CN105419444A - Nano silver wire electric-conductive glue and electroplating method - Google Patents

Nano silver wire electric-conductive glue and electroplating method Download PDF

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Publication number
CN105419444A
CN105419444A CN201510981004.7A CN201510981004A CN105419444A CN 105419444 A CN105419444 A CN 105419444A CN 201510981004 A CN201510981004 A CN 201510981004A CN 105419444 A CN105419444 A CN 105419444A
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China
Prior art keywords
nano
silver thread
conductive resin
thread conductive
resin according
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Pending
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CN201510981004.7A
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Chinese (zh)
Inventor
顾宏伟
戚芬强
鲁英杰
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Gushi nano technology (Zhejiang) Co., Ltd.
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SUZHOU CHUANGKE MICROELECTRONIC MATERIAL Co Ltd
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Priority to CN201510981004.7A priority Critical patent/CN105419444A/en
Publication of CN105419444A publication Critical patent/CN105419444A/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/63Additives non-macromolecular organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/65Additives macromolecular
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08Electroplating with moving electrolyte e.g. jet electroplating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)

Abstract

The invention discloses nano silver wire electric-conductive glue and an electroplating method. The electric-conductive glue is prepared from following raw materials, by weight: 0.5-1.5% of nano silver wires, 0.5-1.5% of a thickening agent, 5-8% of a crosslinking agent, 0.05-0.1% of a flatting agent, 0.05-0.1% of an adhesion force promoter, and the balanced being a solvent. The nano silver wire electric-conductive glue, compared with glues in the prior art, can be directly sprayed onto plastic without the processes of oil removal, coarsening, sensitization, activation and chemical-plating in conventional plastic electroplating, thereby avoiding pollution caused by these processes.

