CN105445976A - Reduction device and application method thereof - Google Patents
Reduction device and application method thereof Download PDFInfo
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- CN105445976A CN105445976A CN201610030775.2A CN201610030775A CN105445976A CN 105445976 A CN105445976 A CN 105445976A CN 201610030775 A CN201610030775 A CN 201610030775A CN 105445976 A CN105445976 A CN 105445976A
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- thinning
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- electrostatic field
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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Abstract
The invention discloses a reduction device and an application method thereof, belonging to the field of displays. The reduction device comprises a liquid outlet component, a bearing component and an electrostatic field component, wherein a dip angle is formed between a bearing surface, for bearing a structure to be reduced, of the bearing component and a horizontal plane; a liquid outlet of the liquid outlet component is located in a higher end of the bearing surface, the liquid outlet direction of the liquid outlet is parallel to the bearing surface, and the liquid outlet component is used for outputting a reduction liquid to the surface to be reduced of the structure to be reduced; the electrostatic field component is used for forming an electrostatic field, the electric field source of the electrostatic field is located on one side, which does not bear the structure to be reduced, of the bearing surface, and the reduction liquid of the surface to be reduced is located in the electrostatic field. The reduction device and the application method thereof, disclosed by the invention, solve the problem of lower flatness of the surface of a substrate, achieve the effect of improving the flatness of the surface to be reduced, and are used for the reduction of the substrate.
Description
Technical field
The present invention relates to display field, particularly a kind of thinning device and using method thereof.
Background technology
Along with LCDs is (English: LiquidCrystalDisplay; Be called for short: LCD) to lightening development, LCDs needs to use more frivolous underlay substrate, therefore, needs to carry out reduction processing to underlay substrate.
In correlation technique, when carrying out reduction processing to underlay substrate, usually using thinning device to the thinning solution of underlay substrate surface spraying, making underlay substrate and thinning solution carry out chemical reaction, realize the thin type of underlay substrate.Concrete, the material of underlay substrate is silicon dioxide (SiO
2), thinning solution is hydrofluorite (HF), when thinning device solution thinning to underlay substrate surface spraying, and SiO
2chemical reaction can be there is with HF, and generate hydrofluosilicic acid (H
2siF
6) and water (H
2o), the H of generation
2siF
6and H
2o can depart from underlay substrate surface along with the flowing of thinning solution.
Due in correlation technique, the reducer of thinning device ejection is different to the impulsive force of each position on underlay substrate surface, and make underlay substrate surface can form multiple concave point, therefore, the flatness on underlay substrate surface is lower.
Summary of the invention
In order to the problem that the flatness solving underlay substrate surface is lower, the invention provides a kind of thinning device and using method thereof.Described technical scheme is as follows:
On the one hand, provide a kind of thinning device, described thinning device comprises: fluid assembly, bearing assembly and electrostatic field assembly,
For carrying the loading end for the treatment of thin structure and surface level exists inclination angle on described bearing assembly;
The liquid outlet of described fluid assembly is positioned at the higher one end of described loading end, and the fluid direction of described liquid outlet is parallel to described loading end, described fluid assembly be used for described treat thin structure treat thinning surface export reducer;
Described electrostatic field assembly for the formation of electrostatic field, the electric field source of described electrostatic field be positioned at described loading end do not carry described in treat the side of thin structure, described in treat that the reducer on thinning surface is positioned at described electrostatic field.
Optionally, described thinning device also comprises: reclaim assembly, described recovery assembly is connected with described fluid assembly,
The inlet of described recovery assembly is positioned at the lower one end of described loading end, described recovery assembly for collect flow through described in treat the reducer on thinning surface, and the reducer collected is transferred to described fluid assembly.
Optionally, described fluid assembly is also for detecting the concentration of reducer to be output;
To described, described fluid assembly, also for when the concentration of reducer to be output is greater than preset concentration, treats that thinning surface exports reducer.
Optionally, described bearing assembly is terrace with edge, and the side of described terrace with edge is described loading end.
Optionally, described terrace with edge is made up of bearing support and at least one loading plate,
Described loading plate is arranged on described bearing support, and described bearing support forms the limit of described terrace with edge, and at least one loading plate described forms the side of described terrace with edge.
Optionally, described loading plate is rectangular slab, and the side being positioned at the first end of described loading plate is parallel with the side of the second end being positioned at described loading plate, and the first end of described loading plate and the second end of described loading plate are rolled respectively in the opposite direction,
The first end of described loading plate is suspended on described bearing support, and the inlet of described recovery assembly is positioned at the second end of described loading plate, described recovery assembly be used for by the second end of described loading plate collect flow through described in treat the reducer on thinning surface.
Optionally, described thinning device also comprises: rotary components, and described rotary components comprises: turning axle,
The axis of described turning axle is through described bearing assembly, and perpendicular to the bottom surface of described bearing assembly, described rotary components rotates along the axis of described turning axle for controlling described bearing assembly.
Optionally, described bearing assembly is positive terrace with edge, the axis of described turning axle and the dead in line of described bearing assembly.
On the other hand, provide a kind of using method of thinning device, for thinning device, described thinning device comprises: fluid assembly, bearing assembly and electrostatic field assembly, and described method comprises:
To treat that thin structure is carried on the loading end of described bearing assembly, there is inclination angle in described loading end and surface level;
Control described fluid assembly to described treat thin structure treat thinning surface export reducer, the liquid outlet of described fluid assembly is positioned at the higher one end of described loading end, and the fluid direction of described liquid outlet is parallel to described loading end;
Control described electrostatic field assembly and form electrostatic field, the electric field source of described electrostatic field is positioned at described loading end and does not carry and need the side of thin structure, described in treat that the reducer on thinning surface is positioned at described electrostatic field.
