CN105453245B - 使用无固定形式管理区域的晶片检验 - Google Patents

使用无固定形式管理区域的晶片检验 Download PDF

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Publication number
CN105453245B
CN105453245B CN201480041322.9A CN201480041322A CN105453245B CN 105453245 B CN105453245 B CN 105453245B CN 201480041322 A CN201480041322 A CN 201480041322A CN 105453245 B CN105453245 B CN 105453245B
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China
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wafer
interest
managed
image
pattern
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Chinese (zh)
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CN105453245A (zh
Inventor
肯翁·吴
涛·骆
高理升
尤金·希夫林
阿拉温迪·巴拉吉
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KLA Corp
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KLA Tencor Corp
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
CN201480041322.9A 2013-06-21 2014-06-20 使用无固定形式管理区域的晶片检验 Active CN105453245B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361837936P 2013-06-21 2013-06-21
US61/837,936 2013-06-21
US201361913380P 2013-12-08 2013-12-08
US61/913,380 2013-12-08
US14/168,011 2014-01-30
US14/168,011 US9171364B2 (en) 2013-06-21 2014-01-30 Wafer inspection using free-form care areas
PCT/US2014/043473 WO2014205385A1 (en) 2013-06-21 2014-06-20 Wafer inspection using free-form care areas

Publications (2)

Publication Number Publication Date
CN105453245A CN105453245A (zh) 2016-03-30
CN105453245B true CN105453245B (zh) 2018-10-26

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CN201480041322.9A Active CN105453245B (zh) 2013-06-21 2014-06-20 使用无固定形式管理区域的晶片检验

Country Status (7)

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US (1) US9171364B2 (enExample)
JP (1) JP6220061B2 (enExample)
KR (1) KR102110634B1 (enExample)
CN (1) CN105453245B (enExample)
IL (1) IL243236B (enExample)
TW (1) TWI605249B (enExample)
WO (1) WO2014205385A1 (enExample)

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US9171364B2 (en) * 2013-06-21 2015-10-27 Kla-Tencor Corp. Wafer inspection using free-form care areas
US9401016B2 (en) 2014-05-12 2016-07-26 Kla-Tencor Corp. Using high resolution full die image data for inspection
US10043261B2 (en) * 2016-01-11 2018-08-07 Kla-Tencor Corp. Generating simulated output for a specimen
US10339262B2 (en) * 2016-03-29 2019-07-02 Kla-Tencor Corporation System and method for defining care areas in repeating structures of design data
US10740888B2 (en) * 2016-04-22 2020-08-11 Kla-Tencor Corporation Computer assisted weak pattern detection and quantification system
US10146036B2 (en) 2016-06-07 2018-12-04 Globalfoundries Inc. Semiconductor wafer inspection using care area group-specific threshold settings for detecting defects
US11580398B2 (en) * 2016-10-14 2023-02-14 KLA-Tenor Corp. Diagnostic systems and methods for deep learning models configured for semiconductor applications
US10679909B2 (en) * 2016-11-21 2020-06-09 Kla-Tencor Corporation System, method and non-transitory computer readable medium for tuning sensitivies of, and determining a process window for, a modulated wafer
US10402688B2 (en) * 2016-12-07 2019-09-03 Kla-Tencor Corporation Data augmentation for convolutional neural network-based defect inspection
US10692690B2 (en) * 2017-03-27 2020-06-23 Kla-Tencor Corporation Care areas for improved electron beam defect detection
US10600177B2 (en) * 2017-08-09 2020-03-24 Kla-Tencor Corporation Nuisance reduction using location-based attributes
US10997710B2 (en) * 2017-10-18 2021-05-04 Kla-Tencor Corporation Adaptive care areas for die-die inspection
CN109560000B (zh) * 2018-11-30 2020-08-25 上海华力微电子有限公司 一种晶圆缺陷扫描方法
US11776859B2 (en) 2018-12-19 2023-10-03 Kla Corporation Care area based swath speed for throughput and sensitivity improvement
US11379972B2 (en) * 2020-06-03 2022-07-05 Applied Materials Israel Ltd. Detecting defects in semiconductor specimens using weak labeling
US20220101114A1 (en) * 2020-09-27 2022-03-31 Kla Corporation Interpretable deep learning-based defect detection and classification
US12165306B2 (en) * 2021-03-16 2024-12-10 Kla Corporation Segmentation of design care areas with a rendered design image
JP7700248B2 (ja) * 2021-08-27 2025-06-30 株式会社日立ハイテク コンピュータシステムおよび解析方法
US20230128610A1 (en) * 2021-10-25 2023-04-27 Kla Corporation Continuous Machine Learning Model Training for Semiconductor Manufacturing

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CN101295659A (zh) * 2007-04-29 2008-10-29 中芯国际集成电路制造(上海)有限公司 半导体器件的缺陷检测方法
US20090290782A1 (en) * 2005-09-01 2009-11-26 Menachem Regensburger Method and a system for establishing an inspection-recipe
US20090324055A1 (en) * 2008-06-02 2009-12-31 Ditza Auerbach System and method for generating spatial signatures reference to related applications
US20110170091A1 (en) * 2010-01-11 2011-07-14 Kla-Tencor Corporation Inspection guided overlay metrology

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JP3566470B2 (ja) * 1996-09-17 2004-09-15 株式会社日立製作所 パターン検査方法及びその装置
US7676077B2 (en) * 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570796B2 (en) * 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8045786B2 (en) 2006-10-24 2011-10-25 Kla-Tencor Technologies Corp. Waferless recipe optimization
US7894659B2 (en) 2007-02-28 2011-02-22 Kla-Tencor Technologies Corp. Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a wafer
US9390490B2 (en) * 2010-01-05 2016-07-12 Hitachi High-Technologies Corporation Method and device for testing defect using SEM
JP5722551B2 (ja) * 2010-05-13 2015-05-20 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
JP2012255740A (ja) * 2011-06-10 2012-12-27 Fujitsu Semiconductor Ltd 欠陥検査装置および欠陥検査方法
US9189844B2 (en) * 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
WO2014149197A1 (en) * 2013-02-01 2014-09-25 Kla-Tencor Corporation Detecting defects on a wafer using defect-specific and multi-channel information
US9171364B2 (en) * 2013-06-21 2015-10-27 Kla-Tencor Corp. Wafer inspection using free-form care areas
US9355208B2 (en) * 2013-07-08 2016-05-31 Kla-Tencor Corp. Detecting defects on a wafer

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US20090290782A1 (en) * 2005-09-01 2009-11-26 Menachem Regensburger Method and a system for establishing an inspection-recipe
CN101295659A (zh) * 2007-04-29 2008-10-29 中芯国际集成电路制造(上海)有限公司 半导体器件的缺陷检测方法
US20090324055A1 (en) * 2008-06-02 2009-12-31 Ditza Auerbach System and method for generating spatial signatures reference to related applications
US20110170091A1 (en) * 2010-01-11 2011-07-14 Kla-Tencor Corporation Inspection guided overlay metrology

Also Published As

Publication number Publication date
WO2014205385A1 (en) 2014-12-24
CN105453245A (zh) 2016-03-30
US9171364B2 (en) 2015-10-27
JP2016524334A (ja) 2016-08-12
IL243236B (en) 2019-02-28
JP6220061B2 (ja) 2017-10-25
US20140376802A1 (en) 2014-12-25
TWI605249B (zh) 2017-11-11
KR102110634B1 (ko) 2020-05-13
KR20160022377A (ko) 2016-02-29
TW201510516A (zh) 2015-03-16

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