CN105430931A - Soaking and washing mechanism behind organic solderability preservative horizontal line main trough - Google Patents
Soaking and washing mechanism behind organic solderability preservative horizontal line main trough Download PDFInfo
- Publication number
- CN105430931A CN105430931A CN201510989234.8A CN201510989234A CN105430931A CN 105430931 A CN105430931 A CN 105430931A CN 201510989234 A CN201510989234 A CN 201510989234A CN 105430931 A CN105430931 A CN 105430931A
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- CN
- China
- Prior art keywords
- water
- soaking
- water jet
- cutter
- jet cutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention discloses a soaking and washing mechanism behind an organic solderability preservative horizontal line main trough. A washing tank is formed hind the organic solderability preservative main trough; two horizontal washing water jet cutters are arranged in the washing tank and respectively are a grouting water jet cutter and a soaking water jet cutter; the grouting water jet cutter and the soaking water jet cutter are in parallel mutually and are arranged at an interval; the grouting water jet cutter is connected with a first water pump; and the soaking water jet cutter is connected with a second water pump. According to the soaking and washing mechanism, the grouting water jet cutter and the soaking water jet cutter are adopted to replace two spray pipes in the prior art, moreover, the water pumps are respectively and separately configured to the grouting water jet cutter and the soaking water jet cutter to raise a pressure, so that a sufficient washing pressure exists in the washing tank, and thus, residual medicinal liquid in a semi-blocked hole can be effectively washed and the semi-blocked hole is prevented from being blacked.
Description
Technical field
The invention belongs to field of printed circuit board fabrication, be specifically related to soaking and water washing water knife structure after a kind of OSP horizontal line major trough.
Background technology
OSP is a kind of technique meeting RoHS command request of printed circuit board (PCB) (PCB) copper foil surface process.OSP is the abbreviation of OrganicSolderabilityPreservatives, in be translated into organic guarantor and weld film, also known as protecting copper agent, English is also referred to as Preflux.Briefly, OSP be exactly cleaning naked copper on the surface, grow one deck organic coating with the method for chemistry.This tunic has anti-oxidation, heat shock resistance, moisture-proof, gets rusty (oxidation or sulfuration etc.) in order to protect copper surface no longer to continue in normal environment; But in follow-up welding high temperature, this kind of diaphragm must be easy to again be removed rapidly by scaling powder, the clean copper surface of exposing so can be made to be able to be combined into firmly solder joint immediately with melting scolding tin within the extremely short time.
Need after OSP horizontal line major trough to carry out soaking and water washing to plank, at present, the structure of soaking and water washing is mainly provided with two jet pipes exactly on rinsing bowl, and jet pipe is placed with nozzle, the water sprayed by nozzle is washed plank, and two showers are connected with a pressure pumping jointly.There is following defect in above-mentioned soaking and water washing structure: because washing pressure is less, causes residual liquid medicine in half consent not wash clean clearly, cause half consent blackout.
Summary of the invention
In order to solve the problem, the invention provides a kind of organic guarantor and welding soaking and water washing mechanism after film water horizontal line major trough, after this organic guarantor welds film water horizontal line major trough, soaking and water washing mechanism can clean residual liquid medicine in half consent effectively, prevents half consent blackout.
The present invention in order to the technical scheme solving its technical problem and adopt is:
A kind of organic guarantor welds soaking and water washing mechanism after film water horizontal line major trough, organic guarantor has rinsing bowl after welding film major trough, be provided with the washing water cutter of two transverse directions in described rinsing bowl and be respectively grout water cutter and soak water cutter, described grout water cutter and described immersion water cutter are parallel to each other and are intervally arranged, described grout water cutter is connected with the first water pump, and described immersion water cutter is connected with the second water pump.
The present invention in order to the further technical scheme solving its technical problem and adopt is:
Say further, described grout water cutter lie across in described rinsing bowl width to.
Say further, described immersion water cutter lie across in described rinsing bowl width to.
Say further, described grout water cutter spacing is in the upstream of described immersion water cutter.
Say further, described first water pump is all connected feed pipe with described second water pump.
The invention has the beneficial effects as follows: after organic guarantor of the present invention welds film water horizontal line major trough, soaking and water washing mechanism adopts grout water cutter and soaks two jet pipes that water cutter substitutes prior art, and grout water cutter and immersion water cutter are configured with separately water pump lifting pressure separately, make that there is in rinsing bowl enough washing pressure, effectively can clean residual liquid medicine in half consent, prevent half consent blackout.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
Below by way of specific instantiation, the specific embodiment of the present invention is described, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented in further, different ways, that is, not deviating under disclosed category, can give different modifications and change.
