CN105388090A - Method for testing spreadability of brazing filler metal - Google Patents
Method for testing spreadability of brazing filler metal Download PDFInfo
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- CN105388090A CN105388090A CN201510865787.2A CN201510865787A CN105388090A CN 105388090 A CN105388090 A CN 105388090A CN 201510865787 A CN201510865787 A CN 201510865787A CN 105388090 A CN105388090 A CN 105388090A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
- G01N2013/003—Diffusion; diffusivity between liquids
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Abstract
The invention discloses a method for testing the spreadability of brazing filler metal. The method is used for evaluating the spreadability of the brazing filler metal to a platy base material by using a capillary effect of molten liquid brazing filler metal on the platy base material having a certain angle along a form that the platy base material climbs, and a device provided by the invention is the base material having a platy structure, wherein the base material has a first platy body and a second platy body, and the device can be either solely used, or matched with a provided base to use. The provided testing device can be used for realizing testing of the spreadability of the brazing filler metal conveniently and rapidly. According to the method and the device disclosed by the invention, the systematic error that cannot be avoided in the traditional spreadability testing of the brazing filler metal is reduced, and meanwhile multiple evaluation data can be obtained.
Description
Technical field
The present invention relates to soldering tech field, specifically relate to a kind of solder spreading property method of testing.
Background technology
Judge the brazing quality of a kind of solder to certain mother metal, the wetting state of this solder to this mother metal be one extremely important, be also the most frequently used evaluation index.If a kind of solder is nonwetting to a kind of mother metal, weld this kind of mother metal with this kind of solder, the quality of the soldered fitting obtained is desirable scarcely.Wettability test is divided into two kinds, spreadability and joint filling.Spreadability experiment is most convenient, conventional evaluation method.Traditional spreadability method of testing is all test by GB/T11364-2008.The roughly step of the method is: the solder placing certain mass on the motherboard of horizontal positioned, and is covered by solder brazing flux, then carries out heating, being incubated, and finally measures the spreading area of solder.This kind of method has following shortcoming: 1. not easily ensured absolute level by the mother metal sprawled, slightly tilt, and solder will spread to lower stream after being melted down, causes spreading area can not the spreading ability of authentic representative solder on this mother metal; 2. the impact of the initial area of solder on mother metal can not be avoided, the solder of equal quality, and the size of its original area will certainly affect the spreading area of solder on mother metal.Such as, the solder of equal quality, be prepared into laminar and spherical, be placed on respectively on identical mother metal and carry out sprawling test, the size after sprawling will certainly be different, produces data error.Especially, when doing Comparative and Quantitative Analysis to solder relative to certain mother metal spreading property under different conditions, error slightly will have influence on experimental result.
Summary of the invention
Object of the present invention provides a kind of solder spreading property method of testing for weak point existing in above-mentioned prior art just, the method can avoid out-of-level, the solder initial configuration of motherboard on the impact of solder spreading property parameter, and a test experiments can obtain more parameter.
Object of the present invention realizes by following technique measures:
Solder spreading property method of testing of the present invention, is characterized in that: comprise the following steps:
A, preparation solder, brazing flux and tabular mother metal; Described tabular mother metal is made up of the tabular body of first and second the two pieces of rectangular configuration arranged with 60 ° ~ 170 ° angles;
B, first piece of tabular body of described tabular mother metal is placed on stand in the mode of horizontal positioned, described solder is placed on the angle of tabular mother metal, and on solder, covers brazing flux described in one deck;
C, mobile heating furnace body of heater, make the tabular mother metal be positioned on stand enter in heating furnace, then heat, and after being heated to be greater than described solder and brazing flux melting temperature, is incubated 30s ~ 80s;
D, mobile heating furnace, take out described tabular mother metal, after measuring described brazing filler metal melts, height L2, the area S2 on second piece of tabular body and the area S1 on first piece of tabular body, at least one data flowed in paving distance L1 tetra-kinds of data, evaluate the spreading property of described solder to described tabular mother metal with described data L1 or L2 or S1 or S2 or S1+S2 or S2/S1.
The shape of solder described in said method is rectangular parallelepiped or right cylinder; The preferred angle of described first piece of tabular body and described second piece of tabular body is 90 °; Described tabular mother metal can be made up of the red copper sheet material that centre position is along its length folding.