Description

A kind of nano-silver thread conductive resin and electro-plating method
Technical field
The present invention relates to a kind of nano-silver thread conductive resin and electro-plating method, belong to field of new.
Background technology
Plating utilizes chemistry and electrochemical method to plate various metal at metal or at other material surface.Electroplating technology is widely used in the industries such as manufacture, light industry, electronics.Plastic electroplating can make surface of plastic products have metalluster, attractive in appearance, plays decoration function; Improve the physical strength of product surface, increase the service life; Plastics are made to have higher stability to the extraneous factor such as light and air, not easily aging; Plastics are made to have conduction, magnetic conduction and weldability.Plastic electroplating goods can be used for the industries such as aerospace, shipbuilding, automobile, electronic apparatus, building decoration, toy and daily necessities, and purposes is very extensive.The plastics that can be used for electroplating comprise: ABS, polypropylene, polysulfones, polycarbonate, nylon, polystyrene and phenolic glass fiber reinforced plastics etc., wherein maximum with ABS consumption, technique is the most ripe, and electroplating effect is best.
Conventional plastic electroplating technology flow process, its technical process is followed successively by: oil removing, alligatoring, sensitization, activation, electroless plating, plating, nickel plating, chromium plating, finished product.Five steps more than in operation before electroplating operations are chemical plating technology, from electroplating operations, are conventional plating process.
Chinese patent 201410298602.X discloses a kind of electrosilvering paint, be made up of the component of following weight percents: fine silver slurry 2-5%, celluosic resin 6-15%, acrylic resin 40-60%, melamine resin 1-3%, titanic acid ester modified additive 0.5-1%, N-BUTYL ACETATE 10-25%, pimelinketone 5-10%, toluene 5-10%.By the way, a kind of electrosilvering paint of the present invention, can make the plastic cement paint that can compare favourably with vacuum plating, solve vacuum plating and pollute the problems such as large, energy consumption is high, have and pollute the advantage little, energy consumption is low.But organic content contained inside this electrosilvering paint is very high, and there is a large amount of volatile organic solvent, cost with the pollution of environment is hindered to its industrialization and popularizes, simultaneously electroplating technology required voltage and electric current all higher.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of nano-silver thread conductive resin and electro-plating method.
In order to achieve the above object, technical scheme of the present invention is: a kind of nano-silver thread conductive resin, it is characterized in that, be made up of the raw material of following weight percent: nano-silver thread 0.5 ~ 1.5%, thickening material 0.5-1.5%, linking agent 5-8%, flow agent 0.05-0.1%, adhesion promoter 0.05-0.1%, surplus is solvent.
Nano-silver thread diameter described above is 20nm, length is 20 μm.
Nano-silver thread diameter described above is 40nm, length is 20 μm.
Nano-silver thread diameter described above is 60nm, length is 20 μm.
Thickening material described above is at least one in Walocel MT 20.000PV, Natvosol, Vltra tears, hydroxyethylmethyl-cellulose.
Linking agent described above is the mixture of acrylic resin, urethane resin.
Flow agent described above is the acrylic resin of the hydroxyl of fluorine richness.
Adhesion promoter described above is cyano-acetamide oxygen ethylmethyl acrylate.
Solvent described above is water.
A kind of nano-silver thread conductive resin and electro-plating method, is characterized in that comprising the steps:
1) nano silver wire is disperseed in aqueous uniformly, stand-by;
2) in the reactor of agitating heater, add a part of aqueous solvent, start whipping appts, rotating speed is 100r/min, and being heated to temperature is 80 DEG C, evenly adds thickening material slowly, until be reduced to room temperature after dispersed;
3) control rotating speed be 30r/min, 2) described in reactor in progressively add linking agent, flow agent, adhesion promoter, 1 in order) described in the nano silver wire aqueous solution;
4) organic solvent is adopted, if the surface of the wiping such as alcohol, normal hexane wish plated material is to remove the dirt on surface;
5) adopt spraying method to the material surface spraying nano-silver thread conductive resin for plating, form the coating that thickness is 10-20 μm, at 85 DEG C, toast 10min,
6) to step 5) coating electroplate, voltage is 0.5-1.5V, and electric current is 0.05-0.1A, and then completes plating.
Compared with prior art, a kind of nano silver wire conductive resin provided by the invention, can be painted on plastics, eliminates the operation of the oil removing of conventional plastic plating, alligatoring, sensitization, activation, electroless plating, avoids the pollution brought thus; Compared with the conductive resin reported, because we have employed the ultra-fine silver nano wire of length-to-diameter ratio overlength, the nano silver wire being low to moderate 0.5% also can make the conductive resin of excellent electric conductivity, thickening material coordinates with the ingenious of linking agent the use avoiding a large amount of resin, exclusive solvents water it also avoid the use of volatile organic solvent simultaneously, these not only reduce cost, also reduce the destruction to environment.In addition, excellent electroconductibility makes the voltage in electroplating process and electric current be significantly less than in prior art and electroplates required voltage and electric current.
Embodiment
Below in conjunction with embodiment, the present invention is further described.
Embodiment 1
The formula of nano-silver thread conductive resin: nano-silver thread 0.5g, thickening material 1.5g, linking agent 6g, flow agent 0.1g, adhesion promoter 0.05g, surplus is aqueous solvent.Specific configuration and plating comprise the steps:
1) 0.5g nano silver wire is dispersed in the 10g aqueous solution uniformly, stand-by;
2) in the reactor of agitating heater, add 81.15g aqueous solvent, start whipping appts, rotating speed is 100r/min, and being heated to temperature is 80 DEG C, evenly adds 1.5g thickening material slowly, until be reduced to room temperature after dispersed;
3) control rotating speed be 30r/min, 2) described in reactor in progressively add 6g linking agent, 0.1g flow agent, 0.05g adhesion promoter, 10.5g1 in order) described in the nano silver wire aqueous solution;
4) organic solvent is adopted, if the surface of the wiping such as alcohol, normal hexane wish plated material is to remove the dirt on surface;
5) adopt spraying method to the material surface spraying nano-silver thread conductive resin for plating, form the coating that thickness is 10 μm, at 85 DEG C, toast 10min;
After tested, its resistance of every square is 10 Ω, and sticking power is 5B;
6) to step 5) coating electroplate, voltage is 1.5V, and electric current is 0.1A, and then completes electro-coppering, and the time is 5min.
Plating terminates rear Reliability Test Data and is:
Embodiment 2
The formula of nano-silver thread conductive resin: nano-silver thread 1.5g, thickening material 1g, linking agent 5g, flow agent 0.1g, adhesion promoter 0.1g, surplus is aqueous solvent.Specific configuration and plating comprise the steps:
1) 1.5g nano silver wire is dispersed in the 15g aqueous solution uniformly, stand-by;
2) in the reactor of agitating heater, add 77.3g aqueous solvent, start whipping appts, rotating speed is 100r/min, and being heated to temperature is 80 DEG C, evenly adds 1g thickening material slowly, until be reduced to room temperature after dispersed;
3) control rotating speed be 30r/min, 2) described in reactor in progressively add 5g linking agent, 0.1g flow agent, 0.1g adhesion promoter, 16.5g1 in order) described in the nano silver wire aqueous solution;
4) organic solvent is adopted, if the surface of the wiping such as alcohol, normal hexane wish plated material is to remove the dirt on surface;
5) adopt spraying method to the material surface spraying nano-silver thread conductive resin for plating, form the coating that thickness is 15 μm, at 85 DEG C, toast 10min;
After tested, its resistance of every square is 8 Ω, and sticking power is 5B;
6) to step 5) coating electroplate, voltage is 1V, and electric current is 0.05A, and then completes electro-coppering, and the time is 5min.
All simple distortion of making when not departing from core of the present invention or amendment all fall into protection scope of the present invention.