Optionally, described thinning device also comprises: reclaim assembly, the inlet of described recovery assembly is positioned at the lower one end of described loading end, and treat that thinning surface exports after reducer at described control described fluid assembly to described, described method also comprises:
Control described recovery collect components flow through described in treat the reducer on thinning surface;
Control described recovery assembly and the reducer collected is transferred to described fluid assembly.
Optionally, described control described fluid assembly to described treat thin structure treat that thinning surface exports before reducer, described method also comprises:
Control the concentration of described fluid component detection reducer to be output;
Described control described fluid assembly to described treat thin structure treat thinning surface export reducer, comprising:
When the concentration of described reducer to be output is greater than preset concentration, controls described recovery assembly and the reducer collected is transferred to described fluid assembly.
Optionally, described bearing assembly is terrace with edge, described thinning device also comprises: rotary components, described rotary components comprises: turning axle, the axis of described turning axle is through described bearing assembly, and perpendicular to the bottom surface of described bearing assembly, described by after treating on the loading end that thin structure is carried on described bearing assembly, described method also comprises:
By controlling described rotary components, controlling described bearing assembly and rotating along the axis of described turning axle.
The invention provides a kind of thinning device and using method thereof, in thinning device, there is inclination angle in the loading end on bearing assembly and surface level, the liquid outlet of fluid assembly is positioned at the higher one end of loading end, fluid assembly can be parallel to the direction of loading end from liquid outlet edge, to treating that thinning surface exports reducer.And the electric field source of electrostatic field that electrostatic field assembly is formed is positioned at loading end does not carry and need the side of thin structure, to treat that the reducer on thinning surface is positioned at electrostatic field.When being placed on loading end until thin structure, what this treated thin structure treats that thinning surface and surface level exist inclination angle, and the reducer that this fluid assembly exports can flow under gravity, and in the process of flowing, treats thinning surface carry out thinning.Because initial velocity when reducer exports from liquid outlet is less, so the impulsive force that thinning surface treated by this reducer is less, achieves and carry out in thinning process treating thin structure, improve the flatness that this treats thinning surface.
Further, to this, electrostatic field can treat that the reducer on thinning surface plays suction-operated, treat that the reducer on thinning surface is under the effect of gravity and electrostatic field, the speed flowed can be reduced, further reduce the impulsive force that thinning surface treated by reducer, and add the thickness treating thinning surperficial reducer, thus increase the volume of the reducer treating thinning surface, be HF at reducer and treat that the material of thin structure is SiO
2time, reduce the concentration of the hydrofluosilicic acid generated in thinning process, prevent the crystallize out because hydrofluosilicic acid concentration is comparatively large, treat thinning surface and pollute.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The structural representation of a kind of thinning device that Fig. 1 provides for the embodiment of the present invention;
The structural representation of the another kind of thinning device that Fig. 2 provides for the embodiment of the present invention;
The structural representation of another thinning device that Fig. 3 provides for the embodiment of the present invention;
The partial structurtes schematic diagram of a kind of thinning device that Fig. 4 provides for the embodiment of the present invention;
The structural representation of a kind of loading plate that Fig. 5 provides for the embodiment of the present invention;
The schematic diagram of a kind of thinning substrate that Fig. 6 provides for correlation technique;
The method flow diagram of the using method of a kind of thinning device that Fig. 7 provides for the embodiment of the present invention;
The method flow diagram of the using method of the another kind of thinning device that Fig. 8 provides for the embodiment of the present invention.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiment of the present invention is described further in detail.
As shown in Figure 1, embodiments provide a kind of thinning device 0, this thinning device 0 can comprise: fluid assembly 01, bearing assembly 02 and electrostatic field assembly 03.
Wherein, there is inclination angle for carrying the loading end A that treats thin structure W and surface level X in bearing assembly 02; The liquid outlet B of fluid assembly 01 is positioned at the higher one end of loading end A, and the fluid direction Y of liquid outlet B is parallel to loading end A, and fluid assembly 01 is for treating that thin structure W's treats that thinning surperficial Z exports reducer; Electrostatic field assembly 03 is for the formation of electrostatic field C, and the electric field source of electrostatic field C is positioned at loading end A do not carry and needs the side of thin structure W, to treat that the reducer of thinning surperficial Z is positioned at electrostatic field C.
In sum, in thinning device provided by the invention, there is inclination angle in the loading end on bearing assembly and surface level, and the liquid outlet of fluid assembly is positioned at the higher one end of loading end, fluid assembly can be parallel to the direction of loading end from liquid outlet edge, to treating that thinning surface exports reducer.And the electric field source of electrostatic field that electrostatic field assembly is formed is positioned at loading end does not carry and need the side of thin structure, to treat that the reducer on thinning surface is positioned at electrostatic field.When being placed on loading end until thin structure, what this treated thin structure treats that thinning surface and surface level exist inclination angle, and the reducer that this fluid assembly exports can flow under gravity, and in the process of flowing, treats thinning surface carry out thinning.Because initial velocity when reducer exports from liquid outlet is less, so the impulsive force that thinning surface treated by this reducer is less, achieves and carry out in thinning process treating thin structure, improve the flatness that this treats thinning surface.
