CN105375941B - A kind of integrated T/R modular structures of small-sized high density - Google Patents
A kind of integrated T/R modular structures of small-sized high density Download PDFInfo
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- CN105375941B CN105375941B CN201510795156.8A CN201510795156A CN105375941B CN 105375941 B CN105375941 B CN 105375941B CN 201510795156 A CN201510795156 A CN 201510795156A CN 105375941 B CN105375941 B CN 105375941B
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- modules
- packaging body
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- module
- high density
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
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- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses the first T/R modules packaging body and the 2nd T/R module packaging bodies of a kind of integrated T/R modular structures of small-sized high density, including box body shape, radio frequency chip group in passage is integrated with the first T/R modules packaging body and the 2nd T/R module packaging bodies；The first T/R modules packaging body and the 2nd T/R modules packaging body mutually fasten and form fastening cavity；The T/R modules being provided with the fastening cavity close to the first T/R modules packaging body one side in voltage regulator board, the first T/R module packaging bodies are connected with the voltage regulator board；Simultaneously, the 2nd T/R modules packaging body one side is provided with control signal transmission board in the fastening cavity, T/R modules in the 2nd T/R module packaging bodies are connected with the control signal plate, are electrically connected between the voltage regulator board and the control signal transmission board.Purpose is to provide a kind of small size, light-weighted small-sized high density integrated T/R modular structures.
Description
Technical field
The present invention relates to microwave transmitting and receiving component field, more particularly to a kind of integrated T/R modular structures of small-sized high density.
Background technology
In key component of the T/R modules in Connectors for Active Phased Array Radar antenna, existing T/R module structure type substantially all
Using box body structure.And box body structure internal radio frequency link uses a variety of combination of devices so that small product size is big, weight weight；Together
When, radiating uses fin mode again, just further increases product size and weight.
The content of the invention
The problem of it is an object of the invention to overcome big existing T/R modular assemblies volume, weight weight, there is provided a kind of corpusculum
Long-pending, the light-weighted integrated T/R modular structures of small-sized high density.
In order to realize foregoing invention purpose, the invention provides following technical scheme：
A kind of integrated T/R modular structures of small-sized high density, including the first T/R modules packaging body of box body shape and the 2nd T/
Radio frequency chip group in passage is integrated with R module packaging body, the first T/R modules packaging body and the 2nd T/R module packaging bodies；
The first T/R modules packaging body and the 2nd T/R modules packaging body mutually fasten and form fastening cavity；Institute
State close first T/R modules packaging body one side in fastening cavity and be provided with voltage regulator board, the first T/R modules encapsulation
Radio frequency chip group is connected with the voltage regulator board in internal passage；
Meanwhile, the 2nd T/R modules packaging body one side is provided with control signal transmission board in the fastening cavity,
Radio frequency chip group is connected with the control signal transmission board in passage in the 2nd T/R module packaging bodies；
Electrically connected between the voltage regulator board and the control signal transmission board.
It is preferred that, be provided with heat sink in the fastening cavity, the heat sink and the first T/R modules packaging body and
2nd T/R modules packaging body is fitted, for heater members to be transmitted into the first T/R modules packaging body and the 2nd T/R modules
Heat transfer on packaging body is to outside.
It is preferred that, the heat sink is fastened to form by two pieces of aluminium alloy cavities, fixed in the middle of two blocks of aluminium alloys
One high heat conduction graphite flake.
It is preferred that, it is used to heater members part be installed in the first T/R modules packaging body and the 2nd T/R module packaging bodies
Housing be cooling plate structure, the cooling plate structure, which refers to, to be fixed a height in the middle of two pieces of aluminium alloy cavities being mutually fastened and leads
Hot graphite flake.
It is preferred that, be respectively arranged with voltage regulator board and the control signal transmission board socket that can cooperate and
Contact pin, when the first T/R modules packaging body and the 2nd T/R modules packaging body fastening, contact pin inserts the socket, real
The connection of the existing voltage regulator board and the control signal transmission board.
It is preferred that, the first T/R modules packaging body is provided with through hole in the fastening side body of cavity one, described logical
Hole is embedded in and the row's of being fixed with pin, and the two ends of row's pin are connected respectively to be penetrated in the passage in the first T/R module packaging bodies
Frequency chipset and the voltage regulator board in the fastening cavity；
Meanwhile, the 2nd T/R modules packaging body is provided with through hole in the fastening side body of cavity one, in the through hole
It is embedded in and the row's of being fixed with pin, the two ends of row's pin connect radio frequency in passage in the 2nd T/R module packaging bodies respectively
Chipset and the control signal transmission board in the fastening cavity.
