CN105355573A - CCGA automatic column planting machine - Google Patents
CCGA automatic column planting machine Download PDFInfo
- Publication number
- CN105355573A CN105355573A CN201510740583.6A CN201510740583A CN105355573A CN 105355573 A CN105355573 A CN 105355573A CN 201510740583 A CN201510740583 A CN 201510740583A CN 105355573 A CN105355573 A CN 105355573A
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- CN
- China
- Prior art keywords
- tin
- ccga
- post
- welding column
- column
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Ceramic Products (AREA)
Abstract
The invention relates to the technical field of automation equipment, in particular to a CCGA automatic column planting machine. The CCGA automatic column planting machine comprises a machine base, wherein the front end surface of the machine base is provided with a human-machine interface and a plurality of control buttons used for controlling the human-machine interface, the upper surface of the machine base is provided with an XY workbench, the upper surface of the XY workbench is provided with a tin column distribution mold, a clamp and a recognition camera, the clamp is used for clamping a tin column array in the tin column distribution mold, and the recognition camera is used for recording the process of clamping the tin column array in the tin column distribution mold through the clamp. The CCGA automatic column planting machine achieves chip column planting through distributing welding columns into the special tin column distribution mold accurately and then transferring the welding columns into a welding jig for welding via the tin column distribution mold.
Description
Technical field
The present invention relates to the technical field of automation equipment, especially a kind of CCGA plants post machine automatically.
Background technology
According to the difference of BGA substrate, be mainly divided three classes: PBGA (plastic ball grid array), CBGA (ceramic welded ball array) and CCGA (ceramic welding column array).CCGA (ceramic welding column array) packaged chip is mainly used in the occasion of space flight, aviation, the contour reliable request of military project, and CCGA chip has been applied for many years abroad, and current domestic just beginning is applied.Because foreign technology blocks, related data lacks, and makes slow progress, those skilled in the art seeking can small lot batch manufacture, maintenance and research CCGA chip method.
One, PBGA (plastic ball grid array) has following features:
(1) good with the thermal matching of pcb board (printed substrate-be generally FR-4 plate); The thermal coefficient of expansion (CTE) of the BT resin/glass laminated sheet in PBGA structure is about 14ppm/ DEG C, and pcb board is about 17ppm/ DEG C, and relatively, thus thermal matching is good for the CTE of bi-material;
(2) the autoregistration effect of soldered ball can be utilized in reflow process, namely the surface tension of melting soldered ball reach soldered ball and pad to alignment request, coplane degree requires loose;
(3) cost is low, and electrical property is good.
The shortcoming of PBGA encapsulation is: to moisture-sensitive, and " popcorn effect " is serious, and reliability exists hidden danger, is not suitable for the encapsulation having air-tightness requires and reliability requirement is high device.
Two, the feature of CBGA (ceramic welded ball array): CBGA substrate is multi-layer ceramics, and metal cover board sealing solder is welded on substrate, has higher reliability and physical protection performance through air-tightness process.Soldered ball material is high temperature eutectic solder pb90/sn10, and the connection of soldered ball and packaging body need use low temperature eutectic solder 63Sn37Pb.Package body sizes is generally 10 ~ 35mm, and the solder pad space length of standard is 1.27mm, 1.0mm; The size of solder ball of standard has 0.889mm, 0.76mm, 0.60mm.
See that the advantage that accompanying drawing 4, CBGA (ceramic welded ball array) encapsulates is as follows:
(1) air-tightness is good, and moisture vapor resistance can be high, and thus the long-term reliability of package assembling is high;
(2) compared with PBGA device, electrical insulation characteristics is better;
(3) heat dispersion is better than PBGA structure.
The shortcoming that CBGA (ceramic welded ball array) encapsulates is as follows:
(1) thermal coefficient of expansion (CTE) difference due to ceramic substrate and pcb board is comparatively large, and the CTE of A1203 ceramic substrate is about 7ppm/ DEG C, and the CTE of pcb board is about 17ppm/ DEG C, and therefore thermal matching is poor, and solder joint fatigue is its main failure mode;
(2) compared with PBGA device, packaging cost is high;
(3) difficulty aimed at by the soldered ball at packaging body edge increases, inapplicable large device size application.