Further, to this, electrostatic field can treat that the reducer on thinning surface plays suction-operated, treat that the reducer on thinning surface is under the effect of gravity and electrostatic field, the speed flowed can be reduced, further reduce the impulsive force that thinning surface treated by reducer, and add the thickness treating thinning surperficial reducer, thus increase the volume of the reducer treating thinning surface, be HF at reducer and treat that the material of thin structure is SiO
2time, reduce the concentration of the hydrofluosilicic acid generated in thinning process, prevent the crystallize out because hydrofluosilicic acid concentration is comparatively large, treat thinning surface and pollute.
Optionally, the structural representation of the another kind of thinning device 0 that Fig. 2 provides for the embodiment of the present invention, as shown in Figure 2, this thinning device 0 can also comprise memory module J, this memory module J can comprise storage tank J1, communicating pipe J2 and charge pump J3, this storage tank J1 can comprise thinning flow container P and water pot Q, reducer is stored in this thinning flow container P, water is stored in water pot Q, this thinning flow container P is all connected with this communicating pipe J2 with water pot Q, this communicating pipe, J2 was connected with the entrance of charge pump J3, the outlet of this charge pump J3 is connected with the liquid outlet B of fluid assembly 01.When the valve (not marking in Fig. 2) on thinning flow container P is opened, reducer in this thinning flow container P can flow into this communicating pipe J2, when the valve (not marking in Fig. 2) on water pot Q is opened, water in this water pot Q can flow into this communicating pipe J2, the water and the reducer that flow into communicating pipe J2 can mix, staff by the volume of the water of outflow on this water pot of adjustment Q, can adjust the concentration of reducer in this communicating pipe.Reducer in this communicating pipe J2 and the mixed liquor of water can flow into charge pump J3, and when this charge pump J3 works, this mixed liquor can be expelled to the liquid outlet B of fluid assembly 01 by this charge pump J3 from the outlet of this charge pump 013.
The structural representation of another thinning device 0 that Fig. 3 provides for the embodiment of the present invention, as shown in Figure 3, thinning device 0 can also comprise: reclaim assembly 04, reclaim assembly 04 to be connected with fluid assembly 01, the inlet (not shown in Fig. 3) reclaiming assembly 04 is positioned at one end that on bearing assembly 02, loading end is lower, reclaim assembly 04 for collecting the reducer flowing through and treat thinning surface, and the reducer collected is transferred to fluid assembly 01.Can collect owing to reclaiming assembly 04 reducer flowing through and treat thinning surface, and the reducer collected is transferred to fluid assembly 01, therefore achieve the recycling of reducer.
Example, this thinning device 0 also comprises discharges assembly U, fluid assembly 01 is connected with discharge assembly U by reclaiming assembly 04, fluid assembly 01 is also for detecting the concentration of reducer to be output, when the concentration of reducer to be output is greater than preset concentration, by reducer to be output to treating that thinning surface exports, when the concentration of reducer to be output is less than or equal to preset concentration, reducer to be output can be transferred to discharge assembly U by reclaiming assembly 04, carry out the discharge of reducer, ensure that the concentration of the reducer that fluid assembly 01 exports is higher, what the reducer that fluid assembly exports can treat thin structure treats that thinning surface is carried out effectively thinning, improve thinning efficiency.
The partial structurtes schematic diagram of a kind of thinning device 0 that Fig. 4 provides for the embodiment of the present invention, as shown in Figure 4, bearing assembly 02 can be terrace with edge, and the side of terrace with edge is the loading end of bearing assembly 02.Terrace with edge can be made up of bearing support 021 and at least one loading plate 022, and loading plate 022 is arranged on bearing support 021, and bearing support 021 forms the limit of terrace with edge, and at least one loading plate 022 forms the side of terrace with edge.Example, if this terrace with edge is the terrace with edge with 6 sides, then in this bearing assembly 02, the number of loading plate is also 6.
The structural representation of a kind of loading plate 022 that Fig. 5 provides for the embodiment of the present invention, as shown in Figure 5, this loading plate 022 can be rectangular slab, the side being positioned at the first end M of loading plate 022 is parallel with the side of the second end N being positioned at loading plate 022, the first end M of loading plate 022 and the second end N of loading plate 022 rolls respectively in the opposite direction, and the first end M of loading plate 022 can be suspended on bearing support, the inlet reclaiming assembly is positioned at the second end N of loading plate 022, reclaim assembly to be used for being collected by the second end N of loading plate 022 flowing through the reducer treating thinning surface.
Please continue to refer to Fig. 4, thinning device 0 can also comprise: rotary components 05, rotary components 05 can comprise: turning axle 051, the axis of turning axle 051 is through bearing assembly 02, and perpendicular to the bottom surface of bearing assembly 02, rotary components 05 rotates along the axis of turning axle 051 for controlling bearing assembly 02.Concrete, this bearing assembly 02 can be positive terrace with edge, now, and the axis of turning axle 051 and the dead in line of bearing assembly 02.Rotary components 05 rotates along the axis of turning axle 051 owing to can control bearing assembly 02, on the one hand, in the process that bearing assembly 02 rotates, staff may stand in same position, replaces different bearer face (i.e. the side of terrace with edge) treat thin structure; On the other hand, in the process that bearing assembly 02 rotates, be positioned at and treat that the reducer on thinning surface is subject to the effect of centrifugal force, make reducer treat that the movement locus on thinning surface increases, thus improve the thinning efficiency of reducer.
