CN105358950B - Piezoelectric transducer - Google Patents

Piezoelectric transducer Download PDF

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Publication number
CN105358950B
CN105358950B CN201480037748.7A CN201480037748A CN105358950B CN 105358950 B CN105358950 B CN 105358950B CN 201480037748 A CN201480037748 A CN 201480037748A CN 105358950 B CN105358950 B CN 105358950B
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China
Prior art keywords
electrode
grounding electrode
notch
signal electrode
piezoelectric patches
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CN201480037748.7A
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Chinese (zh)
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CN105358950A (en
Inventor
神谷信人
八田文吾
冈林赏纯
森本直之
玉井义昭
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Priority claimed from JP2013144215A external-priority patent/JP6074331B2/en
Priority claimed from JP2013203029A external-priority patent/JP6110267B2/en
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN105358950A publication Critical patent/CN105358950A/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/09Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/08Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices, i.e. electric circuits therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/30Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302Sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The piezoelectric transducer of the present invention has:Piezoelectric patches;First grounding electrode, it folds integration in the first surface layer of above-mentioned piezoelectric patches, and has the first notch;Signal electrode, it folds integration in the second surface layer of above-mentioned piezoelectric patches, and has the 3rd notch;Second grounding electrode, it is laminated integrated with the state being electrically insulated with above-mentioned signal electrode on above-mentioned signal electrode, and there is the second notch, the above-mentioned notch of above-mentioned signal electrode, above-mentioned first grounding electrode and the second grounding electrode at least overlaps in a part on the thickness direction of above-mentioned piezoelectric patches each other, and the part of the above-mentioned piezoelectric patches exposed from the part that the above-mentioned notch of above-mentioned signal electrode, above-mentioned first grounding electrode and the second grounding electrode overlaps on the thickness direction of above-mentioned piezoelectric patches each other is set to exposed division.

Description

Piezoelectric transducer
Technical field
The present invention relates to the piezoelectric transducer that can maintain excellent piezoelectricity for a long time
Background technology
It is known that the bio-signal sensor of sensor is used as using piezoelectric patches.When will be by pulse wave, breathing, body movement When the pressure of generation puts on piezoelectric patches, the electric signal of size corresponding with pressure can be produced by piezoelectric patches, using the telecommunications Number detection bio signal.
Patent document 1 discloses following piezoelectric transducer:Possess the piezoelectrics being made of high molecular material, configuration exists The side of above-mentioned piezoelectrics and in first insulator the first electrode supporting part of carrying signal electrode, configuration in above-mentioned piezoelectrics Opposite side and in second insulator carry grounding electrode second electrode supporting part, above-mentioned piezoelectrics, it is above-mentioned first electricity When pole supporting part, the overlapping side of above-mentioned second electrode supporting part look up, above-mentioned piezoelectricity is incorporated in above-mentioned signal electrode In the region of body, and above-mentioned piezoelectrics are integrally incorporated in the area in the region of above-mentioned grounding electrode or with above-mentioned grounding electrode The mode that domain overlaps configures.
Patent document 1:No. 5044196 publication of patent
But the piezoelectrics for forming above-mentioned piezoelectric transducer become by fixative for example as shown in Fig. 1 of patent document 1 The state of sealing.Fixative is usually made of bonding agent, and when manufacturing piezoelectric transducer, the adhesive applicating containing solvent is existed After on component parts, make evaporation of the solvent, the removal contained in bonding agent, thus make piezoelectric patches and signal electrode and grounding electrode Stacking integration.
On the other hand, piezoelectric patches is usually made of synthetic resin, since synthetic resin can make vapor or gas (gas) shape Organic compound pass through, so in the manufacture of piezoelectric transducer, vapor or gasiform organic compound are possible to ooze Thoroughly into piezoelectric patches, in this way, when vapor or gasiform organic compound penetrate into piezoelectric patches, then the pressure of piezoelectric patches can be produced The problem of electrically declining.
It is sometimes molten in bonding agent in the manufacture of piezoelectric transducer in the case of using the bonding agent containing solvent Agent penetrates into the residual monomer contained in piezoelectric patches, or bonding agent and penetrates into piezoelectric patches.When solvent or residual monomer etc. once Piezoelectric patches is penetrated into, then can be sealed as described above by fixative because of the piezoelectric patches for the piezoelectric transducer for forming patent document 1, and Cannot make to penetrate into solvent in piezoelectric patches or residual monomer to piezoelectric patches external diffusion, remove, as a result, producing piezoelectric patches The problem of piezoelectricity declines.
In addition, as the bonding agent for forming fixative, mostly using acrylic-based adhesives, due to acrylic-based adhesives With polarity, so acrylic-based adhesives have, easily the property containing vapor, vapor are possible to ooze via fixative Piezoelectric patches is arrived thoroughly, can not make to penetrate into the vapor in piezoelectric patches in this case to piezoelectric patches external diffusion, removal, produce The problem of piezoelectricity of piezoelectric patches declines.
The content of the invention
Under piezoelectricity caused by the present invention provides a kind of infiltration almost without as vapor, solvent or residual monomer etc. Drop and maintain the piezoelectric transducer of excellent piezoelectricity for a long time.
The piezoelectric transducer of first aspect present invention has:
Piezoelectric patches;
First grounding electrode, it folds integration in the first surface layer of the piezoelectric patches, and has the first notch;
Signal electrode, it folds integration in the second surface layer of the piezoelectric patches, and has the 3rd notch;
Second grounding electrode, it is laminated one with the state being electrically insulated with the signal electrode on the signal electrode Change, and there is the second notch,
The notch of the signal electrode, first grounding electrode and the second grounding electrode is each other at least at one Divide and overlap on the thickness direction of the piezoelectric patches,
By from the notch of the signal electrode, first grounding electrode and the second grounding electrode each other described The part for the piezoelectric patches that the part to overlap on the thickness direction of piezoelectric patches is exposed is set to exposed division.
In the piezoelectric transducer of second aspect of the present invention, the second grounding electrode by will in the second electrical insulation sheet layer successively Fold second grounding electrode and the second fixation oxidant layer and the second grounding electrode piece that is integrated and forming is consolidated using described second Determine oxidant layer and be bonded in the second face and the integration of piezoelectric patches, so that integration is laminated on the second face of the piezoelectric patches,
Signal electrode in the 3rd electrical insulation sheet by that will stack gradually the signal electrode and the 3rd fixation oxidant layer and one Body and the signal electrode piece that forms is bonded in the second grounding electrode on piece and integration using the described 3rd fixation oxidant layer, So as to be laminated integration on the signal electrode,
In the part that the end face of the signal electrode piece and the end face of the second grounding electrode piece intersect, in the signal The 4th electrical insulation sheet is accompanied between electrode slice and the second grounding electrode piece.
In the piezoelectric transducer of third aspect present invention, the first notch of the first grounding electrode, the second grounding electrode Second notch, a part for signal electrode are overlapping at least partially on the thickness direction of piezoelectric patches, will be described heavy The part of conjunction is set to signal electrode connecting portion,
3rd notch of the signal electrode, a part for first grounding electrode, second grounding electrode A part is overlapping at least partially on the thickness direction of piezoelectric patches, and the part of the coincidence is set to grounding electrode uses Connecting portion,
In addition, the piezoelectric transducer also has:
With terminal is pierced through, there is signal electrode the puncture signal electrode to be electrically connected with connecting portion with the signal electrode for it The claw connect and the protrusion connecting portion protruded outward from the outer peripheral edge of the piezoelectric patches;
Grounding electrode with piercing through terminal, its have pierce through the grounding electrode connecting portion and with first grounding electrode And second claw that is electrically connected of grounding electrode and the protrusion connecting portion that is protruded outward from the outer peripheral edge of the piezoelectric patches.