Three, CCGA (ceramic welding column array PB90/SN10)
See that accompanying drawing 6, CCGA is the modified model of CBGA, the difference of the two is: CCGA adopts diameter to be 0.51mm, highly to be the solder ball that the solder post of 2.21mmPB90/sn10 substitutes PB90/SN10 in CBGA, to improve the anti-fatigue ability of its solder joint.Therefore column structure more can alleviate the shear stress between ceramic monolith and pcb board caused by thermal mismatching.Package body sizes is generally and is greater than 32mm, and the solder pad space length of standard is 1.27mm, 1.0mm; The welding column size of standard: long 2.21mm, diameter 0.51mm.
See that the advantage of accompanying drawing 5, CCGAPB90/SN10 pottery welding column array package is as follows:
(1) advantage of CCGA is identical with CBGA;
(2) between CCGA packaging body and PCB substrate material, thermal matching ability is better, and therefore reliability is better than CBGA device, particularly large device size application.
See accompanying drawing 5, the shortcoming of CCGAPB90/SN10 encapsulation is: the substrate that existing CBGA, CCGA encapsulation adopts is aluminium oxide ceramic substrate, its limitation is that its thermal coefficient of expansion differs comparatively large with the thermal coefficient of expansion of pcb board or card, and thermal mismatching easily causes solder joint fatigue; Its high-k, resistivity are not suitable at a high speed yet, high-frequency element.
Summary of the invention
The technical problem to be solved in the present invention is: in order to solve the prior art Problems existing in above-mentioned background technology, provide a kind of can small lot batch manufacture, maintenance and research CCGA chip CCGA automatically plant post machine.
The technical solution adopted for the present invention to solve the technical problems is: a kind of CCGA plants post machine automatically, there is support, the front end face of described support is provided with man-machine interface and multiple control button for controlling man-machine interface, the upper surface of support is provided with XY worktable, the upper surface of described XY worktable is provided with tin post and distributes mould, distribute the fixture in mould for welding column array being clamped in tin post and being used for recording welding column array by the identification camera of clamp in tin post distribution mold process.
Further, the diameter of described welding column is 0.56mm, is highly 2.21mm; Welding column is made up of alloy material, and the percentage by weight of each component is respectively: plumbous 90%, tin 10%.
Further, described welding column is the outside solder post with copper strips; Welding column is made up of alloy material, and the percentage by weight of each component is respectively: plumbous 80%, tin 20%.
The invention has the beneficial effects as follows: CCGA of the present invention plants post machine automatically, distribute in mould by welding column being accurately assigned to special tin post, transferred in welding fixture by tin post distribution mould again and weld, complete chip post, solve the predicament that enterprise or mechanism could produce or keep in repair CCGA chip, use special supporting tool, compare implant post, 10 times ~ 20 times can be raised the efficiency, solve instability and the pollution problem of implant post.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is the structural representation that CCGA of the present invention plants post machine automatically;
Fig. 2 is the structural representation of CCGAPB80/SN20 pottery welding column array package;
Fig. 3 is the structural representation of CCGAPB80/SN20 pottery welding column;
Fig. 4 is the structural representation of CBGA pottery welded ball array encapsulation;
Fig. 5 is the structural representation of CCGAPB90/SN10 pottery welding column array package;
Fig. 6 is the structural representation of CCGAPB90/SN10 pottery welding column.
Label in accompanying drawing is: 1, support, 2, man-machine interface, 3, control button, 4, XY worktable, 5, tin post distributes mould, 6, fixture, 7, identify camera.
Embodiment
In conjunction with the accompanying drawings, the present invention is further detailed explanation.These accompanying drawings are the schematic diagram of simplification, only basic structure of the present invention are described in a schematic way, and therefore it only shows the formation relevant with the present invention.
CCGA of the present invention as shown in Figure 1 plants post machine automatically, there is support 1, the front end face of support 1 is provided with man-machine interface 2 and multiple control button 3 for controlling man-machine interface 2, the upper surface of support 1 is provided with XY worktable 4, the upper surface of XY worktable 4 is provided with tin post and distributes mould 5, distributes the fixture 6 in mould 5 and be used for recording welding column array and be clamped in by fixture 6 the identification camera 7 that tin post distributes mould 5 process for welding column array being clamped in tin post.
Multiple control button 3 comprises host service function button and distributor control button.