Example, this treats that thin structure can be underlay substrate, this treats thin structure treats that thinning surface can be a plate face of underlay substrate, when the thinning device using the embodiment of the present invention to provide carries out thinning to underlay substrate plate face, can first this underlay substrate be placed on the loading end of bearing assembly, and ensure that the plate face relative with this underlay substrate needing thinning plate face contacts with loading plate, when underlay substrate is placed on loading end, this underlay substrate treat that thinning surface and surface level exist inclination angle.Example, this bearing assembly can be the positive terrace with edge be made up of bearing support and loading plate, this underlay substrate can be placed on a side (i.e. a loading plate) of this positive terrace with edge.
Then, the concentration that fluid assembly real-time (or every preset time period) detects reducer to be output can be controlled, when the concentration of reducer to be output is greater than preset concentration, control fluid assembly by reducer to be output to treating that thinning surface exports; When the concentration of reducer to be output is less than or equal to preset concentration, reducer to be output can be transferred to discharge assembly by reclaiming assembly, carry out the discharge of reducer, ensure that the concentration of the reducer that fluid assembly exports is higher, what the reducer that fluid assembly is exported can treat thin structure treats that thinning surface is carried out effectively thinning, improves thinning efficiency.Controlling fluid assembly to when exporting reducer until thinning surface, can control the liquid outlet of fluid assembly from fluid assembly to treating that thinning surface (i.e. a plate face of underlay substrate) exports reducer, example, the material of this underlay substrate can be SiO
2this reducer can be HF, due to when underlay substrate is placed on loading end, this underlay substrate treat that thinning surface and surface level exist inclination angle, so the reducer that this fluid assembly exports can flow under gravity, and treat thinning surface and carry out thinning in the process of flowing.Because initial velocity when reducer exports from liquid outlet is less, so the impulsive force that thinning surface treated by this reducer is less, achieves and carry out in thinning process treating thin structure, improve the flatness that this treats thinning surface.
Further, electrostatic field assembly can also be controlled and form electrostatic field, and the electric field source of electrostatic field is positioned at the side that loading end does not carry underlay substrate, exports the reducer treating thinning surface to and can be positioned at this electrostatic field.To this, electrostatic field can treat that the reducer on thinning surface plays suction-operated, treat that the reducer on thinning surface is under the effect of gravity and electrostatic field, the speed flowed can be reduced, further reduce the impulsive force that thinning surface treated by reducer, and add the thickness treating thinning surperficial reducer, increase the volume of the reducer treating thinning surface, be HF at reducer and treat that the material of thin structure is SiO
2time, reduce the concentration of the hydrofluosilicic acid generated in thinning process, prevent the crystallize out because hydrofluosilicic acid concentration is comparatively large, treat thinning surface and pollute.
It should be noted that, after exporting reducer from the liquid outlet of fluid assembly, can also by controlling rotary components, control bearing assembly rotates along the axis of turning axle in rotary components, on the one hand, in the process that bearing assembly rotates, if staff determines that the underlay substrate on loading plate is thinning complete, then staff may stand in same position, replaces the underlay substrate on different bearer face (i.e. the side of terrace with edge); On the other hand, in the process that bearing assembly rotates, be positioned at and treat that the reducer on thinning surface is subject to the effect of centrifugal force, make reducer treat that the movement locus on thinning surface increases, thus improve the thinning efficiency of reducer.
Flow out to this at reducer from the liquid outlet of fluid assembly and treat thinning surface, and under gravity, when flowing to the second end of loading plate in bearing assembly, because the second end of this loading plate is connected with the liquid inlet reclaiming assembly, so reclaim assembly can flow through from the second end collection of this loading plate the reducer that this treats thinning surface, realize the recovery of reducer.Reclaim assembly after collecting reducer, the reducer collected can be transferred to fluid assembly, realize the recycling of reducer.
In correlation technique, on the one hand, when carrying out reduction processing to underlay substrate, usually using thinning device to the thinning solution of underlay substrate surface spraying, making underlay substrate and thinning solution carry out chemical reaction, realize the thin type of underlay substrate.Concrete, the material of underlay substrate is SiO
2, thinning solution is HF, when thinning device solution thinning to underlay substrate surface spraying, and SiO
2chemical reaction can be there is with HF, and generate H
2siF
6with water H
2o, the H of generation
2siF
6and H
2o can depart from underlay substrate surface along with the flowing of thinning solution.Because the reducer of thinning device ejection is different to the impulsive force of each position on underlay substrate surface, make underlay substrate surface can form multiple concave point, therefore, the flatness on underlay substrate surface is lower.On the other hand, as shown in Figure 6, reducer (not shown in Fig. 6) is filled in container F, when carrying out thinning to underlay substrate E, underlay substrate E can also be placed in container F, and be immersed in thinning solution, make the thinning solution in underlay substrate E and container F carry out chemical reaction, realize the thinning of underlay substrate E, can H be generated in the process of chemical reaction
2siF
6and H
2o, H
2siF
6h can be dissolved in
2o.Work as H
2siF
6concentration larger time, H
2siF
6can solid particle be separated out, and be attached to underlay substrate surface, cause underlay substrate Superficial Foreign Body bad, pollute underlay substrate.And when adopting the mode of soaking to carry out thinning to underlay substrate, because underlay substrate is all arranged in reducer, so cannot only carry out thinning to a surface of underlay substrate.
In the embodiment of the present invention, reducer from the liquid outlet of fluid assembly flow out to treat thin structure treat thinning surface, and reducer is under the effect of gravity and electrostatic attraction, treating that thinning surface uniform flows through, repeatedly treating that thinning surface is flow through by controlling reducer, controlling the thinning degree treating thinning surface.Due in the embodiment of the present invention, reducer is treating that thinning surface distributed is even, makes to treat that the smooth degree on thinning surface is higher, and treat thinning surface carry out thinning after, treat that thinning surface is ground without the need to what treat thin structure.Further, due to the thinning device that the embodiment of the present invention provides, can only to treating that one of thin structure is treated that thinning surface is carried out thinning, so the thinning device that the embodiment of the present invention provides can treat thin structure, and to carry out asymmetric thinning.It should be noted that, the reducer in the embodiment of the present invention can also be not construed as limiting this for other reducer embodiment of the present invention except HF.