The piezoelectric transducer of first aspect with as described above due to forming, so even in the manufacture of piezoelectric transducer In, vapor, solvent, residual monomer etc. penetrate into form piezoelectric transducer piezoelectric patches in, also piezoelectric transducer formed with Electrode and signal electrode covering and the exposed division that exposes in extraneous gas of two sides are not grounded.It can make to penetrate into piezoelectric patches The impurity compounds such as vapor, solvent and residual monomer are successfully diffused into outside piezoelectric patches from the two sides of exposed division.Therefore, this hair The decline of bright piezoelectric transducer piezoelectricity caused by almost without its piezoelectric patches is penetrated into as gas, piezoelectric transducer are tieed up for a long time Hold excellent piezoelectricity.
The piezoelectric transducer of second aspect is due to above-mentioned composition, so can be by by signal electrode piece and First, the second grounding electrode piece pastes simple process as integration on piezoelectric patches and manufacture is effectively performed.
In addition, the second piezoelectric transducer due to the end face of signal electrode piece and the end face of the second grounding electrode piece intersection Part, the 4th electrical insulation sheet is accompanied between signal electrode piece and the second grounding electrode piece, so signal electrode and the second ground connection Electrode is unlikely to unintentionally that short circuit occurs, and stably can be taken out the current potential produced by piezoelectric patches by signal electrode.
The piezoelectric transducer of the third aspect will be due to above-mentioned composition, so piezoelectric patches can not be damaged, easily will Conducting wire is electrically connected with piezoelectric patches.
In above-mentioned piezoelectric patches, signal electrode (below, sometimes will with terminal and grounding electrode puncture terminal is pierced through The two is combined and is referred to as " puncture terminal ") the face of piezoelectric patches side of protrusion connecting portion be set to leading for connecting wire In the case of line joint face, piezoelectric sensing can either be made using solder in the lead connecting surface for the protrusion connecting portion for piercing through terminal The thickness of device is thin as much as possible, also can easily be connected conducting wire with electrode with terminal is pierced through, and can realize that piezoelectricity passes The miniaturization of sensor.
In above-mentioned piezoelectric transducer, in the signal electrode prominent connection for piercing through terminal and grounding electrode puncture terminal In the case that portion is formed with the clamping piece for clamping the conducting wire being connected with lead connecting surface, conducting wire is clamped by using clamping piece And conducting wire can be securely fixed in lead connecting surface, the piezoelectric transducer of reliability higher can be obtained.
Brief description of the drawings
Fig. 1 is the plan for representing the piezoelectric transducer of the present invention;
Fig. 2 is the II-II line profiles of Fig. 1;
Fig. 3 is the III-III line profiles of Fig. 1;
Fig. 4 is the exploded perspective view of the piezoelectric transducer of Fig. 1;
Fig. 5 is the stereogram for the piezoelectric transducer for representing Fig. 1;
Fig. 6 is the plan of another for representing the piezoelectric transducer of the present invention;
Fig. 7 is the VII-VII line profiles of Fig. 6;
Fig. 8 is the VIII-VIII line profiles of Fig. 6;
Fig. 9 is the exploded perspective view of the piezoelectric transducer of Fig. 6;
Figure 10 is the plan for an example again for representing the piezoelectric transducer of the present invention;
Figure 11 is the exploded perspective view of the piezoelectric transducer of Figure 10;
Figure 12 is the stereogram for the manufacturing process for representing electrode slice;
Figure 13 is the profile for the manufacturing process for representing electrode slice;
Figure 14 is the stereogram for representing to pierce through terminal;
Figure 15 is the stereogram for the another example for representing piezoelectric transducer;
Figure 16 is the plan for the piezoelectric transducer for representing Figure 15;
Figure 17 is the longitudinal sectional drawing of the signal electrode connecting portion of the piezoelectric transducer of Figure 15;
Figure 18 is the longitudinal sectional drawing of the grounding electrode connecting portion of the piezoelectric transducer of Figure 15;
Figure 19 is the plan for other an examples for representing piezoelectric transducer;
Figure 20 is the XX-XX line profiles of Figure 19;
Figure 21 is the XXI-XXI line profiles of Figure 19;
Figure 22 is the exploded perspective view for the piezoelectric transducer for representing Figure 19;
Figure 23 is the stereogram for the piezoelectric transducer for representing Figure 19;
Description of symbols
3:Electrode slice
3a:First grounding electrode piece
3b:Signal electrode piece
3c:Second grounding electrode piece
5a:Signal electrode puncture terminal
5b:Grounding electrode puncture terminal
7:Electrical insulation sheet
11:Piezoelectric patches
11a:Exposed division
11b:Expose teat
12:First grounding electrode
13:Signal electrode
13b:Protuberance
14:Second grounding electrode
15、17、19:Fixed oxidant layer
16、18、20:Electrical insulation sheet
A:Piezoelectric transducer
A1:Signal electrode connecting portion
A2:Grounding electrode connecting portion
Embodiment
An example of the piezoelectric transducer of the present invention is illustrated referring to the drawings.As shown in Fig. 1~5, piezoelectric transducer A tools Have:Piezoelectric patches 11, in the first surface layer of the piezoelectric patches 11 fold integrated first grounding electrode 12, in the second face of piezoelectric patches 11 It is laminated integrated signal electrode 13, integrated second grounding electrode 14 is laminated on above-mentioned signal electrode 13.
As piezoelectric patches 11, as long as (there can be the phenomenon of piezoelectricity by applying external force and the sheet material for producing electric charge on surface Sheet material), be just not particularly limited.As piezoelectric patches 11, such as can include:To synthetic resin sheet material, (synthetic resin foams Sheet material or synthetic resin non-foamed sheet material) assign polarization form piezoelectric patches, to making inorganic piezoelectric be dispersed in resin Inorganic based sheet assign polarization form piezoelectric patches, to containing inorganic piezoelectric inorganic based sheet assign polarization form Piezoelectric patches, can precisely detect the faint bio signal such as pulse wave, high sensitivity, from easily because of the change of thickness direction Shape and for producing in terms of electric charge, preferably to synthetic resin sheet material (synthetic resin foam sheet or synthetic resin non-foamed sheet material) The piezoelectric patches that polarization forms is assigned, the piezoelectric patches that polarization forms more preferably is assigned to synthetic resin foam sheet.
As the synthetic resin for forming synthetic resin sheet material, it is not particularly limited, such as can include:Polyethylene kind tree The polyolefin resins such as fat, polypropylene-based resin, polyvinylidene fluoride, polylactic acid, liquid crystalline resin etc..As the inorganic such sheets of composition The inorganic material of material, such as can include:Lead zirconate titanate, lead titanates, potassium niobate, lithium niobate, lithium tantalate, sodium tungstate, zinc oxide, Lithium tetraborate, Ba2NaNb5O5、Pb2KNb5O15Deng.