Host service function button comprises: (1) mode switch: switch manual mode and automatic mode; (2) start button: mode switch presses start button in automatic mode, starts to produce; (3) stop button: in automatic mode, presses stop button in production process, can force to stop producing; (4) scram button: emergency stop push button, by the power supply of the equipment of cut-out after pressing.
Distributor control button comprises: (1) insufflation button: during for debugging, and hand-guided distributor is blown; (2) reset button: when automatically producing, when generation inserting column fault alarm, after fixing a breakdown, presses reset button, can resume production.
Man-machine interface 2 comprises manual mode and automatic mode.
Manual mode comprises: (1) HOME:XY workbench 4 returning to mechanical reference point; (2) check: automatically identify whether tin post leaks by camera and insert or run coordinate according to program; (3) coordinate imports 1; (4) coordinate imports 2; (5) vibrations are opened: control the whether feeding of tin post distributor; (6) vibrations are closed; (7) Pin1 is returned: after clicking, equipment is automatically moved to first insertion point (photograph seat in the plane), whether has error for gauging fixture; (8) stop: stopping checking; (9) single-step mode: switching when checking is continuous operation, still often clicks NEXT and makes a move; (10) arrange and show the current step run; (11) step pitch of movement; (12) manual mobile XY worktable 4; (13) initial point is set to: changing coordinates is set to the first point inserted; (13) put position to preserve: changing coordinates is saved in current insertion step.
Automatic mode comprises: (1) vibrations are opened: opening/closing tin post distributor shakes; (2) single-step mode: single-step mode and continuous mode switch; During continuous mode, continuous inserting column; (3) NEXT: under the pattern of single-step mode, often inserts tin post once by a NEXT; (4) continue: under a halt condition, button click will work on; (5) cylinder instruction: distribute rise and fall: (6) stop: suspending inserting column.
Equipment operating step is as follows:
One, confirm to insert coordinate
A, in a manual mode, clicks " HOME ", gets back to after initial point until equipment, clicks " returning Pin1 ";
B, by first insertion point of the image confirming in display whether at center, if button Shi Qi center up and down please be clicked in Bu center." being set to initial point " button is clicked after image to center;
C, inserting the precision of coordinate to ensure, can repeatedly repeat a, b step.
Two, tin post distributor checks
A, reinforced;
B, confirmation fiber amplifier LED status, otherwise illustrate have tin post to block, by insufflation button, attempt blowout tin post, then by reset button.
Three, start to produce
If a wants to produce from step is inserted in appointment, click step operation, otherwise skip;
A1, the numeral clicked in the current step of setting and display operation;
A2, input numeral;
B, by mode of operation switching over to automatic mode;
C, be confirmed to be single step production or continuous seepage, button click switches as required;
D, by start button;
If e step c you select be " continuous seepage ", equipment is by the tin of insertion successively post step by step; If what select is " single step production ", often by once " Next ", insert a tin post;
After f, product inserting column complete, XY worktable 4 will move to initial point.
See Fig. 3, the diameter of welding column is 0.56mm, is highly 2.21mm; Welding column is made up of alloy material, and the percentage by weight of each component is respectively: plumbous 90%, tin 10%.
Welding column is the outside solder post with copper strips.
CCGA called after in the present invention: ceramic welding column array PB80/SN20.
The operation principle that this CCGA plants post machine automatically is accurately assigned in particular manufacturing craft by CCGAPB80/SN20 welding column, then transferred in welding fixture by mould and weld, and completes chip post.
See Fig. 3, PB80/SN20 welding column is the modified model of PB90/SN10; The difference of the two is: PB80/SN20 welding column adopts diameter to be 0.56mm, is highly 2.21mm; Welding column is made up of alloy material, and the percentage by weight of each component is respectively: plumbous 90%, tin 10%; The solder post of the outside copper strips of PB80/sn20 substitutes the welding column of PB90/SN10, and diameter is 0.56mm, is highly 2.21mm; Welding column is made up of alloy material, and the percentage by weight of each component is respectively: plumbous 80%, and tin 20%, to improve the anti-fatigue ability of its solder joint, this column structure more can alleviate the shear stress between ceramic monolith and pcb board caused by thermal mismatching.
See Fig. 2, the advantage of CCGAPB80/SN20 welding column array package is as follows:
One, the advantage of CCGAPB80/SN20 is identical with CCGAPB90/SN10;
Two, between CCGAPB80/SN20 packaging body and PCB substrate material, thermal matching ability is better, and therefore reliability is better than CCGAPB90/SN10 device, particularly large device size application;
Three, because CCGAPB80/SN20 adopts the copper-connection system of low-resistance, the electrical property of its encapsulating products is improved.