In sum, in thinning device provided by the invention, there is inclination angle in the loading end on bearing assembly and surface level, and the liquid outlet of fluid assembly is positioned at the higher one end of loading end, fluid assembly can be parallel to the direction of loading end from liquid outlet edge, to treating that thinning surface exports reducer.And the electric field source of electrostatic field that electrostatic field assembly is formed is positioned at loading end does not carry and need the side of thin structure, to treat that the reducer on thinning surface is positioned at electrostatic field.When being placed on loading end until thin structure, what this treated thin structure treats that thinning surface and surface level exist inclination angle, and the reducer that this fluid assembly exports can flow under gravity, and in the process of flowing, treats thinning surface carry out thinning.Because initial velocity when reducer exports from liquid outlet is less, so the impulsive force that thinning surface treated by this reducer is less, achieves and carry out in thinning process treating thin structure, improve the flatness that this treats thinning surface.
Further, to this, electrostatic field can treat that the reducer on thinning surface plays suction-operated, treat that the reducer on thinning surface is under the effect of gravity and electrostatic field, the speed flowed can be reduced, further reduce the impulsive force that thinning surface treated by reducer, and add the thickness treating thinning surperficial reducer, thus increase the volume of the reducer treating thinning surface, be HF at reducer and treat that the material of thin structure is SiO
2time, reduce the concentration of the hydrofluosilicic acid generated in thinning process, prevent the crystallize out because hydrofluosilicic acid concentration is comparatively large, treat thinning surface and pollute.
As shown in Figure 7, embodiments provide a kind of using method of thinning device, the using method of this thinning device may be used for as shown in Figure 1, Figure 2, the thinning device 0 shown in Fig. 3 or Fig. 4, this thinning device can comprise: fluid assembly, bearing assembly and electrostatic field assembly, and the using method of this thinning device can comprise:
Step 701, will treating that thin structure is carried on the loading end of bearing assembly, there is inclination angle in loading end and surface level.
Step 702, control fluid assembly to what treat thin structure and treat that thinning surface exports reducer, the liquid outlet of fluid assembly is positioned at the higher one end of loading end, and the fluid direction of liquid outlet is parallel to loading end.
Step 703, control electrostatic field assembly and form electrostatic field, the electric field source of electrostatic field is positioned at loading end and does not carry and need the side of thin structure, to treat that the reducer on thinning surface is positioned at electrostatic field.
In sum, in the using method of thinning device provided by the invention, to treat that thin structure is carried on loading end, and control fluid assembly to treating that thinning surface exports reducer, control electrostatic field assembly and form electrostatic field, and the electric field source of electrostatic field is positioned at loading end does not carry and need the side of thin structure, to make to export to and treat that the reducer on thinning surface is positioned at electrostatic field.When being placed on loading end until thin structure, what this treated thin structure treats that thinning surface and surface level exist inclination angle, and the reducer that this fluid assembly exports can flow under gravity, and in the process of flowing, treats thinning surface carry out thinning.Because initial velocity when reducer exports from liquid outlet is less, so the impulsive force that thinning surface treated by this reducer is less, achieves and carry out in thinning process treating thin structure, improve the flatness that this treats thinning surface.
Further, to this, electrostatic field can treat that the reducer on thinning surface plays suction-operated, treat that the reducer on thinning surface is under the effect of gravity and electrostatic field, the speed flowed can be reduced, further reduce the impulsive force that thinning surface treated by reducer, and add the thickness treating thinning surperficial reducer, thus increase the volume of the reducer treating thinning surface, be HF at reducer and treat that the material of thin structure is SiO
2time, reduce the concentration of the hydrofluosilicic acid generated in thinning process, prevent the crystallize out because hydrofluosilicic acid concentration is comparatively large, treat thinning surface and pollute.
Optionally, thinning device also comprises: reclaim assembly, and the inlet reclaiming assembly is positioned at the lower one end of loading end, and after step 702, the using method of this thinning device can also comprise:
Control to reclaim collect components and flow through the reducer treating thinning surface;
Control to reclaim assembly and the reducer collected is transferred to fluid assembly.
Optionally, before step 702, the using method of this thinning device can also comprise: the concentration controlling fluid component detection reducer to be output;
Step 702 can comprise: when the concentration of reducer to be output is greater than preset concentration, controls to reclaim assembly and the reducer collected is transferred to fluid assembly.
Optionally, bearing assembly can be terrace with edge, thinning device can also comprise: rotary components, rotary components comprises: turning axle, the axis of turning axle through bearing assembly, and perpendicular to the bottom surface of bearing assembly, after step 701, the using method of this thinning device can also comprise: by controlling rotary components, and control bearing assembly rotates along the axis of turning axle.
In sum, in the using method of thinning device provided by the invention, to treat that thin structure is carried on loading end, and control fluid assembly to treating that thinning surface exports reducer, control electrostatic field assembly and form electrostatic field, and the electric field source of electrostatic field is positioned at loading end does not carry and need the side of thin structure, to make to export to and treat that the reducer on thinning surface is positioned at electrostatic field.When being placed on loading end until thin structure, what this treated thin structure treats that thinning surface and surface level exist inclination angle, and the reducer that this fluid assembly exports can flow under gravity, and in the process of flowing, treats thinning surface carry out thinning.Because initial velocity when reducer exports from liquid outlet is less, so the impulsive force that thinning surface treated by this reducer is less, achieves and carry out in thinning process treating thin structure, improve the flatness that this treats thinning surface.