Polarized method is assigned as to synthetic resin sheet material or inorganic based sheet, is not particularly limited, such as can enumerate Go out the methods of following:(1) synthetic resin sheet material or inorganic based sheet are clamped with a pair of plates electrode, by the table powered with making its The plate electrode of face contact is connected with high-voltage DC power supply, and another plate electrode is grounded, to synthetic resin sheet material or nothing Machine based sheet applies the high voltage of direct current or pulse type and injects electric charge to synthetic resin or inorganic material, to synthetic resin sheet material Or inorganic based sheet assigns polarization;(2) the surface irradiating electron beam to synthetic resin sheet material or inorganic based sheet, X-ray etc. are swum From radiation or ultraviolet, the air molecule near synthetic resin sheet material or inorganic based sheet is ionized, so that pairing Resin or inorganic based sheet assign polarization;(3) plate electrode being grounded is overlapped in synthetic resin sheet material with tightlock status Or the first face of inorganic based sheet, separate predetermined distance in the second surface side of synthetic resin sheet material or inorganic based sheet and arrange with The needle electrode or wire electrodes that the high voltage power supply of direct current is electrically connected, by electric field to the front end of needle electrode or wire electrodes Near surface concentrate and produce corona discharge, ionize air molecule, make by the polarity of needle electrode or wire electrodes and The air ion bounce-back of generation, polarization is assigned to synthetic resin or inorganic based sheet.
In the first face 11A of piezoelectric patches 11, in the part in addition to its peripheral part, it is laminated via the first fixation oxidant layer 15 There are the first electrical insulation sheet 16 and integration.In the second face 11B of piezoelectric patches 11, in the part in addition to its peripheral part, via 3rd fixation oxidant layer 17 is laminated with the 3rd electrical insulation sheet 18 and integration.In the 3rd electrical insulation sheet 18 oxidant layer is fixed via second 19 are laminated with the second electrical insulation sheet 20 and integration.In addition, if electrical insulation sheet 16,18,20 has electrical insulating property, without spy Do not limit, such as can include:Polyethylene terephthalate sheet material, polyethylene naphthalate sheet material, polyvinyl chloride Sheet material etc..
The fixative of fixed oxidant layer is formed by the bonding agent or adhesive structure of reaction system solvent system water system hot melt system Into, from the viewpoint of the sensitivity for maintaining piezoelectric patches 11, the preferred low fixative of dielectric constant.
The first grounding electrode is integrally formed with the entire surface of the face 16a of 11 side of piezoelectric patches of the first electrical insulation sheet 16 12, on first grounding electrode 12, it is integrally formed with above-mentioned first throughout entire surface and fixes oxidant layer 15.
Signal electrode 13 is integrally formed with the entire surface of the face 18a of 11 side of piezoelectric patches of the 3rd electrical insulation sheet 18, On the signal electrode 13, it is integrally formed with the above-mentioned 3rd throughout entire surface and fixes oxidant layer 17.
The second grounding electrode is integrally formed with the entire surface of the face 20a of 11 side of piezoelectric patches of the second electrical insulation sheet 20 14, on second grounding electrode 14, it is integrally formed with above-mentioned second throughout entire surface and fixes oxidant layer 19.
On the first face 11A of piezoelectric patches 11, the first grounding electrode 12 is laminated with simultaneously integrally via the first fixation oxidant layer 15 Change, the first electrical insulation sheet 16 and integration are laminated with the first grounding electrode 12.
As shown in figure 3, signal electrode 13 is laminated with via the 3rd fixation oxidant layer 17 simultaneously on the second face 11B of piezoelectric patches 11 Integration, is laminated with the 3rd electrical insulation sheet 18 and integration on signal electrode 13.And then in the 3rd electrical insulation sheet 18 via Second fixation oxidant layer 19 is laminated with the second grounding electrode 14 and integration, and the second electric insulation is laminated with the second grounding electrode 14 Piece 20 and integration.13 and second grounding electrode 14 of signal electrode becomes the shape of electrically insulated from one another by the 3rd electrical insulation sheet 18 State.
When being observed on the thickness direction of piezoelectric patches 11, the first electrical insulation sheet 16, the first grounding electrode 12 and first are fixed Oxidant layer 15 is formed as same shape, formed objects, and the 3rd electrical insulation sheet 18, signal electrode 13 and the 3rd are fixed oxidant layer 17 and be formed as Same shape, formed objects, the second electrical insulation sheet 20, the second grounding electrode 14 and the second fixation oxidant layer 19 are formed as phase similar shape Shape, formed objects.
As the method for the formation electrode in electrical insulation sheet, such as the methods of following can be included:(1) in electrical insulation sheet Coated in the conductive paste formed in adhesive containing conductive particle and make its drying;(2) by being vaporized on electrical insulation sheet Upper formation electrode;(3) in electrical insulation sheet integration is laminated using sheet metals such as copper foil, aluminium foils as electrode.
As shown in Figure 1, in integrated first, second ground connection of the first face 11A stackings of the piezoelectric patches 11 of flat rectangular Electrode 12,14 is formed as the size smaller than piezoelectric patches 11 when being observed on the thickness direction of piezoelectric patches 11.In the thickness of piezoelectric patches 11 When degree side looks up, occupied by the outer peripheral edge portion from first, second grounding electrode 12,14 and signal electrode 13 of piezoelectric patches 11 Region protrudes outward.
First grounding electrode 12 is formed as plane substantially rectangular shape body, beyond the corner of the surrounding of oblong-shaped body Part, has the first notch 12a in the flat rectangular of the outer peripheral edge opening of oblong-shaped body.In the first electrical insulation sheet 16 And first fix oxidant layer 15, by the first notch 12a of the first grounding electrode 12 projecting in a thickness direction gained part Formed with notch.First electrical insulation sheet 16 and first fix oxidant layer 15 and have and 12 same shape of the first grounding electrode, identical The flat shape of size.In addition, the second grounding electrode 14 is formed as plane substantially rectangular shape body, in the surrounding of oblong-shaped body Corner beyond part, have oblong-shaped body outer peripheral edge opening flat rectangular shape the second notch 14a. Second electrical insulation sheet 20 and second fix oxidant layer 19, by the second notch 14a of the second grounding electrode 14 in a thickness direction Projection gained is formed in part with notch.Second electrical insulation sheet 20 and second fix oxidant layer 19 and have and the second grounding electrode 14 Same shape, the flat shape of formed objects.In Fig. 1~5, illustrate the first grounding electrode 12 and the second grounding electrode 14 Be formed as formed objects, the situation of same shape, as long as but the first grounding electrode 12 and the second grounding electrode 14 in piezoelectric patches 11 Thickness direction on when observing the rwo, the first notch 12a of the first grounding electrode 12 and the second of the second grounding electrode 14 Notch 14a entire surfaces or partly overlap, then can also be different sizes or different shapes.Also wrapped in rectangle Containing square.
The shape of signal electrode 13 connects when being observed on the thickness direction of piezoelectric patches 11 than the first grounding electrode 12, second Region occupied by ground electrode 14, the first notch 12a and the second notch 14a is small.Signal electrode 13 is formed as plane substantially Oblong-shaped body, a pair of of the corner to adjoin each other of oblong-shaped body is cut away and formed with the 3rd notch 13a, 13a.Believing Protuberance 13b formed with flat rectangular between the 3rd notch 13a, 13a of number electrode 13.In the 3rd electrical insulation sheet 18 and Three fix oxidant layer 17, obtained by the 3rd notch 13a, 13a of signal electrode 13 is projected on the thickness direction of piezoelectric patches 11 Be formed in part with notch.3rd electrical insulation sheet 18 and the 3rd fix oxidant layer 17 and have and 13 same shape of signal electrode, phase With the flat shape of size.
