CN106847758A - A kind of functional circuit module vertical interconnecting structure - Google Patents
A kind of functional circuit module vertical interconnecting structure Download PDFInfo
- Publication number
- CN106847758A CN106847758A CN201710175273.3A CN201710175273A CN106847758A CN 106847758 A CN106847758 A CN 106847758A CN 201710175273 A CN201710175273 A CN 201710175273A CN 106847758 A CN106847758 A CN 106847758A
- Authority
- CN
- China
- Prior art keywords
- contact pin
- circuit module
- functional circuit
- mosaics
- vertical interconnecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000004891 communication Methods 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010923 batch production Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The present invention relates to the communications field, more particularly to a kind of functional circuit module vertical interconnecting structure.The present invention is by setting a sealing structure, can be contained in functional circuit module in a seal casinghousing by the structure, and then housing top surface or bottom surface are provided with contact pin so that functional circuit module is interconnected by contact pin with extraneous, and the sealing structure that the present invention is provided is in housing top surface（Or bottom surface）Interconnection means are set（Mosaics+contact pin）The interconnection distance between the functional module of levels setting can largely be saved（Such as T/R modules and the interconnection between the other functions module of levels）, and improve the density of the functional module set with layer（Because functional circuit module is all disposed within seal casinghousing, when contact pin is arranged on top surface, can more closely be arranged with layer intermodule）.
Description
Technical field
The present invention relates to the communications field, more particularly to a kind of functional circuit module vertical interconnecting structure.
Background technology
Now develop progressively towards high frequency, high integration and modularization direction in communications fields such as communication, radar, navigation, phase
Answer, wherein each functional circuit unit/module（Such as T/R modules or other any circuit modules with independent function）'s
Reliability, stability requirement also more and more higher.And the interconnection mode of each functional unit also can direct relation device it is whole
Body electrical property.Connected mode between existing each functional module exist take up room it is big, the problems such as easily cause interference；Such as, it is open
The direct-connected interconnection of formula（Such as the interconnection of field of radar T/R modules and levels difference in functionality module）, the shortcoming one of this interconnection mode
It is to need connecting line more long, so as to need to reserve larger space for connecting line between each functional circuit module, and then causes to set
Standby overall volume increase, two is to open connected mode to be interfered so that can be produced between each functional circuit module, so as to reduce
The overall stability of equipment.
The content of the invention
It is an object of the invention to overcome the above-mentioned deficiency in the presence of prior art, there is provided one kind can reduce microwave should
With the functional circuit attachment structure of connection space between each functional circuit module in field.
In order to realize foregoing invention purpose, the invention provides following technical scheme：
A kind of functional circuit module vertical interconnecting structure, including housing, the housing are sealing structure, and its top surface and/or bottom
Face is planar structure；Connector is provided with the top surface of planar structure and/or bottom surface, shape contract is inlaid with the connector
The mosaics of conjunction, the mosaics and housing are again by airtight soldering and sealing mode（Or other any can reach good hermetic seal
The mounting means for filling effect is arranged in the connector, meanwhile, the contact pin for penetrating mosaics is provided with the mosaics, should
Contact pin, such as, under preferable case, can be allowed to keep good air-tightness using the technique in fine and close mosaics is directly fired,
How considered critical contact pin is not set into mosaics this patent, only limits between contact pin and mosaics with good airtight
Property, it is any to cause that contact pin can make the mosaics-contact pin mentioned in the application with the technique of airtight insertion mosaics
Structure；
Connected using above-mentioned airtight soldering and sealing, user can be set in the housing appropriate functional circuit module/unit, and pass through
Contact pin realizes the functional circuit module（Functional module）External connection, the external connection can be power supply connection or signal connect
Connect.
