CN105406686A - Laminated electrohydrodynamic micropump - Google Patents

Laminated electrohydrodynamic micropump Download PDF

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Publication number
CN105406686A
CN105406686A CN201510936983.4A CN201510936983A CN105406686A CN 105406686 A CN105406686 A CN 105406686A CN 201510936983 A CN201510936983 A CN 201510936983A CN 105406686 A CN105406686 A CN 105406686A
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China
Prior art keywords
hole
insulation spacer
becket
lamination type
negative pole
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CN201510936983.4A
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Chinese (zh)
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CN105406686B (en
Inventor
陈伯扦
柳俊城
万珍平
朱智科
李星
马明怡
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South China University of Technology SCUT
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South China University of Technology SCUT
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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K44/00Machines in which the dynamo-electric interaction between a plasma or flow of conductive liquid or of fluid-borne conductive or magnetic particles and a coil system or magnetic field converts energy of mass flow into electrical energy or vice versa
    • H02K44/02Electrodynamic pumps

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

The invention relates to a laminated electrohydrodynamic micropump, comprising a negative electrode conducting wire, a positive electrode conducting wire and a plurality of electrode pair units stacked from bottom to top in sequence, wherein each electrode pair unit comprises a second insulating spacer, a collector member, a first insulating spacer and an emitter member, which are stacked from bottom to top in sequence; the thickness of the second insulating spacer is larger than that of the first insulating spacer, the negative electrode conducting wire sequentially penetrates through the collector member of each electrode pair unit, and the positive electrode conducting wire sequentially penetrates through the emitter member of each electrode pair unit; and central through holes are formed in the end faces of the emitter member, the first insulating spacer, the collector member and the second insulating spacer, and all central through holes form a flow channel seen from top to bottom. The laminated electrohydrodynamic micropump provided by the invention can well drive the fluid flow to achieve a good heat dissipation effect, and belongs to the technical field of microelectronic heat dissipation and microfluidics.