Further, to this, electrostatic field can treat that the reducer on thinning surface plays suction-operated, treat that the reducer on thinning surface is under the effect of gravity and electrostatic field, the speed flowed can be reduced, further reduce the impulsive force that thinning surface treated by reducer, and add the thickness treating thinning surperficial reducer, thus increase the volume of the reducer treating thinning surface, be HF at reducer and treat that the material of thin structure is SiO
2time, reduce the concentration of the hydrofluosilicic acid generated in thinning process, prevent the crystallize out because hydrofluosilicic acid concentration is comparatively large, treat thinning surface and pollute.
As shown in Figure 8, embodiments provide the using method of another kind of thinning device, the using method of this thinning device may be used for as shown in Figure 1, Figure 2, the thinning device 0 shown in Fig. 3 or Fig. 4, this thinning device can comprise: fluid assembly, bearing assembly and electrostatic field assembly, and the using method of this thinning device can comprise:
Step 801, will treating that thin structure is carried on the loading end of bearing assembly, there is inclination angle in loading end and surface level.
This treats that thin structure can for underlay substrate, and this treats thin structure treats that thinning surface can be a plate face of underlay substrate, and example, bearing assembly can be terrace with edge, and the side of terrace with edge is loading end.As shown in Figure 4, bearing assembly 02 can be terrace with edge, and the side of terrace with edge is the loading end of bearing assembly 02.Terrace with edge can be made up of bearing support 021 and at least one loading plate 022, and loading plate 022 is arranged on bearing support 021, and bearing support 021 forms the limit of terrace with edge, and at least one loading plate 022 forms the side of terrace with edge.Example, if this terrace with edge is the terrace with edge with 6 sides, then in this bearing assembly 02, the number of loading plate is also 6.Example, can this underlay substrate be placed on the loading end of bearing assembly, and ensure the plate face relative with this underlay substrate needing thinning plate face contact with loading plate, when underlay substrate is placed on loading end, this underlay substrate treat that thinning surface and surface level exist inclination angle.Example, this bearing assembly can be the positive terrace with edge be made up of bearing support and loading plate, this underlay substrate can be placed on a side (i.e. a loading plate) of this positive terrace with edge.
The concentration of the reducer that step 802, control fluid component detection are to be output.
Example, the concentration that fluid assembly real-time (or every preset time period) detects reducer to be output can be controlled, and the concentration of this reducer to be output and preset concentration are compared.It should be noted that, this preset concentration can set in advance for staff on fluid assembly, what the reducer being greater than this preset concentration can treat thinning substrate to this treats that thinning surface is carried out effectively thinning, and what the reducer being less than or equal to this preset concentration cannot treat thinning substrate to this treats that thinning surface is carried out effectively thinning.
Step 803, when the concentration of reducer to be output is greater than preset concentration, controls fluid assembly to what treat thin structure and treat that thinning surface exports reducer.
When the concentration of reducer to be output is greater than preset concentration, control fluid assembly by reducer to be output to treating that thinning surface exports, when the concentration of reducer to be output is less than or equal to preset concentration, reducer to be output can be transferred to discharge assembly by reclaiming assembly, carry out the discharge of reducer, ensure that the concentration of the reducer that fluid assembly exports is higher, what the reducer that fluid assembly is exported can treat thin structure treats that thinning surface is carried out effectively thinning, improves thinning efficiency.Example, this thinning device can also comprise discharge assembly, this fluid assembly can be connected with discharge assembly by reclaiming assembly, fluid assembly is when the concentration detecting reducer to be output is less than or equal to preset concentration, this reducer to be output can be transferred to discharge assembly by reclaiming assembly, carry out the discharge of reducer, do not recycle the reducer of this discharge.
Example, the liquid outlet of fluid assembly is positioned at the higher one end of loading end, and the fluid direction of liquid outlet is parallel to loading end.Control fluid assembly to until thin structure export reducer until thinning surface time, the liquid outlet of fluid assembly from fluid assembly can be controlled to treating that thinning surface (i.e. a plate face of underlay substrate) exports reducer.Example, the material of this underlay substrate can be SiO
2this reducer can be HF, due to when underlay substrate is placed on loading end, this underlay substrate treat that thinning surface and surface level exist inclination angle, so the reducer that this fluid assembly exports can flow under gravity, and treat thinning surface and carry out thinning in the process of flowing.The fluid direction of the liquid outlet of this fluid assembly is parallel to loading end, initial velocity when reducer exports from liquid outlet is less, so the impulsive force that thinning surface treated by this reducer is less, achieve and carry out in thinning process treating thin structure, improve the flatness that this treats thinning surface.
Step 804, control electrostatic field assembly and form electrostatic field, the electric field source of electrostatic field is positioned at loading end and does not carry and need the side of thin structure, to treat that the reducer on thinning surface is positioned at electrostatic field.
