CN106848667A - A kind of functional circuit module attachment structure - Google Patents
A kind of functional circuit module attachment structure Download PDFInfo
- Publication number
- CN106848667A CN106848667A CN201710175264.4A CN201710175264A CN106848667A CN 106848667 A CN106848667 A CN 106848667A CN 201710175264 A CN201710175264 A CN 201710175264A CN 106848667 A CN106848667 A CN 106848667A
- Authority
- CN
- China
- Prior art keywords
- contact pin
- circuit module
- functional circuit
- mosaics
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 238000005476 soldering Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000010923 batch production Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5202—Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/521—Sealing between contact members and housing, e.g. sealing insert
Abstract
The present invention relates to microwave interconnecting field, more particularly to a kind of functional circuit module attachment structure.The present invention is by setting a sealing structure, can be contained in functional circuit module in a gas-tight seal housing by the structure, and then contact pin is set by mosaics in housing side, so that functional circuit module is interconnected by contact pin with extraneous, it is same gas-tight seal between mosaics and contact pin, so as to reduce the interference between each module, increase the stability of device, so that lifting means overall performance.
Description
Technical field
The present invention relates to microwave interconnecting field, more particularly to a kind of functional circuit module attachment structure.
Background technology
Microwave technology is developed so far, be widely used in communication, radar, navigation etc. items field, now just towards high frequency,
High integration and modularization direction are developed, accordingly, to each functional circuit unit/module（Such as T/R modules or other are any
Circuit module with independent function）Reliability, stability requirement also more and more higher.Connector is each function of microwave regime
The important microwave component that unit is connected with each other, the overall performance electrical performance of its performance direct relation microwave components.Existing microwave regime is each
Between functional module to use open direct-connected interconnection, the shortcoming of this interconnection mode is easily produced between each functional circuit module more
Life is interfered, so as to reduce the overall stability of equipment.
The content of the invention
It is an object of the invention to overcome the above-mentioned deficiency in the presence of prior art, there is provided one kind can facilitate hermetic seal
Dress, so as to reduce the functional circuit attachment structure interfered between each functional circuit module.
In order to realize foregoing invention purpose, the invention provides following technical scheme：
A kind of airtight soldering and sealing attachment structure, including housing, the housing are sealing structure, and its side is planar structure；In shell
Connector is provided with body either side, the mosaics that shape is agreed with is inlaid with the connector, the mosaics and housing are same
Sample is by airtight soldering and sealing mode（Or other any mounting means that can reach good level Hermetic Package effect are arranged on the company
In interface, meanwhile, the contact pin for penetrating mosaics is provided with the mosaics, the contact pin such as, under preferable case, can be adopted
With the technique in fine and close mosaics is directly fired, be allowed to keep good air-tightness, this patent not considered critical contact pin how
Set into mosaics, only limiting has good air-tightness between contact pin and mosaics, any to cause that contact pin can be with airtight
The technique for inserting mosaics can make the mosaics-contact pin structure mentioned in the application；
The housing is airtight soldering and sealing, and the mosaics is level Hermetic Package with housing.
Connected using above-mentioned airtight soldering and sealing, user can be set in the housing appropriate functional circuit module/unit, and
The functional circuit module is realized by contact pin（Functional module）External connection, the external connection can be power supply connection or believe
Number connection.
Further, two terminations of the contact pin have the planar structure vertical with end face.
Further, the mosaics is made up of glass material or polytetrafluoroethylmaterial material.
Further, a diameter of 0.4mm ~ 0.6mm of the contact pin.
Further, it is 0A ~ 2A that the contact pin allows the current value for passing through, in fact, contact pin allows the current value for passing through
There is incidence relation with pin diameter, for different application scenarios, entirely different pin diameter need to be set, and then cause to insert
Pin can be by suitable electric current, to meet the functional circuit module external connection demand in housing.
Further, the contact pin in the mosaics be a row set, two rows be arranged in parallel or it is multiple rows of be arranged in parallel, this is
Because, different functional circuit module has a different external connection quantity demands, it is double or it is multiple rows of be arranged in parallel, both can be
In the case that contact pin quantity is constant, the volume that is taken in functional module of contact pin is reduced, be that functional module is pre- so as to allow on housing
More spaces are stayed, sets more mosaics to meet different connection requirements；Can also inlay not expanding as needed
On the premise of body volume, the contact pin of multiplication is inlayed in same mosaics.
