CN105445976B - Thinning device and its application method - Google Patents
Thinning device and its application method Download PDFInfo
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- CN105445976B CN105445976B CN201610030775.2A CN201610030775A CN105445976B CN 105445976 B CN105445976 B CN 105445976B CN 201610030775 A CN201610030775 A CN 201610030775A CN 105445976 B CN105445976 B CN 105445976B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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Abstract
The invention discloses a kind of thinning device and its application methods, belong to display field.The thinning device includes：Go out liquid component, bearing assembly and electrostatic field assembly, being used to carry the loading end for waiting for thin structure on bearing assembly, there are inclination angles with horizontal plane；The liquid outlet for going out liquid component is located at the higher one end of loading end, and the liquid that goes out of liquid outlet is oriented parallel to loading end, goes out liquid component and is used for surface the to be thinned output reducer for waiting for thin structure；Electrostatic field assembly is used to form electrostatic field, and the electric field source of electrostatic field is located at loading end and does not carry the side for needing thin structure, and the reducer on surface to be thinned is located in electrostatic field.The present invention solves the problems, such as that the flatness on underlay substrate surface is relatively low, has achieved the effect that the flatness for improving surface to be thinned, the present invention are thinned for substrate.
Description
Technical field
The present invention relates to display field, more particularly to a kind of thinning device and its application method.
Background technology
With liquid crystal display (English：Liquid Crystal Display；Referred to as：LCD) to lightening development, liquid crystal
Display screen needs to use more frivolous underlay substrate, and therefore, it is necessary to carry out reduction processing to underlay substrate.
In the related technology, when carrying out reduction processing to underlay substrate, usually using thinning device to underlay substrate surface
Solution is thinned in spray so that underlay substrate is chemically reacted with thinned solution, realizes the thin type of underlay substrate.Specifically,
The material of underlay substrate is silica (SiO2), it is hydrofluoric acid (HF) that solution, which is thinned, when thinning device is to underlay substrate surface
When solution is thinned in spray, SiO2It can be chemically reacted with HF, and generate fluosilicic acid (H2SiF6) and water (H2O), generation
H2SiF6And H2O can be detached from underlay substrate surface with the flowing of thinned solution.
Due in the related technology, reducer that thinning device sprays to the impact force of each position on underlay substrate surface not
Together so that underlay substrate surface can form multiple concave points, and therefore, the flatness on underlay substrate surface is relatively low.
Invention content
Flatness in order to solve the problems, such as underlay substrate surface is relatively low, the present invention provides a kind of thinning device and its makes
Use method.The technical solution is as follows：
On the one hand, a kind of thinning device is provided, the thinning device includes：Go out liquid component, bearing assembly and electrostatic field
Component,
It waits for the loading end of thin structure for carrying on the bearing assembly there are inclination angles with horizontal plane；
It is described go out liquid component liquid outlet be located at the higher one end of the loading end, the liquid outlet to go out liquid direction parallel
In the loading end, it is described go out liquid component be used for surface the to be thinned output reducer for waiting for thin structure；
The electrostatic field assembly is used to form electrostatic field, and the electric field source of the electrostatic field is located at the loading end and does not carry
The reducer of the side for waiting for thin structure, the surface to be thinned is located in the electrostatic field.
Optionally, the thinning device further includes：Recycle component, the recycling component with it is described go out liquid component be connected,
The inlet of the recycling component is located at the lower one end of the loading end, and the recycling component is flowed through for collecting
The reducer on the surface to be thinned, and by the reducer being collected into be transmitted to it is described go out liquid component.
Optionally, it is described go out liquid component be additionally operable to detect the concentration of reducer to be output；
It is described go out liquid component be additionally operable to reducer to be output concentration be more than preset concentration when, to the table to be thinned
Face exports reducer.
Optionally, the bearing assembly is terrace with edge, and the side of the terrace with edge is the loading end.
Optionally, the terrace with edge is made of bearing support and at least one loading plate,
The loading plate is arranged on the bearing support, and the bearing support constitutes the side of the terrace with edge, it is described at least
One loading plate constitutes the side of the terrace with edge.
Optionally, the loading plate is rectangular slab, is located at the side of the first end of the loading plate and is located at the carrying
The side of the second end of plate is parallel, and the second end of the first end of the loading plate and the loading plate is rolled up in the opposite direction respectively
It rises,
The first end of the loading plate is suspended on the bearing support, and the inlet of the recycling component is located at described hold
The second end of support plate, the recycling component, which is used to collect by the second end of the loading plate, flows through subtracting for the surface to be thinned
Thin liquid.
Optionally, the thinning device further includes：Rotary components, the rotary components include：Rotary shaft,
The axis of the rotary shaft passes through the bearing assembly, and perpendicular to the bottom surface of the bearing assembly, the rotation
Component is used to control the bearing assembly and is rotated along the axis of the rotary shaft.
Optionally, the bearing assembly is positive terrace with edge, and the axis of the rotary shaft is overlapped with the axis of the bearing assembly.
On the other hand, a kind of application method of thinning device is provided, thinning device is used for, the thinning device includes：
Go out liquid component, bearing assembly and electrostatic field assembly, the method includes：
It will wait for that thin structure is carried on the loading end of the bearing assembly, there are inclination angles with horizontal plane for the loading end；
Go out the surface to be thinned that liquid component waits for thin structure to described described in control and export reducer, it is described go out liquid component
Liquid outlet is located at the higher one end of the loading end, and the liquid that goes out of the liquid outlet is oriented parallel to the loading end；
It controls the electrostatic field assembly and forms electrostatic field, the electric field source of the electrostatic field is located at the loading end and does not carry
Wait for that the side of thin structure, the reducer on the surface to be thinned are located in the electrostatic field.
