CN105458910B - A kind of wafer-supporting platform system - Google Patents

A kind of wafer-supporting platform system Download PDF

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Publication number
CN105458910B
CN105458910B CN201510977408.9A CN201510977408A CN105458910B CN 105458910 B CN105458910 B CN 105458910B CN 201510977408 A CN201510977408 A CN 201510977408A CN 105458910 B CN105458910 B CN 105458910B
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China
Prior art keywords
wafer
supporting platform
mesh plate
bearing
base
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CN201510977408.9A
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CN105458910A (en
Inventor
衣忠波
赵岁花
高岳
刘国敬
张敏杰
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CETC Beijing Electronic Equipment Co
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CETC Beijing Electronic Equipment Co
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/30Work carriers for single side lapping of plane surfaces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a kind of wafer-supporting platform system, is related to detachable mechanical device field, including:Wafer-supporting platform body, the wafer-supporting platform body include:Wafer-supporting platform top, and the wafer-supporting platform bottom of connection can be engaged with the wafer-supporting platform top;The wafer-supporting platform top includes:First mesh plate;The wafer-supporting platform bottom includes:Second mesh plate, base, the base sub-set is loaded on outside the second mesh plate lower end;The gas passage that gas is conveyed for accessing air-control device is provided with base, the gas passage is with being communicated to the bearing at seat lower end;When conveying has gas in the gas passage, the bearing seat drive the relatively described spline of the second mesh plate to do ascending motion and realize via the rolling bearing to engage connection with first mesh plate.This improves the operating efficiency of workbench, improves the positioning precision of station conversion, ensures grinding quality.

