquid above mold cavity in gap
Unanimously, i.e., the consistency of thickness of the electroplating film of thickness and mold cavity surface of the electroplate liquid in die cavity formed with electroplating film, its mould are noted
Each position is wear-resistant identical with ageing-resistant effect when modeling；If gap is smaller than 0.5mm, it will causes interstitial site
Flowing velocity it is too fast, the thickness of electroplating film is excessively thin, if the spacing in gap is more than 1mm, the flowing of electroplate liquid will be layered, outside
The electroplate liquid that layer is bonded with die cavity does not flow typically, and the electroplate liquid flowing among gap, now mold cavity surface plating
Redox reaction is less efficient, and the thickness of electroplating film is excessively thin, influences electroplating quality.
Preferably, the spacing in the gap is 0.7mm.
Further, 0.7mm gap is a preferable size, and 0.7mm gap has met commonly required electricity
Effect is plated, if greater than 0.7mm, it will cause the thickness of plated film blocked up, cause the waste of the raw material of electroplate liquid；Such as simultaneously
The size in fruit gap is less than 0.7mm, electroplating film will clogging gap, the thickness of the electroplating film after production is with regard to excessively thin.
A kind of electro-plating method using the electroplating clamp, electro-plating method comprise the following steps：
Step 1: prepare electroplating clamp according to claim 1；
Step 2: the flange on the electroplating clamp is inserted into the mold cavity of plug；
Step 3: the position by adjusting electroplating clamp, makes flange be maintained between the inwall of die cavity, and not with die cavity
Inwall contact contact；
Step 4: the mould and electroplating clamp are put into electric bath groove, then electroplated to being injected in the through hole of mould
Liquid；
Step 5: powered to the battery lead plate, so as to form metal film on the surface of mould and the surface of the die cavity of mould.
Further, in the present invention, using the application method of this kind of electroplating clamp, by the way that the flange on electroplating clamp is inserted
In the mold cavity for entering plug, the size for adjusting padded part may then pass through, or the battery lead plate in adjustment electric bath groove
Height and right position, so that the flange less than die cavity is located in die cavity, does not contact with die cavity, then will be fixed on mould
Battery lead plate and mould be placed into together in electric bath groove, then to being filled with electroplate liquid in electric bath groove, make electroplate liquid fully with
Mould and battery lead plate contact, then to injecting electroplate liquid in through hole, electroplate liquid is set to be realized by the gap between flange and die cavity
Flowing of the electroplate liquid on mold cavity, so that electroplate liquid constantly flows in die cavity；Then battery lead plate is powered, with
Continuous flowing of the electroplate liquid in mold cavity, the mold cavity surface of mould is continuously generated metal film, strengthen electroplating effect.
Preferably, the electroplate liquid contains polytetrafluoroethylgranule granule.
Further, in general mould is using the metal such as chromium plating, in the utility model, using adding poly- four in electroplate liquid
PVF particle, so as to which in electroplating process, polytetrafluoroethylgranule granule is also attached in the die cavity of mould, so as in the type of mould
Intracavitary forms the electrodeposited coating of one layer of wear-resisting type, serves good abrasion resistant effect, simultaneously the electricity containing polytetrafluoroethylgranule granule
Plating solution is difficult flowing, and the flange of die cavity is stretched into by being provided with, so as to serve electroplate liquid of the reinforcement containing polytetrafluoro dimly
Flowing, strengthens its electroplating effect.
Preferably, in the step 5, the current density of power supply is 6 peaces/square decimeter, electroplating time 3-7 minutes.
Further, the current density of power supply is 6 peaces/square decimeter, if being less than this parameter, it will when causing plating
Redox reaction it is not thorough, while as high with this parameter, the surface quality in the mold cavity of plating can decline,
Can be too high due to current density, corrugation is produced on the surface of die cavity, while if electroplating time is less than 3 minutes, it will cause electricity
Coating is relatively thin, if electroplating time is higher than 7 minutes, it will the problem of causing electrodeposited coating blocked up.