Further, the contact pin for two rows be arranged in parallel or it is multiple rows of be arranged in parallel when, adjacent two sockets pin intersects wrong
Open up and put, because different contact pins undertake different connection tasks, the contact pins of difference row should intersect setting of staggering, with facilitate its with it is right
The connection of unit module is answered, the unit module refers to the subelement module in functional circuit module in housing.
Further, the contact pin for two rows be arranged in parallel or it is multiple rows of be arranged in parallel when different socket pins stretched in housing
The length for entering is different.Although this is because, allow contact pin intersect stagger setting can also facilitate to a certain extent different contact pins with not
Same linking objective（Such as subelement module or correspondence pad, correspondence solder joint）Connection, but, in some cases, Jin Jinjiao
The welding staggered and set and can not be completely secured and be independent of each other between contact pin is pitched, therefore, in a preferred embodiment, we also allow
Stretching into the contact pin of housing has different length, so as to spatially further pad is staggered, the different length can be with
It is that different rows have different length, or have different length between the contact pin arranged, it might even be possible to be that each contact pin has respectively
The length for differing.But for the convenience of batch production, preferred scheme is that the contact pin of different rows has different length, and same
Socket pin uses equal length.
Further, functional circuit module is provided with the housing, while being set in each contact pin termination correspondence position
There is pad, the contact pin is connected with pad, and the pad is connected with corresponding function circuit module.
Preferably, the pad is connected by spun gold with contact pin.
Compared with prior art, beneficial effects of the present invention：The present invention can be by by setting a sealing structure, the structure
Functional circuit module is contained in a gas-tight seal housing, and then sets contact pin by mosaics in housing side so that work(
Energy circuit module is interconnected by contact pin with extraneous, equally gas-tight seal between mosaics and contact pin, so that between reducing each module
Interference, increase device stability so that lifting means overall performance.
Meanwhile, the application causes functional circuit module size and the equal modularization that takes up room（Such as, size is the body of housing
Product）, while its external connection relies on contact pin, need connecting line more long different from open system interconnection, provided using the present invention
Attachment structure, the connecting length between functional circuit module determines by contact pin length, realizes that functional circuit module size in advance may be used
Control, connecting length is controllable between module, so as to allow equipment volume comprising functional circuit module to reduce and controllable in advance.
Sensitive functional circuit module is arranged in airtight space simultaneously, can be with the sealing structure of present invention offer in shell
Body side surface sets interconnection means（Mosaics+contact pin）The interconnection between the functional module that same layer is set can largely be saved
Distance（Such as functional circuit module and between the power module of same layer）, and improve the density of longitudinally disposed functional module
（Can more closely be arranged because functional circuit module is all disposed within seal casinghousing, therefore between levels）；
Contact pin in the mosaics is set for a row, two rows be arranged in parallel or it is multiple rows of be arranged in parallel, this is because, different work(
Can circuit module there are different external connection quantity demands, it is double or it is multiple rows of be arranged in parallel, both can be constant in contact pin quantity
In the case of, the volume that is taken in functional module of contact pin is reduced, so as to allow on housing as functional module reserves more spaces,
More mosaics are set to meet different connection requirements；The premise of mosaics volume can not also expanded as needed
Under, the contact pin of multiplication is inlayed in same mosaics.
Brief description of the drawings：
The structure chart of the hermetic seal welding structure that Fig. 1 is provided for the present invention.
Fig. 2 is that the structure of housing in the present invention constitutes exemplary plot.
Fig. 3 a are the mosaic structure exemplary plot for being provided with single contact pin.
Fig. 3 b are the mosaic structure exemplary plot for being provided with double contact pin.
Fig. 4 a are connected exemplary plot for single contact pin with pad.
Fig. 4 b are connected exemplary plot for double contact pin with pad.
Fig. 5 a are functional circuit module topology example figure in housing.