Description

A kind of wafer-supporting platform system
Technical field
The present invention relates to detachable mechanical device field, more particularly to a kind of wafer-supporting platform system.
Background technology
In semiconductor manufacturing equipment manufacturing process, the rotary index table that machine is thinned in wafer realizes grinding quality Critical component, in grinding process, rotary index table rotation drives each station wafer-supporting platform system rotate reality around table core Existing station conversion, after each station reaches specified location, installed in the wafer-supporting platform system rotation of each station, realizes wafer grinding process Process.Traditional rotary index table device, its primary structure wafer-supporting platform system are integral type structure, whole wafer-supporting platform system It is fixed on workbench pallet, and is rotated with workbench, but because each wafer-supporting platform system is equipped with motor with slowing down The power set of the compositions such as device, during worktable rotary, the motor cable and decelerator cable of wafer-supporting platform system can hinder one's work platform Rotation, workbench can not realize continuous rotation, need to invert 270 ° of arrival the 4th afterwards in continuously 3 stations (3 90 °) of rotation Station.This 270 ° of wide-angle return motions reduce the operating efficiency of wafer grinding, while cause energy waste.In addition, work Making platform return motion causes workbench main shaft motion to produce reversion back clearance, reduces the positioning precision of station conversion, influences to be ground Quality.
The content of the invention
In order to overcome above mentioned problem, the present invention provides a kind of wafer-supporting platform system, to solve to work present in prior art Platform can not equidirectional continuous transformation, operating efficiency be low, energy waste, low rotational positioning precision the problem of.
In order to solve the above-mentioned technical problem, the present invention adopts the following technical scheme that:
A kind of wafer-supporting platform system, including:
Wafer-supporting platform body, the wafer-supporting platform body include:Wafer-supporting platform top, and connection can be engaged with the wafer-supporting platform top Wafer-supporting platform bottom;
The wafer-supporting platform top includes:Wafer-supporting platform main shaft, an axle bed, the axle bed are provided with outside the wafer-supporting platform main shaft Bearing is installed between the wafer-supporting platform main shaft, the axle bed bottom is connected with a support base inlay card, on the wafer-supporting platform main shaft End is fixedly connected with one and holds piece disk, and the wafer-supporting platform main shaft lower end runs through the axle bed and is fixedly connected with one first engagement Disk;
The wafer-supporting platform bottom includes:Second mesh plate, the second mesh plate lower end are spent through a rolling bearing and one Key is socketed, and the spline lower end is fixedly connected with power set, the rolling bearing external stability with being provided with bearing seat, institute Seat is movably installed on base with stating bearing, and the base sub-set is loaded on outside the second mesh plate lower end;
The gas passage that gas is conveyed for accessing air-control device is provided with base, the gas passage connects With passing to the bearing at seat lower end;
When in the gas passage conveying have gas when, the bearing seat via the rolling bearing drive described second The relatively described spline of mesh plate does ascending motion realization and engages connection with first mesh plate.
Alternatively, the bearing installed between the axle bed and the wafer-supporting platform main shaft is angular contact ball bearing and deep-groove ball Bearing.
Alternatively, the angular contact ball bearing number is two.
Alternatively, the field of conjugate action of first mesh plate and second mesh plate is disposed as trapezoidal dentation.
Alternatively, the piece disk material of holding is ceramic material.
Alternatively, the gas passage is arranged at the side edge of the sub- bottom of the base, and the gas passage is along the bottom The lateral edges of stand are L-shaped to be folded upward at being communicated to the bearing at seat lower end.
Alternatively, the sealing ring for sealing the gas passage is provided with base.
Alternatively, the power set include:One shaft coupling, the shaft coupling lower end are fixedly connected with one speed reducer, institute State decelerator lower end and be fixed with a wafer-supporting platform motor, the spline lower end by be connected with the shaft coupling upper end realize with it is described Power set are fixedly connected.
The beneficial effects of the invention are as follows:
Such scheme, by being detachable structure by wafer-supporting platform system design, two parts up and down are divided into, this is upper and lower Two parts are connected as an entirety by engaging realization, and then drive the entirety to do spin transhipment by the power set of bottom Dynamic, the cable of power set in wafer-supporting platform system can be achieved not by detachable structure design in the wafer-supporting platform system The platform that hinders one's work continuously rotates, and has the characteristics of simple and practical, easy to use and structure is reliable, operates steadily, Bu Huifang Hinder the continuous rotation of workbench, significantly improve the operating efficiency of workbench, improve the positioning precision of station conversion, ensure mill Cut quality.
Brief description of the drawings
Fig. 1 represents the structural profile illustration on the wafer-supporting platform top in the present invention;
Fig. 2 represents the structural profile illustration of the wafer-supporting platform bottom in the present invention;