Claims (10)

1. a nano-silver thread conductive resin, it is characterized in that, be made up of the raw material of following weight percent: nano-silver thread 0.5 ~ 1.5%, thickening material 0.5-1.5%, linking agent 5-8%, flow agent 0.05-0.1%, adhesion promoter 0.05-0.1%, surplus is solvent.
2. a kind of nano-silver thread conductive resin according to claim 1, is characterized in that, described nano-silver thread diameter is 20nm, length is 20 μm.
3. a kind of nano-silver thread conductive resin according to claim 1, is characterized in that, described nano-silver thread diameter is 40nm, length is 20 μm.
4. a kind of nano-silver thread conductive resin according to claim 1, is characterized in that, described nano-silver thread diameter is 60nm, length is 20 μm.
5. a kind of nano-silver thread conductive resin according to claim 1, is characterized in that, described thickening material is at least one in Walocel MT 20.000PV, Natvosol, Vltra tears, hydroxyethylmethyl-cellulose.
6. a kind of nano-silver thread conductive resin according to claim 1, is characterized in that, described linking agent is the mixture of acrylic resin, urethane resin.
7. a kind of nano-silver thread conductive resin according to claim 1, is characterized in that, described flow agent is the acrylic resin of the hydroxyl of fluorine richness.
8. a kind of nano-silver thread conductive resin according to claim 1, is characterized in that, described adhesion promoter is cyano-acetamide oxygen ethylmethyl acrylate.
9. a kind of nano-silver thread conductive resin according to claim 1, is characterized in that, described solvent is water.
10. a nano-silver thread conductive resin electro-plating method, is characterized in that, comprises the following steps:
1) nano silver wire is disperseed in aqueous uniformly, stand-by;
2) in the reactor of agitating heater, add a part of aqueous solvent, start whipping appts, rotating speed is 100r/min, and being heated to temperature is 80 DEG C, evenly adds thickening material slowly, until be reduced to room temperature after dispersed;
3) control rotating speed be 30r/min, 2) described in reactor in progressively add linking agent, flow agent, adhesion promoter, 1 in order) described in the nano silver wire aqueous solution;
4) organic solvent is adopted, if the surface of the wiping such as alcohol, normal hexane wish plated material is to remove the dirt on surface;
5) adopt spraying method to the material surface spraying nano-silver thread conductive resin for plating, form the coating that thickness is 10-20 μm, at 85 DEG C, toast 10min,
6) to step 5) coating electroplate, voltage is 0.5-1.5V, and electric current is 0.05-0.1A, and then completes plating.
CN201510981004.7A 2015-12-23 2015-12-23 Nano silver wire electric-conductive glue and electroplating method Pending CN105419444A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106191952A (en) * 2016-07-20 2016-12-07 苏州顾氏新材料有限公司 A kind of black holes liquid and methods for making and using same thereof
JP2018003014A (en) * 2016-06-27 2018-01-11 Dowaエレクトロニクス株式会社 Silver nanowire ink, manufacturing method thereof and conductive film
CN107987636A (en) * 2017-12-05 2018-05-04 浙江欧仁新材料有限公司 Nano silver wire coating liquid for flexible photoelectric device
US10982119B2 (en) * 2017-12-01 2021-04-20 The Regents Of The University Of California Methods for conductive adhesives based on graphene and applications thereof
CN113831864A (en) * 2021-11-11 2021-12-24 苏州诺菲纳米科技有限公司 Single-layer nano silver wire strippable conductive adhesive and preparation method thereof

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CN103979802A (en) * 2014-05-27 2014-08-13 东莞市鑫聚光电科技有限公司 Method for producing nano silver wire transparent conductive glass
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CN101760147A (en) * 2009-08-22 2010-06-30 漳立冰 Solvent type aeolotropic nano conductive adhesive and manufacturing method thereof
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CN103979802A (en) * 2014-05-27 2014-08-13 东莞市鑫聚光电科技有限公司 Method for producing nano silver wire transparent conductive glass

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018003014A (en) * 2016-06-27 2018-01-11 Dowaエレクトロニクス株式会社 Silver nanowire ink, manufacturing method thereof and conductive film
CN106191952A (en) * 2016-07-20 2016-12-07 苏州顾氏新材料有限公司 A kind of black holes liquid and methods for making and using same thereof
US10982119B2 (en) * 2017-12-01 2021-04-20 The Regents Of The University Of California Methods for conductive adhesives based on graphene and applications thereof
CN107987636A (en) * 2017-12-05 2018-05-04 浙江欧仁新材料有限公司 Nano silver wire coating liquid for flexible photoelectric device
CN113831864A (en) * 2021-11-11 2021-12-24 苏州诺菲纳米科技有限公司 Single-layer nano silver wire strippable conductive adhesive and preparation method thereof

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