Fig. 5 b are another exemplary plot of functional circuit module structure in housing.
Marked in figure：1- housings, 11- receiving portions, 12- cover plates, 13- support plates, 131- subelement modules, 132- pads, 2-
Mosaics, 3- contact pins, 31- planar structures, 4- spun golds.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment the present invention is described in further detail.But this should not be interpreted as this
The scope for inventing above-mentioned theme is only limitted to following embodiment, and all technologies realized based on present invention belong to the present invention
Scope.
Embodiment 1：As shown in figure 1, a kind of airtight soldering and sealing attachment structure, including housing 1, the housing 1 is sealing structure,
Can be cuboid or square it is preferred that using constructed of aluminium, or other have the polygonized structure of planar side；But housing
Top surface and bottom surface be also planar structure；The present embodiment is illustrated by taking cuboid as an example；As shown in Fig. 2 some are preferable to carry out
In mode, the housing 1 is constituted by the receiving portion 11 of upper opening and for closing the cover plate 12 on top, other implementation method
In, the housing 1 can also be by the completely open receiving portion 11 in side, and side cover plate composition（In preferred scheme, the side cover plate
It is provided with connector）；After housing 1 is sealed, connector is provided with the either side of housing 1, the shape of the connector can be
Rectangle, trapezoidal, circular, polygon even irregular shape, preferably oval or rectangle, when being rectangle, mosaics 2
Chamfering is provided with each angle；The mosaics 2 that shape is agreed with is inlaid with the connector, the mosaics 2 and housing 1 are same
By airtight soldering and sealing mode（Or other any mounting means that can reach good level Hermetic Package effect are arranged on the connection
In mouthful, meanwhile, the contact pin 3 for penetrating mosaics 2 is provided with the mosaics 2, the contact pin 3 is the gold-plated structure of copper, preferable case
Under, can be allowed to keep good air-tightness using the technique in fine and close mosaics 2 is directly fired, this patent is not limited strictly
Determine how contact pin 3 is set into mosaics 2, only limiting has good air-tightness between contact pin 3 and mosaics 2, any to make
Obtaining contact pin 3 can make the mosaics-contact pin structure mentioned in the application with the technique of airtight insertion mosaics 2；This implementation
In example, mosaics is made up of glass material or polytetrafluoroethylmaterial material.
Connected using above-mentioned airtight soldering and sealing, user can be set within the case 1 appropriate functional circuit module/unit,
And the functional circuit module is realized by contact pin 3（Functional module）External connection, the external connection can be power supply connection or
Person's signal is connected, and connector is arranged on into side can greatly save horizontal connection distance, while so that longitudinal different layers
Between functional circuit module more closely arrange.
As shown in Figure 3 a, 3 b, 3 two terminations of the contact pin have the planar structure 31 vertical with end face, some implementations
In example, 3 two terminations of contact pin are provided with planar structure 31, to facilitate contact pin 3 to be welded with spun gold 4；And implement in other
In example, the end that only inner termination of contact pin 3, i.e. contact pin 3 are located in housing 1 is provided with planar structure 31, and external end head（I.e.
Contact pin 3 is located at the termination outside housing 1）There is no planar structure 31, now external end head can be using standard plug-in unit and other functions mould
Block is attached.
Preferably, the housing 1 is airtight soldering and sealing, in theory, the above-mentioned functions circuit connection structure of non-hermetically sealed soldering and sealing
Can play a part of reduce connection space, but the housing 1 of air-tightness, the functional circuit being encapsulated in housing 1 can be caused
The signal for the receiving external circuit interference that module is tried one's best few, so as to further increase the stability of module work.
Preferably, a diameter of 0.4mm ~ 0.6mm of the contact pin 3.It is 0A ~ 2A that the contact pin 3 allows the current value for passing through,
In fact, contact pin 3 allows the current value for passing through and the diameter of contact pin 3 to have incidence relation, for different application scenarios, need to set
The entirely different diameter of contact pin 3, and then contact pin 3 is allowd by suitable electric current, to meet the functional circuit mould in housing 1
Block external connection demand.