Fig. 3 represents that wafer-supporting platform system is arranged on the overall schematic after wafer is thinned on machine.
Reference:
1 wafer-supporting platform top, 11 wafer-supporting platform main shafts, 12 axle beds, 13 support bases, 14 hold piece disk, 15 first mesh plates, 2 hold piece Platform bottom, 21 second mesh plates, 22 rolling bearings, 23 splines, 24 bearings ground seat, 25 bases, 26 gas passages, 27 shaft couplings Device, 28 decelerators, 29 wafer-supporting platform motors, 3 first installation things, 4 second installation things.
Embodiment
The exemplary embodiment of the disclosure is more fully described below with reference to accompanying drawings.Although the disclosure is shown in accompanying drawing Exemplary embodiment, it being understood, however, that may be realized in various forms the disclosure without should be by embodiments set forth here Limited.On the contrary, these embodiments are provided to facilitate a more thoroughly understanding of the present invention, and can be by the scope of the present disclosure Completely it is communicated to those skilled in the art.
As shown in Figure 1 and Figure 2, the invention discloses a kind of wafer-supporting platform system, including:
Wafer-supporting platform body, wafer-supporting platform body include:Wafer-supporting platform top 1, and can be engaged with wafer-supporting platform top 1 connection hold piece Platform bottom 2;Wherein, wafer-supporting platform top 1 includes:Wafer-supporting platform main shaft 11, an axle bed 12 is provided with outside the wafer-supporting platform main shaft 11, should Bearing is installed between axle bed 12 and wafer-supporting platform main shaft 11, the bottom of axle bed 12 is connected with the inlay card of a support base 13, wafer-supporting platform main shaft 11 upper ends are fixedly connected with one and hold piece disk 14, and the lower end of wafer-supporting platform main shaft 11 runs through axle bed 12 and is fixedly connected with one first and nibbles Close disk 15;Wafer-supporting platform bottom 2 includes:Second mesh plate 21, the lower end of the second mesh plate 21 are spent through a rolling bearing 22 and one Key 23 is socketed, and the lower end of spline 23 is fixedly connected with power set, the external stability of rolling bearing 22 with being provided with bearing seat 24, should Bearing seat 24 be movably installed on base 25, base 25 is set in outside the lower end of the second mesh plate 21;Base 25 On be provided with the gas passage 26 that gas is conveyed for accessing air-control device, the gas passage 26 is with being communicated to bearing under seat 24 At end;When conveying has gas in the gas passage 26, bearing seat 24 drive the second mesh plate 21 relative via rolling bearing 22 Spline 23 does ascending motion realization and engages connection with the first mesh plate 15.
Specifically, the wafer-supporting platform system is detachable to be divided into two parts up and down, in actual mechanical process, passes through gas Control device controls its division, and in no engagement connection, top separates each other with bottom, and both can pass through the first mesh plate 15 engage connection with the realization of the second mesh plate 21, and then wafer-supporting platform top 1 and wafer-supporting platform bottom 2 are linked to be into an entirety, pass through The power set of wafer-supporting platform bottom 2 drive wafer-supporting platform top 1 to carry out integral-rotation, wafer-supporting platform top 1 hold piece disk 14 hold plus Work object, generally wafer body, operation is processed to the wafer body by the rotation of the wafer-supporting platform system.
Wherein, bearing is installed between axle bed 12 and wafer-supporting platform main shaft 11, is for realizing that the wafer-supporting platform main shaft 11 is being held Rotated under the drive of piece platform bottom 2 relative to axle bed 12, and then drive is held piece disk 14 and rotated.
Wherein, the lower end of the second mesh plate 21 passes through a rolling bearing 22, the lower end of the second mesh plate 21 and rolling bearing 22 Ring-shaped inner part be the state being fixed, seat 24 is fixedly mounted the annular, outer of rolling bearing 22 with bearing, the second mesh plate 21 lower ends are socketed with a spline 23, and the second mesh plate 21 realizes phase under the drive for the power set that the lower end of spline 23 is fixedly connected Seat 24 rotates for bearing.
Wherein, the realization of the ascending and descending process of the second mesh plate 21 is specially:The lower end of second mesh plate 21, which is provided with, to be used for The groove of spline 23 is installed, the teeth of spline 23 and the groove clamping, on left and right directions is kept while being relatively fixed, in guarantee The upward relative slip in lower section, when the gas passage 26 on base 25 is connected with air-control device, the gas passage 26 will press Contracting gas is with being directed into bearing at the lower end of seat 24, and seat 24 rises with urging the bearing, bearing seat 24 drive rolling bearing 22 Rise, rolling bearing 22 drives the second mesh plate 21 to do ascending motion relative to spline 23, and realization is carried out with the first mesh plate 15 Engagement connection.After connection is engaged in the top of wafer-supporting platform system with bottom, you can realized by power set in the drive of bottom Portion integrally rotates.
Specifically, as shown in figure 3, after being arranged on wafer when the wafer-supporting platform system and being thinned on machine, wafer-supporting platform top 1 is installed On the first installation thing 3, wafer-supporting platform bottom 2 be arranged on the second installation thing 4, the first mesh plate 15 engage down, second nibble It is face-up to close the engagement of disk 21, so that both can realize engagement.