Optionally, the thinning device further includes：Component is recycled, the inlet of the recycling component is located at the loading end
Lower one end goes out liquid component to after surface the to be thinned output reducer described in the control, and the method is also wrapped
It includes：
Control the reducer that the recycling collect components flow through the surface to be thinned；
Control the recycling component by the reducer being collected into be transmitted to it is described go out liquid component.
Optionally, go out described in the control surface to be thinned output reducer that liquid component waits for thin structure to described it
Before, the method further includes：
Go out the concentration of liquid component detection reducer to be output described in control；
Go out liquid component described in the control and exports reducer to the surface to be thinned for waiting for thin structure, including：
When the concentration of the reducer to be output is more than preset concentration, controls the recycling component and subtract what is be collected into
Thin liquid goes out liquid component described in being transmitted to.
Optionally, the bearing assembly is terrace with edge, and the thinning device further includes：Rotary components, the rotary components packet
It includes：The axis of rotary shaft, the rotary shaft passes through the bearing assembly, and perpendicular to the bottom surface of the bearing assembly, described
After waiting for that thin structure is carried on the loading end of the bearing assembly, the method further includes：
By controlling the rotary components, the axis for controlling the bearing assembly along the rotary shaft rotates.
The present invention provides a kind of thinning device and its application methods, in thinning device, the loading end on bearing assembly
With horizontal plane there are inclination angle, the liquid outlet for going out liquid component is located at the higher one end of loading end, and going out liquid component can be from liquid outlet edge
It is parallel to the direction of loading end, reducer is exported to surface to be thinned.And the electric field source position of the electrostatic field of electrostatic field assembly formation
The side for needing thin structure is not carried in loading end, the reducer on surface to be thinned is located in electrostatic field.When waiting for thin structure
When being placed on loading end, this waits for the surface to be thinned of thin structure and horizontal plane, and there are inclination angles, this goes out being thinned for liquid component output
Liquid energy is enough to be flowed under gravity, and is treated thinned surface during flowing and be thinned.Due to reducer
Initial velocity when being exported from liquid outlet is smaller, so, the impact force which treats thinned surface is smaller, realizes and is treating
Thin structure carries out during being thinned, and improves the flatness on the surface to be thinned.
Further, electrostatic field can play the reducer on the surface to be thinned suction-operated, and surface to be thinned subtracts
Thin liquid can reduce the speed of flowing under the action of gravity and electrostatic field, further reduce reducer and treat thinned table
The impact force in face, and increase the thickness of surface reducer to be thinned, to increase surface to be thinned reducer volume,
It is HF in reducer and waits for that the material of thin structure is SiO2When, the concentration of the fluosilicic acid generated in thinning process is reduced, is prevented
Stop and having been precipitated crystal since fluosilicic acid concentration is larger, has treated thinned surface and pollute.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.
Fig. 1 is a kind of structural schematic diagram of thinning device provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of another thinning device provided in an embodiment of the present invention；
Fig. 3 is the structural schematic diagram of another thinning device provided in an embodiment of the present invention；
Fig. 4 is a kind of partial structural diagram of thinning device provided in an embodiment of the present invention；
Fig. 5 is a kind of structural schematic diagram of loading plate provided in an embodiment of the present invention；
Fig. 6 is a kind of schematic diagram for thinned substrate that the relevant technologies provide；
Fig. 7 is a kind of method flow diagram of the application method of thinning device provided in an embodiment of the present invention；
Fig. 8 is the method flow diagram of the application method of another thinning device provided in an embodiment of the present invention.
Specific implementation mode
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to embodiment party of the present invention
Formula is described in further detail.
As shown in Figure 1, an embodiment of the present invention provides a kind of thinning device 0, which may include：Go out liquid group
Part 01, bearing assembly 02 and electrostatic field assembly 03.
Wherein, it waits for the loading end A and horizontal plane X of thin structure W for carrying on bearing assembly 02 there are inclination angles；Go out liquid group
The liquid outlet B of part 01 is located at the higher one end loading end A, and the liquid direction Y that goes out of liquid outlet B is parallel to loading end A, goes out liquid component 01
For to wait for thin structure W surface Z to be thinned export reducer；Electrostatic field assembly 03 is used to form electrostatic field C, electrostatic field C
Electric field source be located on loading end A and do not carry the side for needing thin structure W, the reducer of surface Z to be thinned is located at electrostatic field C
It is interior.
In conclusion in thinning device provided by the invention, there are inclination angles with horizontal plane for the loading end on bearing assembly, go out
The liquid outlet of liquid component is located at the higher one end of loading end, and the direction of loading end can be parallel to from liquid outlet edge by going out liquid component,
Reducer is exported to surface to be thinned.And the electric field source of electrostatic field that is formed of electrostatic field assembly is located at loading end and does not carry and needs to be subtracted
The reducer of the side of thin structure, surface to be thinned is located in electrostatic field.When thin structure is placed on loading end, this waits subtracting
The surface to be thinned of thin structure and horizontal plane there are inclination angle, this go out the output of liquid component reducer can under gravity into
Row flowing, and treat thinned surface during flowing and be thinned.Initial velocity when being exported from liquid outlet due to reducer
It is smaller, so, the impact force which treats thinned surface is smaller, realizes and carries out thinned process treating thin structure
In, improve the flatness on the surface to be thinned.
Further, electrostatic field can play the reducer on the surface to be thinned suction-operated, and surface to be thinned subtracts
Thin liquid can reduce the speed of flowing under the action of gravity and electrostatic field, further reduce reducer and treat thinned table
The impact force in face, and increase the thickness of surface reducer to be thinned, to increase surface to be thinned reducer volume,
It is HF in reducer and waits for that the material of thin structure is SiO2When, the concentration of the fluosilicic acid generated in thinning process is reduced, is prevented
Stop and having been precipitated crystal since fluosilicic acid concentration is larger, has treated thinned surface and pollute.