It is preferred that, radio frequency chip group and the first T/R modules packaging body and the 2nd T/R module packaging bodies in the passage
To be welded to connect.
It is preferred that, the housing of the first T/R modules packaging body and the 2nd T/R module packaging bodies is carried out using Laser seal welding
Welding, realizes the overall air-tightness requirement of T/R module packaging bodies.
Compared with prior art, beneficial effects of the present invention：
1st, installed in the back-to-back form of two cavitys, make full use of the space of two modular mid portions to place control signal
Transmission board, voltage regulator board, realize the miniaturization and lightweight of the structure of T/R module.
2nd, high-power chip of the present invention is directly welded on the first T/R modules packaging body and the 2nd T/R module packaging bodies, is made
Chip heat can be conducted well, enhance the heat-sinking capability of T/R module.
3rd, outer enclosure cover plate uses Laser seal welding, realizes the level Hermetic Package of whole module, meets T/R module various
Use requirement under adverse circumstances.
Brief description of the drawings：
Fig. 1 is that the buckling surface structure of the first T/R modules packaging body and the 2nd T/R module packaging bodies in the embodiment of the present invention is shown
It is intended to.
Fig. 2 is radio frequency chip in passage in the embodiment of the present invention and the structural representation of row's pin.
The structural representation for the frequency microwave plate that Fig. 3 installs for radio frequency chip in passage in the embodiment of the present invention.
Fig. 4 is the structural representation of row's pin in the embodiment of the present invention.
Marked in figure：The T/R module packaging bodies of 1- the first, the T/R module packaging bodies of 2- the 2nd, 100- voltage regulator boards, 200-
Control signal transmission board, 110- sockets, 210- contact pins, 111- welding holes, 120- power connectors, the control connection of 220- low frequencies
Radio frequency chip group resettlement area in device, A- heat sinks installation region, B- passages, 150- frequency microwave plates, 160- row's pins, 170- rows
Pin.
Embodiment
With reference to test example and embodiment, the present invention is described in further detail.But this should not be understood
Following embodiment is only limitted to for the scope of above-mentioned theme of the invention, it is all that this is belonged to based on the technology that present invention is realized
The scope of invention.
A kind of integrated T/R modular structures of small-sized high density, as shown in figure 1, the encapsulation of the first T/R modules including box body shape
It is integrated with the T/R modules packaging body 2 of body 1 and the 2nd, the first T/R modules packaging body 1 and the 2nd T/R modules packaging body 2 logical
Radio frequency chip group in road, the transmitting-receiving work for completing T/R modules.
The first T/R modules packaging body 1 and the 2nd T/R modules packaging body 2 mutually fasten and form fastening cavity.
Referring to Fig. 1, the one side of the first T/R modules packaging body 1 is provided with voltage regulator board in the fastening cavity
100, the T/R modules in the first T/R module packaging bodies are connected with the voltage regulator board 100.
Meanwhile, the one side of the 2nd T/R modules packaging body 2 is provided with control signal transmission board in the fastening cavity
200, the T/R modules in the 2nd T/R modules packaging body 2 are connected with the control signal transmission board 200.Further, institute
State and be respectively arranged with socket 110 and contact pin 210 in voltage regulator board 100 and the control signal transmission board 200, in the first T/R
During the T/R modules packaging body 2 of module packaging body 1 and the 2nd is mutually fastened, the contact pin 210 inserts the socket 110, from
And realize and the voltage regulator board 100 being separately positioned on 2 cavitys and control signal transmission board 200 link together.
Further, heat sink is provided with the fastening cavity, A is marked referring to Fig. 1.The heat sink and described first
T/R modules packaging body 1 and the 2nd T/R modules packaging body 2 are fitted, and are sealed for heater members to be transmitted into the first T/R modules
The heat transfer on body and the 2nd T/R module packaging bodies is filled to outside, the heater members are high-power chip, described high-power
Direct chip attachment is on the first T/R modules packaging body and the 2nd T/R module packaging bodies.
Further, the heat sink is fastened to form by two pieces of aluminium alloy cavities, and in two pieces of aluminium alloy chambers
High heat conduction graphite flake is fixed with the middle of body.
Preferably, heat sink and 2 packaging bodies to be manufactured to integrated, i.e. the first T/R modules packaging body and
Being used to install the part of heater members in two T/R module packaging bodies has the cooling plate structure, i.e., mutually detained using at two pieces
Close the structure that a high heat conduction graphite flake is fixed in the middle of fixed aluminium alloy cavity, so that the heat dissipation path of heater members is more
Short, more preferably, what the power of chip can be done is bigger for effect.