Object of the present invention also can be realized by following step:
A, prepare solder, brazing flux, base and by the tabular mother metal sprawled; Described base is provided with the V-type groove of 10 ° ~ 170 ° of angles, described tabular mother metal is made up of the tabular body of first and second the two pieces of rectangular configuration arranged with 10 ° ~ 170 ° angles;
B, be placed into described tabular mother metal on described base V-type groove in, described solder is placed on the angle of tabular mother metal, and covers brazing flux described in one deck on described solder;
C, mobile heating furnace, make the base being placed with tabular mother metal enter in heating furnace, then heat, and after being heated to be greater than described solder and brazing flux melting temperature, is incubated 30s ~ 80s;
D, mobile heating furnace, take out tabular mother metal, at least one data in distance L5 five kinds of data that solder after stream paving distance L3, L4 after measuring brazing filler metal melts on first piece of tabular body and second piece of tabular body, area S3, S4 and fusing flows along from the angle of first piece, second piece tabular body to two ends, evaluate the spreading property of described solder to described tabular mother metal by least one data in described data L3, L4, S3, S4 or L5.
The shape of solder described in said method is slender bodies, and the cross sectional shape of described slender bodies is any one in circular, triangle or polygon; The shape of described solder is plates, the cross section of described plates be circular, triangle or square in any one; The shape of described solder is graininess, Powdered or paste.
Described tabular mother metal is made up of the red copper sheet material that centre position is along its length folding, and preferred angle is 90 °; The angle of the V-type groove that described base is arranged is identical with the angle of tabular mother metal.
Beneficial effect of the present invention is as follows:
Due to the present invention adopt fusing after solder relative to have certain angle of inclination sprawled mother metal the height that soaks to evaluate the spreadability of solder for this mother metal, can effectively reduce in conventional test methodologies because the original area size of solder, sprawled the inclination of mother metal cause data error; The change at the angle of inclination of second piece of tabular body, test can be used for for being sprawled the different solder of mother metal spreadability, larger angle of inclination is used for testing the bad solder of spreadability, relatively large data can be obtained, when solder is relative to certain mother metal, time spreadability is very good, can does experiment under less angle at second piece of tabular body, obtain relatively little data; Angled for tool tabular mother metal, be placed in the base being provided with V-type groove, solder is placed on the angle of tabular mother metal, the height that can climb with solder on the tabular mother metal of two sides, area and these three parameters of length of flowing to two ends along angle are respectively or combine the spreadability evaluating solder, once can place multiple sample in V-type groove simultaneously, can contrast test be carried out; Compare traditional two-dimentional spreadability method of testing, the method extend to three dimensions and tests, and once can obtain more parameter, can evaluate by different parameters to this solder under specific extraneous bar to the spreading property of corresponding mother metal.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that solder and brazing flux are placed on tabular mother metal.
Fig. 2 is the close-up schematic view that solder and brazing flux are placed on tabular mother metal.
Fig. 3 is second piece of tabular body of tabular mother metal and the angle of first piece of tabular body when being greater than 90 °, places the schematic diagram of solder and brazing flux in angle.
Fig. 4 be first piece of tabular body of tabular mother metal out-of-level place time schematic diagram.
Fig. 5 is understructure schematic diagram.
Fig. 6 is the schematic diagram that tabular mother metal and the tabular mother metal being placed with solder and brazing flux place v-depression in the base.
Mark in figure: 1. tabular mother metal, 101. first pieces of tabular bodys, 102. second pieces of tabular body, 2. brazing flux, 3. solder, 4. bases, 401.V type groove.
Embodiment
The present invention is further described below with reference to embodiment (accompanying drawing):
Embodiment 1
In the present embodiment, solder 3 is HL205, and brazing flux 2 is Powdered brazing flux FB308, and tabular mother metal 1 is copper plate.
Solder 3 is 0.2cm(diameter) × 1cm(length) bar; Tabular mother metal 1 is of a size of 0.1(thickness) × 5(width) × 6(length) cm, tabular mother metal 1 centre position is along its length folded, make tabular mother metal 1 form the shape with first piece of tabular body 101 and second piece of tabular body 102, the angle of first piece of tabular body 101 and second piece of tabular body 102 is 90 °; Angle will not have the defects such as hole as far as possible.
First piece of tabular body 101 is lain in a horizontal plane on stand, solder 3 is placed on the angle of first piece of tabular body 101 and second piece of tabular body 102, brazing flux 2 is covered on solder 3.Mobile heating furnace, making the tabular mother metal 1 being placed with solder 3 and brazing flux 2 enter into furnace temperature is that the heating furnace of 830 DEG C heats, and temperature retention time is 60s.After insulation, mobile heating furnace, takes out tabular mother metal 1, clear first clean.