Embodiment: a kind of organic guarantor welds soaking and water washing mechanism after film water horizontal line major trough, organic guarantor has rinsing bowl after welding film major trough, be provided with the washing water cutter of two transverse directions in described rinsing bowl 1 and be respectively grout water cutter 2 and soak water cutter 3, described grout water cutter 2 and described immersion water cutter 3 are parallel to each other and are intervally arranged, described grout water cutter lie across in described rinsing bowl width to, described immersion water cutter lie across in described rinsing bowl width to, described grout water cutter spacing is in the upstream of described immersion water cutter, described grout water cutter 2 is connected with the first water pump 4, described immersion water cutter 3 is connected with the second water pump 5, described first water pump is all connected feed pipe 6 with described second water pump.
The present invention adopts grout water cutter and soaks two jet pipes that water cutter substitutes prior art, and grout water cutter and immersion water cutter are configured with separately water pump lifting pressure separately, make that there is in rinsing bowl enough washing pressure, effectively can clean residual liquid medicine in half consent, prevent half consent blackout.
Claims (5)
1. an organic guarantor welds soaking and water washing mechanism after film water horizontal line major trough, organic guarantor has rinsing bowl after welding film major trough, it is characterized in that: be provided with the washing water cutter of two transverse directions in described rinsing bowl (1) and be respectively grout water cutter (2) and soak water cutter (3), described grout water cutter (2) and described immersion water cutter (3) are parallel to each other and are intervally arranged, described grout water cutter (2) is connected with the first water pump (4), and described immersion water cutter (3) is connected with the second water pump (5).
2. organic guarantor as claimed in claim 1 welds soaking and water washing mechanism after film water horizontal line major trough, it is characterized in that: described grout water cutter lie across in described rinsing bowl width to.
3. organic guarantor as claimed in claim 1 welds soaking and water washing mechanism after film water horizontal line major trough, it is characterized in that: described immersion water cutter lie across in described rinsing bowl width to.
4. organic guarantor as claimed in claim 1 welds soaking and water washing mechanism after film water horizontal line major trough, it is characterized in that: described grout water cutter spacing is in the upstream of described immersion water cutter.
5. organic guarantor as claimed in claim 1 welds soaking and water washing mechanism after film water horizontal line major trough, it is characterized in that: described first water pump is all connected feed pipe (6) with described second water pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510989234.8A CN105430931A (en) | 2015-12-24 | 2015-12-24 | Soaking and washing mechanism behind organic solderability preservative horizontal line main trough |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510989234.8A CN105430931A (en) | 2015-12-24 | 2015-12-24 | Soaking and washing mechanism behind organic solderability preservative horizontal line main trough |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105430931A true CN105430931A (en) | 2016-03-23 |
Family
ID=55508778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510989234.8A Pending CN105430931A (en) | 2015-12-24 | 2015-12-24 | Soaking and washing mechanism behind organic solderability preservative horizontal line main trough |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105430931A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04238355A (en) * | 1991-01-23 | 1992-08-26 | Sharp Corp | Developing device |
| TW200504808A (en) * | 2003-06-13 | 2005-02-01 | Sumitomo Precision Prod Co | Equipment for peeling resist |
| US20050099690A1 (en) * | 2003-11-10 | 2005-05-12 | Reg Yang | Washing device for washing the transparent layer of the image sensor package |
| CN201812133U (en) * | 2010-08-19 | 2011-04-27 | 高德(苏州)电子有限公司 | Development horizontal line of printed circuit board |
| CN203820903U (en) * | 2014-03-25 | 2014-09-10 | 苏州南德罗拉自动化设备有限公司 | Pitting type wing-attached three-row water sprayer |
| CN204657030U (en) * | 2015-04-23 | 2015-09-23 | 梅州市恒晖电子有限公司 | PCB Water-cutting type washes panel assembly |
| CN205385657U (en) * | 2015-12-24 | 2016-07-13 | 竞陆电子(昆山)有限公司 | It soaks washing mechanism behind membrane water flat line major trough to have organizational security to weld |
-
2015
- 2015-12-24 CN CN201510989234.8A patent/CN105430931A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04238355A (en) * | 1991-01-23 | 1992-08-26 | Sharp Corp | Developing device |
| TW200504808A (en) * | 2003-06-13 | 2005-02-01 | Sumitomo Precision Prod Co | Equipment for peeling resist |
| US20050099690A1 (en) * | 2003-11-10 | 2005-05-12 | Reg Yang | Washing device for washing the transparent layer of the image sensor package |
| CN201812133U (en) * | 2010-08-19 | 2011-04-27 | 高德(苏州)电子有限公司 | Development horizontal line of printed circuit board |
| CN203820903U (en) * | 2014-03-25 | 2014-09-10 | 苏州南德罗拉自动化设备有限公司 | Pitting type wing-attached three-row water sprayer |
| CN204657030U (en) * | 2015-04-23 | 2015-09-23 | 梅州市恒晖电子有限公司 | PCB Water-cutting type washes panel assembly |
| CN205385657U (en) * | 2015-12-24 | 2016-07-13 | 竞陆电子(昆山)有限公司 | It soaks washing mechanism behind membrane water flat line major trough to have organizational security to weld |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160323 |