Description

A kind of lamination type electrohydrodynamic Micropump
Technical field
The present invention relates to microelectronics heat radiation and micro-fluidic technical field, particularly relate to a kind of lamination type electrohydrodynamic Micropump.
Background technology
At microelectronics field of radiating, along with the integrated level of electronic devices and components is more and more higher, the power density of electronic chip constantly increases, and its density of heat flow rate also starts remarkable increase.The temperature of chip greatly affects the life-span of chip, and for ensureing that chip can work in suitable temperature range, the heat that good Cooling Solution must be adopted to be produced is discharged in time.
Researchers are by finding the research of radiator structure, and in micro-channel heat sink, convection cell working medium is carried out forced convertion and can be significantly improved radiating effect; And by finding the research of chip thermal source, 20% of total heat dissipation capacity is accounted for from chip top dispersed heat, 80% of total amount of heat concentrates on the bottom of chip, and air-cooled and traditional fluid cooling technology the most frequently used at present just dispels the heat for local above chip, can not tackle the problem at its root.Therefore for meeting the radiating requirements of future electronic product, researcher proposes novel cooling scheme, namely prepare microchannel radiator structure for chip thermal source core, by chip and Micro Channel Architecture integrated, adopt the temperature of fluid-cooled mode to chip to regulate and control.
But, fluid working substance flowing in Micro Channel Architecture can produce very high flow differential pressure, conventional fluid driving method (as conventional gear pumps, plunger displacement pump etc.) is inapplicable in Micro Channel Architecture, and integrated chip has again strict restriction to size simultaneously; This is with regard to the power source needing a kind ofly neither to take that too many volume can provide sufficient power again for the fluid in micro-channel structure, the drive unit of steady operation is used as fluid working substance flowing.
In micro-fluidic field, during research microfluidic device, the mixing between the driving usually needing to consider how to realize fluid, the flow direction controlling fluid and speed, enhance fluid or be separated the problems such as different ions.The Driving technique of microfluid is the running basis of micro-fluidic chip, and driving and the control of microfluid are again the operation cores of microfluidic system, and all processes such as sample introduction, mixing, reaction, separation related to all need just to complete in the motion of controlled microfluid.
According to the growth requirement of current microfluidic system, Micropump becomes the preferred option solving fluid Driving technique in microfluidic system.Microfluidic system mainly contains volume for Micropump, the requirement of flow and pump pressure three aspects.In volume, under the prerequisite of guaranteed performance, the size of Micropump is little as far as possible, can realize the integrated of Micropump and chip or other micro-systems like this; In flow, require stability and the exact controllability of flow; In pump pressure, different micro-analysis systems has requirements different separately due to the difference of application scenario.In micro-fluidic chip chromatographic analysis system, higher to the requirement of drive system, general flow is at 50nl/min ~ 50 μ l/min, and fluid pulse is less than 3%, and flow control accuracy is ± 5% etc.In addition, in microfluidic system, Micropump also needs to have following characteristics: be easy to manipulation, the life-span is long, changes fluid convenient, easy to clean, for variety classes fluid wide adaptability, corrosion-resistant etc.
As can be seen here, originally can as traditional mechanical pump of hydrodynamic source because volume be large, the shortcomings such as power consumption is high, and noise is large, flow control accuracy difference all show serious inadaptability at microelectronics field of radiating or in micro-fluidic; And Micropump is little owing to self having volume, the feature such as low in energy consumption, shows unique value and wide application prospect in micro fluid dynamcis.
Electrohydrodynamic pump has movement-less part, reliable, low consumption, the easily advantage such as making and Maintenance free; And can directly with chip or runner integrated, without the need to separate space, adopt DC driven (but some electrohydrodynamic pump also can not adopt DC driven), do not produce complementary field, electronic component work can not be disturbed.This kind of Micropump is not only recognized a breakthrough of the cooling problem being high hot-fluid device in solution microelectronic industry, can also be used in microfluid cooling system, the field such as drug delivery and MEMS (micro electro mechanical system).
Summary of the invention
For the technical problem existed in prior art, the object of the invention is: provide a kind of lamination type electrohydrodynamic Micropump, the flowing of drive fluid that can be good, reaches good radiating effect.
In order to achieve the above object, the present invention adopts following technical scheme:
A kind of lamination type electrohydrodynamic Micropump, comprise cathode conductor, positive wire and fold the multiple electrode pair unit established from lower to upper successively, described electrode pair unit comprises from lower to upper folded the second insulation spacer, collector electrode part, the first insulation spacer, the emitter part established successively; The thickness of described second insulation spacer is greater than the thickness of the first insulation spacer, and described cathode conductor is successively through the collector electrode part of each electrode pair unit, and described positive wire is successively through the emitter part of each electrode pair unit; The end face of described emitter part, the first insulation spacer, collector electrode part, the second insulation spacer is equipped with central through hole, sees from top to bottom, and described all central through holes form flow channel.The first insulation spacer that this Micropump is arranged and the second insulation spacer can play the effect of insulation to adjacent emitter part and collector electrode part, the thickness of the second insulation spacer is greater than the thickness of the first insulation spacer, can play the effect guiding direction of flow; With positive wire, emitter part is connected, and be connected with the positive pole of adjustable DC power supply; With cathode conductor, collector electrode part is connected, and be connected with the negative pole of adjustable DC power supply; Then Micropump entrance and exit is connected with external circulating system respectively, allows fluid be full of whole flow channel, then connect 500V DC power supply, utilize the flowing of electrical hydrodynamic effect drive fluid.
Below technical scheme is described further:
Further: described emitter part and collector electrode part are made by becket;
The left side as the becket end face of emitter part is provided with the positive pole through hole passed for positive wire, and the right of this becket end face is provided with positive pole breach;
The right as the becket end face of collector electrode part is provided with the negative pole through hole passed for cathode conductor, and the left side of this becket end face is provided with negative pole breach;
See from top to bottom, described positive pole through hole drops in the scope of negative pole breach, and described negative pole through hole drops in the scope of positive pole breach.
Positive wire can extend only through the becket of emitter part, and not with the metallic rings contact of collector electrode part; Cathode conductor can extend only through the becket of collector electrode part, and not with the metallic rings contact of emitter part.
Further: the first described insulation spacer and the right and left of the second insulation spacer are equipped with emargintion, see from top to bottom, described positive pole through hole drops in the scope of the emargintion on the left side, and described negative pole through hole drops in the scope of the emargintion on the right.
