CN105437089A - Sapphire thinning diamond resin grinding wheel and preparation method - Google Patents
Sapphire thinning diamond resin grinding wheel and preparation method Download PDFInfo
- Publication number
- CN105437089A CN105437089A CN201510742116.7A CN201510742116A CN105437089A CN 105437089 A CN105437089 A CN 105437089A CN 201510742116 A CN201510742116 A CN 201510742116A CN 105437089 A CN105437089 A CN 105437089A
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- Prior art keywords
- grinding wheel
- diamond
- powder
- thinning
- resin grinding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/285—Reaction products obtained from aldehydes or ketones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a sapphire thinning diamond resin grinding wheel. A preparation method for the sapphire thinning diamond resin grinding wheel includes the specific steps that firstly, all components of the diamond resin grinding wheel are weighed respectively, then put into a mixing machine to be mixed for 15 minutes to 1.5 hours, and mixed evenly; secondly, the mixture is evenly input into a specified mold cavity of a mold, then the mold is arranged into a press to be pressed and heated at the same time, and the heating and pressing process includes that the pre-pressure is 5 MPa, the heating temperature of an upper plate and a lower plate of the press is 240 DEG C, pressure is relieved when the temperature of the mold reaches 112 DEG C, then air is exhausted, and heating and pressing treatment is carried out again; and thirdly, after heat pressing is finished, a grinding wheel workpiece is taken out. By changing the product formula of the diamond resin grinding wheel, the edge breakage rate of the product is effectively reduced, the sharpness is improved, color fading is eliminated, the environment protection requirement is met, the actual production efficiency is improved, and the service life is achieved.
Description
Technical field
The invention belongs to skive manufacturing technology field, particularly the thinning diamond-resin grinding wheel of a kind of sapphire.
Background technology
Sapphire has the performances such as excellent machinery, optics, calorifics, more and more causes the attention of people at photovoltaic industry, and its product is widely used in multiple fields such as wrist-watch, mobile phone, diaphragm, jewellery.
Existing diamond-resin grinding wheel, performance is increasingly stable, and formula Design diversification and seriation, in processing sapphire process, define thinning, open the requirement to meet different process or fineness in client's production and processing such as thick, fine grinding, grinding.
Summary of the invention
The invention provides the thinning diamond-resin grinding wheel of a kind of sapphire and preparation method, collapse limit rate to reduce product and enhance productivity, improve emery wheel sharpness, and eliminate redness.
Concrete technical scheme of the present invention is:
The thinning diamond-resin grinding wheel of a kind of sapphire, is made up of the material of following percentage by weight: diamond dust 19-33%, phenol-formaldehyde resin powder 45-49%, copper powder 16-20%, aluminium powder 2-5%, green silicon carbide powder 2-4%, zinc oxide/magnesium oxide powder 2-3%.
A preparation method for the thinning diamond-resin grinding wheel of sapphire, the concrete steps of the method are:
The first step, weighs by the above proportioning respectively by diamond dust, phenol-formaldehyde resin powder, copper powder, aluminium powder, green silicon carbide powder, zinc oxide/magnesium oxide powder, then loads in batch mixer and mixes 15 minutes-1.5 hours, make it full and uniform;
Second step, compound is evenly put in the mould cavity of regulation, again mould is put into press compacting, heating mould simultaneously, its heating pressing technology is as follows: first adding precompression is 5 MPas, and setting press upper and lower plates heating-up temperature is 240 DEG C, the release when mold temperature reaches 112 DEG C, be exhausted, then continue heating pressurized treatments;
3rd step, hot pressing is complete, takes out emery wheel workpiece.
Further, emery wheel workpiece is put into after baking oven is cured process, naturally cool to room temperature with stove and come out of the stove; Carry out machining by finished product dimensional requirement again and make product, described solidification treatment temperature is 210 DEG C, is incubated 3 hours.
Further, the diameter dimension of prepared thinning diamond-resin grinding wheel is 400mm, the wide 30mm of being of a size of of sand, diameter of bore are of a size of 203mm, sand is thick is of a size of 10mm.