With above-mentioned according to desirable embodiment of the present invention for enlightenment, by above-mentioned description, relevant staff in the scope not departing from this invention technological thought, can carry out various change and amendment completely.The technical scope of this invention is not limited to the content on specification, must determine its technical scope according to right.
Claims (3)
1. a CCGA plants post machine automatically, it is characterized in that: there is support (1), the front end face of described support (1) is provided with man-machine interface (2) and multiple control button (3) for controlling man-machine interface (2), the upper surface of support (1) is provided with XY worktable (4), the upper surface of described XY worktable (4) is provided with tin post and distributes mould (5), distribute fixture (6) in mould (5) for welding column array being clamped in tin post and being clamped in by fixture (6) the identification camera (7) that tin post distributes mould (5) process for recording welding column array.
2. CCGA according to claim 1 plants post machine automatically, it is characterized in that: the diameter of described welding column is 0.56mm, is highly 2.21mm; Welding column is made up of alloy material, and the percentage by weight of each component is respectively: plumbous 90%, tin 10%.
3. CCGA according to claim 1 plants post machine automatically, it is characterized in that: described welding column is the outside solder post with copper strips, and diameter is 0.56mm, is highly 2.21mm; Welding column is made up of alloy material, and the percentage by weight of each component is respectively: plumbous 80%, tin 20%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510740583.6A CN105355573B (en) | 2015-11-04 | 2015-11-04 | CCGA plants post machine automatically |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510740583.6A CN105355573B (en) | 2015-11-04 | 2015-11-04 | CCGA plants post machine automatically |
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| Publication Number | Publication Date |
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| CN105355573A true CN105355573A (en) | 2016-02-24 |
| CN105355573B CN105355573B (en) | 2017-11-21 |
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| CN201510740583.6A Active CN105355573B (en) | 2015-11-04 | 2015-11-04 | CCGA plants post machine automatically |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106971951A (en) * | 2017-03-31 | 2017-07-21 | 哈尔滨理工大学 | A kind of plant column method for CuCGA devices |
| CN108807188A (en) * | 2018-06-17 | 2018-11-13 | 重庆群崴电子材料有限公司 | A kind of automatic ceramic column gate array plants column machine and plants column method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110084370A1 (en) * | 2009-10-14 | 2011-04-14 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and process for fabricating same |
| US20150048504A1 (en) * | 2013-08-19 | 2015-02-19 | Ambit Microsystems (Zhongshan) Ltd. | Package assembly for chip and method of manufacturing same |
| CN104779186A (en) * | 2014-12-31 | 2015-07-15 | 中国航天科技集团公司第五研究院第五一三研究所 | Device for column planting technology of CCGA chip |
-
2015
- 2015-11-04 CN CN201510740583.6A patent/CN105355573B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110084370A1 (en) * | 2009-10-14 | 2011-04-14 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and process for fabricating same |
| US20150048504A1 (en) * | 2013-08-19 | 2015-02-19 | Ambit Microsystems (Zhongshan) Ltd. | Package assembly for chip and method of manufacturing same |
| CN104779186A (en) * | 2014-12-31 | 2015-07-15 | 中国航天科技集团公司第五研究院第五一三研究所 | Device for column planting technology of CCGA chip |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106971951A (en) * | 2017-03-31 | 2017-07-21 | 哈尔滨理工大学 | A kind of plant column method for CuCGA devices |
| CN108807188A (en) * | 2018-06-17 | 2018-11-13 | 重庆群崴电子材料有限公司 | A kind of automatic ceramic column gate array plants column machine and plants column method |
| CN108807188B (en) * | 2018-06-17 | 2020-04-10 | 重庆群崴电子材料有限公司 | Column planting method of automatic ceramic column grid array column planting machine |
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| Publication number | Publication date |
|---|---|
| CN105355573B (en) | 2017-11-21 |
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Denomination of invention: CCGA automatic column planting machine Effective date of registration: 20230209 Granted publication date: 20171121 Pledgee: China Construction Bank Co.,Ltd. Suzhou High tech Industrial Development Zone Branch Pledgor: SUZHOU QIWEIXIN ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023980032318 |
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