Further: described all central through holes form columniform flow channel.
Further: see from top to bottom, the outline line of described becket is surrounded by the first circular arc and first string, and the circle at described central through hole place and the circle at the first circular arc place are concentric circles; The right and left of described first string and described positive pole through hole or negative pole through hole separation becket.
Further: see from top to bottom, the first described insulation spacer and the outline line of the second insulation spacer are surrounded by the second circular arc of second string on the left side, back, second string on the right, the second circular arc in front successively, and the circle at described central through hole place and the circle at the second circular arc place are concentric circles.
Further: the thickness range≤0.5mm of described first insulation spacer.
Further: the thickness of described first insulation spacer is 0.2mm, the thickness of described second insulation spacer is 0.4mm.
Further: the aperture of the central through hole of described becket is 4mm, the diameter of the first circular arc is 6mm, and the aperture of described positive pole through hole or negative pole through hole is 0.3mm.
Further: the quantity of described electrode pair unit is 10.
Generally speaking, tool of the present invention has the following advantages:
1. the annular electric field formed between emitter part of the present invention and collector electrode part acts on fluid, right
Ion in fluid has stronger active force.
2. the columniform flow channel of the present invention reduces the resistance of fluid flowing.
3. the present invention arrange the first insulation spacer and the second insulation spacer can play good insulation effect.
Accompanying drawing explanation
Fig. 1 is the structural representation of front view of the present invention.
Fig. 2 is the explosive view of electrode pair unit.
Fig. 3 is the vertical view of the first insulation spacer and the second insulation spacer.
Fig. 4 is the vertical view of becket.
Wherein, 1 is cathode conductor, and 2 is positive wire, 3 is emitter part, and 4 is collector electrode part, and 5 is the second insulation spacer, 6 is the first insulation spacer, through hole centered by 7, and 8 is positive pole breach, 9 is positive pole through hole, and 10 is emargintion, and 11 is negative pole through hole, 12 is negative pole breach, and 13 is the second string, and 14 is the second circular arc, 15 is the first circular arc, and 16 is first string.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention will be further described in detail.
Hereafter said direction up and down up and down shown in direction with Fig. 1 is consistent, and said fore-and-aft direction is consistent with the fore-and-aft direction of perspective view 1.
Shown in composition graphs 1 and Fig. 2, a kind of lamination type electrohydrodynamic Micropump, comprise cathode conductor, positive wire and fold the multiple electrode pair unit established from lower to upper successively, described electrode pair unit comprises from lower to upper folded the second insulation spacer, collector electrode part, the first insulation spacer, the emitter part established successively.The thickness of described second insulation spacer is greater than the thickness of the first insulation spacer, and described cathode conductor is successively through the collector electrode part of each electrode pair unit, and described positive wire is successively through the emitter part of each electrode pair unit; The end face of described emitter part, the first insulation spacer, collector electrode part, the second insulation spacer is equipped with central through hole, sees from top to bottom, and described all central through holes form columniform flow channel.
Emitter part and collector electrode part are made by equiform becket, and the becket of half quantity is used as emitter part and is used, and the becket of second half quantity is used as collector electrode part and is used.Shown in composition graphs 2 and Fig. 4, see from top to bottom, the outline line of becket is surrounded by the first circular arc and first string, and metal Ring current distribution is provided with central through hole, and the circle at central through hole place and the circle at the first circular arc place are concentric circles.The left side of becket is provided with a small through hole, and when becket is used as the use of emitter part, this small through hole is called positive pole through hole; When becket is used as the use of collector electrode part, this small through hole is called negative pole through hole.The right and left of first string and positive pole through hole or negative pole through hole separation becket; The outline line of becket is originally a complete circle, after being cut, forms a breach by first string, and when becket is used as the use of emitter part, this breach is called positive pole breach; When becket is used as the use of collector electrode part, this breach is called negative pole breach.Certain becket can be made into other shapes, and shown in composition graphs 1, the shape of becket should make: the left side as the becket end face of emitter part is provided with the positive pole through hole passed for positive wire, and the right of this becket end face is provided with positive pole breach; The right as the becket end face of collector electrode part is provided with the negative pole through hole passed for cathode conductor, and the left side of this becket end face is provided with negative pole breach; See from top to bottom, described positive pole through hole drops in the scope of negative pole breach, and described negative pole through hole drops in the scope of positive pole breach.
Shown in composition graphs 3, see from top to bottom, the first described insulation spacer and the outline line of the second insulation spacer are surrounded by the second circular arc of second string on the left side, back, second string on the right, the second circular arc in front successively, and the circle at central through hole place and the circle at the second circular arc place are concentric circles.The outline line of the first insulation spacer and the second insulation spacer is originally a complete circle, and after being cut by the second flat-cut, form two breach, the breach of this right and left is called emargintion.The end face of the first insulation spacer and the second insulation spacer also can be in complete circle, then open corresponding breach to pass by positive wire and cathode conductor, preferably should make: see from top to bottom, described positive pole through hole drops in the scope of the emargintion on the left side, and described negative pole through hole drops in the scope of the emargintion on the right.
As preferred scheme, the thickness range≤0.5mm of the first insulation spacer.The thickness of the first insulation spacer is preferably 0.2mm, and the thickness of the second insulation spacer is preferably 0.4mm.The aperture of the central through hole of becket is 4mm, and the diameter of the first circular arc is 6mm, and the aperture of positive pole through hole or negative pole through hole is 0.3mm.The quantity of electrode pair unit is 10.
When using this lamination type electrohydrodynamic Micropump, with positive wire, emitter part is connected, and be connected with the positive pole of adjustable DC power supply; With cathode conductor, collector electrode part is connected, and be connected with the negative pole of adjustable DC power supply; Then Micropump entrance and exit is connected with external circulating system respectively, allows fluid be full of whole flow channel, then connect 500V DC power supply, utilize the flowing of electrical hydrodynamic effect drive fluid.
Above-described embodiment is the present invention's preferably execution mode; but embodiments of the present invention are not restricted to the described embodiments; change, the modification done under other any does not deviate from Spirit Essence of the present invention and principle, substitute, combine, simplify; all should be the substitute mode of equivalence, be included within protection scope of the present invention.

