CN104102095A - Silicon chip developing and fixing device - Google Patents
Silicon chip developing and fixing device Download PDFInfo
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- CN104102095A CN104102095A CN201410350781.7A CN201410350781A CN104102095A CN 104102095 A CN104102095 A CN 104102095A CN 201410350781 A CN201410350781 A CN 201410350781A CN 104102095 A CN104102095 A CN 104102095A
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- gas
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Abstract
A silicon chip developing and fixing device comprises a tank body, a tank cover, a blowing pump, a getter pump, a gas tank, a flow control valve and a gas shunting device, wherein the gas inlet end of the blowing pump is communicated with the gas tank, the gas outlet end of the blowing pump is communicated with the gas shunting device, and the flow control valve is arranged on a pipeline for communicating the gas outlet end of the blowing pump and the gas shunting device; the gas inlet end of the getter pump is communicated with the tank body, and the gas outlet end of the getter pump is communicated with the gas tank; and the gas shunting device is arranged at the bottom of the tank body. According to the silicon chip developing and fixing device, the gas shunting device is arranged in the tank body, gas is introduced in a developing and fixing liquid, a silicon chip is cleaned through impact force of bubbles, and simultaneously, the gas can be recycled, so that not only can the environment pollution be prevented, but also the use cost is low.
Description
Technical field
the present invention relates to silicon chip developing fixing device.
Background technology
At present, developing fixing equipment in technique for processing silicon chip is mainly that developing fixing equipment is rocked in silicon chip submergence, this equipment need to rock cleaning by silicon chip in developing fixing liquid, although energy mass disposal silicon chip rocks in process and easily causes silicon chip fragmentation to damage.Also having a kind of is to adopt nozzle spray developing stop bath on silicon chip, while silicon chip low speed rotation, and this device processes silicon chip quantity is few, and equipment cost is high.
Summary of the invention
The shortcoming existing in order to overcome above-mentioned prior art, the object of the present invention is to provide a kind of processing silicon chip efficiency high, simple in structure, the silicon chip developing fixing device that cost is low.
In order to address the above problem, the present invention is by the following technical solutions: a kind of silicon chip developing fixing device, it is characterized in that, it comprises cell body, groove lid, blower pump, asepwirator pump, gas tank, flow control valve and gas diverter, the inlet end of described blower pump is communicated with gas tank, its outlet side is communicated with described gas diverter, and described flow control valve is set on the pipeline being communicated with gas diverter in outlet side; The inlet end of described asepwirator pump is communicated with cell body, and its outlet side is communicated with described gas tank; Described gas diverter is arranged on cell body bottom.
Preferably, described gas diverter is isocon, is provided with some ventholes on described isocon.
As another preferred embodiment of the present invention, described gas diverter is the box body that is arranged on described cell body bottom, and the upper surface of described box body is provided with some ventholes.
The invention has the beneficial effects as follows: it,, by gas diverter is set in cell body, passes into gas in developing fixing liquid, utilize the impulsive force of bubble to clean silicon chip, simultaneously, gas recoverable, not only can be to environment, and use cost is low.
Accompanying drawing explanation
below in conjunction with drawings and Examples, the present invention is described further:
Fig. 1 is the plan structure schematic diagram of first embodiment of the invention;
Fig. 2 is the main TV structure schematic diagram of second embodiment of the invention.
In figure, 1 cell body, 2 groove lids, 3 blower pump, 4 asepwirator pumps, 5 gas tank, 6 flow control valves, 7 gas diverters.
Embodiment
below in conjunction with accompanying drawing, the present invention is described in further detail:
As depicted in figs. 1 and 2, the first embodiment of the present invention and the second embodiment include cell body 1, groove lid 2, blower pump 3, asepwirator pump 4, gas tank 5, flow control valve 6 and gas diverter 7.
The inlet end of described blower pump 3 is communicated with gas tank 5 by pipeline, the outlet side of blower pump 3 and described gas diverter 7 pass through pipeline communication, for the gas flow of adjustments of gas part flow arrangement 7, described flow control valve 6 is set on the pipeline being communicated with gas diverter 7 in outlet side.
The inlet end of described asepwirator pump 4 is communicated with the upper end of cell body 1, and the outlet side of asepwirator pump 4 is communicated with described gas tank 5.Described gas diverter 7 is arranged on cell body 1 bottom.
Gas is not revealed in order to guarantee to clean, and the edge of groove lid 2 is provided with sealing strip, and groove lid 2 adopts thicker steel plate, when groove lid 2 covers on cell body 1 and cell body 1 closely cooperate.
To the first embodiment of the present invention, as shown in Figure 1, first it should be noted that, in Fig. 1, do not draw groove lid 2.Gas diverter described in the present embodiment 7 is isocon, on described isocon, be provided with some ventholes, the shape of isocon can be varied, shown in Fig. 1 neither be unique shape, it can also be for example crooked " S " type, isocon can be the bottom that is directly placed on cell body 1, also can be welded on the bottom of cell body 1.