Optionally, Fig. 2 is the structural schematic diagram of another thinning device 0 provided in an embodiment of the present invention, as shown in Fig. 2,
The thinning device 0 can also include storage assembly J, and storage assembly J may include storage tank J1, communicating pipe J2 and supply pump
J3, storage tank J1 may include that flow container P and water pot Q is thinned, this is thinned in flow container P and is stored with reducer, is stored in water pot Q
Water, this is thinned flow container P and water pot Q and is connected with communicating pipe J2, and the communicating pipe, J2 was connected with the entrance of supply pump J3, should
The outlet of supply pump J3 is connected with the liquid outlet B for going out liquid component 01.When the valve (not marked in Fig. 2) being thinned on flow container P is beaten
When opening, which can flow into communicating pipe J2, when the valve (not marked in Fig. 2) on water pot Q is opened
When, the water in water pot Q can flow into communicating pipe J2, and the water and reducer for flowing into communicating pipe J2 can mix, staff
The concentration of reducer in the communicating pipe can be adjusted by adjusting the volume of the water flowed out on water pot Q.In communicating pipe J2
The mixed liquor of reducer and water can flow into supply pump J3, and when supply pump J3 works, supply pump J3 can be by the mixing
Liquid is expelled to out the liquid outlet B of liquid component 01 from the outlet of the supply pump 013.
Fig. 3 is the structural schematic diagram of another thinning device 0 provided in an embodiment of the present invention, as shown in figure 3, thinning device
0 can also include：Component 04 is recycled, recycling component 04 is connected with liquid component 01 is gone out, and recycles the inlet of component 04 (in Fig. 3
It is not shown) it is located at lower one end of loading end on bearing assembly 02, recycling component 04 flows through subtracting for surface to be thinned for collecting
Thin liquid, and the reducer being collected into is transmitted to out liquid component 01.Surface to be thinned is flowed through since recycling component 04 can be collected
Reducer, and the reducer being collected into is transmitted to out liquid component 01, it is achieved that the recycling of reducer.
Exemplary, which further includes discharge component U, goes out liquid component 01 by recycling component 04 and discharge component U
It is connected, goes out liquid component 01 and be additionally operable to detect the concentration of reducer to be output, is more than in the concentration of reducer to be output pre-
If when concentration, reducer to be output is exported to surface to be thinned, it is less than or equal in the concentration of reducer to be output pre-
If when concentration, can reducer to be output be transmitted to discharge component U by recycling component 04, carry out the discharge of reducer,
It ensure that out that the concentration for the reducer that liquid component 01 exports is higher, thin structure can be treated by going out the reducer of liquid component output
Surface to be thinned effectively is thinned, and thinned efficiency is improved.
Fig. 4 is a kind of partial structural diagram of thinning device 0 provided in an embodiment of the present invention, as shown in figure 4, carrying group
Part 02 can be terrace with edge, and the side of terrace with edge is the loading end of bearing assembly 02.Terrace with edge can be by bearing support 021 and at least one
Loading plate 022 is constituted, and loading plate 022 is arranged on bearing support 021, and bearing support 021 constitutes the side of terrace with edge, at least one to hold
Support plate 022 constitutes the side of terrace with edge.It is exemplary, if the terrace with edge is the terrace with edge with 6 sides, carried in the bearing assembly 02
The number of plate is also 6.
Fig. 5 is a kind of structural schematic diagram of loading plate 022 provided in an embodiment of the present invention, as shown in figure 5, the loading plate
022 can be rectangular slab, and the side for being located at the first end M of loading plate 022 and the side of the second end N positioned at loading plate 022 are flat
Row, the first end M of loading plate 022 and the second end N of loading plate 022 roll in the opposite direction respectively, and the of loading plate 022
One end M can be suspended on bearing support, and the inlet for recycling component is located at the second end N of loading plate 022, and recycling component is used for
The reducer for flowing through surface to be thinned is collected by the second end N of loading plate 022.
With continued reference to FIG. 4, thinning device 0 can also include：Rotary components 05, rotary components 05 may include：Rotation
The axis of axis 051, rotary shaft 051 passes through bearing assembly 02, and perpendicular to the bottom surface of bearing assembly 02, rotary components 05 are for controlling
Bearing assembly 02 processed is rotated along the axis of rotary shaft 051.Specifically, the bearing assembly 02 can be positive terrace with edge, at this point, rotary shaft
051 axis is overlapped with the axis of bearing assembly 02.Since rotary components 05 can control bearing assembly 02 along rotary shaft 051
Axis rotates, on the one hand, during bearing assembly 02 rotates, staff may stand in the same position, replace different
Thin structure is waited on loading end (i.e. the side of terrace with edge)；On the other hand, during bearing assembly 02 rotates, positioned at waiting subtracting
The reducer of thin surface is subject to centrifugal forces so that movement locus of the reducer on surface to be thinned increases, to improve
The thinned efficiency of reducer.
Exemplary, this waits for that thin structure can be underlay substrate, this waits for that the surface to be thinned on thin structure can be lining
One plate face of substrate is being thinned a plate face of underlay substrate using thinning device provided in an embodiment of the present invention
When, the underlay substrate can be placed on the loading end of bearing assembly first, and is needed on guarantee and the underlay substrate thinned
The opposite plate face of plate face is in contact with loading plate, when underlay substrate is placed on loading end, the surface to be thinned of the underlay substrate
There are inclination angles with horizontal plane.Exemplary, which can be the positive terrace with edge being made of bearing support and loading plate, can incite somebody to action
The underlay substrate is placed on a side (i.e. a loading plate) for the positive terrace with edge.