The part of first grounding electrode 12 and the second grounding electrode 14 beyond the outer peripheral edge portion on the two sides of piezoelectric patches 11, with The state stacking integration to overlap on the thickness direction of piezoelectric patches 11.First notch 12a of the first grounding electrode 12 Overlap with the second notch 14a of the second grounding electrode 14 on the thickness direction of piezoelectric patches 11.First grounding electrode 12 As long as the first notch 12a and the second notch 14a of the second grounding electrode 14 partly overlap, it is but preferably completely heavy Close.
Moreover, signal electrode 13 is laminated integration in the second face 11B of piezoelectric patches 11.On the thickness direction of piezoelectric patches 11 During observation, in the portion that the first notch 12a of the first grounding electrode 12 and the second notch 14a of the second grounding electrode 14 are overlapped The protuberance 13b of signal electrode 13 is accommodated with point.In addition, when being observed on the thickness direction of piezoelectric patches 11, signal electrode 13 Entirety be disposed in first, second grounding electrode 12,14 and region occupied by both notch 12a, 14a.Pressing When being observed on the thickness direction of electric piece 11, become following state:Notch 13a, 13a of signal electrode 13 are disposed in be connect with first The corresponding position of corner 12c, 14c of adjoining notch 12a, 14a of 12 and second grounding electrode 14 of ground electrode.
When being observed on the thickness direction of piezoelectric patches 11, the ground connection of the first notch 12a of the first grounding electrode 12 and second Second notch 14a of electrode 14 and notch 13a, 13a of signal electrode 13 overlaps a part.That is, first, second The outer peripheral edge 13c of edge 12b, 14b of notch 12a, 14a of grounding electrode 12,14 and the protuberance 13b of signal electrode 13 it Between formed with gap.When being observed on the thickness direction of piezoelectric patches 11, oxidant layer 15 is fixed in the first electrical insulation sheet 16 and first Formed with the first notch 12a same shapes with the first grounding electrode 12, the notch of formed objects.In the thickness of piezoelectric patches 11 When degree side looks up, first with the second grounding electrode 14 is also formed with the second electrical insulation sheet 20 and the second fixation oxidant layer 19 Notch 14a same shapes, the notch of formed objects.When being observed on the thickness direction of piezoelectric patches 11, in the 3rd electric insulation Piece 18 and the 3rd fixes oxidant layer 17 and is also formed with cutting with the 3rd notch 13a same shapes of signal electrode 13, formed objects Oral area.Therefore, a part for piezoelectric patches 11 is not to be electrically insulated 16,18,20, first, second grounding electrode 12 of piece, 14, signal The state that electrode 13 and fixed oxidant layer 15,17,19 are covered and contacted with extraneous gas is exposed from above-mentioned gap, the portion that this is exposed It is divided into exposed division 11a.The exposed division 11a of piezoelectric patches 11 is with its two sides not by first, second grounding electrode 12,14, signal electricity The state that pole 13, electrical insulation sheet 16,18,20 and fixed oxidant layer 15,17,19 are covered but contacted with extraneous gas is exposed.
In the manufacture of piezoelectric transducer A, make to enter the vapor of piezoelectric patches 11, the organic solvent in bonding agent and residual The impurity compounds such as monomer are stayed successfully to be diffused into by the exposed division 11a of piezoelectric patches 11 from the two sides of piezoelectric patches 11 in air, The gas flow contained in piezoelectric patches 11 can be reduced in a short time.Therefore, it is possible to make the piezoelectricity of piezoelectric patches excellent, and energy It is enough to maintain the excellent piezoelectricity for a long time.In this way, the exposed division 11a of piezoelectric patches 11 can make the impurity compound in piezoelectric patches 11 Successfully it is diffused into from its two sides in air, so only spread with making the impurity compound in piezoelectric patches from the single side of piezoelectric patches Situation is different, can will be miscellaneous no matter the impurity compound in piezoelectric patches is present in which part of the thickness direction of piezoelectric patches Matter compound successfully spreads from piezoelectric patches, removes in a short time.
In addition, in above-mentioned piezoelectric transducer A, when being observed on the thickness direction of piezoelectric patches 11, outside its piezoelectric patches 11 Circumference dashes forward this to more prominent outward than the region occupied by first, second grounding electrode 12,14 and notch 12a, 14a What the part gone out was set to piezoelectric patches 11 exposes teat 11b.This, which exposes teat 11b and also becomes, is not electrically insulated piece 16,18,20, the First, the second grounding electrode 12,14, signal electrode 13 and the fixed covering of oxidant layer 15,17,19 but the shape that is contacted with extraneous gas State, can be such that the impurity compound for entering piezoelectric patches 11 is also diffused into from the teat 11b that exposes of piezoelectric patches 11 in air, so that Reduce the impurity compound amount contained in piezoelectric patches 11.
In addition, when being observed on the thickness direction of piezoelectric patches 11, the 3rd notch 13a of signal electrode 13 is located at and first The corresponding part of corner 12c, 14c for being adjacent to notch 12a, 14a of 12 and second grounding electrode 14 of grounding electrode, in the portion Divide and do not arrange signal electrode 13.The part is set to be used to conducting wire being connected with the first grounding electrode 12 and the second grounding electrode 14 Grounding electrode connecting portion A2, A2.
When being observed on the thickness direction of piezoelectric patches 11, the notch of the first grounding electrode 12 and the second grounding electrode 14 12a, 14a are located at part corresponding with the protuberance 13b of signal electrode 13, do not arrange the second grounding electrode 12 and in the part Two grounding electrodes 14.The part is set to for by conducting wire and the signal electrode that signal electrode 13 is connected connecting portion A1.
It is in grounding electrode connecting portion A2, conducting wire and the first grounding electrode 12 is electric when using above-mentioned piezoelectric transducer A Connection.As the method for being electrically connected conducting wire with the first grounding electrode 12, such as the following methods can be enumerated:In grounding electrode With connecting portion A2, puncture terminal is squeezed into the first grounding electrode 12 and the second grounding electrode 14, makes first, second grounding electrode 12nd, 14 it is not electrically connected and is electrically connected to each other with signal electrode 13, via the puncture terminal by conducting wire and first, second grounding electrode 12nd, 14 it is electrically connected.By being grounded the first grounding electrode 12 via the conducting wire being connected with the first grounding electrode 12, by the first ground connection Electrode 12 is set to reference electrode.
On the other hand, in signal electrode connecting portion A1, conducting wire is electrically connected with the protuberance 13b of signal electrode 13.Make For the method for being electrically connected conducting wire with the protuberance 13b of signal electrode 13, such as the following methods can be enumerated:In signal electrode With connecting portion A1, puncture terminal is squeezed into the protuberance 13b of signal electrode 13, does not make first, second grounding electrode 12,14 and letter Number electrode 13 is electrically connected and is electrically connected conducting wire with signal electrode 13 via terminal is pierced through.
Moreover, can on the basis of the first grounding electrode 12 electrode, will be produced by signal electrode 13 by piezoelectric patches 11 Current potential takes out.
More than, to conducting wire is illustrated with the piezoelectric transducer A main points being electrically connected using general puncture terminal.Make To pierce through terminal, preferably using signal electrode described later puncture terminal 5a and grounding electrode puncture terminal 5b.