Further, the housing is airtight soldering and sealing, and this is, because modern communicationses environment is complicated and changeable, not only system to be set
Standby performance is required, and also very high to its reliability requirement, shadow of the environment such as different temperature, humidity, air pressure to equipment
Ring also different, so while in theory, the above-mentioned functions circuit connection structure of non-hermetically sealed soldering and sealing can also play diminution connection sky
Between effect, but the housing of air-tightness, can cause that the functional circuit module being encapsulated in housing is tried one's best and few receive outside
The signal interference of circuit, so as to further increase the stability of module work.
Further, a diameter of 0.6mm ~ 1mm of the contact pin.
Further, it is 0A ~ 5A that the contact pin allows the current value for passing through, in fact, contact pin allows the current value for passing through
There is incidence relation with pin diameter, for different application scenarios, entirely different pin diameter need to be set, and then cause to insert
Pin can be by suitable electric current, to meet the functional circuit module external connection demand in housing.
Further, the contact pin in the mosaics be a row set, two rows be arranged in parallel or it is multiple rows of be arranged in parallel, this is
Because, different functional circuit module has a different external connection quantity demands, it is double or it is multiple rows of be arranged in parallel, both can be
In the case that contact pin quantity is constant, the volume that is taken in functional module of contact pin is reduced, be that functional module is pre- so as to allow on housing
More spaces are stayed, sets more mosaics to meet different connection requirements；Can also inlay not expanding as needed
On the premise of body volume, the contact pin of multiplication is inlayed in same mosaics.
Further, the contact pin for two rows be arranged in parallel or it is multiple rows of be arranged in parallel when, adjacent two sockets pin intersects wrong
Open up and put, because different contact pins undertake different connection tasks, the contact pins of difference row should intersect setting of staggering, with facilitate its with it is right
The connection of unit module is answered, the unit module refers to the subelement module in functional circuit module in housing.
Further, the contact pin for two rows be arranged in parallel or it is multiple rows of be arranged in parallel when different socket pins stretched in housing
The length for entering is different.Although this is because, allow contact pin intersect stagger setting can also facilitate to a certain extent different contact pins with not
Same linking objective（Such as subelement module or correspondence pad, correspondence solder joint）Connection, but, in some cases, Jin Jinjiao
The welding staggered and set and can not be completely secured and be independent of each other between contact pin is pitched, therefore, in a preferred embodiment, we also allow
Stretching into the contact pin of housing has different length, so as to spatially further pad is staggered, the different length can be with
It is that different rows have different length, or have different length between the contact pin arranged, it might even be possible to be that each contact pin has respectively
The length for differing.But for the convenience of batch production, preferred scheme is that the contact pin of different rows has different length, and same
Socket pin uses equal length.
Further, functional circuit module is provided with the housing, while being set in each contact pin termination correspondence position
There is pad, the contact pin is connected with pad, and the pad is connected with corresponding function circuit module.
Preferably, the pad is connected by spun gold with contact pin.
Preferably, the mosaics is made up of glass material or polytetrafluoroethylmaterial material.
Compared with prior art, beneficial effects of the present invention：The present invention can be by by setting a sealing structure, the structure
Functional circuit module is contained in a seal casinghousing, and then housing top surface or bottom surface are provided with contact pin so that functional circuit
Module is interconnected by contact pin with extraneous, so that functional circuit module size and the equal modularization that takes up room（Such as, size is shell
The volume of body）, while its external connection relies on contact pin, need connecting line more long different from open system interconnection, using the present invention
The attachment structure of offer, the connecting length between functional circuit module determines by contact pin length, realizes functional circuit module size
Controllable in advance, connecting length is controllable between module, so as to allow equipment volume comprising functional circuit module to reduce and controllable in advance.
Sensitive functional circuit module is arranged in airtight space simultaneously, it is possible to reduce the interference between each module, increased
Plus the stability of device, so that lifting means overall performance.
