CN105355571B - Driving type piezoelectric actuator wirebonding device - Google Patents
Driving type piezoelectric actuator wirebonding device Download PDFInfo
- Publication number
- CN105355571B CN105355571B CN201510683370.4A CN201510683370A CN105355571B CN 105355571 B CN105355571 B CN 105355571B CN 201510683370 A CN201510683370 A CN 201510683370A CN 105355571 B CN105355571 B CN 105355571B
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- oscillating platform
- flexible hinge
- connecting rod
- ultrasonic transformer
- pedestal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
The invention discloses a kind of driving type piezoelectric actuator wirebonding device, including pedestal and the oscillating platform that is disposed there above；Left and right two root posts and bridge type enlarger are provided between the oscillating platform and the pedestal, piezoelectric ceramic actuator is provided with the bridge type enlarger, the piezoelectric ceramic actuator is provided with pretension bolt, and the pretension bolt is connected to the bridge type enlarger；Fixed seat is installed between two parties in the upper surface of oscillating platform front portion, the fixed seat and transducer are affixed, the transducer includes the vertically disposed ultrasonic transformer of swinging axle with the oscillating platform, ultrasonic piezoelectric vibrator is provided with the input of the ultrasonic transformer, perpendicular chopper is connected with the output end of the ultrasonic transformer.The present invention is driven using piezoelectric ceramic actuator, and structural compactness, lighter weight, movement inertia are smaller, it is possible to increase the stability that bonding head works in encapsulation process.
Description
Technical field
The invention belongs to semiconductor device fabrication field, more particularly to a kind of driving type piezoelectric actuator wirebonding device.
Background technology
Wire bonding is by technology cloth wire bonding on the I/O leads or substrate of semiconductor chip welding zone and electronic encapsulation shell
The technology that area is connected with filament.Bonding head is as wire bonder Z-direction driving part, its structure and control pair
Realize that the control of bonding force in arcing campaign needed for wire bonding process and bonding process all plays vital effect, be bonded simultaneously
The Static and dynamic performance of head mechanical part also governs the raising of systematic function.
Traditional bonding head is influenceed using the type of drive such as voice coil motor, linear electric motors, the selection of these type of drive more
The compactedness of bonding head mechanical structure, while the quality and movement inertia of bonding head are increased, limit bonding head kinematic accuracy
With the raising of package quality.Other existing lead wire clamp can realize the accurate control of position mostly, but for bonding force
Control mainly uses indirect mode, i.e., is realized using modes such as power demarcation.These modes can be by inertia in motion process
The influence of power, it is difficult to accurately ensure the stably and controllable of bonding force, and power calibration process is more complicated.
The content of the invention
The present invention provides a kind of driving type piezoelectric actuator wirebonding device to solve technical problem present in known technology,
The apparatus structure compactedness, lighter weight, movement inertia are smaller.
The present invention is adopted the technical scheme that to solve technical problem present in known technology：A kind of driving type piezoelectric actuator
Wirebonding device, including pedestal and the oscillating platform that is disposed there above；Set between the oscillating platform and the pedestal
There are left and right two root posts and bridge type enlarger, the bridge type enlarger is centrally disposed between two columns；It is described
The upper surface that the lower end of column is fixed on the pedestal is anterior, and the upper end of the column is put down by flexible hinge IV and described swing
The anterior connection in the lower surface of platform；The bridge type enlarger includes front and rear two movable links be arrangeding in parallel, described movably to connect
Bar is vertical with the pedestal；The upper end of two movable links is connected by exporting crossover, under two movable links
End is connected by fixed crossover；The output crossover includes the output connecting rod for being disposed therein portion, the both ends of the output connecting rod
Respectively it is connected by a parallel double rods mechanism I with the upper end of front and rear two movable links, the parallel double rods mechanism I is to use
The connection of flexible hinge I is formed, and two parallel double rods mechanisms I are in be arranged symmetrically before and after "eight" shape；The output connecting rod
Outside be connected by flexible hinge III with the lower surface rear portion of the oscillating platform；The fixed crossover includes being disposed therein
The fixation connecting rod in portion, the both ends of the fixed connecting rod respectively pass through a parallel double rods mechanism II and front and rear two movable links
Lower end is connected, and the parallel double rods mechanism II is formed using the connection of flexible hinge II, two parallel double rods mechanisms II
With two I arrangements symmetrical above and below of parallel double rods mechanism, the fixed connecting rod and the pedestal are affixed；Described in front and rear two
Piezoelectric ceramic actuator is provided between movable link, the piezoelectric ceramic actuator is provided with pretension bolt, and the pretension bolt connects
It is connected in any one of movable link；Fixed seat is installed between two parties in the upper surface of oscillating platform front portion, it is described solid
Reservation is affixed with transducer, and the transducer includes the vertically disposed ultrasonic transformer of swinging axle with the oscillating platform, described
The input of ultrasonic transformer is provided with ultrasonic piezoelectric vibrator, and perpendicular chopper is connected with the output end of the ultrasonic transformer.