Further, the chip in the passage in radio frequency chip group is directly anchored on 2 packaging bodies, referring to figure
2 mark B；So it is more favorable for directly being directly passed to heat in fastening cavity by packaging body as the chip of heater members
Heat sink and transfer heat to outside, so as to ensure the normal work of chip.
Further, radio frequency chip group also includes a frequency microwave plate 150, the frequency microwave plate in the passage
150 are welded to connect with the chip in radio frequency chip group in passage by spun gold.
Further, referring to Fig. 1, Fig. 2, Fig. 3, the perforate on 2 packaging bodies, embedded row's pin 160,170 simultaneously passes through
Welding hole 111 is welded and fixed, for will fasten cavity in voltage regulator board 100 and control signal transmission board 200 respectively with T/R
Frequency microwave plate 150 in module is connected.Referring to row's needle construction schematic diagram shown in Fig. 4.
Preferably, considering the layout of chip, row's pin 160,170 uses orthogonal layout.
Further, referring to Fig. 1, it is also respectively provided with the control signal transmission board 200, voltage regulator board 100
Low frequency control connector 220 and power connector 120, for T/R module transfers control command and power supply.
Further, cover plate is additionally provided with the first and second T/R module packaging bodies, to the frequency microwave plate
150 and its internal chip be packaged and protect, and the gap between the cover plate and cavity is welded using Laser seal welding
Connect.
Preferably, the material of the frequency microwave plate 150 is FR4.
Control signal transmission board operation principle：
Control instruction from the low frequency control connector 220 in control signal transmission board 200 come in after by arranging pin 160,170
It is delivered on frequency microwave plate 150, then associated radio frequency chip is passed to by the circuit on frequency microwave plate 150 and realizes control function
All control functions of module are realized, including when algorithm resolving, width phase control, AD read-writes, temperature acquisition, Schema control, power supply
The functions such as sequence control.
Voltage regulator board operation principle：
Voltage regulator board 100 receives the control instruction of control signal transmission board 200, by the various voltages of input (as+
5.3VB ,+28VB, -6V) required for modulation conversion into radio frequency chip in passage voltage (as+5.3V (± 0.2V) ,+3.5V (±
0.1V) ,+28V (- 0.2V), -6V (- 0.1V)) powered there is provided the radio system to module.
T/R modules operation principle of the present invention：
Outside power supply signal and control signal is entered by power connector 120 and low frequency control connector 220 respectively
Voltage regulator board 100, control signal transmission board 200, and voltage regulator board 100, control signal transmission board 200 pass through contact pin
210 insertion sockets 110 are connected with each other conducting, so that power supply signal and control signal are respectively delivered in 2 T/R modules.
In summary, the present invention installs control signal by using intermediate gaps part formed by 2 cavity make-ups and passed
Input board, voltage regulator board and heat sink, so as to reduce module overall dimensions, realize the High Density Integration of whole T/R modules
With miniaturization, lightweight.And frequency microwave plate replaces LTCC materials by using FR4 materials, while cost reduction is caused again
Reliability is lifted.Further, the circle gap that the cover plate of module coordinates with cavity is welded with Laser seal welding, is realized whole
The level Hermetic Package of module, meets use requirement of the T/R modules under various adverse circumstances.
Claims (8)
1. a kind of integrated T/R modular structures of small-sized high density, it is characterised in that the first T/R modules encapsulation including box body shape
It is integrated with body and the 2nd T/R module packaging bodies, the first T/R modules packaging body and the 2nd T/R module packaging bodies in passage
Radio frequency chip group；
The first T/R modules packaging body and the 2nd T/R modules packaging body mutually fasten and form fastening cavity；The button
Close first T/R modules packaging body one side in cavity is closed to be provided with voltage regulator board, the first T/R module packaging bodies
Passage in radio frequency chip group be connected with the voltage regulator board；
Meanwhile, the 2nd T/R modules packaging body one side is provided with control signal transmission board in the fastening cavity, it is described
Radio frequency chip group is connected with the control signal transmission board in passage in 2nd T/R module packaging bodies；
Electrically connected between the voltage regulator board and the control signal transmission board.
2. a kind of integrated T/R modular structures of small-sized high density according to claim 1, it is characterised in that the fastening
Heat sink is provided with cavity, the heat sink is fitted with the first T/R modules packaging body and the 2nd T/R module packaging bodies,
For the heat transfer that is transmitted to heater members on the first T/R modules packaging body and the 2nd T/R module packaging bodies to outer
Portion.
3. a kind of integrated T/R modular structures of small-sized high density according to claim 2, it is characterised in that the radiating
Plate is fastened to form by two pieces of aluminium alloy cavities, and a high heat conduction graphite flake is fixed in the middle of two blocks of aluminium alloys.