As shown in figure 14, signal electrode pierces through terminal 5a and grounding electrode pierces through terminal 5b and has:Flat rectangular Plate-like substrate 51a, 51b, be based in the same direction the substrate 51a, 51b half portion 52a, 52b width Multiple claw 53a, 53b of two ora terminalis, another half portion 54a, 54b for being based in aforesaid substrate 51a, 51b in the same direction Multiple clamping piece 55a, 55b of two ora terminalis of width.Signal electrode puncture terminal 5a and grounding electrode puncture terminal Claw 53a, 53b and clamping piece 55a, 55b of 5b is projected in same direction.Signal electrode is used with puncture terminal 5a and grounding electrode The substrate 51a, 51b, claw 53a, 53b and clamping piece 55a, 55b for piercing through terminal 5b are conductive.In fig. 14, end is pierced through Claw 53a, 53b of sub- 5a, 5b are equipped with 6, and clamping piece 55a, 55b are equipped with 4, but claw 53a, 53b and clamping piece The quantity not limited to this of 55a, 55b.
As seen in figs. 15-17, passed through by the claw 53a for making signal electrode pierce through terminal 5a along the puncture of its thickness direction The signal electrode connecting portion A1 of logical piezoelectric transducer A, and the front end of claw 53a is rolled over to piezoelectric transducer A lateral bendings, it will believe Number electrode is fixed on piezoelectric transducer A in signal electrode with terminal 5a is pierced through with connecting portion A1.Signal electrode puncture terminal 5a Become the state being electrically connected with signal electrode 13.In addition, in Figure 15~17, illustrating makes signal electrode pierce through terminal 5a's The situation that claw 53a is pierced through from 13 side of signal electrode of piezoelectric transducer A (the second face 11B sides of piezoelectric patches 11), but can also For situation about being pierced through from the first face 11A sides of piezoelectric patches 11.
In the state of signal electrode is fixed on piezoelectric transducer A with puncture terminal 5a, signal electrode puncture terminal A part of the substrate 51a of 5a it is prominent outward from the outer peripheral edge of piezoelectric patches 11 and formed with prominent connecting portion 56a.Signal electrode Be formed as the conducting wire for connecting wire L with the face for projecting direction of the clamping piece 55a for the protrusion connecting portion 56a for piercing through terminal 5a Joint face 57a.
In addition, as shown in figure 18, passed through by the claw 53b for making grounding electrode pierce through terminal 5b along the puncture of its thickness direction Any one grounding electrode connecting portion A2 in logical piezoelectric transducer A, and make the front end of claw 53b to piezoelectric transducer A sides Bending, is fixed on piezoelectric transducer A in grounding electrode with terminal 5b is pierced through by grounding electrode with connecting portion A2.Grounding electrode pierces Wearing terminal 5b, the first grounding electrode 12 and the second grounding electrode 14 becomes the state being electrically connected to each other.
In the state of grounding electrode is fixed on piezoelectric transducer A with puncture terminal 5b, grounding electrode puncture terminal A part of the substrate 51b of 5b it is prominent outward from the outer peripheral edge of piezoelectric patches 11 and formed with protuberance 56b.Grounding electrode pierces The face for projecting direction for wearing the clamping piece 55b of the protuberance 56b of terminal 5b is formed as lead connecting surface for connecting wire L 57b。
Moreover, pierce through the lead connecting surface 57a of terminal 5a and leading for grounding electrode puncture terminal 5b in signal electrode Line joint face 57b has been electrically connected conducting wire L, L.Conducting wire L, L to signal electrode with the lead connecting surface 57a for piercing through terminal 5a and If grounding electrode is carried out with the connection for the lead connecting surface 57b for piercing through terminal 5b with general main points, but preferably using Solder 4 carries out.
In addition, make clamping piece 55a, 55b bending that signal electrode pierces through terminal 5a and grounding electrode pierces through terminal 5b It is upper to lead connecting surface 57a, 57b and clamp, fixed conducting wire L, L.
As described above, in the signal electrode lead connecting surface 57a and grounding electrode for piercing through terminal 5a puncture terminals 5b Lead connecting surface 57b on, be electrically connected with conducting wire L, L using solder 4 etc..As shown in FIG. 17 and 18, signal electrode pierces through The lead connecting surface 57a and grounding electrode of terminal 5a is arranged on 11 side of piezoelectric patches with the lead connecting surface 57b for piercing through terminal 5b.Cause This, even in conducting wire L, L are connected to using solder etc. lead connecting surface 57a, 57b it is upper in the case of, the thickness of piezoelectric transducer A Degree will not become the aggregate thickness of piezoelectric patches 11 and solder 4.The portion of the thickness more than piezoelectric patches 11 only in the thickness of solder 4 The incrementss of the thickness of piezoelectric transducer A are divided into, the thinner thickness of piezoelectric transducer A can be made.
In addition, as described above, conducting wire L, L pierce through terminal 5a and grounding electrode using solder etc. with being formed at signal electrode Connected with lead connecting surface 57a, 57b of protuberance 56a, the 56b for piercing through terminal 5b.For example using solder connection conducting wire L, L In the case of, in order to make melt solder, to signal electrode puncture terminal 5a and the grounding electrode protuberance for piercing through terminal 5b 56a, 56b are heated, but because signal electrode with pierce through terminal 5a and grounding electrode with pierce through protuberance 56a, 56b of terminal 5b from The outer peripheral edge of piezoelectric patches 11 protrudes outward, so can mitigate the heat transmitted to piezoelectric patches 11, can suppress piezoelectric patches 11 It is damaged because of heat.
In addition, pierce through terminal 5a and grounding electrode thorn being connected using solder by conducting wire L, L, being fixed on signal electrode In the case of lead connecting surface 57a, 57b for wearing terminal 5b, if signal electrode pierced with puncture terminal 5a and grounding electrode Protuberance 56a, the 56b for wearing terminal 5b are positioned on the high plate of the conductivities of heat such as metallic plate, then can make to put on signal electrode use Terminal 5a and grounding electrode is pierced through to be discharged and reduced to the high plate of conductivity of heat with the heat of protuberance 56a, 56b for piercing through terminal 5b The heat transmitted to piezoelectric patches 11, can more reliably suppress piezoelectric patches 11 and be damaged because of heat.
When using piezoelectric transducer A, by being grounded the first grounding electrode 12 via conducting wire L, and the first ground connection is electric Pole 12 is set to reference electrode, and conducting wire L pierces through terminal 5b via grounding electrode and is connected with the first grounding electrode 12.Can be with Electrode on the basis of one grounding electrode 12, piercing through terminal 5a by signal electrode 13 and signal electrode will be produced by piezoelectric patches 11 Current potential takes out.
In above-mentioned piezoelectric transducer A, when being observed on the thickness direction of piezoelectric patches 11, the outer peripheral edge portion of piezoelectric patches 11 from First grounding electrode 12, the second grounding electrode 14 and the region occupied by notch 12a, 14a protrude outward.Such as the institute of Fig. 6~9 Show, when being observed on the thickness direction of piezoelectric patches 11, the first grounding electrode 12, the second grounding electrode 14 and notch 12a, 14a Occupied region and piezoelectric patches 11 can also be formed as same shape, formed objects, and the outer peripheral edge of piezoelectric patches 11 can not also Protruded outward from the region shared by the first grounding electrode 12, the second grounding electrode 14 and notch 12a, 14a.In addition, on The construction identical with the piezoelectric transducer of Fig. 1, marks same mark and omits the description.