In summary, the invention has the advantages that：By on plate body formed with being engaged with mold cavity
Flange, so as in electroplating process, flange be inserted in the die cavity of mould, while to injecting electroplate liquid in through hole, now electroplate
Liquid is entered in gap out of through hole, and then hole deeper in die cavity is electroplated, can not be in hole compared to original electroplate liquid
Interior flowing, electroplating effect now are more preferable；Padded part is further provided with, serving makes flange be suspended in the hole of die cavity,
Prevent flange to be in contact with the hole on die cavity, strengthen its electroplating effect, while the front end of flange is provided with inclined plane, Ran Houqing
Then the side of inclined-plane and through hole accelerates the electroplate liquid of the position to flow, strengthens electroplating effect formed with acute angle；Simultaneously by
Padded part is provided with plate body, flange suspension is realized and is arranged in mould；Then the utility model is by by flange and inwall
Between the size in gap be limited in 0.5-1mm, improve the molding effect of electroplating film.
Brief description of the drawings
Fig. 1 is the structural representation one of the present invention；
Fig. 2 is the diagrammatic cross-section of the present invention；
Fig. 3 is A portions enlarged diagram shown in Fig. 2.
In figure, 0, battery lead plate；1st, mould；11st, mold cavity；2nd, flange；3rd, through hole；4th, gap；5th, padded part.
Embodiment
The present invention is described in further detail to accompanying drawing 3 below in conjunction with accompanying drawing 1.
This specific embodiment is only explanation of the invention, and it is not limitation of the present invention, people in the art
Member can make the modification of no creative contribution to the present embodiment as needed after this specification is read, but as long as at this
All protected in the right of invention by Patent Law.
As shown in figures 1 and 3, a kind of electroplating clamp of plug, including battery lead plate 0, formed with least one on battery lead plate 0
The flange 2 being engaged with mold cavity 11, the gap 4 formed with power supply flow of the electrolyte between flange 2 and mold cavity 11, flange
2 along the axially arranged through hole 3 for having penetrating electrode plate 0 of itself, and flange 2 is in being vacantly arranged in mold cavity 11, by plate
Formed with the flange 2 being engaged with mold cavity 11 on body, so as to which in electroplating process, flange 2 to be inserted to the die cavity of mould 1
It is interior, while to injecting electroplate liquid in through hole 3, now electroplate liquid is entered out of through hole 3 in gap 4, then to deeper in die cavity
Hole electroplated, can not be flowed compared to original electroplate liquid in hole, electroplating effect now is more preferable；Further it is provided with
Padded part 5, serving makes flange 2 be suspended in the hole of die cavity, prevents flange 2 to be in contact with the hole on die cavity, strengthens its plating
Effect, while the front end of flange 2 is provided with inclined plane, then then inclined plane accelerates with the side of through hole 3 formed with acute angle
The electroplate liquid flowing of the position, strengthens electroplating effect；Simultaneously by being provided with padded part 5 on plate body, realize flange 2 and suspend
It is arranged in mould 1；Then the utility model is carried by the way that the size in gap 4 between flange 2 and inwall is limited in into 0.5-1mm
The high molding effect of electroplating film.
As shown in figure 1, being provided with padded part 5 between battery lead plate 0 and mould 1, flange 2 is vacantly arranged on by padded part 5
In mold cavity 11, by being provided with padded part 5, it is achieved thereby that make effect of the flange 2 vacantly in mold cavity 11, so as to
Avoid when battery lead plate 0 is inserted in mould 1, flange 2 is in contact with the inwall in mold cavity 11, so as in contact position electricity
Plating solution can not be electroplated to the position, and after plating terminates, in injection moulding process, plug is easy to glue after shaping for the position
This position is connected in, so as to influence the use of plug and mould 1, by being provided with padded part 5, padded part 5 increases the height of flange 2
Degree, so that flange 2 departs from the contact with mold cavity 11, flange 2 is vacantly arranged in mold cavity 11, prevent flange 2
With the contact of any position in mold cavity 11, mould 1 is prevented after plating, plug moulding sticks together in the position.