4. the integrated T/R modular structures of a kind of small-sized high density according to claim 1, it is characterised in that described first
The housing for being used to install heater members part in T/R modules packaging body and the 2nd T/R module packaging bodies is cooling plate structure, described
Cooling plate structure, which refers to, fixes a high heat conduction graphite flake in the middle of two pieces of aluminium alloy cavities being mutually fastened.
5. a kind of integrated T/R modular structures of small-sized high density according to claim 1, it is characterised in that the voltage
The socket and contact pin that can be cooperated are respectively arranged with adjustable plate and control signal transmission board, when the first T/R modules
When packaging body and the 2nd T/R modules packaging body are fastened, contact pin inserts the socket, realize the voltage regulator board with it is described
The connection of control signal transmission board.
6. the integrated T/R modular structures of a kind of small-sized high density according to claim 1, it is characterised in that described first
T/R modules packaging body is provided with through hole in the fastening side body of cavity one, is embedded in and the row's of being fixed with pin in the through hole, institute
The two ends of the row's of stating pin connect respectively in passage in the first T/R module packaging bodies radio frequency chip group with the fastening cavity
Voltage regulator board；
Meanwhile, the 2nd T/R modules packaging body is provided with through hole in the fastening side body of cavity one, embedded in the through hole
Enter and the row's of being fixed with pin, the two ends of row's pin connect radio frequency chip in passage in the 2nd T/R module packaging bodies respectively
Group and the control signal transmission board in the fastening cavity.
7. the integrated T/R modular structures of a kind of small-sized high density according to claim 1,2,5 or 6 any one, its feature
It is, radio frequency chip group connects with the first T/R modules packaging body and the 2nd T/R modules packaging body for welding in the passage
Connect.
8. the integrated T/R modular structures of a kind of small-sized high density according to claim 7, it is characterised in that described first
The housing of T/R modules packaging body and the 2nd T/R module packaging bodies is welded using Laser seal welding, realizes T/R module packaging bodies
Overall air-tightness requirement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510795156.8A CN105375941B (en) | 2015-11-18 | 2015-11-18 | A kind of integrated T/R modular structures of small-sized high density |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510795156.8A CN105375941B (en) | 2015-11-18 | 2015-11-18 | A kind of integrated T/R modular structures of small-sized high density |
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| CN105375941A CN105375941A (en) | 2016-03-02 |
| CN105375941B true CN105375941B (en) | 2017-10-31 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106847758A (en) * | 2017-03-22 | 2017-06-13 | 成都雷电微力科技有限公司 | A kind of functional circuit module vertical interconnecting structure |
| CN106848667A (en) * | 2017-03-22 | 2017-06-13 | 成都雷电微力科技有限公司 | A kind of functional circuit module attachment structure |
| CN110161334B (en) * | 2019-05-24 | 2021-08-17 | 上海航天电子通讯设备研究所 | Burn-in system for sending and receiving assembly |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998010309A1 (en) * | 1996-09-05 | 1998-03-12 | Northrop Grumman Corporation | Transmit/receive module for planar active apertures |
| CN103926566A (en) * | 2014-05-08 | 2014-07-16 | 成都雷电微力科技有限公司 | T/R module structure |
| CN103983950A (en) * | 2014-05-08 | 2014-08-13 | 成都雷电微力科技有限公司 | T/R module installation PCB structural component |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203813776U (en) * | 2014-05-13 | 2014-09-03 | 成都雷电微力科技有限公司 | TR radio frequency module of high integration level |
| CN104375122A (en) * | 2014-11-18 | 2015-02-25 | 无锡悟莘科技有限公司 | Radar system with high-array antenna as auxiliary antenna |
| CN205105201U (en) * | 2015-11-18 | 2016-03-23 | 成都雷电微力科技有限公司 | Miniaturized superintegration TR modular structure |
-
2015
- 2015-11-18 CN CN201510795156.8A patent/CN105375941B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998010309A1 (en) * | 1996-09-05 | 1998-03-12 | Northrop Grumman Corporation | Transmit/receive module for planar active apertures |
| CN103926566A (en) * | 2014-05-08 | 2014-07-16 | 成都雷电微力科技有限公司 | T/R module structure |
| CN103983950A (en) * | 2014-05-08 | 2014-08-13 | 成都雷电微力科技有限公司 | T/R module installation PCB structural component |
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| CN105375941A (en) | 2016-03-02 |
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Address after: 610041 Shiyang Industrial Park, No.288, Yixin Avenue, hi tech Zone, Chengdu, Sichuan Province Patentee after: Chengdu lightning Micro Power Technology Co., Ltd Address before: 610041 Shiyang Industrial Park, hi tech Zone, Chengdu, Sichuan Patentee before: RML TECHNOLOGY Co.,Ltd. |