It is then possible to control out liquid component, (or every preset time period) detects the dense of reducer to be output in real time
Degree controls out liquid component by reducer to be output to waiting being thinned when the concentration of reducer to be output is more than preset concentration
Surface exports；When the concentration of reducer to be output is less than or equal to preset concentration, reducer to be output can be passed through
Recycling component is transmitted to discharge component, carries out the discharge of reducer, ensure that out that the concentration of the reducer of liquid component output is higher,
Enable to obtain that the reducer of liquid component output is treated the surface to be thinned of thin structure and is effectively thinned, improves thinned
Efficiency.Liquid component is being controlled out to when thinned surface exports reducer, liquid component can be controlled out from going out going out for liquid component
Liquid mouth exports reducer to surface to be thinned (i.e. a plate face of underlay substrate), exemplary, and the material of the underlay substrate can be with
For SiO2, which can be HF, due to when underlay substrate is placed on loading end, the surface to be thinned of the underlay substrate and
There are inclination angles for horizontal plane, so the reducer for going out the output of liquid component can be flowed under gravity, and are flowing
During treat thinned surface and be thinned.Initial velocity when being exported from liquid outlet due to reducer is smaller, so, this is thinned
The impact force that liquid treats thinned surface is smaller, realize treat thin structure carry out be thinned during, improve this and wait subtracting
The flatness of thin surface.
Further, electrostatic field assembly can also be controlled and form electrostatic field, and the electric field source of electrostatic field is located at loading end not
The side of underlay substrate is carried, the reducer exported to surface to be thinned can be located in the electrostatic field.Electrostatic field can be right
The reducer on the surface to be thinned plays suction-operated, and the reducer on surface to be thinned is under the action of gravity and electrostatic field, energy
The enough speed for reducing flowing, further reduces reducer and treats the impact force on thinned surface, and increase surface to be thinned
The thickness of reducer increases the volume of the reducer on surface to be thinned, and is HF in reducer and waits for that the material of thin structure is
SiO2When, reduce the concentration of the fluosilicic acid generated in thinning process, it is therefore prevented that it is precipitated crystal since fluosilicic acid concentration is larger,
Thinned surface is treated to pollute.
It should be noted that from go out liquid component liquid outlet export reducer after, can also by control rotary components,
Control the axis rotation of bearing assembly rotary shaft along rotary components, on the one hand, during bearing assembly rotates, if work
Personnel determine that the underlay substrate on loading plate is thinned and finish that then staff may stand in the same position, replace different bearer
Underlay substrate on face (i.e. the side of terrace with edge)；On the other hand, during bearing assembly rotates, positioned at surface to be thinned
Reducer is subject to centrifugal forces so that movement locus of the reducer on surface to be thinned increases, to improve reducer
Thinned efficiency.
The surface to be thinned is flowed out to from the liquid outlet for going out liquid component in reducer, and under gravity, is flowed to
In bearing assembly when the second end of loading plate, since the second end of the loading plate is connected with the liquid inlet of recycling component, so
Recycling component can collect the reducer for flowing through the surface to be thinned from the second end of the loading plate, realize the recycling of reducer.
Component is recycled after being collected into reducer, the reducer being collected into liquid component can be transmitted to out, realize the repetition of reducer
It utilizes.
In the related technology, on the one hand, when carrying out reduction processing to underlay substrate, usually using thinning device to substrate base
Solution is thinned in plate surface spray so that underlay substrate is chemically reacted with thinned solution, realizes the thin type of underlay substrate.Tool
Body, the material of underlay substrate is SiO2, it is HF that solution, which is thinned, when solution is thinned to underlay substrate surface spraying in thinning device
When, SiO2It can be chemically reacted with HF, and generate H2SiF6With water H2O, the H of generation2SiF6And H2O can be molten with being thinned
The flowing of liquid is detached from underlay substrate surface.Reducer the rushing to each position on underlay substrate surface sprayed due to thinning device
Hit power difference so that underlay substrate surface can form multiple concave points, and therefore, the flatness on underlay substrate surface is relatively low.Another party
Face, when underlay substrate E is thinned, can also incite somebody to action as shown in fig. 6, filling reducer (being not shown in Fig. 6) in container F
Underlay substrate E is placed in container F, and is immersed in thinned solution so that underlay substrate E is carried out with the thinned solution in container F
Chemical reaction realizes being thinned for underlay substrate E, H can be generated during chemical reaction2SiF6And H2O, H2SiF6It can be dissolved in
H2O.Work as H2SiF6Concentration it is larger when, H2SiF6Solid particle can be precipitated, and be attached to underlay substrate surface, cause substrate base
Plate surface foreign matter is bad, pollutes underlay substrate.And when underlay substrate being thinned by the way of impregnating, due to underlay substrate
It is respectively positioned in reducer, so only a surface of underlay substrate can not be thinned.
In the embodiment of the present invention, reducer flows out to the surface to be thinned for waiting for thin structure from the liquid outlet for going out liquid component
On, and reducer flows uniformly through under the action of gravity and electrostatic attraction on surface to be thinned, it is multiple by controlling reducer
It is flowed through on surface to be thinned, the thinned degree on thinned surface is treated in control.Since in the embodiment of the present invention, reducer is waiting being thinned
Surface is evenly distributed so that the smooth degree on surface to be thinned is higher, and after treating thinned surface and be thinned, without treating
The surface to be thinned of thin structure is ground.It further, can be only due to thinning device provided in an embodiment of the present invention
To waiting for that a surface to be thinned of thin structure is thinned, so, thinning device provided in an embodiment of the present invention can be treated
Thin structure carries out asymmetric and is thinned.It should be noted that the reducer in the embodiment of the present invention can also be in addition to HF
Other reducer embodiment of the present invention are not construed as limiting this.
In conclusion in thinning device provided by the invention, there are inclination angles with horizontal plane for the loading end on bearing assembly, go out
The liquid outlet of liquid component is located at the higher one end of loading end, and the direction of loading end can be parallel to from liquid outlet edge by going out liquid component,
Reducer is exported to surface to be thinned.And the electric field source of electrostatic field that is formed of electrostatic field assembly is located at loading end and does not carry and needs to be subtracted
The reducer of the side of thin structure, surface to be thinned is located in electrostatic field.When thin structure is placed on loading end, this waits subtracting
The surface to be thinned of thin structure and horizontal plane there are inclination angle, this go out the output of liquid component reducer can under gravity into
Row flowing, and treat thinned surface during flowing and be thinned.Initial velocity when being exported from liquid outlet due to reducer
It is smaller, so, the impact force which treats thinned surface is smaller, realizes and carries out thinned process treating thin structure
In, improve the flatness on the surface to be thinned.