As shown in figure 3, the shape of cross section of flange 2 is in annular, it is in annulus by the way that the shape of cross section of flange 2 is set
Shape, the flange 2 of annular preferably can be engaged with the die cavity on mould 1, facilitate flowing of the electrolyte in the position, simultaneously circle
The flange 2 that annular is set defines the position of the setting of through hole 3, i.e. through hole 3 is arranged concentrically with flange 2, therefore in electroplating process
In, electroplate liquid can be out of through hole 3 in recoil to die cavity, so that also having the flowing of electroplate liquid in the die cavity of mould 1, so as to add
The thickness of the electroplating film of the strong position.
As shown in figure 3, formed with acute angle between the medial surface of through hole 3 and the lateral surface of flange 2, by before flange 2
End is provided with inwardly angled inclined plane, so as to which setting more inside with the bottom angled of plug is engaged, by being provided with
Inclined plane, so as to ensure that the spacing in the gap 4 of the power supply flow of the electrolyte of the formation between flange 2 and mold cavity 11 is equal
And consistent, by spacing all equal from top to bottom, so as to which flowing velocity of the electroplate liquid in die cavity is consistent, make plating
Side wall of the liquid more uniformly with mold cavity 11 is in contact, so as to strengthen the electroplating effect of motor plate；For being exclusively used in being molded
For the mould 1 of plug, the spacing between the side and side of mold cavity 11 is equal, but in cavity bottom, by
It is the cavity bottom that straight cutting enters mould 1 in flange 2, cavity bottom is vertical, therefore die cavity bottom with the flow direction of electroplate liquid
Portion serves the effect of obstruction to the flowing velocity of electroplate liquid, and then flow velocity of the electroplate liquid when flowing through the position can reduce, shadow
The effect of plating has been rung, has made flow velocity of the electroplate liquid in die cavity and the flow velocity on the surface of mould 1 inconsistent, causes the electricity on mould 1
The thickness of plated film is larger, and die cavity is because not substantial amounts of electroplate liquid flows through, thus its cause the thickness of electroplating film in die cavity compared with
It is thin, by by the side of inclined plane and through hole 3 formed with acute angle, so as in use when, acute angle adds cavity bottom
The both sides of flange 2 the size of gap 4, acute angle makes electroplate liquid behind the knuckle position by cavity bottom, suddenly due to flange 2
Thickness is thinning, the space of the position is become big, so as to produce current difference in the position, the electroplate liquid inside the through hole 3 of flange 2 is inhaled
Take, accelerate the flowing of electroplate liquid.
As depicted in figs. 1 and 2, flange 2 is evenly distributed on plate body, and the gap length at the center of adjacent ribs 2 is equal, in order to
Meet the quantity of the upper impression of mould 1, thus flange 2 can be provided with plate body it is multiple, while in order to increase flange 2 in plate body
On distributed quantity, that is, increase the quantity of the plug after the injection molding of mould 1, the flange 2 in the utility model is using uniform
Be distributed on plate body, at the same the length of center to the center of adjacent flange 2 of each flange 2 be it is equal,
I.e. every three close flanges 2 can form 2 groups of the flange of one group of equilateral triangle structure setting, under identical area, etc.
The flange 2 that the mode of side triangle is set it is more.
As shown in figure 3, the spacing in gap 4 is 0.5-1mm, it is now electric by the way that the spacing in gap 4 is adjusted into 0.5-1mm
The speed that plating solution flows through gap 4 is best suitable for, because in this size of gap 4, the flowing velocity and mould of electroplate liquid in gap 4
The flowing velocity of the top electroplate liquid of die cavity 11 is consistent, i.e. thickness and mold cavity surface of the electroplate liquid in die cavity formed with electroplating film
The consistency of thickness of electroplating film, each position is wear-resistant identical with ageing-resistant effect when its mould 1 is molded；If between gap 4
Away from less than 0.5mm, it will cause that the flowing velocity of the position of gap 4 is too fast, and the thickness of electroplating film is excessively thin, if the spacing in gap 4
More than 1mm, the flowing of electroplate liquid will be layered, and the electroplate liquid that outer layer is bonded with die cavity does not flow typically, and among gap 4
Electroplate liquid flowing, now mold cavity surface plating redox reaction it is less efficient, the thickness of electroplating film is excessively thin, influences to electroplate
Quality, the spacing in gap 4 is 0.7mm, and 0.7mm gap 4 is a preferable size, and 0.7mm gap 4 has been met typically
Required electroplating effect, if greater than 0.7mm, it will cause the thickness of plated film blocked up, cause the wave of the raw material of electroplate liquid
Take；If the size in gap 4 is less than 0.7mm simultaneously, electroplating film will clogging gap 4, the thickness of the electroplating film after production is just
It is excessively thin.