The Advantageous Effects that the present invention produces is: by changing the formula for a product of diamond-resin grinding wheel, effectively reduces product and collapses limit rate, improve sharpness, eliminate chromatic adaptation environmental requirement, improve actual production efficiency and meet service life.
Specific embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
In following examples, green silicon carbide take diamond dust as main material, phenol-formaldehyde resin powder, copper powder, aluminium powder, green silicon carbide powder, zinc oxide/magnesium oxide powder are inserts, phenol-formaldehyde resin powder plays bonding agent effect, green silicon carbide powder plays the effect of polishing, and zinc oxide/magnesium oxide powder mainly plays the effect increasing wearability.
Embodiment one
The thinning diamond-resin grinding wheel of a kind of sapphire, is made up of the material of following percentage by weight: diamond dust 25%, phenol-formaldehyde resin powder 45%, copper powder 20%, aluminium powder 5%, green silicon carbide powder 3%, Zinc oxide powder 2%.
A preparation method for the thinning diamond-resin grinding wheel of sapphire, the concrete steps of the method are:
The first step, weighs by above proportioning respectively by diamond dust, phenol-formaldehyde resin powder, copper powder, aluminium powder, green silicon carbide powder, zinc oxide/magnesium oxide powder, then loads in batch mixer and mixes 15 minutes-1.5 hours, make it full and uniform;
Second step, compound is evenly put in the mould cavity of regulation, again mould is put into press compacting, heating mould simultaneously, its heating pressing technology is as follows: first adding precompression is 5 MPas, and setting press upper and lower plates heating-up temperature is 240 DEG C, the release when mold temperature reaches 112 DEG C, be exhausted, then continue heating pressurized treatments;
3rd step, hot pressing is complete, takes out emery wheel workpiece.
Wherein, emery wheel workpiece is put into after baking oven is cured process, naturally cool to room temperature with stove and come out of the stove; Carry out machining by finished product dimensional requirement again and make product, described solidification treatment temperature is 210 DEG C, is incubated 3 hours.
The diameter dimension of the thinning diamond-resin grinding wheel prepared according to above formula and step is 400mm, the wide 30mm of being of a size of of sand, diameter of bore are of a size of 203mm, sand is thick is of a size of 10mm, and prepared product has good sharpness and has certain wearability.
Embodiment two
The thinning diamond-resin grinding wheel of a kind of sapphire, is made up of the material of following percentage by weight: diamond dust 27.5%, phenol-formaldehyde resin powder 48.5%, copper powder 18%, aluminium powder 2%, green silicon carbide powder 2%, Zinc oxide powder 2%.
A preparation method for the thinning diamond-resin grinding wheel of sapphire, the concrete steps of the method are:
The first step, weighs by above proportioning respectively by diamond dust, phenol-formaldehyde resin powder, copper powder, aluminium powder, green silicon carbide powder, zinc oxide/magnesium oxide powder, then loads in batch mixer and mixes 15 minutes-1.5 hours, make it full and uniform;
Second step, compound is evenly put in the mould cavity of regulation, again mould is put into press compacting, heating mould simultaneously, its heating pressing technology is as follows: first adding precompression is 5 MPas, and setting press upper and lower plates heating-up temperature is 240 DEG C, the release when mold temperature reaches 112 DEG C, be exhausted, then continue heating pressurized treatments;
3rd step, hot pressing is complete, takes out emery wheel workpiece.
Wherein, emery wheel workpiece is put into after baking oven is cured process, naturally cool to room temperature with stove and come out of the stove; Carry out machining by finished product dimensional requirement again and make product, described solidification treatment temperature is 210 DEG C, is incubated 3 hours.
The diameter dimension of the thinning diamond-resin grinding wheel prepared according to above formula and step is 400mm, the wide 30mm of being of a size of of sand, diameter of bore are of a size of 203mm, sand is thick is of a size of 10mm, and prepared product has the sharpness of half and the wearability of half.
Embodiment three
The thinning diamond-resin grinding wheel of a kind of sapphire, is made up of the material of following percentage by weight: diamond dust 25%, phenol-formaldehyde resin powder 48%, copper powder 18%, aluminium powder 4%, green silicon carbide powder 3%, magnesium oxide powder 2%.