Further, electrostatic field can play the reducer on the surface to be thinned suction-operated, and surface to be thinned subtracts
Thin liquid can reduce the speed of flowing under the action of gravity and electrostatic field, further reduce reducer and treat thinned table
The impact force in face, and increase the thickness of surface reducer to be thinned, to increase surface to be thinned reducer volume,
It is HF in reducer and waits for that the material of thin structure is SiO2When, the concentration of the fluosilicic acid generated in thinning process is reduced, is prevented
Stop and having been precipitated crystal since fluosilicic acid concentration is larger, has treated thinned surface and pollute.
As shown in fig. 7, an embodiment of the present invention provides a kind of application method of thinning device, the user of the thinning device
Method can be used for as shown in Figure 1, Figure 2, Fig. 3 or shown in Fig. 4 thinning devices 0, which may include：Go out liquid component, carrying
Component and electrostatic field assembly, the application method of the thinning device may include：
Step 701 will wait for that thin structure is carried on the loading end of bearing assembly, and there are inclination angles with horizontal plane for loading end.
Step 702 controls out liquid component to surface the to be thinned output reducer for waiting for thin structure, and go out liquid component goes out liquid
Mouth is located at the higher one end of loading end, and the liquid that goes out of liquid outlet is oriented parallel to loading end.
Step 703, control electrostatic field assembly form electrostatic field, and the electric field source of electrostatic field, which is located at loading end and does not carry, to be needed to be subtracted
The reducer of the side of thin structure, surface to be thinned is located in electrostatic field.
In conclusion in the application method of thinning device provided by the invention, it will wait for that thin structure is carried on loading end,
And control out liquid component and export reducer to surface to be thinned, control electrostatic field assembly forms electrostatic field, and the electric field of electrostatic field
Source is located at loading end and does not carry the side for needing thin structure so that reducer of the output to surface to be thinned is located at electrostatic field
It is interior.When thin structure is placed on loading end, this waits for that there are inclination angles with horizontal plane for the surface to be thinned of thin structure, this goes out liquid
The reducer of component output can be flowed under gravity, and treated thinned surface during flowing and subtracted
It is thin.Initial velocity when being exported from liquid outlet due to reducer is smaller, so, the reducer treat the impact force on thinned surface compared with
It is small, realize treat thin structure carry out be thinned during, improve the flatness on the surface to be thinned.
Further, electrostatic field can play the reducer on the surface to be thinned suction-operated, and surface to be thinned subtracts
Thin liquid can reduce the speed of flowing under the action of gravity and electrostatic field, further reduce reducer and treat thinned table
The impact force in face, and increase the thickness of surface reducer to be thinned, to increase surface to be thinned reducer volume,
It is HF in reducer and waits for that the material of thin structure is SiO2When, the concentration of the fluosilicic acid generated in thinning process is reduced, is prevented
Stop and having been precipitated crystal since fluosilicic acid concentration is larger, has treated thinned surface and pollute.
Optionally, thinning device further includes：Component is recycled, the inlet for recycling component is located at the lower one end of loading end,
After step 702, the application method of the thinning device can also include：
Control recycling collect components flow through the reducer on surface to be thinned；
The reducer being collected into is transmitted to out liquid component by control recycling component.
Optionally, before step 702, the application method of the thinning device can also include：Control out liquid component detection
The concentration of reducer to be output；
Step 702 may include：When the concentration of reducer to be output is more than preset concentration, control recycling component will be received
The reducer collected is transmitted to out liquid component.
Optionally, bearing assembly can be terrace with edge, and thinning device can also include：Rotary components, rotary components include：Rotation
The axis of shaft, rotary shaft passes through bearing assembly, and perpendicular to the bottom surface of bearing assembly, after step 701, the thinning device
Application method can also include：By controlling rotary components, control bearing assembly is rotated along the axis of rotary shaft.
In conclusion in the application method of thinning device provided by the invention, it will wait for that thin structure is carried on loading end,
And control out liquid component and export reducer to surface to be thinned, control electrostatic field assembly forms electrostatic field, and the electric field of electrostatic field
Source is located at loading end and does not carry the side for needing thin structure so that reducer of the output to surface to be thinned is located at electrostatic field
It is interior.When thin structure is placed on loading end, this waits for that there are inclination angles with horizontal plane for the surface to be thinned of thin structure, this goes out liquid
The reducer of component output can be flowed under gravity, and treated thinned surface during flowing and subtracted
It is thin.Initial velocity when being exported from liquid outlet due to reducer is smaller, so, the reducer treat the impact force on thinned surface compared with
It is small, realize treat thin structure carry out be thinned during, improve the flatness on the surface to be thinned.
Further, electrostatic field can play the reducer on the surface to be thinned suction-operated, and surface to be thinned subtracts
Thin liquid can reduce the speed of flowing under the action of gravity and electrostatic field, further reduce reducer and treat thinned table
The impact force in face, and increase the thickness of surface reducer to be thinned, to increase surface to be thinned reducer volume,
It is HF in reducer and waits for that the material of thin structure is SiO2When, the concentration of the fluosilicic acid generated in thinning process is reduced, is prevented
Stop and having been precipitated crystal since fluosilicic acid concentration is larger, has treated thinned surface and pollute.
As shown in figure 8, an embodiment of the present invention provides the application method of another thinning device, the use of the thinning device
Method can be used for as shown in Figure 1, Figure 2, Fig. 3 or shown in Fig. 4 thinning devices 0, which may include：Go out liquid component, hold
It carries component and electrostatic field assembly, the application method of the thinning device may include：
Step 801 will wait for that thin structure is carried on the loading end of bearing assembly, and there are inclination angles with horizontal plane for loading end.