The sealing structure that the present invention is provided is in housing top surface（Or bottom surface）Interconnection means are set（Mosaics+contact pin）Can be compared with
Interconnection distance between the functional module that the saving levels of big degree are set（Such as T/R modules and other work(positioned at levels
Interconnection between energy module）, and improve the density of the functional module set with layer（Because functional circuit module is all disposed within sealing
In housing, when contact pin is arranged on top surface, can more closely be arranged with layer intermodule）.
Brief description of the drawings：
The structure chart of the hermetic seal welding structure that Fig. 1 is provided for the present invention.
Fig. 2 is that the structure of housing in the present invention constitutes exemplary plot.
Fig. 3 is the mosaic structure exemplary plot for being provided with double contact pin.
Fig. 4 is connected exemplary plot for double contact pin with pad.
Fig. 5 is functional circuit module topology example figure in housing.
Marked in figure：1- housings, 11- receiving portions, 12- cover plates, 13- support plates, 131- subelement modules, 132- pads, 2-
Mosaics, 3- contact pins, 3- planar structures, 4- spun golds.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment the present invention is described in further detail.But this should not be interpreted as this
The scope for inventing above-mentioned theme is only limitted to following embodiment, and all technologies realized based on present invention belong to the present invention
Scope.
Embodiment 1：As shown in figure 1, a kind of airtight soldering and sealing attachment structure, including housing 1, it preferably uses aluminum system
Into；The housing 1 is sealing structure, preferably cuboid or square, or other have many of planar top surface and/bottom surface
Side shape structure；In preferred embodiment, each side of housing also should be planar structure；The present embodiment is said by taking cuboid as an example
It is bright；As shown in Fig. 2 in some preferred embodiments, lid of the housing 1 by the receiving portion 11 of upper opening and for closing top
Plate 12 is constituted, and in preferred scheme, the cover plate is provided with connector；The shape of the connector can be rectangle, trapezoidal, circular, many
Side shape even irregular shape, preferably oval and rectangle, when for rectangle, are provided with down on rectangular each angle
Angle；The mosaics 2 that shape is agreed with is inlaid with the connector, the mosaics 2 and housing 1 are again by airtight soldering and sealing mode
（Or other any mounting means that can reach good level Hermetic Package effect are arranged in the connector, meanwhile, the edge
The contact pin 3 for penetrating mosaics 2 is provided with inlay 2, the contact pin 3 is made up of copper gilding, under preferable case, can be using straight
Firing technique in fine and close mosaics 2 is connect, is allowed to keep good air-tightness, how considered critical contact pin 3 does not set this patent
Put into mosaics 2, only limiting has good air-tightness between contact pin 3 and mosaics 2, any to allow the gas of contact pin 3
The technique of close insertion mosaics 2 can make the mosaics-contact pin structure mentioned in the application.In this implementation, mosaics 2 can be with
It is that glass is made or polytetrafluoroethylmaterial material is made.
Connected using above-mentioned airtight soldering and sealing, user can be set within the case 1 appropriate functional circuit module/unit,
And the functional circuit module is realized by contact pin 3（Functional module）External connection, the external connection can be power supply connection or
Person's signal is connected, and connector is arranged on into top surface or bottom surface can greatly save longitudinal connection distance, while so that horizontal
More closely arranged to the functional circuit module of same interlayer.Preferably, the housing 1 is airtight soldering and sealing, in theory, non-hermetically sealed envelope
The above-mentioned functions circuit connection structure of weldering can also play a part of reduce connection space, but the housing 1 of air-tightness, can make
The signal for the receiving external circuit interference that the functional circuit module that must be encapsulated in housing 1 is tried one's best few, so as to further increase
The stability of module work.
Preferably, a diameter of 0.6mm ~ 1mm of the contact pin 3.It is 0A ~ 5A that the contact pin 3 allows the current value for passing through, real
On border, contact pin 3 allows the current value for passing through and the diameter of contact pin 3 to have incidence relation, for different application scenarios, need to set up
The complete different diameter of contact pin 3, and then contact pin 3 is allowd by suitable electric current, to meet the functional circuit module in housing 1
External connection demand.