In some embodiments, the contact pin 3 in the mosaics 2 is row setting as shown in Figure 3 a, and other reality
Example in, contact pin 3 can be two rows be arranged in parallel or it is multiple rows of be arranged in parallel, Fig. 3 b be just given two rows set when example, this be by
There are different external connection quantity demands in, different functional circuit module, and in order to ensure the overall stability of structure with
And air-tightness, should try one's best and not expand（Or few expansion as far as possible）On the premise of the volume of mosaics 2, inlay more in mosaics 2
Contact pin 3.
The contact pin 3 for two rows be arranged in parallel or it is multiple rows of be arranged in parallel when, adjacent two sockets pin 3 intersects setting of staggering；
Because different contact pins 3 undertake different connection tasks, the contact pin 3 of difference row should intersect setting of staggering, to facilitate it single with corresponding
The connection of element module, the unit module refers to the subelement module 131 in functional circuit module in housing 1, and the contact pin 3 is two rows
It is arranged in parallel or length that multiple rows of socket pins 3 different when be arrangeding in parallel are stretched into housing 1 is different.Although this is because, allowing
Contact pin 3 intersects setting of staggering also can to a certain extent facilitate different contact pins 3 from different linking objectives（Such as subelement module
131 or corresponding pads 132, correspondence solder joint）Connection, specifically, Fig. 5 a, Fig. 5 b give the specific example of functional circuit module
Figure, as shown in Fig. 5 a, Fig. 5 b, in corresponding implementation method, is provided with functional circuit module in housing 1, and functional circuit module
Including multiple subelement modules 131, the plurality of subelement module may be provided on a support plate 13 or be set directly in housing,
Simultaneously each termination correspondence position of contact pin 3 is provided with pad 132, the contact pin 3 is connected with pad 132, the pad 132 and
Corresponding subelement module 131 is connected；Fig. 4 a are the exemplary plot for giving the structure of single contact pin 3 and the welding of pad 132, in example,
The pad 132 is connected by spun gold 4 with contact pin 3；In some cases, only intersect stagger setting can not be completely secured it is slotting
The welding being independent of each other between pin 3, therefore, in a preferred embodiment, it is different that we also allow the contact pin 3 for stretching into housing 1 to have
Length, so as to spatially further pad is staggered, the different length can be that different rows have different length, also may be used
Be with row contact pin 3 between have different length, it might even be possible to be each contact pin 3 have different length.But in order to
The convenience of batch production, preferred scheme is that the contact pin 3 of different rows has different length, and uses equal length with socket pin 3,
Fig. 4 b are the exemplary plot for giving the double contact pin 3 with different length and the welding of pad 132.
Claims (10)
1. a kind of functional circuit module attachment structure, it is characterised in that including housing, the housing is sealing structure, and its side
Face is planar structure；At least one connector is provided with housing either side, being inlaid with shape in the connector agrees with
Mosaics, the contact pin for penetrating mosaics is provided with the mosaics；
The housing is airtight soldering and sealing, and the mosaics is level Hermetic Package with housing.
2. functional circuit module attachment structure as claimed in claim 1, it is characterised in that two terminations of the contact pin have with
The vertical planar structure of end face.
3. functional circuit module attachment structure as claimed in claim 1, it is characterised in that the mosaics be glass material or
Person's polytetrafluoroethylmaterial material is made.
4. functional circuit module attachment structure as claimed in claim 1, it is characterised in that a diameter of 0.4mm of the contact pin ~
0.6mm。
5. functional circuit module attachment structure as claimed in claim 4, it is characterised in that the contact pin allows the electric current for passing through
It is 0A ~ 2A to be worth.
6. functional circuit module attachment structure as claimed in claim 1, it is characterised in that the contact pin in the mosaics is
Row is set, two rows be arranged in parallel or multiple rows of be arranged in parallel.
7. functional circuit module attachment structure as claimed in claim 6, it is characterised in that the contact pin be arranged in parallel for two rows
Or it is multiple rows of when be arrangeding in parallel, adjacent two sockets pin intersects setting of staggering.