Multiple wafer-supporting platform systems that can install are thinned on machine in wafer, concretely 4, are needed in wafer-supporting platform system with revolution When workbench rotates, the separation of two parts up and down of wafer-supporting platform system, lower part position keeps constant, and upper part is with rotary table Rotate, when rotating a station, wafer-supporting platform top 1 now is entered with fixed wafer-supporting platform bottom 2 in the current station Row engagement forms an overall wafer-supporting platform system, and then is rotated by power set on the station, finally realizes to holding piece disk The processing of the wafer body of support on 14, during being somebody's turn to do, because wafer-supporting platform bottom 2 is fixed, therefore the wafer-supporting platform bottom 2 In the cables of power set can fix cabling, the continuous rotation for the platform that will not hinder one's work, significantly improve the work of workbench Make efficiency, improve the positioning precision of station conversion, ensure grinding quality.
The electricity of the power set in wafer-supporting platform system can be achieved by detachable structure design in above-mentioned wafer-supporting platform system Cable continuously rotates without prejudice to workbench, for four station rotary index tables, workbench operating now When need not after continuously three stations of rotation the 4th station of 270 ° of arrival of reversion, avoid cable and pull, whole work Platform can continue to rotate in one direction, and one direction rotary motion eliminates conventional table and the back of the body is being inverted caused by return motion Gap, the stability and positioning precision of device are effectively improved, have that simple and practical, easy to use and structure is reliable, fortune The characteristics of row is steady.
Specifically, the bearing installed between axle bed 12 and wafer-supporting platform main shaft 11 is angular contact ball bearing and deep groove ball bearing.Axle Seat 12 is connected by deep groove ball bearing, angular contact ball bearing with wafer-supporting platform main shaft 11, and the angular contact ball bearing is specifically arranged at Between axle bed 12 and wafer-supporting platform main shaft 11 axle bed 12 and wafer-supporting platform main shaft 11 are arranged at close to the top for holding piece disk 14, deep groove ball bearing Between close to support base 13 bottom, wherein, angular contact ball bearing number is preferably two.
Wherein, the field of conjugate action of the first mesh plate 15 and the second mesh plate 21 is disposed as trapezoidal dentation, ensures two up and down Divide engagement when combining stable, and then also ensure that positioning precision of the wafer-supporting platform system in rotation on station;Wherein, piece disk 14 is held Material is ceramic material.
Specifically, the gas passage 26 is arranged at the side edge of sub 25 bottoms of base, and the gas passage 26 is along base 25 Lateral edges it is L-shaped be folded upward at being communicated to bearing at the lower end of seat 24, wherein, can be provided with base 25 for sealing There is the annular in hole at the sealing ring of the gas passage 26, the generally middle part of base 25, and it is set in the second mesh plate by the hole Outside 21 lower ends, multiple gas passages 26 are provided with base 25 periphery lateral edges of son, by the gas passage 26 by outside gas control The compressed gas that device provides is transmitted at the lower end of seat 24 to bearing, makes it drive second mesh plate 21 to be done relative to spline 23 Elevator is moved.Wherein, air valve can also be installed outside the gas passage 26 of base 25, open air valve switch, on base 25 Gas passage 26 is ventilated, and the second mesh plate 21 rises to be engaged with the first mesh plate 15, closing air valve switch, under the second mesh plate 21 Drop to home.
Wherein, the power set include:One shaft coupling 27, the lower end of shaft coupling 27 are fixedly connected with one speed reducer 28, subtracted The fast lower end of device 28 is fixed with a wafer-supporting platform motor 29, and the lower end of spline 23 is realized and power dress by being connected with the upper end of shaft coupling 27 Put and be fixedly connected.
Although having been described for the preferred embodiment of the embodiment of the present invention, those skilled in the art once know base This creative concept, then other change and modification can be made to these embodiments.So appended claims are intended to be construed to Including preferred embodiment and fall into having altered and changing for range of embodiment of the invention.
Finally, it is to be noted that, herein, such as first and second or the like relational terms be used merely to by One entity or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or operation Between any this actual relation or order be present.Moreover, term " comprising ", "comprising" or its any other variant meaning Covering including for nonexcludability, so that process, method, article or terminal device including a series of elements are not only wrapped Those key elements, but also the other element including being not expressly set out are included, or is also included for this process, method, article Or the key element that terminal device is intrinsic.In the absence of more restrictions, wanted by what sentence "including a ..." limited Element, it is not excluded that other identical element in the process including the key element, method, article or terminal device also be present.
Above-described is the preferred embodiment of the present invention, it should be pointed out that is come for the ordinary person of the art Say, some improvements and modifications can also be made under the premise of principle of the present invention is not departed from, and these improvements and modifications also exist In protection scope of the present invention.