In some embodiments, the contact pin 3 in the mosaics 2 can only set a row, it is also possible to as shown in figure 3, setting
It is two rows or more；This is because, different functional circuit modules has different external connection quantity demands, and in order to protect
Card structure overall stability and air-tightness, should try one's best and not expand（Or few expansion as far as possible）On the premise of the volume of mosaics 2,
More contact pins 3 are inlayed in mosaics 2.
In certain embodiments, the contact pin 3 for two rows be arranged in parallel or it is multiple rows of be arranged in parallel when, adjacent two sockets pin
3 intersect setting of staggering can also be symmetrical arranged；Because different contact pins 3 undertake different connection tasks, the contact pin 3 of difference row should intersect
Stagger setting, to facilitate it to be connected with corresponding subelement module 131, specifically, Fig. 5 gives specifically showing for functional circuit module
Illustration, in corresponding implementation method, is provided with functional circuit module in housing 1, and functional circuit module includes multiple subelements
Module 131, the plurality of subelement module 131 may be provided on a support plate 13 or be set directly in housing, its be probably by
The unitary function of multiple component compositions, it is also possible to single component；Set in each termination correspondence position of contact pin 3 simultaneously
There is pad 132, the contact pin 3 is connected with pad 132, the pad 132 is connected with corresponding subelement module 131；Fig. 4 is to be given
The exemplary plot of the structure of double contact pin 3 and the welding of pad 132, in example, the pad 132 is connected by spun gold 4 with contact pin 3；
In some cases, the welding staggered and set and can not be completely secured and be independent of each other between contact pin 3 is only intersected, therefore, excellent
In the embodiment of choosing, we also allow the contact pin 3 for stretching into housing 1 with different length, so that spatially further weldering
Contact staggers, and the different length can be that different rows have different length, or have different length between the contact pin 3 arranged,
Can even is that each contact pin 3 has different length.But for the convenience of batch production, preferred scheme is different
The contact pin 3 of row has different length or equal length.
Claims (10)
1. a kind of functional circuit module vertical interconnecting structure, it is characterised in that including housing, the housing is sealing structure, and
Its top surface and/or bottom surface are planar structure；Connector, the connector are provided with the top surface of planar structure and/or bottom surface
In be inlaid with the mosaics that shape is agreed with, be provided with the contact pin for penetrating mosaics in the mosaics.
2. functional circuit module vertical interconnecting structure as claimed in claim 1, it is characterised in that the housing is hermetic seal
Weldering.
3. functional circuit module vertical interconnecting structure as claimed in claim 1, it is characterised in that the contact pin it is a diameter of
0.6mm~1mm。
4. functional circuit module vertical interconnecting structure as claimed in claim 3, it is characterised in that the contact pin allows what is passed through
Current value is 0A ~ 5A.
5. functional circuit module vertical interconnecting structure as claimed in claim 1, it is characterised in that the contact pin in the mosaics
Set for a row, two rows be arranged in parallel or multiple rows of be arranged in parallel.
6. functional circuit module vertical interconnecting structure as claimed in claim 5, it is characterised in that the contact pin is that two rows are parallel
Set or multiple rows of when be arrangeding in parallel, adjacent two sockets pin intersects setting of staggering.
7. functional circuit module vertical interconnecting structure as claimed in claim 5, it is characterised in that the contact pin is that two rows are parallel
Set or length that multiple rows of socket pins different when be arrangeding in parallel are stretched into housing is different.
8. functional circuit module vertical interconnecting structure as claimed in claim 1, it is characterised in that set active in the housing
Can circuit module；
Meanwhile, each contact pin correspondence position is provided with pad, the contact pin is connected with pad, and the pad is electric with corresponding function
Road module connection.