This waits for that thin structure can be underlay substrate, this waits for that the surface to be thinned on thin structure can be underlay substrate
One plate face, exemplary, bearing assembly can be terrace with edge, and the side of terrace with edge is loading end.As shown in figure 4, bearing assembly 02 can
Think that terrace with edge, the side of terrace with edge are the loading end of bearing assembly 02.Terrace with edge can be by bearing support 021 and at least one loading plate
022 is constituted, and loading plate 022 is arranged on bearing support 021, and bearing support 021 constitutes the side of terrace with edge, at least one loading plate
022 constitutes the side of terrace with edge.It is exemplary, if the terrace with edge is the terrace with edge with 6 sides, loading plate in the bearing assembly 02
Number is also 6.It is exemplary, which can be placed on the loading end of bearing assembly, and on guarantee and the underlay substrate
The plate face for needing thinned plate face opposite is in contact with loading plate, when underlay substrate is placed on loading end, the underlay substrate
There are inclination angles with horizontal plane on surface to be thinned.Exemplary, which can be to be made of just bearing support and loading plate
The underlay substrate can be placed on a side (i.e. a loading plate) for the positive terrace with edge by terrace with edge.
Step 802, the concentration for controlling out liquid component detection reducer to be output.
Exemplary, can controlling out liquid component, (or every preset time period) detects reducer to be output in real time
Concentration, and the concentration of the reducer to be output is compared with preset concentration.It should be noted that the preset concentration can be with
It sets on going out liquid component for staff, the substrate to be thinned can be waited for more than the reducer of the preset concentration in advance
Surface is thinned effectively to be thinned, the substrate to be thinned can not be waited being thinned less than or equal to the reducer of the preset concentration
Surface is effectively thinned.
Step 803, when the concentration of reducer to be output is more than preset concentration, control out liquid component to waiting for thin structure
Surface to be thinned export reducer.
When the concentration of reducer to be output is more than preset concentration, liquid component is controlled out by reducer to be output to waiting for
Surface output is thinned, it, can be by reducer to be output when the concentration of reducer to be output is less than or equal to preset concentration
It is transmitted to discharge component by recycling component, carries out the discharge of reducer, ensure that out the concentration of the reducer of liquid component output
It is higher so that the surface to be thinned of thin structure can be treated and be effectively thinned by going out the reducer of liquid component output, raising
Thinned efficiency.It is exemplary, the thinning device can also include discharge component, this go out liquid component can by recycle component with
Discharge component is connected, and goes out liquid component when the concentration for detecting reducer to be output is less than or equal to preset concentration, can incite somebody to action
The reducer to be output is transmitted to discharge component by recycling component, carries out the discharge of reducer, does not recycle the discharge
Reducer.
Exemplary, the liquid outlet for going out liquid component is located at the higher one end of loading end, and the liquid that goes out of liquid outlet is oriented parallel to hold
Section.When thinned surface exports reducer, liquid component can be controlled out from going out to when thin structure controlling out liquid component
The liquid outlet of liquid component exports reducer to surface to be thinned (i.e. a plate face of underlay substrate).It is exemplary, the underlay substrate
Material can be SiO2, which can be HF, since when underlay substrate is placed on loading end, which waits for
Surface is thinned, and there are inclination angles with horizontal plane, so the reducer for going out the output of liquid component can be flowed under gravity
It is dynamic, and treat thinned surface during flowing and be thinned.The liquid that goes out for going out the liquid outlet of liquid component is oriented parallel to hold
Section, initial velocity when reducer is exported from liquid outlet is smaller, so, the impact force which treats thinned surface is smaller,
Realize treat thin structure carry out be thinned during, improve the flatness on the surface to be thinned.
Step 804, control electrostatic field assembly form electrostatic field, and the electric field source of electrostatic field, which is located at loading end and does not carry, to be needed to be subtracted
The reducer of the side of thin structure, surface to be thinned is located in electrostatic field.
Electrostatic field assembly can be controlled and form electrostatic field, and the electric field source of electrostatic field is located at loading end and does not carry substrate base
The side of plate, the reducer exported to surface to be thinned can be located in the electrostatic field.Electrostatic field can be to the surface to be thinned
Reducer play suction-operated, the reducer on surface to be thinned can reduce flowing under the action of gravity and electrostatic field
Speed further reduces the impact force that reducer treats thinned surface.And reducer is under the action of gravity and electrostatic field,
The thickness of surface reducer to be thinned is larger, that is, the volume of the reducer on surface to be thinned is larger, is HF in reducer and waits subtracting
The material of thin structure is SiO2When, reduce the concentration of the fluosilicic acid generated in thinning process, it is therefore prevented that due to fluosilicic acid concentration
It is larger and precipitate crystal, it treats thinned surface and pollutes.
Step 805 passes through control rotary components, axis rotation of the control bearing assembly along rotary shaft.
Referring to FIG. 4, thinning device 0 can also include：Rotary components 05, rotary components 05 may include：Rotary shaft
051, the axis of rotary shaft 051 passes through bearing assembly 02, and perpendicular to the bottom surface of bearing assembly 02, rotary components 05 are for controlling
Bearing assembly 02 is rotated along the axis of rotary shaft 051.Specifically, the bearing assembly 02 can be positive terrace with edge, at this point, rotary shaft
051 axis is overlapped with the axis of bearing assembly 02.Since rotary components 05 can control bearing assembly 02 along rotary shaft 051
Axis rotates, on the one hand, during bearing assembly 02 rotates, staff may stand in the same position, replace different
Thin structure is waited on loading end (i.e. the side of terrace with edge)；On the other hand, during bearing assembly 02 rotates, positioned at waiting subtracting
The reducer of thin surface is subject to centrifugal forces so that movement locus of the reducer on surface to be thinned increases, to improve
The thinned efficiency of reducer.