Claims (8)

  1. A kind of 1. wafer-supporting platform system, it is characterised in that including:
    Wafer-supporting platform body, the wafer-supporting platform body include:Wafer-supporting platform top (1), and can be with wafer-supporting platform top (1) company of engagement The wafer-supporting platform bottom (2) connect;
    The wafer-supporting platform top (1) includes:Wafer-supporting platform main shaft (11), the wafer-supporting platform main shaft (11) is outside to be provided with an axle bed (12), bearing, axle bed (12) bottom and a support base are installed between the axle bed (12) and the wafer-supporting platform main shaft (11) (13) inlay card connects, and wafer-supporting platform main shaft (11) upper end is fixedly connected with one and holds piece disk (14), the wafer-supporting platform main shaft (11) Lower end runs through the axle bed (12) and is fixedly connected with one first mesh plate (15);
    The wafer-supporting platform bottom (2) includes:Second mesh plate (21), the second mesh plate (21) lower end pass through a rolling bearing (22) it is socketed with a spline (23), spline (23) lower end is fixedly connected with power set, and the rolling bearing (22) is outside With being installed with bearing seat (24), the bearing seat (24) be movably installed on a base (25), base (25) it is set in outside the second mesh plate (21) lower end;
    The base is provided with the gas passage (26) that gas is conveyed for accessing air-control device on sub (25), and the gas leads to Road (26) is with being communicated to the bearing at seat (24) lower end;
    When conveying has gas in the gas passage (26), the bearing seat (24) driven via the rolling bearing (22) The relatively described spline (23) of second mesh plate (21) does ascending motion realization and engages connection with first mesh plate (15).
  2. 2. wafer-supporting platform system according to claim 1, it is characterised in that the axle bed (12) and the wafer-supporting platform main shaft (11) bearing installed between is angular contact ball bearing and deep groove ball bearing.
  3. 3. wafer-supporting platform system according to claim 2, it is characterised in that the angular contact ball bearing number is two.
  4. 4. wafer-supporting platform system according to claim 1, it is characterised in that first mesh plate (15) and described second nibble The field of conjugate action for closing disk (21) is disposed as trapezoidal dentation.
  5. 5. wafer-supporting platform system according to claim 1, it is characterised in that described piece disk (14) material of holding is ceramic material.
  6. 6. wafer-supporting platform system according to claim 1, it is characterised in that the gas passage (26) is arranged at the base The side edge of sub (25) bottom, lateral edges of the gas passage (26) along the base (25) are L-shaped to be folded upward at connecting At seat (24) lower end to the bearing.
  7. 7. wafer-supporting platform system according to claim 1, it is characterised in that the base is provided with for sealing on sub (25) The sealing ring of the gas passage (26).
  8. 8. wafer-supporting platform system according to claim 1, it is characterised in that the power set include:One shaft coupling (27), Shaft coupling (27) lower end is fixedly connected with one speed reducer (28), and decelerator (28) lower end is fixed with a wafer-supporting platform motor (29), spline (23) lower end is fixedly connected by being connected realization with the shaft coupling (27) upper end with the power set.
CN201510977408.9A 2015-12-23 2015-12-23 A kind of wafer-supporting platform system Active CN105458910B (en)

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Application Number Priority Date Filing Date Title
CN201510977408.9A CN105458910B (en) 2015-12-23 2015-12-23 A kind of wafer-supporting platform system

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Application Number Priority Date Filing Date Title
CN201510977408.9A CN105458910B (en) 2015-12-23 2015-12-23 A kind of wafer-supporting platform system

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CN105458910B true CN105458910B (en) 2018-01-09

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108214243A (en) * 2018-03-09 2018-06-29 湖南宇晶机器股份有限公司 A kind of station start stop apparatus for continous way curved surface polishing machine
CN117020898B (en) * 2023-09-28 2023-12-26 和研半导体设备(沈阳)有限公司 Dicing saw and semiconductor material processing equipment

Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2001090739A (en) * 1999-09-24 2001-04-03 Okuma Corp Main shaft bearing lubricating device
CN101220836A (en) * 2007-12-25 2008-07-16 中国电子科技集团公司第四十五研究所 Accurate mechanical bearing and aerostatic bearing associated shafting
CN201501828U (en) * 2009-07-20 2010-06-09 潘昌贵 Multi-station automatic bending forming machine with clutches for spiral fluorescent lamps
CN102793369A (en) * 2012-08-30 2012-11-28 湖北智丰数控机械有限公司 Disc-type multi-position drilling and hair-planting device
CN203171577U (en) * 2013-02-05 2013-09-04 深圳市大族激光科技股份有限公司 Multi-station rotating work table

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001090739A (en) * 1999-09-24 2001-04-03 Okuma Corp Main shaft bearing lubricating device
CN101220836A (en) * 2007-12-25 2008-07-16 中国电子科技集团公司第四十五研究所 Accurate mechanical bearing and aerostatic bearing associated shafting
CN201501828U (en) * 2009-07-20 2010-06-09 潘昌贵 Multi-station automatic bending forming machine with clutches for spiral fluorescent lamps
CN102793369A (en) * 2012-08-30 2012-11-28 湖北智丰数控机械有限公司 Disc-type multi-position drilling and hair-planting device
CN203171577U (en) * 2013-02-05 2013-09-04 深圳市大族激光科技股份有限公司 Multi-station rotating work table

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