CN105405935A - 一种led芯片透镜的封装方法 - Google Patents
一种led芯片透镜的封装方法 Download PDFInfo
- Publication number
- CN105405935A CN105405935A CN201510954258.XA CN201510954258A CN105405935A CN 105405935 A CN105405935 A CN 105405935A CN 201510954258 A CN201510954258 A CN 201510954258A CN 105405935 A CN105405935 A CN 105405935A
- Authority
- CN
- China
- Prior art keywords
- led chip
- substrate
- lens
- glue
- basal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 title abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims description 23
- 238000012856 packing Methods 0.000 claims description 9
- 238000005538 encapsulation Methods 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 230000002262 irrigation Effects 0.000 claims description 3
- 238000003973 irrigation Methods 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000004382 potting Methods 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510954258.XA CN105405935B (zh) | 2015-12-20 | 2015-12-20 | 一种led芯片透镜的封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510954258.XA CN105405935B (zh) | 2015-12-20 | 2015-12-20 | 一种led芯片透镜的封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105405935A true CN105405935A (zh) | 2016-03-16 |
CN105405935B CN105405935B (zh) | 2017-12-22 |
Family
ID=55471312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510954258.XA Active CN105405935B (zh) | 2015-12-20 | 2015-12-20 | 一种led芯片透镜的封装方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105405935B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109659416A (zh) * | 2018-11-09 | 2019-04-19 | 惠州市华星光电技术有限公司 | 显示组件、点胶装置及显示装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080029775A1 (en) * | 2006-08-02 | 2008-02-07 | Lustrous Technology Ltd. | Light emitting diode package with positioning groove |
CN101452986A (zh) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | 白光发光二极管器件的封装结构和方法 |
CN102257646A (zh) * | 2008-12-19 | 2011-11-23 | 三星Led株式会社 | 发光器件封装、背光单元、显示器件和发光器件 |
CN103872220A (zh) * | 2014-04-02 | 2014-06-18 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | 一种led封装方法 |
-
2015
- 2015-12-20 CN CN201510954258.XA patent/CN105405935B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080029775A1 (en) * | 2006-08-02 | 2008-02-07 | Lustrous Technology Ltd. | Light emitting diode package with positioning groove |
CN102257646A (zh) * | 2008-12-19 | 2011-11-23 | 三星Led株式会社 | 发光器件封装、背光单元、显示器件和发光器件 |
CN101452986A (zh) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | 白光发光二极管器件的封装结构和方法 |
CN103872220A (zh) * | 2014-04-02 | 2014-06-18 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | 一种led封装方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109659416A (zh) * | 2018-11-09 | 2019-04-19 | 惠州市华星光电技术有限公司 | 显示组件、点胶装置及显示装置 |
Also Published As
Publication number | Publication date |
---|---|
CN105405935B (zh) | 2017-12-22 |
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Legal Events
Date | Code | Title | Description |
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SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201221 Address after: Room 602, unit 1, building 9, Hexi community, Hexi District, Tanzhong West Road, Liunan District, Liuzhou City, Guangxi Zhuang Autonomous Region Patentee after: Ye Xiulan Address before: 230088 Room 207, Building 1, Science Park Pioneering Center, 79 Science Avenue, Hefei High-tech Zone, Anhui Province Patentee before: HEFEI ESK OPTICAL-ELECTRICAL TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210105 Address after: 223900 Oriental Pearl 2 -15-1, Sihong, Suqian, Jiangsu Patentee after: SIHONG COUNTY ZHUANGLIAN BUILDING TECHNOLOGY Co.,Ltd. Address before: Room 602, unit 1, building 9, Hexi community, Hexi District, Tanzhong West Road, Liunan District, Liuzhou City, Guangxi Zhuang Autonomous Region Patentee before: Ye Xiulan |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210304 Address after: 211111 No. 12, Mazhou East Road, Mau Ling Street, Jiangning District, Nanjing, Jiangsu Patentee after: JIANGSU ZHIJU INTELLECTUAL PROPERTY SERVICE Co.,Ltd. Address before: 223900 Oriental Pearl 2 -15-1, Sihong, Suqian, Jiangsu Patentee before: SIHONG COUNTY ZHUANGLIAN BUILDING TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220330 Address after: 512799 building 3, northeast of national highway 323 (West of sewage treatment plant), Rucheng Town, Ruyuan County, Shaoguan City, Guangdong Province Patentee after: Guangdong Shenglan Photoelectric Technology Co.,Ltd. Address before: 211111 No. 12, Mazhou East Road, Mau Ling Street, Jiangning District, Nanjing, Jiangsu Patentee before: JIANGSU ZHIJU INTELLECTUAL PROPERTY SERVICE CO.,LTD. |