Step 806, control recycling collect components flow through the reducer on surface to be thinned.
As shown in figure 3, thinning device 0 can also include：Component 04 is recycled, recycling component 04 is connected with liquid component 01 is gone out
Logical, the inlet (being not shown in Fig. 3) of recycling component 04 is located at lower one end of loading end on bearing assembly 02, recycles component 04
For collecting the reducer for flowing through surface to be thinned.
The reducer being collected into is transmitted to out liquid component by step 807, control recycling component.
Component is recycled after being collected into reducer, the reducer being collected into can be transmitted to out to liquid component, realizes and is thinned
The recycling of liquid.
In the related technology, on the one hand, when carrying out reduction processing to underlay substrate, usually using thinning device to substrate base
Solution is thinned in plate surface spray so that underlay substrate is chemically reacted with thinned solution, realizes the thin type of underlay substrate.Tool
Body, the material of underlay substrate is SiO2, it is HF that solution, which is thinned, when solution is thinned to underlay substrate surface spraying in thinning device
When, SiO2It can be chemically reacted with HF, and generate H2SiF6With water H2O, the H of generation2SiF6And H2O can be molten with being thinned
The flowing of liquid is detached from underlay substrate surface.Reducer the rushing to each position on underlay substrate surface sprayed due to thinning device
Hit power difference so that underlay substrate surface can form multiple concave points, and therefore, the flatness on underlay substrate surface is relatively low.Another party
Face, when underlay substrate E is thinned, can also incite somebody to action as shown in fig. 6, filling reducer (being not shown in Fig. 6) in container F
Underlay substrate E is placed in container F, and is immersed in thinned solution so that underlay substrate E is carried out with the thinned solution in container F
Chemical reaction realizes being thinned for underlay substrate E, H can be generated during chemical reaction2SiF6And H2O, H2SiF6It can be dissolved in
H2O.Work as H2SiF6Concentration it is larger when, H2SiF6Solid particle can be precipitated, and be attached to underlay substrate surface, cause substrate base
Plate surface foreign matter is bad, pollutes underlay substrate.And when underlay substrate being thinned by the way of impregnating, due to underlay substrate
It is respectively positioned in reducer, so only a surface of underlay substrate can not be thinned.
In the embodiment of the present invention, reducer flows out to the surface to be thinned for waiting for thin structure from the liquid outlet for going out liquid component
On, and reducer flows uniformly through under the action of gravity and electrostatic attraction on surface to be thinned, it is multiple by controlling reducer
It is flowed through on surface to be thinned, the thinned degree on thinned surface is treated in control.Since in the embodiment of the present invention, reducer is waiting being thinned
Surface is evenly distributed so that the smooth degree on surface to be thinned is higher, and after treating thinned surface and be thinned, without treating
The surface to be thinned of thin structure is ground.It further, can be only due to thinning device provided in an embodiment of the present invention
To waiting for that a surface to be thinned of thin structure is thinned, so, thinning device provided in an embodiment of the present invention can be treated
Thin structure carries out asymmetric and is thinned.It should be noted that the reducer in the embodiment of the present invention can also be in addition to HF
Other reducer embodiment of the present invention are not construed as limiting this.
In conclusion in the application method of thinning device provided by the invention, it will wait for that thin structure is carried on loading end,
And control out liquid component and export reducer to surface to be thinned, control electrostatic field assembly forms electrostatic field, and the electric field of electrostatic field
Source is located at loading end and does not carry the side for needing thin structure so that reducer of the output to surface to be thinned is located at electrostatic field
It is interior.When thin structure is placed on loading end, this waits for that there are inclination angles with horizontal plane for the surface to be thinned of thin structure, this goes out liquid
The reducer of component output can be flowed under gravity, and treated thinned surface during flowing and subtracted
It is thin.Initial velocity when being exported from liquid outlet due to reducer is smaller, so, the reducer treat the impact force on thinned surface compared with
It is small, realize treat thin structure carry out be thinned during, improve the flatness on the surface to be thinned.
Further, electrostatic field can play the reducer on the surface to be thinned suction-operated, and surface to be thinned subtracts
Thin liquid can reduce the speed of flowing under the action of gravity and electrostatic field, further reduce reducer and treat thinned table
The impact force in face, and increase the thickness of surface reducer to be thinned, to increase surface to be thinned reducer volume,
It is HF in reducer and waits for that the material of thin structure is SiO2When, the concentration of the fluosilicic acid generated in thinning process is reduced, is prevented
Stop and having been precipitated crystal since fluosilicic acid concentration is larger, has treated thinned surface and pollute.
The sequencing of the application method step of thinning device provided in an embodiment of the present invention can be adjusted suitably, step
Suddenly according to circumstances can also accordingly be increased and decreased, any one skilled in the art the invention discloses technology model
In enclosing, the method that can readily occur in variation should be covered by the protection scope of the present invention, therefore repeat no more.
It is apparent to those skilled in the art that for convenience and simplicity of description, foregoing description is thinned
The specific steps of the application method of device can refer to the corresponding process in aforementioned thinning device embodiment, and details are not described herein.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention.
Claims (12)
1. a kind of thinning device, which is characterized in that the thinning device includes：Go out liquid component, bearing assembly and electrostatic field assembly,
It waits for the loading end of thin structure for carrying on the bearing assembly there are inclination angles with horizontal plane；
It is described go out liquid component liquid outlet be located at the higher one end of the loading end, the liquid that goes out of the liquid outlet is oriented parallel to institute
State loading end, it is described go out liquid component be used for surface the to be thinned output reducer for waiting for thin structure；
The electrostatic field assembly is used to form electrostatic field, the electric field source of the electrostatic field be located at the loading end do not carry it is described
Wait for that the side of thin structure, the reducer on the surface to be thinned are located in the electrostatic field.