Can control electrostatic field assembly and form electrostatic field, and the electric field source of electrostatic field is positioned at the side that loading end does not carry underlay substrate, exports the reducer treating thinning surface to and can be positioned at this electrostatic field.To this, electrostatic field can treat that the reducer on thinning surface plays suction-operated, treat that the reducer on thinning surface is under the effect of gravity and electrostatic field, can reduce the speed flowed, further reduce the impulsive force that thinning surface treated by reducer.And reducer is under the effect of gravity and electrostatic field, treat that the thickness of thinning surperficial reducer is comparatively large, namely treat that the volume of the reducer on thinning surface is comparatively large, be HF at reducer and treat that the material of thin structure is SiO
2time, reduce the concentration of the hydrofluosilicic acid generated in thinning process, prevent the crystallize out because hydrofluosilicic acid concentration is comparatively large, treat thinning surface and pollute.
Step 805, by controlling rotary components, controlling bearing assembly and rotating along the axis of turning axle.
Please refer to Fig. 4, thinning device 0 can also comprise: rotary components 05, and rotary components 05 can comprise: turning axle 051, and the axis of turning axle 051 is through bearing assembly 02, and perpendicular to the bottom surface of bearing assembly 02, rotary components 05 rotates along the axis of turning axle 051 for controlling bearing assembly 02.Concrete, this bearing assembly 02 can be positive terrace with edge, now, and the axis of turning axle 051 and the dead in line of bearing assembly 02.Rotary components 05 rotates along the axis of turning axle 051 owing to can control bearing assembly 02, on the one hand, in the process that bearing assembly 02 rotates, staff may stand in same position, replaces different bearer face (i.e. the side of terrace with edge) treat thin structure; On the other hand, in the process that bearing assembly 02 rotates, be positioned at and treat that the reducer on thinning surface is subject to the effect of centrifugal force, make reducer treat that the movement locus on thinning surface increases, thus improve the thinning efficiency of reducer.
Step 806, control reclaim collect components and flow through the reducer treating thinning surface.
As shown in Figure 3, thinning device 0 can also comprise: reclaim assembly 04, reclaim assembly 04 to be connected with fluid assembly 01, the inlet (not shown in Fig. 3) reclaiming assembly 04 is positioned at one end that on bearing assembly 02, loading end is lower, reclaims assembly 04 for collecting the reducer flowing through and treat thinning surface.
Step 807, control reclaim assembly and the reducer collected are transferred to fluid assembly.
Reclaim assembly after collecting reducer, the reducer collected can be transferred to fluid assembly, realize the recycling of reducer.
In correlation technique, on the one hand, when carrying out reduction processing to underlay substrate, usually using thinning device to the thinning solution of underlay substrate surface spraying, making underlay substrate and thinning solution carry out chemical reaction, realize the thin type of underlay substrate.Concrete, the material of underlay substrate is SiO
2, thinning solution is HF, when thinning device solution thinning to underlay substrate surface spraying, and SiO
2chemical reaction can be there is with HF, and generate H
2siF
6with water H
2o, the H of generation
2siF
6and H
2o can depart from underlay substrate surface along with the flowing of thinning solution.Because the reducer of thinning device ejection is different to the impulsive force of each position on underlay substrate surface, make underlay substrate surface can form multiple concave point, therefore, the flatness on underlay substrate surface is lower.On the other hand, as shown in Figure 6, reducer (not shown in Fig. 6) is filled in container F, when carrying out thinning to underlay substrate E, underlay substrate E can also be placed in container F, and be immersed in thinning solution, make the thinning solution in underlay substrate E and container F carry out chemical reaction, realize the thinning of underlay substrate E, can H be generated in the process of chemical reaction
2siF
6and H
2o, H
2siF
6h can be dissolved in
2o.Work as H
2siF
6concentration larger time, H
2siF
6can solid particle be separated out, and be attached to underlay substrate surface, cause underlay substrate Superficial Foreign Body bad, pollute underlay substrate.And when adopting the mode of soaking to carry out thinning to underlay substrate, because underlay substrate is all arranged in reducer, so cannot only carry out thinning to a surface of underlay substrate.
In the embodiment of the present invention, reducer from the liquid outlet of fluid assembly flow out to treat thin structure treat thinning surface, and reducer is under the effect of gravity and electrostatic attraction, treating that thinning surface uniform flows through, repeatedly treating that thinning surface is flow through by controlling reducer, controlling the thinning degree treating thinning surface.Due in the embodiment of the present invention, reducer is treating that thinning surface distributed is even, makes to treat that the smooth degree on thinning surface is higher, and treat thinning surface carry out thinning after, treat that thinning surface is ground without the need to what treat thin structure.Further, due to the thinning device that the embodiment of the present invention provides, can only to treating that one of thin structure is treated that thinning surface is carried out thinning, so the thinning device that the embodiment of the present invention provides can treat thin structure, and to carry out asymmetric thinning.It should be noted that, the reducer in the embodiment of the present invention can also be not construed as limiting this for other reducer embodiment of the present invention except HF.
In sum, in the using method of thinning device provided by the invention, to treat that thin structure is carried on loading end, and control fluid assembly to treating that thinning surface exports reducer, control electrostatic field assembly and form electrostatic field, and the electric field source of electrostatic field is positioned at loading end does not carry and need the side of thin structure, to make to export to and treat that the reducer on thinning surface is positioned at electrostatic field.When being placed on loading end until thin structure, what this treated thin structure treats that thinning surface and surface level exist inclination angle, and the reducer that this fluid assembly exports can flow under gravity, and in the process of flowing, treats thinning surface carry out thinning.Because initial velocity when reducer exports from liquid outlet is less, so the impulsive force that thinning surface treated by this reducer is less, achieves and carry out in thinning process treating thin structure, improve the flatness that this treats thinning surface.