First grounding electrode 12, the first electrical insulation sheet 16, first fix oxidant layer 15, second the 14, second electricity of grounding electrode absolutely Embolium 20, second is fixed oxidant layer 19, signal electrode 13, the shape of the 3rd electrical insulation sheet the 20, the 3rd fixation oxidant layer 19 and is not limited to State bright shape.As shown in Figures 10 and 11, it is substantially long to be formed as plane for the first grounding electrode 12 and the second grounding electrode 14 It is square, any one corner of oblong-shaped body is cut away and forms notch 12a, 14a.Pressed by the first grounding electrode 12 The first face 11A stacking integrations of electric piece 11, and the second grounding electrode 14 is laminated to one on the second face 11B of piezoelectric patches 11 In the state of change, to be formed at the first notch 12a of the first grounding electrode 12 and be formed at the second of the second grounding electrode 14 The mode that notch 14a is mutually partially or completely overlapped is formed.
In addition, when being observed on the thickness direction of piezoelectric patches 11, signal electrode 13 has than the first grounding electrode 12, second The small size in region occupied by grounding electrode 14, the first notch 12a and the second notch 14a.Signal electrode 13 is formed as Plane is generally rectangular.Signal electrode 13 has the 3rd notch 13a by the way that the arbitrary corner of oblong-shaped body is cut away, The corner abutted with the 3rd notch 13a is set to protuberance 13b.By signal electrode 13 piezoelectric patches 11 the second face 11B Under the upper integrated state of stacking, when being observed on the thickness direction of piezoelectric patches 11, the first notch of the first grounding electrode 12 The notch 13a of 12a, the second notch 14a of the second grounding electrode 14 and signal electrode 13 are partly overlapped.In piezoelectric patches 11 Thickness direction on when observing, the protuberance 13b of signal electrode 13 becomes the notch 12a for being incorporated in the first grounding electrode 12 And second grounding electrode 14 notch 14a in state.Moreover, notch 12a in first, second grounding electrode 12,14, Formed with gap between the outer peripheral edge 13c of edge 12b, 14b of 14a and the protuberance 13b of signal electrode 13.The one of piezoelectric patches 11 Part with not by first, second grounding electrode 12,14, signal electrode 13, electrical insulation sheet 16,18,20 and fixed oxidant layer 15,17, 19 states for covering but being contacted with extraneous gas are exposed from above-mentioned gap, and the part that this is exposed is set to exposed division 11a.This Outside, when being observed on the thickness direction of piezoelectric patches 11, the entirety of signal electrode 13, which becomes, is disposed in first, second grounding electrode 12nd, 14 and its notch 12a, 14a occupied by region in state.When being observed on the thickness direction of piezoelectric patches 11, first Electrical insulation sheet 16, the first grounding electrode 12 and the first fixation oxidant layer 15 are formed as same shape, formed objects, the 3rd electrical insulation sheet 18th, the fixation of signal electrode 13 and the 3rd oxidant layer 17 is formed as same shape, formed objects, the second electrical insulation sheet 20, second ground connection Electrode 14 and second fixes oxidant layer 19 and is formed as same shape, formed objects.On same with the piezoelectric transducer shown in Fig. 1~9 The composition part of sample, the description thereof will be omitted.
To the flat shape of first, second grounding electrode 12,14 and signal electrode 13 is formed in above-mentioned piezoelectric transducer A It is illustrated for the situation of substantially rectangular shape, but the flat shape of first, second grounding electrode 12,14 and signal electrode 13 Rectangle is not necessarily, such as can also be polygon, ellipse, the positive round such as the triangle beyond rectangle, pentagon, hexagon The circles such as shape.
Then, the manufacture method of above-mentioned piezoelectric transducer A is illustrated.System as the piezoelectric transducer A of the present invention Method is made, such as can be manufactured by the way that electrode slice 3 to be pasted onto to two sides and the integration of piezoelectric patches 11.
As shown in FIG. 12 and 13, for electrode slice 3, laminates B is manufactured, laminates B will be by that will become fixative The adhesive layer 32 of layer, the electrode layer 33 as electrode, electrical insulation sheet 34 stack gradually integrated state and are layered in first Face implements in the demoulding process face 30 of the substrate sheets 31 formed by synthetic resin sheet material etc. of demoulding processing and forms.In addition, The demoulding process face 30 and adhesive layer 32 of substrate sheets 31 are strippingly laminated.Electrode layer 33 and electrical insulation sheet 34 can also be via Adhesive layer (not shown) and be laminated integration.
Afterwards, using cutoff tool desirable shape is cut into from the lateral substrate sheets 31 of electrical insulation sheet 34.At this time, substrate sheets 31 can both be cut off, and can not also be cut off.In this way, for grounding electrode or signal electrode manufacture respectively will fixed oxidant layer, Electrode, electrical insulation sheet stacking integration and the electrode slice 3 with desirable shape.In addition, electrode slice 3 is fixing oxidant layer from it Sur-face peeling, eliminate and used after substrate sheets.In fig. 12, the situation formed with grounding electrode piece is illustrated.
First grounding electrode piece 3a is sequentially laminated with the first electrical insulation sheet 16, the first grounding electrode 12 and first fixes oxidant layer 15 simultaneously integrations, the first electrical insulation sheet 16, the first grounding electrode 12 and the first fixation oxidant layer 15 are all formed as same shape, phase Same size.Moreover, the first grounding electrode piece 3a is bonded in the first face of piezoelectric patches 11 by using its first fixation oxidant layer 15 11A and integration so that the first grounding electrode 12 piezoelectric patches 1 the first face 11A stackings integration (with reference to Fig. 4, Fig. 5 and Figure 19~23).First grounding electrode piece 3a is formed as that plane is generally rectangular, beyond the corner of the surrounding of oblong-shaped body Part, has the 4th notch 31a in the flat rectangular of the outer peripheral edge opening of oblong-shaped body.
Signal electrode piece 3b stacks gradually the 3rd electrical insulation sheet 18, signal electrode 13 and the 3rd fixes oxidant layer 17 and integral Change, the 3rd electrical insulation sheet 18, signal electrode 13 and the 3rd fix oxidant layer 17 and be all formed as same shape, formed objects.Moreover, Signal electrode piece 3b is bonded in the second face 11B and the integration of piezoelectric patches 11 by using the 3rd fixation oxidant layer 17, so that Second face 11B stacking integration of the signal electrode 13 in piezoelectric patches 11 (with reference to Fig. 4, Fig. 5 and Figure 19~23).Signal electrode piece 3b Be formed as that plane is generally rectangular, by cutting away in a pair of of the corner to adjoin each other of oblong-shaped body and formed with the 5th notch Portion 31b, 31b.
Second grounding electrode piece 3c stacks gradually the second electrical insulation sheet 20, the second grounding electrode 14 and second fixes oxidant layer 19 And integration, the second electrical insulation sheet 20, the second grounding electrode 14 and the second fixation oxidant layer 19 are all formed as same shape, identical Size.Moreover, second grounding electrode piece 3c is bonded in signal electrode piece 3b on and integral by using the second fixation oxidant layer 19 Change, so that the first grounding electrode 12 is laminated integration on signal electrode piece 3b, form piezoelectric transducer A (with reference to Fig. 4, Fig. 5 And Figure 19~23).Second grounding electrode piece 3c is formed as that plane is generally rectangular, beyond the corner of the surrounding of oblong-shaped body Part, have oblong-shaped body outer peripheral edge opening flat rectangular the 6th notch 31c.
On the other hand, as described above, signal electrode piece 3b and the second grounding electrode piece 3c are manufactured by the following method:It is accurate It is standby successively by as the adhesive layer 32, the electrode layer 33 as electrode, electrical insulation sheet 34 of fixed oxidant layer mutually in substrate sheets The laminates B for demoulding process face stacking integration and forming, using cutoff tool from the lateral substrate sheets 31 of electrical insulation sheet 34 by the layer Adhesive layer 32, electrode layer 33 and the electrical insulation sheet 34 of lamination B is cut to desirable shape.