Meanwhile a kind of electro-plating method using the electroplating clamp, electro-plating method comprise the following steps：
Step 1: prepare electroplating clamp according to claim 1；
Step 2: the flange 2 on electroplating clamp is inserted into the mold cavity 11 of plug；
Step 3: the position by adjusting electroplating clamp, makes flange 2 be maintained between the inwall of die cavity, and not with die cavity
Inwall contact contact；
Step 4: mould 1 and electroplating clamp are put into electric bath groove, then to injection plating in the through hole 3 of mould 1
Liquid；
Step 5: powered to battery lead plate 0, so as to form metal film on the surface of mould 1 and the surface of the die cavity of mould 1.
Further, in the present invention, using the application method of this kind of electroplating clamp, by by the flange 2 on electroplating clamp
Insert in the mold cavity 11 of plug, may then pass through the electrode in the size for adjusting padded part 5, or adjustment electric bath groove
The height and right position of plate 0, so that the flange 2 less than die cavity is located in die cavity, does not contact with die cavity, then will be fixed on
Battery lead plate 0 and mould 1 on mould 1 are placed into electric bath groove together, then to being filled with electroplate liquid in electric bath groove, make plating
Liquid fully contacts with mould 1 and battery lead plate 0, then to injection electroplate liquid in through hole 3, make electroplate liquid by flange 2 and die cavity it
Between gap 4, flowing of the electroplate liquid on mold cavity 11 is realized, so that electroplate liquid constantly flows in die cavity；Then
Battery lead plate 0 is powered, with continuous flowing of the electroplate liquid in mold cavity 11, the mold cavity surface of mould 1 is continuously generated gold
Belong to film, strengthen electroplating effect；Electroplate liquid contains polytetrafluoroethylgranule granule, and in general mould 1 is using the metals such as chromium plating, the utility model
In, using polytetrafluoroethylgranule granule is added in electroplate liquid, so as to which in electroplating process, polytetrafluoroethylgranule granule is also attached to mould
In the die cavity of tool 1, so as to form the electrodeposited coating of one layer of wear-resisting type in the die cavity of mould 1, good abrasion resistant effect is served,
The electroplate liquid containing polytetrafluoroethylgranule granule is difficult flowing simultaneously, and the flange 2 of die cavity is stretched into by being provided with, and is added so as to serve
The flowing of electroplate liquid containing polytetrafluoro dimly by force, strengthen its electroplating effect.
In step 5, the current density of power supply is 6 peaces/square decimeter, electroplating time 3-7 minutes, the current density of power supply
For 6 peaces/square decimeter, if being less than this parameter, it will cause redox reaction during plating not thorough, while such as height
With this parameter, the surface quality in the mold cavity 11 of plating can decline, can be too high due to current density, in the table of die cavity
Face produces corrugation, while if electroplating time is less than 3 minutes, it will cause electrodeposited coating relatively thin, if electroplating time is higher than 7 points
Clock, it will the problem of causing electrodeposited coating blocked up.
Claims (8)
1. a kind of electroplating clamp of plug, including battery lead plate, it is characterised in that：Formed with least one and mould on the battery lead plate
The flange that tool die cavity is engaged, the gap formed with power supply flow of the electrolyte between the flange and mold cavity, the flange edge
The axially arranged through hole for having penetrating electrode plate of itself, the flange in vacantly being arranged in mold cavity, the battery lead plate and
Padded part is provided between mould, the flange is vacantly arranged in mold cavity by padded part, and the flange is uniformly distributed
On plate body, the gap length at the adjacent flange center is equal.