A preparation method for the thinning diamond-resin grinding wheel of sapphire, the concrete steps of the method are:
The first step, weighs by above proportioning respectively by diamond dust, phenol-formaldehyde resin powder, copper powder, aluminium powder, green silicon carbide powder, zinc oxide/magnesium oxide powder, then loads in batch mixer and mixes 15 minutes-1.5 hours, make it full and uniform;
Second step, compound is evenly put in the mould cavity of regulation, again mould is put into press compacting, heating mould simultaneously, its heating pressing technology is as follows: first adding precompression is 5 MPas, and setting press upper and lower plates heating-up temperature is 240 DEG C, the release when mold temperature reaches 112 DEG C, be exhausted, then continue heating pressurized treatments;
3rd step, hot pressing is complete, takes out emery wheel workpiece.
Wherein, emery wheel workpiece is put into after baking oven is cured process, naturally cool to room temperature with stove and come out of the stove; Carry out machining by finished product dimensional requirement again and make product, described solidification treatment temperature is 210 DEG C, is incubated 3 hours.
The diameter dimension of the thinning diamond-resin grinding wheel prepared according to above formula and step is 400mm, the wide 30mm of being of a size of of sand, diameter of bore are of a size of 203mm, sand is thick is of a size of 10mm, and prepared product mainly has sharpness and has certain wearability.
Embodiment four
The thinning diamond-resin grinding wheel of a kind of sapphire, is made up of the material of following percentage by weight: diamond dust 25%, phenol-formaldehyde resin powder 48%, copper powder 16%, aluminium powder 4%, green silicon carbide powder 4%, magnesium oxide powder 3%.
A preparation method for the thinning diamond-resin grinding wheel of sapphire, the concrete steps of the method are:
The first step, weighs by above proportioning respectively by diamond dust, phenol-formaldehyde resin powder, copper powder, aluminium powder, green silicon carbide powder, zinc oxide/magnesium oxide powder, then loads in batch mixer and mixes 15 minutes-1.5 hours, make it full and uniform;
Second step, compound is evenly put in the mould cavity of regulation, again mould is put into press compacting, heating mould simultaneously, its heating pressing technology is as follows: first adding precompression is 5 MPas, and setting press upper and lower plates heating-up temperature is 240 DEG C, the release when mold temperature reaches 112 DEG C, be exhausted, then continue heating pressurized treatments;
3rd step, hot pressing is complete, takes out emery wheel workpiece.
Wherein, emery wheel workpiece is put into after baking oven is cured process, naturally cool to room temperature with stove and come out of the stove; Carry out machining by finished product dimensional requirement again and make product, described solidification treatment temperature is 210 DEG C, is incubated 3 hours.
The diameter dimension of the thinning diamond-resin grinding wheel prepared according to above formula and step is 400mm, the wide 30mm of being of a size of of sand, diameter of bore are of a size of 203mm, sand is thick is of a size of 10mm, and prepared product has very strong sharpness.
Practically for prior art shortcoming, reduce product and collapse limit rate and enhance productivity, improve emery wheel sharpness, and eliminate redness.Mainly for above 3 points, carry out effectively adjusting to grinding wheel formula.Due to product to be processed: its hardness of sapphire workpiece is only second to diamond, therefore carried out repeatedly many combination formulas contrast experiment, experiment proves: above formula reaches client and quality requirements: (1) sample and product do not collapse limit; (2) sharpness is good, is easy to feed; (3) emery wheel does not fade, and meets the requirement of client to environmental protection.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
The present invention does not address part and is applicable to prior art.
Claims (4)
1. the thinning diamond-resin grinding wheel of sapphire, it is characterized in that: be made up of the material of following percentage by weight, diamond dust 19-33%, phenol-formaldehyde resin powder 45-49%, copper powder 16-20%, aluminium powder 2-5%, green silicon carbide powder 2-4%, zinc oxide/magnesium oxide powder 2-3%.