However, when manufacturing electrode slice cutting off laminates B using cutoff tool, can be to electrode layer in the thickness direction thereof Apply the shear stress as caused by cutoff tool.The electrode layer of laminates is formed by soft material mostly.Therefore, sometimes into A part for electrode layer, that is, electrode after cut-out extends because of the shear stress of cutoff tool and is attached to the section of laminates The state of the cut-out end face of i.e. obtained electrode slice.
When as the state for the part for being attached with electrode in the cut-out end face of electrode slice, it is possible to following feelings occur Condition:Between the signal electrode piece and the second grounding electrode piece for the arranging that adjoins each other, in the cut-out end face of signal electrode piece and The part that the cut-out end face of two grounding electrode pieces intersects, is being attached to the signal electrode of the cut-out end face of signal electrode piece and attachment Short circuit occurs between the second grounding electrode of the cut-out end face of the second grounding electrode piece.When the cut-out for being attached to signal electrode piece When short circuit occurs for the signal electrode of end face and the second grounding electrode of the cut-out end face for being attached to the second grounding electrode piece, it is impossible to logical Signal electrode is crossed to take out the current potential produced by piezoelectric patches 11.
Therefore, signal electrode piece 3b the 5th notch 31b cut-out end face 311b and the second grounding electrode piece 3c The part 6 that the cut-out end face 311c of 6th notch 31c intersects, is pressed from both sides between signal electrode piece 3b and the second grounding electrode piece 3c There is electrical insulation sheet 7, prevent from being attached to the signal electrode 13 of the cut-out end face of signal electrode piece 3b and being attached to the second ground connection electricity Short circuit occurs between second grounding electrode 14 of the cut-out end face of pole piece 3c.As long as in the cut-out end face of signal electrode piece 3b and The part 6 that the cut-out end face of two grounding electrode piece 3c intersects at least accompanies electrical insulation sheet 7, can also include signal electrode Near the part 6 and the part 6 of the intersection that the cut-out end face of piece 3b and the cut-out end face of the second grounding electrode piece 3c intersect Part accompany electrical insulation sheet 7.
If above-mentioned electrical insulation sheet 7 has electrical insulating property, it is not particularly limited, such as can includes:Poly- terephthaldehyde Sour glycol ester sheet material, polyethylene naphthalate sheet material, polychlorovinyl sheet material etc..
Alternatively, it is also possible to make bonding agent 71 the one side stacking integration of electrical insulation sheet 7 and with signal electrode piece 3b or the Either one bonding and integration in two grounding electrode piece 3c.In addition, as bonding agent, from the sensitivity for maintaining piezoelectric patches 11 From the point of view of viewpoint, the preferred low fixative of dielectric constant.
Known electro-magnetic wave shield can also be utilized to cover piezoelectric transducer A, signal electrode shown in above-mentioned Fig. 1~23 With part or all pierced through in terminal 5a, grounding electrode puncture terminal 5b and conducting wire L.With grounding electrode puncture terminal 5b and/or grounding electrode are electrically connected with the conducting wire L and electron waves shielding case for piercing through terminal 5b connections.Pass through electro-magnetic wave shield energy Enough piezoelectric transducer A that further suppresses are influenced be subject to from exterior electromagnetic wave.As electro-magnetic wave shield, do not limit especially It is fixed, such as metal housing, metal foil etc. can be included.In the situation using electro-magnetic wave shield covering piezoelectric transducer A Down, it is necessary to the state that the exposed division 11a for being maintained piezoelectric transducer A is contacted with extraneous gas.
(related application cross-referenced)
This application claims based on Japanese patent application filed in 10 days July in 2013 the 2013-144211st, 2013 years 7 Japanese patent application filed in Japanese patent application filed in months 10 days the 2013-144215th and September in 2013 30 days the The priority of No. 2013-203029, the disclosure of these applications are incorporated into this specification by referring to entire contents.
Industrial applicability
The piezoelectric transducer of the present invention can maintain excellent piezoelectricity for a long time, can be used as being used to detect pulse wave, breathing and body The biology sensor of the bio signals such as body activity, the sensor current for detecting automobile, bicycle and people etc..

Claims (11)

1. a kind of piezoelectric transducer, it is characterised in that have:
Piezoelectric patches;
First grounding electrode, it folds integration in the first surface layer of the piezoelectric patches, and has the first notch;
Signal electrode, it folds integration in the second surface layer of the piezoelectric patches, and has the 3rd notch;
Second grounding electrode, its be laminated with the state being electrically insulated with the signal electrode on the signal electrode it is integrated, and With the second notch,
The notch of the signal electrode, first grounding electrode and the second grounding electrode at least exists in a part each other Overlap on the thickness direction of the piezoelectric patches,
By from the notch of the signal electrode, first grounding electrode and the second grounding electrode each other in the piezoelectricity The part for the piezoelectric patches that the part to overlap on the thickness direction of piece is exposed is set to exposed division.
2. piezoelectric transducer as claimed in claim 1, it is characterised in that
First grounding electrode has the first notch in its ora terminalis opening, and the second grounding electrode has the of its ora terminalis opening Two incisions portion, signal electrode have the 3rd notch in its ora terminalis opening.
3. piezoelectric transducer as claimed in claim 1 or 2, it is characterised in that
First grounding electrode and the second grounding electrode have the ora terminalis opening in addition to corner in flat rectangular shape body respectively The first notch and the second notch, and signal electrode has a pair of of the corner to adjoin each other of flat rectangular shape body The 3rd notch for cutting away and being formed, formed with protuberance between the 3rd notch.
4. piezoelectric transducer as claimed in claim 1 or 2, it is characterised in that
When being observed on the thickness direction of the piezoelectric patches, the peripheral end of piezoelectric patches from signal electrode, the first grounding electrode and Region occupied by second grounding electrode protrudes outward, exposes teat by what the part of the protrusion was set to the piezoelectric patches.
5. piezoelectric transducer as claimed in claim 1 or 2, it is characterised in that
Second grounding electrode in the second electrical insulation sheet by that will stack gradually second grounding electrode and the second fixation oxidant layer And integration and the second grounding electrode piece for forming are bonded in the second face of piezoelectric patches and integral using the described second fixation oxidant layer Change, so that integration is laminated on the second face of the piezoelectric patches,
Signal electrode in the 3rd electrical insulation sheet by that will stack gradually the signal electrode and the 3rd fixation oxidant layer and integration And the signal electrode piece formed is bonded in the second grounding electrode on piece and integration using the described 3rd fixation oxidant layer, so that Integration is laminated on the signal electrode,
In the part that the end face of the signal electrode piece and the end face of the second grounding electrode piece intersect, in the signal electrode The 4th electrical insulation sheet is accompanied between piece and the second grounding electrode piece.
6. piezoelectric transducer as claimed in claim 5, it is characterised in that
Signal electrode piece by using cutoff tool will stack gradually adhesive layer, signal electrode layer and electrical insulation sheet and integration and The laminates of composition are formed from the lateral adhesive layer cut-out of the electrical insulation sheet, also,
Second grounding electrode piece will stack gradually adhesive layer, the second ground electrode layer and electrical insulation sheet simultaneously by using cutoff tool Laminates that are integrated and forming are formed from the lateral adhesive layer cut-out of the electrical insulation sheet.