Claims (10)

1. a lamination type electrohydrodynamic Micropump, it is characterized in that: comprise cathode conductor, positive wire and fold the multiple electrode pair unit established from lower to upper successively, described electrode pair unit comprises from lower to upper folded the second insulation spacer, collector electrode part, the first insulation spacer, the emitter part established successively; The thickness of described second insulation spacer is greater than the thickness of the first insulation spacer, and described cathode conductor is successively through the collector electrode part of each electrode pair unit, and described positive wire is successively through the emitter part of each electrode pair unit; The end face of described emitter part, the first insulation spacer, collector electrode part, the second insulation spacer is equipped with central through hole, sees from top to bottom, and described all central through holes form flow channel.
2., according to a kind of lamination type electrohydrodynamic Micropump according to claim 1, it is characterized in that: described emitter part and collector electrode part are made by becket;
The left side as the becket end face of emitter part is provided with the positive pole through hole passed for positive wire, and the right of this becket end face is provided with positive pole breach;
The right as the becket end face of collector electrode part is provided with the negative pole through hole passed for cathode conductor, and the left side of this becket end face is provided with negative pole breach;
See from top to bottom, described positive pole through hole drops in the scope of negative pole breach, and described negative pole through hole drops in the scope of positive pole breach.
3. according to a kind of lamination type electrohydrodynamic Micropump according to claim 2, it is characterized in that: the first described insulation spacer and the right and left of the second insulation spacer are equipped with emargintion, see from top to bottom, described positive pole through hole drops in the scope of the emargintion on the left side, and described negative pole through hole drops in the scope of the emargintion on the right.
4., according to a kind of lamination type electrohydrodynamic Micropump according to claim 2, it is characterized in that: described all central through holes form columniform flow channel.
5. according to a kind of lamination type electrohydrodynamic Micropump according to claim 4, it is characterized in that: see from top to bottom, the outline line of described becket is surrounded by the first circular arc and first string, and the circle at described central through hole place and the circle at the first circular arc place are concentric circles; The right and left of described first string and described positive pole through hole or negative pole through hole separation becket.
6. according to a kind of lamination type electrohydrodynamic Micropump according to claim 4, it is characterized in that: see from top to bottom, the first described insulation spacer and the outline line of the second insulation spacer are surrounded by the second circular arc of second string on the left side, back, second string on the right, the second circular arc in front successively, and the circle at described central through hole place and the circle at the second circular arc place are concentric circles.
7., according to a kind of lamination type electrohydrodynamic Micropump according to claim 1, it is characterized in that: the thickness range≤0.5mm of described first insulation spacer.
8. according to a kind of lamination type electrohydrodynamic Micropump according to claim 1, it is characterized in that: the thickness of described first insulation spacer is 0.2mm, the thickness of described second insulation spacer is 0.4mm.
9. according to a kind of lamination type electrohydrodynamic Micropump according to claim 5, it is characterized in that: the aperture of the central through hole of described becket is 4mm, the diameter of the first circular arc is 6mm, and the aperture of described positive pole through hole or negative pole through hole is 0.3mm.
10. according to a kind of lamination type electrohydrodynamic Micropump according to claim 1, it is characterized in that: the quantity of described electrode pair unit is 10.
CN201510936983.4A 2015-12-15 2015-12-15 A kind of lamination type electrohydrodynamic Micropump Expired - Fee Related CN105406686B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010068567A (en) * 2008-09-09 2010-03-25 Yasuhiro Koshimoto Pump for magnetic fluid
EP2695849A1 (en) * 2011-04-06 2014-02-12 Postech Academy-industry Foundation Micropump
CN104795963A (en) * 2015-03-19 2015-07-22 华南理工大学 Multi-electrode-plate laminating type electrofluid dynamic micro-pump
CN205212680U (en) * 2015-12-15 2016-05-04 华南理工大学 Lamination formula electrohydrodynamic micropump

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010068567A (en) * 2008-09-09 2010-03-25 Yasuhiro Koshimoto Pump for magnetic fluid
EP2695849A1 (en) * 2011-04-06 2014-02-12 Postech Academy-industry Foundation Micropump
CN104795963A (en) * 2015-03-19 2015-07-22 华南理工大学 Multi-electrode-plate laminating type electrofluid dynamic micro-pump
CN205212680U (en) * 2015-12-15 2016-05-04 华南理工大学 Lamination formula electrohydrodynamic micropump

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