To the second embodiment of the present invention, as shown in Figure 2, its gas diverter 7 is for being arranged on the box body of described cell body 1 bottom, the upper surface of described box body is provided with some ventholes, the size of box body is identical with the bottom of cell body 1, box body can directly be welded on cell body 1 bottom, also can be placed on cell body 1 bottom.
Because nitrogen stability is stronger, can not react with developing fixing liquid, so pack nitrogen in gas tank 5, during use, silicon wafer basket is placed in cell body 1, pour developing fixing liquid into, cover groove lid 2, open asepwirator pump and blower pump, start Wafer Cleaning.Gas is in gas tank 5 and the interior circulation of cell body 1.
The above is the preferred embodiment of the present invention, for those skilled in the art, under the premise without departing from the principles of the invention, can also make some improvements and modifications, and these improvements and modifications are also regarded as protection scope of the present invention.
Claims (3)
1. a silicon chip developing fixing device, it is characterized in that, it comprises cell body, groove lid, blower pump, asepwirator pump, gas tank, flow control valve and gas diverter, the inlet end of described blower pump is communicated with gas tank, its outlet side is communicated with described gas diverter, and described flow control valve is set on the pipeline being communicated with gas diverter in outlet side; The inlet end of described asepwirator pump is communicated with cell body, and its outlet side is communicated with described gas tank; Described gas diverter is arranged on cell body bottom.
2. silicon chip developing fixing device according to claim 1, is characterized in that, described gas diverter is isocon, is provided with some ventholes on described isocon.
3. silicon chip developing fixing device according to claim 1, is characterized in that, described gas diverter is the box body that is arranged on described cell body bottom, and the upper surface of described box body is provided with some ventholes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410350781.7A CN104102095A (en) | 2014-07-23 | 2014-07-23 | Silicon chip developing and fixing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410350781.7A CN104102095A (en) | 2014-07-23 | 2014-07-23 | Silicon chip developing and fixing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104102095A true CN104102095A (en) | 2014-10-15 |
Family
ID=51670343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410350781.7A Pending CN104102095A (en) | 2014-07-23 | 2014-07-23 | Silicon chip developing and fixing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104102095A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107039247A (en) * | 2015-09-30 | 2017-08-11 | 台湾积体电路制造股份有限公司 | The method and system being used for producing the semiconductor devices |
| CN108897199A (en) * | 2018-05-10 | 2018-11-27 | 深圳市志凌伟业技术股份有限公司 | A kind of autography section processing solution tank with pH value tester |
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| CN201162047Y (en) * | 2008-03-03 | 2008-12-10 | 深圳深爱半导体有限公司 | Etching tank bubble apparatus and etching tank |
| CN203324649U (en) * | 2013-07-04 | 2013-12-04 | 扬州杰利半导体有限公司 | Semiconductor wafer developing device |
| CN203678745U (en) * | 2014-01-07 | 2014-07-02 | 西安神光安瑞光电科技有限公司 | Washing device for CUP shell of spin coater |
| CN204028566U (en) * | 2014-07-23 | 2014-12-17 | 济南晶博电子有限公司 | Silicon chip developing fixing device |
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2014
- 2014-07-23 CN CN201410350781.7A patent/CN104102095A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1221128A (en) * | 1997-12-24 | 1999-06-30 | 三星电子株式会社 | Development system for manufacturing semiconductor device and controlling method thereof |
| CN1373393A (en) * | 2001-02-06 | 2002-10-09 | 长濑产业株式会社 | Developing liquid mfg. device and method |
| CN201162047Y (en) * | 2008-03-03 | 2008-12-10 | 深圳深爱半导体有限公司 | Etching tank bubble apparatus and etching tank |
| CN203324649U (en) * | 2013-07-04 | 2013-12-04 | 扬州杰利半导体有限公司 | Semiconductor wafer developing device |
| CN203678745U (en) * | 2014-01-07 | 2014-07-02 | 西安神光安瑞光电科技有限公司 | Washing device for CUP shell of spin coater |
| CN204028566U (en) * | 2014-07-23 | 2014-12-17 | 济南晶博电子有限公司 | Silicon chip developing fixing device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107039247A (en) * | 2015-09-30 | 2017-08-11 | 台湾积体电路制造股份有限公司 | The method and system being used for producing the semiconductor devices |
| US10649336B2 (en) | 2015-09-30 | 2020-05-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for fabricating semiconductor device |
| CN107039247B (en) * | 2015-09-30 | 2020-07-24 | 台湾积体电路制造股份有限公司 | Method and system for manufacturing semiconductor device |
| CN108897199A (en) * | 2018-05-10 | 2018-11-27 | 深圳市志凌伟业技术股份有限公司 | A kind of autography section processing solution tank with pH value tester |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141015 |