7. piezoelectric transducer as claimed in claim 5, it is characterised in that
Signal electrode piece has the 4th notch, and the second grounding electrode piece has the 5th notch, the end of the 4th notch Face and the end face of the 5th notch intersect, in the part of the intersection, in the signal electrode piece and the second grounding electrode piece Between accompany the 4th electrical insulation sheet.
8. piezoelectric transducer as claimed in claim 6, it is characterised in that
Signal electrode piece has the 4th notch, and the second grounding electrode piece has the 5th notch, the end of the 4th notch Face and the end face of the 5th notch intersect, in the part of the intersection, in the signal electrode piece and the second grounding electrode piece Between accompany the 4th electrical insulation sheet.
9. piezoelectric transducer as claimed in claim 1 or 2, it is characterised in that
First notch of the first grounding electrode, the second notch of the second grounding electrode, a part for signal electrode are in piezoelectricity Overlapping at least partially on the thickness direction of piece, the part of the coincidence be set to signal electrode connecting portion,
3rd notch of the signal electrode, a part for first grounding electrode, one of second grounding electrode Divide and overlapping at least partially on the thickness direction of piezoelectric patches, the part of the coincidence is set to grounding electrode connection Portion,
In addition, the piezoelectric transducer also has:
For signal electrode with terminal is pierced through, it has what is pierced through the signal electrode connecting portion and be electrically connected with the signal electrode Claw and the protrusion connecting portion protruded outward from the outer peripheral edge of the piezoelectric patches;
Grounding electrode with piercing through terminal, its have pierce through the grounding electrode connecting portion and with first grounding electrode and the The claw that two grounding electrodes are electrically connected and the protrusion connecting portion protruded outward from the outer peripheral edge of the piezoelectric patches.
10. piezoelectric transducer as claimed in claim 9, it is characterised in that
Signal electrode is set to use with terminal and grounding electrode is pierced through with the face of the piezoelectric patches side for the protrusion connecting portion for piercing through terminal In the lead connecting surface of connecting wire.
11. piezoelectric transducer as claimed in claim 10, it is characterised in that
In signal electrode with the protrusion connecting portion of puncture terminal and grounding electrode puncture terminal formed with for clamping and conducting wire The clamping piece of the conducting wire of joint face connection.
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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6983490B2 (en) * 2016-03-29 2021-12-17 ローム株式会社 Electronic components
EP3502641B1 (en) * 2016-09-27 2021-01-27 Mitsui Chemicals, Inc. Piezoelectric substrate attachment structure, sensor module, moving body, and protecting body
JP6862820B2 (en) * 2016-12-26 2021-04-21 セイコーエプソン株式会社 Ultrasonic devices and ultrasonic devices
JP2019174234A (en) * 2018-03-28 2019-10-10 セイコーエプソン株式会社 Sensor element, sensor device, force detector, and robot
TWI679784B (en) * 2018-04-09 2019-12-11 中原大學 Piezoelectric sensing module, piezoelectric sensing module detecting method, and piezoelectric sensing detection system thereof
US20210038092A1 (en) * 2019-08-09 2021-02-11 Apple Inc. Layered Sensor Having Multiple Laterally Adjacent Substrates in a Single Layer
CN115553755B (en) * 2022-10-29 2023-07-25 宁波韧和科技有限公司 Dual-capacitance strain sensor, preparation method thereof and respiration monitoring belt

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4443730A (en) * 1978-11-15 1984-04-17 Mitsubishi Petrochemical Co., Ltd. Biological piezoelectric transducer device for the living body
US6394960B1 (en) * 1999-03-11 2002-05-28 Seiko Instruments Inc. Pulse wave detecting device and method for manufacturing the same, and portable wrist device
CN101784874A (en) * 2007-08-28 2010-07-21 爱信精机株式会社 Piezoelectric film sensor

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5044196Y1 (en) 1970-10-08 1975-12-17
JPS58180063A (en) 1982-04-15 1983-10-21 Seiko Epson Corp Thin film transistor
US4499394A (en) * 1983-10-21 1985-02-12 Koal Jan G Polymer piezoelectric sensor of animal foot pressure
DE3709533A1 (en) * 1986-03-27 1987-10-15 Nettelhorst Frhr Von Herwig Dr Sensor for mechanical forces preceding from animal or human bodies
EP0355289A1 (en) * 1988-07-01 1990-02-28 ATOCHEM NORTH AMERICA, INC. (a Pennsylvania corp.) Accelerometer
JPH0555656A (en) * 1991-08-29 1993-03-05 Toyota Motor Corp Electrode structure of piezoelectric element
JP3548280B2 (en) * 1995-06-29 2004-07-28 シルバー株式会社 Fluid transfer abnormality detection device
JPH10332509A (en) * 1997-05-27 1998-12-18 Amp Japan Ltd Piezoelectric pressure sensor
JP2002016301A (en) * 2000-06-28 2002-01-18 Matsushita Electric Ind Co Ltd Flexible piezoelectric element and abnormality monitor using the same
JP2002340700A (en) * 2001-05-14 2002-11-27 Matsushita Electric Ind Co Ltd Piezoelectric sensor
WO2004031711A1 (en) * 2002-10-01 2004-04-15 National Institute Of Advanced Industrial Science And Technology Piezoelectric sensor and input device comprising same
JP2005156531A (en) * 2003-11-05 2005-06-16 Sony Corp Pressure sensor and biological information processor
EP1777669A1 (en) * 2004-08-04 2007-04-25 Matsushita Electric Industrial Co., Ltd. Invasion detection device
JP2007017420A (en) * 2004-10-28 2007-01-25 Matsushita Electric Ind Co Ltd Piezo-electric element and its manufacturing method
WO2006080301A1 (en) 2005-01-25 2006-08-03 The Furukawa Electric Co., Ltd. Three-dimensional wiring body for mounting electronic component and electronic component mounting structure
JP5044196B2 (en) * 2006-11-13 2012-10-10 アイシン精機株式会社 Piezoelectric sensor and manufacturing method thereof
JP5066551B2 (en) * 2008-05-20 2012-11-07 日本電波工業株式会社 Piezoelectric sensor and sensing device
US8264129B2 (en) * 2010-07-21 2012-09-11 General Electric Company Device and system for measuring material thickness
US8963402B2 (en) * 2010-11-30 2015-02-24 Seiko Epson Corporation Piezoelectric vibrator element, piezoelectric module, and electronic device
JP2012186727A (en) * 2011-03-07 2012-09-27 Seiko Instruments Inc Piezoelectric vibrating reed manufacturing method, piezoelectric vibrating reed manufacturing apparatus, piezoelectric vibrating reed, piezoelectric transducer, oscillator, electronic apparatus and atomic clock
JP5811588B2 (en) * 2011-05-18 2015-11-11 国立大学法人佐賀大学 Compound sensor
US9864450B2 (en) * 2013-06-04 2018-01-09 Nissha Co., Ltd. Piezoelectric sensor and pressure detection apparatus
US9427967B2 (en) * 2014-07-28 2016-08-30 Rohm Co., Ltd. Piezoelectric membrane, piezoelectric device, and inkjet head

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4443730A (en) * 1978-11-15 1984-04-17 Mitsubishi Petrochemical Co., Ltd. Biological piezoelectric transducer device for the living body
US6394960B1 (en) * 1999-03-11 2002-05-28 Seiko Instruments Inc. Pulse wave detecting device and method for manufacturing the same, and portable wrist device
CN101784874A (en) * 2007-08-28 2010-07-21 爱信精机株式会社 Piezoelectric film sensor

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