2. the preparation method of the thinning diamond-resin grinding wheel of sapphire according to claim 1, is characterized in that: the concrete steps of the method are,
The first step, weighs by proportioning described in power 1 respectively by diamond dust, phenol-formaldehyde resin powder, copper powder, aluminium powder, green silicon carbide powder, zinc oxide/magnesium oxide powder, then loads in batch mixer and mixes 15 minutes-1.5 hours, make it full and uniform;
Second step, compound is evenly put in the mould cavity of regulation, again mould is put into press compacting, heating mould simultaneously, its heating pressing technology is as follows: first adding precompression is 5 MPas, and setting press upper and lower plates heating-up temperature is 240 DEG C, the release when mold temperature reaches 112 DEG C, be exhausted, then continue heating pressurized treatments;
3rd step, hot pressing is complete, takes out emery wheel workpiece.
3. the preparation method of the thinning diamond-resin grinding wheel of sapphire according to claim 2, is characterized in that: put into by emery wheel workpiece after baking oven is cured process, naturally cool to room temperature come out of the stove with stove; Carry out machining by finished product dimensional requirement again and make product, described solidification treatment temperature is 210 DEG C, is incubated 3 hours.
4. the preparation method of the thinning diamond-resin grinding wheel of sapphire according to claim 2, is characterized in that: the diameter dimension of prepared thinning diamond-resin grinding wheel is 400mm, the wide 30mm of being of a size of of sand, diameter of bore are of a size of 203mm, sand is thick is of a size of 10mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510742116.7A CN105437089A (en) | 2015-11-05 | 2015-11-05 | Sapphire thinning diamond resin grinding wheel and preparation method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510742116.7A CN105437089A (en) | 2015-11-05 | 2015-11-05 | Sapphire thinning diamond resin grinding wheel and preparation method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106002658A (en) * | 2016-07-11 | 2016-10-12 | 镇江永亮电气科技有限公司 | Grinding wheel special for photovoltaic glass and production technique of grinding wheel |
| CN106607776A (en) * | 2016-07-01 | 2017-05-03 | 台山市兰宝磨具有限公司 | A manufacturing method for a grinding tool with a plurality of heat radiation layers |
| CN108942708A (en) * | 2018-07-11 | 2018-12-07 | 郑州磨料磨具磨削研究所有限公司 | A kind of thinned grinding wheel and preparation method thereof |
| CN110125822A (en) * | 2019-04-29 | 2019-08-16 | 宁波大学 | Fixed grinding tool and preparation method thereof for sapphire substrate wafer grinding |
| CN110871402A (en) * | 2017-12-30 | 2020-03-10 | 苏州赛尔科技有限公司 | Thinning grinding wheel for sapphire substrate |
-
2015
- 2015-11-05 CN CN201510742116.7A patent/CN105437089A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106607776A (en) * | 2016-07-01 | 2017-05-03 | 台山市兰宝磨具有限公司 | A manufacturing method for a grinding tool with a plurality of heat radiation layers |
| CN106607776B (en) * | 2016-07-01 | 2019-01-04 | 台山市兰宝磨具有限公司 | The manufacturing method of grinding tool with multi-layer heat dissipation layer |
| CN106002658A (en) * | 2016-07-11 | 2016-10-12 | 镇江永亮电气科技有限公司 | Grinding wheel special for photovoltaic glass and production technique of grinding wheel |
| CN110871402A (en) * | 2017-12-30 | 2020-03-10 | 苏州赛尔科技有限公司 | Thinning grinding wheel for sapphire substrate |
| CN110871402B (en) * | 2017-12-30 | 2020-11-27 | 苏州赛尔科技有限公司 | Thinning grinding wheel for sapphire substrate |
| CN108942708A (en) * | 2018-07-11 | 2018-12-07 | 郑州磨料磨具磨削研究所有限公司 | A kind of thinned grinding wheel and preparation method thereof |
| CN110125822A (en) * | 2019-04-29 | 2019-08-16 | 宁波大学 | Fixed grinding tool and preparation method thereof for sapphire substrate wafer grinding |
| CN110125822B (en) * | 2019-04-29 | 2021-06-15 | 宁波大学 | Fixed grinding tool for grinding sapphire substrate wafer and preparation method thereof |
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Application publication date: 20160330 |
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