A kind of 2. electroplating clamp of plug according to claim 1, it is characterised in that：The shape of cross section of the flange is in
Annular.
A kind of 3. electroplating clamp of plug according to claim 2, it is characterised in that：The medial surface and flange of the through hole
Lateral surface between formed with acute angle.
A kind of 4. electroplating clamp of plug according to claim 1, it is characterised in that：The spacing in the gap is 0.5-
1mm。
A kind of 5. electroplating clamp of plug according to claim 4, it is characterised in that：The spacing in the gap is 0.7mm.
6. a kind of electro-plating method of the electroplating clamp of the plug described in usage right requirement 1, the electro-plating method include following step
Suddenly：Step 1: prepare electroplating clamp according to claim 1；
Step 2: the flange on the electroplating clamp is inserted into the mold cavity of plug；
Step 3: the position by adjusting electroplating clamp, makes flange be maintained between the inwall of die cavity, and the not inwall with die cavity
Contact；
Step 4: the mould and electroplating clamp are put into electric bath groove, then to injecting electroplate liquid in the through hole of mould；
Step 5: powered to the battery lead plate, so as to form metal film on the surface of mould and the surface of the die cavity of mould.
7. the electro-plating method according to claim 6 using the electroplating clamp, it is characterised in that：The electroplate liquid contains poly- four
PVF particle.
8. the electro-plating method according to claim 6 using the electroplating clamp, it is characterised in that：In the step 5, supply
The current density of electricity is 6 peaces/square decimeter, electroplating time 3-7 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610020389.5A CN105463557B (en) | 2016-01-13 | 2016-01-13 | A kind of electroplating clamp of plug and the electro-plating method using the electroplating clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610020389.5A CN105463557B (en) | 2016-01-13 | 2016-01-13 | A kind of electroplating clamp of plug and the electro-plating method using the electroplating clamp |
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| Publication Number | Publication Date |
|---|---|
| CN105463557A CN105463557A (en) | 2016-04-06 |
| CN105463557B true CN105463557B (en) | 2017-12-12 |
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|---|---|---|---|
| CN201610020389.5A Active CN105463557B (en) | 2016-01-13 | 2016-01-13 | A kind of electroplating clamp of plug and the electro-plating method using the electroplating clamp |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120009321A (en) * | 2010-07-23 | 2012-02-01 | 김규태 | Plating for rack conncetion structure |
| US8236151B1 (en) * | 2009-10-30 | 2012-08-07 | Cypress Semiconductor Corporation | Substrate carrier for wet chemical processing |
| KR20150002426U (en) * | 2013-12-13 | 2015-06-23 | 대덕전자 주식회사 | Clamp for panel holder |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008238720A (en) * | 2007-03-28 | 2008-10-09 | Toyoda Gosei Co Ltd | Electroforming mold and its manufacturing method |
| JP2009197283A (en) * | 2008-02-22 | 2009-09-03 | Shinko Electric Ind Co Ltd | Plating tool and method of plating electronic component using the same |
| CN103789815B (en) * | 2014-02-26 | 2016-08-17 | 陈谦 | One metal ion species passes through deposition and the method and apparatus of two-way constraint shaping |
| CN205347615U (en) * | 2016-01-13 | 2016-06-29 | 盛州橡塑胶（苏州）有限公司 | Electroplate plate electrode of plug mould |
-
2016
- 2016-01-13 CN CN201610020389.5A patent/CN105463557B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8236151B1 (en) * | 2009-10-30 | 2012-08-07 | Cypress Semiconductor Corporation | Substrate carrier for wet chemical processing |
| KR20120009321A (en) * | 2010-07-23 | 2012-02-01 | 김규태 | Plating for rack conncetion structure |
| KR20150002426U (en) * | 2013-12-13 | 2015-06-23 | 대덕전자 주식회사 | Clamp for panel holder |
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| CN105463557A (en) | 2016-04-06 |
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