2. thinning device according to claim 1, which is characterized in that the thinning device further includes：Component is recycled, it is described
Recycling component with it is described go out liquid component be connected,
The inlet of the recycling component is located at the lower one end of the loading end, and the recycling component flows through described for collection
The reducer on surface to be thinned, and by the reducer being collected into be transmitted to it is described go out liquid component.
3. thinning device according to claim 1, which is characterized in that
It is described go out liquid component be additionally operable to detect the concentration of reducer to be output；
It is described go out liquid component be additionally operable to reducer to be output concentration be more than preset concentration when, it is defeated to the surface to be thinned
Go out reducer.
4. thinning device according to claim 2, which is characterized in that the bearing assembly is terrace with edge, the side of the terrace with edge
Face is the loading end.
5. thinning device according to claim 4, which is characterized in that the terrace with edge is by bearing support and at least one carrying
Plate is constituted,
The loading plate is arranged on the bearing support, and the bearing support constitutes the side of the terrace with edge, described at least one
Loading plate constitutes the side of the terrace with edge.
6. thinning device according to claim 5, which is characterized in that the loading plate is rectangular slab, is located at the carrying
The side of the first end of plate is parallel with positioned at the side of second end of the loading plate, the first end of the loading plate and described holds
The second end of support plate is rolled in the opposite direction respectively,
The first end of the loading plate is suspended on the bearing support, and the inlet of the recycling component is located at the loading plate
Second end, the recycling component, which is used to collect by the second end of the loading plate, flows through the thinned of the surface to be thinned
Liquid.
7. according to any thinning devices of claim 4-6, which is characterized in that the thinning device further includes：Rotation group
Part, the rotary components include：Rotary shaft,
The axis of the rotary shaft passes through the bearing assembly, and perpendicular to the bottom surface of the bearing assembly, the rotary components
It is rotated along the axis of the rotary shaft for controlling the bearing assembly.
8. thinning device according to claim 7, which is characterized in that
The bearing assembly is positive terrace with edge, and the axis of the rotary shaft is overlapped with the axis of the bearing assembly.
9. a kind of application method of thinning device, which is characterized in that be used for thinning device, the thinning device includes：Go out liquid group
Part, bearing assembly and electrostatic field assembly, the method includes：
It will wait for that thin structure is carried on the loading end of the bearing assembly, there are inclination angles with horizontal plane for the loading end；
Go out the surface to be thinned that liquid component waits for thin structure to described described in control and export reducer, it is described go out liquid component go out liquid
Mouth is located at the higher one end of the loading end, and the liquid that goes out of the liquid outlet is oriented parallel to the loading end；
It controls the electrostatic field assembly and forms electrostatic field, the electric field source of the electrostatic field, which is located at the loading end and does not carry, to be needed to be subtracted
The reducer of the side of thin structure, the surface to be thinned is located in the electrostatic field.
10. according to the method described in claim 9, it is characterized in that, the thinning device further includes：Recycling component, described time
The inlet for receiving component is located at the lower one end of the loading end, and liquid component is gone out described in the control to the surface to be thinned
After exporting reducer, the method further includes：
Control the reducer that the recycling collect components flow through the surface to be thinned；
Control the recycling component by the reducer being collected into be transmitted to it is described go out liquid component.
11. according to the method described in claim 10, waiting being thinned to described it is characterized in that, going out liquid component described in the control
Before surface the to be thinned output reducer of structure, the method further includes：
Go out the concentration of liquid component detection reducer to be output described in control；
Go out liquid component described in the control and exports reducer to the surface to be thinned for waiting for thin structure, including：
When the concentration of the reducer to be output is more than preset concentration, the reducer that the recycling component will be collected into is controlled
Go out liquid component described in being transmitted to.
12. according to any method of claim 9 to 11, which is characterized in that the bearing assembly is terrace with edge, described to be thinned
Device further includes：Rotary components, the rotary components include：The axis of rotary shaft, the rotary shaft passes through the bearing assembly,
And perpendicular to the bottom surface of the bearing assembly, it will wait for that thin structure is carried on the loading end of the bearing assembly it described
Afterwards, the method further includes：
By controlling the rotary components, the axis for controlling the bearing assembly along the rotary shaft rotates.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10312951A (en) * | 1997-05-14 | 1998-11-24 | Dainippon Screen Mfg Co Ltd | Substrate processor |
| JP2010123838A (en) * | 2008-11-21 | 2010-06-03 | Seiko Epson Corp | Development device, development method, and semiconductor device manufacturing method |
| CN102044412A (en) * | 2009-10-16 | 2011-05-04 | 东京毅力科创株式会社 | Substrate liquid processing apparatus and substrate liquid processing method |
| CN103915364A (en) * | 2012-12-28 | 2014-07-09 | 大日本网屏制造株式会社 | Substrate processing apparatus and substrate processing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102520212B (en) * | 2011-12-14 | 2013-10-30 | 中国科学院苏州纳米技术与纳米仿生研究所 | Device for thinning multi-layer material and method for thinning to-be-detected sample |
| CN103456766B (en) * | 2013-09-24 | 2016-03-16 | 四川虹视显示技术有限公司 | Oled panel thinning device, thinning system and thining method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10312951A (en) * | 1997-05-14 | 1998-11-24 | Dainippon Screen Mfg Co Ltd | Substrate processor |
| JP2010123838A (en) * | 2008-11-21 | 2010-06-03 | Seiko Epson Corp | Development device, development method, and semiconductor device manufacturing method |
| CN102044412A (en) * | 2009-10-16 | 2011-05-04 | 东京毅力科创株式会社 | Substrate liquid processing apparatus and substrate liquid processing method |
| CN103915364A (en) * | 2012-12-28 | 2014-07-09 | 大日本网屏制造株式会社 | Substrate processing apparatus and substrate processing method |
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