The area S1=2.281cm on first piece of tabular body 101 is drawn through survey calculation
2, the maximum distance of solder flowing is L1=0.662cm, the solder wetting height L2=0.179cm on second piece of tabular body 102, area S2=0.456cm
2.S1/S2=5, S1+S2=2.737cm can be used
2, L1/L2=3.698 etc. evaluates the spreadability of solder 3 pairs of mother metals 1.The height L2 that on second piece of tabular body 102, the solder 3 of fusing climbs and area S2 is the result leaning on the capillary action of liquid solder 3 self to climb, evaluate the spreadability of solder 3 pairs of mother metals 1 with L2 and S2, avoid the error that the factor such as solder original state, motherboard inclination causes.
In summary, this test once can obtain more parameter, can separately with parameter S1, L1, S2, L2, also parameter S1, L1, S2, L2 can be combined with each other and come together to evaluate the spreading property of solder 3 when the heating-up temperature T specified, the temperature retention time t specified, the brazing flux of specifying and mother metal.
Embodiment 2
Solder 3 can with the solder of Powdered, sheet, the form such as bar-shaped.
In the present embodiment, solder 3 for string diameter be 2mm, the long HL205 solder for 3mm, heating-up temperature 820 DEG C, temperature retention time 40s, brazing flux 2 are Powdered FB308, the material of tabular mother metal 1 is copper coin, it is of a size of 1 × 5 × 10cm, centre position along the length direction of tabular mother metal 1 folds, and make it have first piece of tabular body 101 and the piece of two tabular body 102, and the angle between first piece of tabular body 101 and second piece of tabular body 102 is 90 °.
The material of base 4 is that refractory brick or other fusing point are made higher than the material of temperature 820 DEG C, and its overall size is 50 × 20 × 20cm, and the degree of depth of V-type groove 401 is 5cm, and the angle between two faces of V-type groove 401 is 90 °; The angle in the plane at the place, two faces of V-type groove 401 and the face at place, base 4 bottom surface is all 45 °.
Tabular mother metal 1 is put in the V-type groove 401 on base 4, solder 3 is placed into the angle between first piece of tabular body 101 of tabular mother metal 1 and second piece of tabular body 102, and covers one deck brazing flux 2 on solder 3.Then base 4 being put into temperature is heat in the heating furnace of 820 DEG C, and temperature retention time is 40s.After insulation, take out tabular mother metal 1, measure stream paving distance L3=0.61mm, the L4=0.60mm of solder on first piece of tabular body 101 corresponding to solder 3 and second piece of tabular body 102, solder area S3=0.668cm
2, S4=0.667cm
2, because first piece of tabular body 101 is the same with second piece of tabular body 102 angle with respect to the horizontal plane, so the parameter on this two boards shape body is closely; The distance L5=46mm that solder 3 flows along the angle of first piece of tabular body 101 and second piece of tabular body 102 to two ends.Obtain altogether L3, L4, S3, S4 and L5 five parameters.The spreading property of solder can be evaluated separately by the parameter of in L3, L4, S3, S4 or L5, also these data can be combined with each other and evaluate the spreading property of solder, such as: L3+L4, S3+S4, L5/L3+L4, L5/L4, L5/L3.
The method and device can also be used to be contrast experiment, and such as when heating-up temperature, temperature retention time, mother metal, solder are all certain, more different brazing flux is on the impact of spreading property.
In embodiment 1 and embodiment 2, angle between first piece of tabular body 101 and second piece of tabular body 102 sets according to the concrete condition of test, such as, 60 °, 70 °, 80 °, 90 °, 100 °, 110 °, 120 °, 130 °, 140 °, 150 °, 160 ° and 170 ° etc. can be got.Adopt different angles according to the spreading property of solder power, thus obtain size to fit, be convenient to the parameter of Measurement and analysis.
Claims (9)
1. a solder spreading property method of testing, is characterized in that: comprise the following steps:
A, preparation solder, brazing flux and tabular mother metal; Described tabular mother metal is made up of the tabular body of first and second the two pieces of rectangular configuration arranged with 60 ° ~ 170 ° angles;
B, first piece of tabular body of described tabular mother metal is placed on stand in the mode of horizontal positioned, described solder is placed on the angle of tabular mother metal, and on solder, covers brazing flux described in one deck;
C, mobile heating furnace body of heater, make the tabular mother metal be positioned on stand enter in heating furnace, then heat, and after being heated to be greater than described solder and brazing flux melting temperature, is incubated 30s ~ 80s;
D, mobile heating furnace, take out described tabular mother metal, after measuring described brazing filler metal melts, height L2, the area S2 on second piece of tabular body and the area S1 on first piece of tabular body, at least one data flowed in paving distance L1 tetra-kinds of data, evaluate the spreading property of described solder to described tabular mother metal with described data L1 or L2 or S1 or S2 or S1+S2 or S2/S1.