9. functional circuit module vertical interconnecting structure as claimed in claim 8, it is characterised in that the pad by spun gold with
The termination connection of contact pin.
10. functional circuit module vertical interconnecting structure as claimed in claim 1, it is characterised in that the mosaics is glass
Material or polytetrafluoroethylmaterial material are made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710175273.3A CN106847758A (en) | 2017-03-22 | 2017-03-22 | A kind of functional circuit module vertical interconnecting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710175273.3A CN106847758A (en) | 2017-03-22 | 2017-03-22 | A kind of functional circuit module vertical interconnecting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106847758A true CN106847758A (en) | 2017-06-13 |
Family
ID=59131153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710175273.3A Pending CN106847758A (en) | 2017-03-22 | 2017-03-22 | A kind of functional circuit module vertical interconnecting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106847758A (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0936271A (en) * | 1995-07-18 | 1997-02-07 | Ibiden Co Ltd | Semiconductor package |
| US5726493A (en) * | 1994-06-13 | 1998-03-10 | Fujitsu Limited | Semiconductor device and semiconductor device unit having ball-grid-array type package structure |
| DE102006041641A1 (en) * | 2006-09-05 | 2008-03-20 | Siemens Ag | Housing for function module, forms receiving space for receiving electrical switch, with multiple contact pins for contacting electrical switch with external electrical circuit |
| CN101431197A (en) * | 2007-09-12 | 2009-05-13 | 安费诺公司 | Modular board to board connector |
| CN101507375A (en) * | 2006-06-30 | 2009-08-12 | 莫列斯公司 | Compliant pin control module and method for making the same |
| CN204191038U (en) * | 2014-10-23 | 2015-03-04 | 中国电子科技集团公司第三十八研究所 | A kind of assembled package device connected for low frequency device |
| CN104518377A (en) * | 2013-10-04 | 2015-04-15 | Hgst荷兰有限公司 | Hard disk drive with feedthrough connector |
| CN105375941A (en) * | 2015-11-18 | 2016-03-02 | 成都雷电微力科技有限公司 | Mini-type high-density integrated T/R module structure |
| CN105529313A (en) * | 2016-02-19 | 2016-04-27 | 无锡新洁能股份有限公司 | Thin type package module suitable for three-terminal power device |
| CN205376514U (en) * | 2016-01-23 | 2016-07-06 | 重庆三峡学院 | Three -dimensional poP stacked package structure |
| CN205488828U (en) * | 2016-01-29 | 2016-08-17 | 西安迪博电子器件有限责任公司 | Slim low frequency connector |
| CN106252940A (en) * | 2016-09-22 | 2016-12-21 | 西安雷航电子信息技术有限公司 | A kind of high-density sealed adapter |
| CN206541821U (en) * | 2017-03-22 | 2017-10-03 | 成都雷电微力科技有限公司 | Functional circuit module vertical interconnecting structure |
-
2017
- 2017-03-22 CN CN201710175273.3A patent/CN106847758A/en active Pending
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| DE102006041641A1 (en) * | 2006-09-05 | 2008-03-20 | Siemens Ag | Housing for function module, forms receiving space for receiving electrical switch, with multiple contact pins for contacting electrical switch with external electrical circuit |
| CN101431197A (en) * | 2007-09-12 | 2009-05-13 | 安费诺公司 | Modular board to board connector |
| CN104518377A (en) * | 2013-10-04 | 2015-04-15 | Hgst荷兰有限公司 | Hard disk drive with feedthrough connector |
| CN204191038U (en) * | 2014-10-23 | 2015-03-04 | 中国电子科技集团公司第三十八研究所 | A kind of assembled package device connected for low frequency device |
| CN105375941A (en) * | 2015-11-18 | 2016-03-02 | 成都雷电微力科技有限公司 | Mini-type high-density integrated T/R module structure |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170613 |
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| RJ01 | Rejection of invention patent application after publication |