8. functional circuit module attachment structure as claimed in claim 6, it is characterised in that the contact pin be arranged in parallel for two rows
Or length that multiple rows of socket pins different when be arrangeding in parallel are stretched into housing is different.
9. functional circuit module attachment structure as claimed in claim 1, it is characterised in that functional electricity is set in the housing
Road module；
Meanwhile, each contact pin termination correspondence position is provided with pad, the contact pin is connected with pad, the pad and corresponding work(
Can circuit module connection.
10. functional circuit module attachment structure as claimed in claim 9, it is characterised in that the pad is by spun gold and inserts
Pin is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710175264.4A CN106848667A (en) | 2017-03-22 | 2017-03-22 | A kind of functional circuit module attachment structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710175264.4A CN106848667A (en) | 2017-03-22 | 2017-03-22 | A kind of functional circuit module attachment structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106848667A true CN106848667A (en) | 2017-06-13 |
Family
ID=59129432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710175264.4A Pending CN106848667A (en) | 2017-03-22 | 2017-03-22 | A kind of functional circuit module attachment structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106848667A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1458722A (en) * | 2002-03-13 | 2003-11-26 | 海德罗-艾瑞公司 | Improved plane fuel pump electric connection box |
| US20030236030A1 (en) * | 2002-04-01 | 2003-12-25 | Mccormack George John | Hermetic connector |
| CN201570674U (en) * | 2009-12-14 | 2010-09-01 | 沈阳兴华航空电器有限责任公司 | Glass sintering sealing welding type rectangular connector |
| CN202210585U (en) * | 2011-04-19 | 2012-05-02 | 中国电子科技集团公司第二十三研究所 | Airtight and watertight multi-core sealing assembly |
| CN102576977A (en) * | 2010-01-27 | 2012-07-11 | 三菱电机株式会社 | Semiconductor laser module |
| CN202534855U (en) * | 2011-11-12 | 2012-11-14 | 高文彬 | Air-tight seal cylindrical connector |
| CN104518377A (en) * | 2013-10-04 | 2015-04-15 | Hgst荷兰有限公司 | Hard disk drive with feedthrough connector |
| CN105375941A (en) * | 2015-11-18 | 2016-03-02 | 成都雷电微力科技有限公司 | Mini-type high-density integrated T/R module structure |
| CN106252940A (en) * | 2016-09-22 | 2016-12-21 | 西安雷航电子信息技术有限公司 | A kind of high-density sealed adapter |
| CN206541963U (en) * | 2017-03-22 | 2017-10-03 | 成都雷电微力科技有限公司 | Functional circuit module attachment structure |
-
2017
- 2017-03-22 CN CN201710175264.4A patent/CN106848667A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1458722A (en) * | 2002-03-13 | 2003-11-26 | 海德罗-艾瑞公司 | Improved plane fuel pump electric connection box |
| US20030236030A1 (en) * | 2002-04-01 | 2003-12-25 | Mccormack George John | Hermetic connector |
| CN201570674U (en) * | 2009-12-14 | 2010-09-01 | 沈阳兴华航空电器有限责任公司 | Glass sintering sealing welding type rectangular connector |
| CN102576977A (en) * | 2010-01-27 | 2012-07-11 | 三菱电机株式会社 | Semiconductor laser module |
| CN202210585U (en) * | 2011-04-19 | 2012-05-02 | 中国电子科技集团公司第二十三研究所 | Airtight and watertight multi-core sealing assembly |
| CN202534855U (en) * | 2011-11-12 | 2012-11-14 | 高文彬 | Air-tight seal cylindrical connector |
| CN104518377A (en) * | 2013-10-04 | 2015-04-15 | Hgst荷兰有限公司 | Hard disk drive with feedthrough connector |
| CN105375941A (en) * | 2015-11-18 | 2016-03-02 | 成都雷电微力科技有限公司 | Mini-type high-density integrated T/R module structure |
| CN106252940A (en) * | 2016-09-22 | 2016-12-21 | 西安雷航电子信息技术有限公司 | A kind of high-density sealed adapter |
| CN206541963U (en) * | 2017-03-22 | 2017-10-03 | 成都雷电微力科技有限公司 | Functional circuit module attachment structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170613 |