2. solder spreading property method of testing according to claim 1, is characterized in that: described solder shape is rectangular parallelepiped or cylinder.
3. solder spreading property method of testing according to claim 1, is characterized in that: the angle of described first piece of tabular body and described second piece of tabular body is 90 °.
4. solder spreading property method of testing according to claim 1, is characterized in that: described tabular mother metal is made up of the red copper sheet material that centre position is along its length folding.
5. a solder spreading property method of testing, is characterized in that: comprise the following steps:
A, prepare solder, brazing flux, base and by the tabular mother metal sprawled; Described base is provided with the V-type groove of 10 ° ~ 170 ° of angles, described tabular mother metal is made up of the tabular body of first and second the two pieces of rectangular configuration arranged with 10 ° ~ 170 ° angles;
B, be placed into described tabular mother metal on described base V-type groove in, described solder is placed on the angle of tabular mother metal, and covers brazing flux described in one deck on described solder;
C, mobile heating furnace, make the base being placed with tabular mother metal enter in heating furnace, then heat, and after being heated to be greater than described solder and brazing flux melting temperature, is incubated 30s ~ 80s;
D, mobile heating furnace, take out tabular mother metal, at least one data in distance L5 five kinds of data that solder after stream paving distance L3, L4 after measuring brazing filler metal melts on first piece of tabular body and second piece of tabular body, area S3, S4 and fusing flows along from the angle of first piece, second piece tabular body to two ends, evaluate the spreading property of described solder to described tabular mother metal by least one data in described data L3, L4, S3, S4 or L5.
6. solder spreading property method of testing according to claim 5, is characterized in that: described solder shape is slender bodies, and the cross sectional shape of described slender bodies is any one in circular, triangle or polygon.
7. solder spreading property method of testing according to claim 5, is characterized in that: the shape of described solder is plates, the cross section of described plates be circular, triangle or square in any one.
8. solder spreading property method of testing according to claim 5, is characterized in that: the shape of described solder is graininess, Powdered or paste.
9. solder spreading property method of testing according to claim 5, is characterized in that: described tabular mother metal is made up of the red copper sheet material that centre position is along its length folding, and angle is 90 °; The angle of the V-type groove that described base is arranged is identical with the angle of tabular mother metal.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510865787.2A CN105388090A (en) | 2015-12-01 | 2015-12-01 | Method for testing spreadability of brazing filler metal |
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| CN201510865787.2A CN105388090A (en) | 2015-12-01 | 2015-12-01 | Method for testing spreadability of brazing filler metal |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019146548A1 (en) * | 2018-01-29 | 2019-08-01 | 国立大学法人大阪大学 | Method for measuring wet state of brazing material, base material, and device for measuring wet state of brazing material |
| CN110220824A (en) * | 2019-07-03 | 2019-09-10 | 郑州机械研究所有限公司 | A kind of gas shielded solder sprawls test method and its device |
| CN110320132A (en) * | 2019-07-03 | 2019-10-11 | 郑州机械研究所有限公司 | A kind of solder wetting sprawls test method |
| CN113008733A (en) * | 2021-02-07 | 2021-06-22 | 中冶武汉冶金建筑研究院有限公司 | Upper feeding type thermal-state repair material spreading test furnace and test method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2019146548A1 (en) * | 2018-01-29 | 2019-08-01 | 国立大学法人大阪大学 | Method for measuring wet state of brazing material, base material, and device for measuring wet state of brazing material |
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| CN110220824A (en) * | 2019-07-03 | 2019-09-10 | 郑州机械研究所有限公司 | A kind of gas shielded solder sprawls test method and its device |
| CN110320132A (en) * | 2019-07-03 | 2019-10-11 | 郑州机械研究所有限公司 | A kind of solder wetting sprawls test method |
| CN113008733A (en) * | 2021-02-07 | 2021-06-22 | 中冶武汉冶金建筑研究院有限公司 | Upper feeding type thermal-state repair material spreading test furnace and test method |
| CN113008733B (en) * | 2021-02-07 | 2023-12-08 | 中冶武汉冶金建筑研究院有限公司 | Upper feeding type thermal state repair material spreadability test furnace and test method |
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