Further, to this, electrostatic field can treat that the reducer on thinning surface plays suction-operated, treat that the reducer on thinning surface is under the effect of gravity and electrostatic field, the speed flowed can be reduced, further reduce the impulsive force that thinning surface treated by reducer, and add the thickness treating thinning surperficial reducer, thus increase the volume of the reducer treating thinning surface, be HF at reducer and treat that the material of thin structure is SiO
2time, reduce the concentration of the hydrofluosilicic acid generated in thinning process, prevent the crystallize out because hydrofluosilicic acid concentration is comparatively large, treat thinning surface and pollute.
The sequencing of the using method step of the thinning device that the embodiment of the present invention provides can suitably adjust; step also according to circumstances can carry out corresponding increase and decrease; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; the method changed can be expected easily; all should be encompassed within protection scope of the present invention, therefore repeat no more.
Those skilled in the art can be well understood to, and for convenience and simplicity of description, the concrete steps of the using method of the thinning device of foregoing description, with reference to the corresponding process in aforementioned thinning device embodiment, can not repeat them here.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (12)
1. a thinning device, is characterized in that, described thinning device comprises: fluid assembly, bearing assembly and electrostatic field assembly,
For carrying the loading end for the treatment of thin structure and surface level exists inclination angle on described bearing assembly;
The liquid outlet of described fluid assembly is positioned at the higher one end of described loading end, and the fluid direction of described liquid outlet is parallel to described loading end, described fluid assembly be used for described treat thin structure treat thinning surface export reducer;
Described electrostatic field assembly for the formation of electrostatic field, the electric field source of described electrostatic field be positioned at described loading end do not carry described in treat the side of thin structure, described in treat that the reducer on thinning surface is positioned at described electrostatic field.
2. thinning device according to claim 1, is characterized in that, described thinning device also comprises: reclaim assembly, described recovery assembly is connected with described fluid assembly,
The inlet of described recovery assembly is positioned at the lower one end of described loading end, described recovery assembly for collect flow through described in treat the reducer on thinning surface, and the reducer collected is transferred to described fluid assembly.
3. thinning device according to claim 1, is characterized in that,
Described fluid assembly is also for detecting the concentration of reducer to be output;
To described, described fluid assembly, also for when the concentration of reducer to be output is greater than preset concentration, treats that thinning surface exports reducer.
4. thinning device according to claim 1, is characterized in that, described bearing assembly is terrace with edge, and the side of described terrace with edge is described loading end.
5. thinning device according to claim 4, is characterized in that, described terrace with edge is made up of bearing support and at least one loading plate,
Described loading plate is arranged on described bearing support, and described bearing support forms the limit of described terrace with edge, and at least one loading plate described forms the side of described terrace with edge.
6. thinning device according to claim 5, it is characterized in that, described loading plate is rectangular slab, the side being positioned at the first end of described loading plate is parallel with the side of the second end being positioned at described loading plate, the first end of described loading plate and the second end of described loading plate are rolled respectively in the opposite direction
The first end of described loading plate is suspended on described bearing support, and the inlet of described recovery assembly is positioned at the second end of described loading plate, described recovery assembly be used for by the second end of described loading plate collect flow through described in treat the reducer on thinning surface.
7., according to the arbitrary described thinning device of claim 4-6, it is characterized in that, described thinning device also comprises: rotary components, and described rotary components comprises: turning axle,
The axis of described turning axle is through described bearing assembly, and perpendicular to the bottom surface of described bearing assembly, described rotary components rotates along the axis of described turning axle for controlling described bearing assembly.
8. thinning device according to claim 7, is characterized in that,
Described bearing assembly is positive terrace with edge, the axis of described turning axle and the dead in line of described bearing assembly.
9. a using method for thinning device, is characterized in that, for thinning device, described thinning device comprises: fluid assembly, bearing assembly and electrostatic field assembly, and described method comprises:
To treat that thin structure is carried on the loading end of described bearing assembly, there is inclination angle in described loading end and surface level;
Control described fluid assembly to described treat thin structure treat thinning surface export reducer, the liquid outlet of described fluid assembly is positioned at the higher one end of described loading end, and the fluid direction of described liquid outlet is parallel to described loading end;
Control described electrostatic field assembly and form electrostatic field, the electric field source of described electrostatic field is positioned at described loading end and does not carry and need the side of thin structure, described in treat that the reducer on thinning surface is positioned at described electrostatic field.
10. method according to claim 9, it is characterized in that, described thinning device also comprises: reclaim assembly, the inlet of described recovery assembly is positioned at the lower one end of described loading end, treat that thinning surface exports after reducer at described control described fluid assembly to described, described method also comprises:
Control described recovery collect components flow through described in treat the reducer on thinning surface;
Control described recovery assembly and the reducer collected is transferred to described fluid assembly.
11. methods according to claim 9, is characterized in that, described control described fluid assembly to described treat thin structure treat that thinning surface exports before reducer, described method also comprises:
Control the concentration of described fluid component detection reducer to be output;
Described control described fluid assembly to described treat thin structure treat thinning surface export reducer, comprising:
When the concentration of described reducer to be output is greater than preset concentration, controls described recovery assembly and the reducer collected is transferred to described fluid assembly.
12. according to the arbitrary described method of claim 9 to 11, it is characterized in that, described bearing assembly is terrace with edge, described thinning device also comprises: rotary components, described rotary components comprises: turning axle, the axis of described turning axle through described bearing assembly, and perpendicular to the bottom surface of described bearing assembly, described by after treating on the loading end that thin structure is carried on described bearing assembly, described method also comprises:
By controlling described rotary components, controlling described bearing assembly and rotating along the axis of described turning axle.
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