Mounting flange is provided with around the middle part of the ultrasonic transformer, the mounting flange is equal by more with the ultrasonic transformer
The flexible plate-like spoke connection of cloth, there are two flexible plate-likes of arrangement symmetrical above and below in the more flexible plate-like spokes
Spoke is parallel with the chopper, and bonding force survey is pasted with any one of flexible plate-like spoke parallel with the chopper
Measure metal strain plate；The fixed seat uses subdivision structure, and the mounting flange is packed in the fixed seat.
The flexible hinge I and the flexible hinge II use unilateral circumferential notch flexible hinge, in any one institute
State and be pasted with displacement measurement metal strain plate on the outside of unilateral circumferential notch flexible hinge.
The present invention has the advantages and positive effects of：Bridge type enlarger drive key is passed through using piezoelectric ceramic actuator
Attach together and put, can substantially reduce the total quality and movement inertia of bonding apparatus.Other piezoelectric ceramic actuator have small volume,
The features such as rigidity height, fast response time, high displacement resolution.By the way that piezoelectric ceramic actuator is arranged on into bridge type enlarger
Inside, make bonding apparatus compact-sized.Bonding apparatus is driven using piezoelectric ceramic actuator, realizes swinging up and down for chopper, can
To be effectively improved the static and dynamic c haracteristics of bonding apparatus.In addition make bonding apparatus that there is larger work using bridge type enlarger
Make space.Using metal strain plate as bonding head moving displacement and the feedback element of chopper bonding force, motion bit can be realized
Shifting and measurement and the Real-time Feedback of chucking power, so as to improve the stability that bonding apparatus works in encapsulation process.In summary, originally
Invention is driven using piezoelectric ceramic actuator, and structural compactness, lighter weight, movement inertia are smaller, and can be realized
The measurement of moving displacement and bonding force and Real-time Feedback, so as to improve the stability that bonding head works in encapsulation process, energy
Enough it is applied to the wire bonding of wire bonder.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the bridge type enlarger structural representation of the present invention；
Fig. 3 is the transducer architecture schematic diagram of the present invention.
In figure：1st, pedestal, 2, bridge type enlarger, 2-1, fixed connecting rod, 2-2, parallel double rods mechanism II, 2-3, movably connect
Bar, 2-4, parallel double rods mechanism I, 2-5, flexible hinge III, 2-6, output connecting rod, 2-7, using flexible hinge I, 2-8, flexible hinge
Chain II, 3, column, 4, piezoelectric ceramic actuator, 5, oscillating platform, 6, bonding force measurement metal strain plate, 7, chopper, 8, transducing
Device, 8-1, ultrasonic transformer, 8-2, mounting flange, 8-3, flexible plate-like spoke, 9, fixed seat, 10, ultrasonic piezoelectric vibrator, 11, flexible
Hinge IV, 12, displacement measurement metal strain plate, 13, pretension bolt.
Embodiment
In order to further understand the content, features and effects of the present invention, hereby enumerating following examples, and coordinate accompanying drawing
Describe in detail as follows：
Refer to Fig. 1~Fig. 3, a kind of driving type piezoelectric actuator wirebonding device, including pedestal 1 and the pendulum being disposed there above
Moving platform 5；Left and right two root posts 3 and bridge type enlarger 2, the bridge are provided between the oscillating platform 5 and the pedestal 1
Type enlarger 2 is centrally disposed between two columns 3；The lower end of the column 3 is fixed on the upper surface of the pedestal 1
Front portion, the upper end of the column 3 are connected by flexible hinge IV 11 with the lower surface front portion of the oscillating platform 5；The bridge type
Enlarger 2 includes the front and rear two movable links 2-3 be arrangeding in parallel, and the movable link 2-3 is vertical with the pedestal 1；Two
Movable link 2-3 upper end described in root is connected by exporting crossover, and two movable link 2-3 lower end passes through fixed crossover
Connection；The output crossover includes the output connecting rod 2-6 for being disposed therein portion, and the both ends of the output connecting rod 2-6 respectively pass through one
The 2-4 of parallel double rods mechanism I is connected with front and rear two movable link 2-3 upper end, and the 2-4 of parallel double rods mechanism I is to adopt
Connect what is formed with the 2-7 of flexible hinge I, two 2-4 of parallel double rods mechanism I are in be arranged symmetrically before and after "eight" shape；It is described
Output connecting rod 2-6 outside is connected by the 2-5 of flexible hinge III with the lower surface rear portion of the oscillating platform 5；The fixation is even
Bridge includes the fixation connecting rod 2-1 for being disposed therein portion, and the both ends of the fixed connecting rod 2-1 respectively pass through the 2- of a parallel double rods mechanism II
2 are connected with front and rear two movable link 2-3 lower end, and the 2-2 of parallel double rods mechanism II is to use the 2-8 of flexible hinge II
What connection was formed, two described II 2-2 and two 2-4 of parallel double rods mechanism I arrangements symmetrical above and below of parallel double rods mechanism, institute
State fixed connecting rod 2-1 and the pedestal 1 is affixed；Piezoelectric ceramic actuator is provided between the front and rear two movable link 2-3
4, the piezoelectric ceramic actuator 4 is provided with pretension bolt 13, and the pretension bolt 13 is connected to any one of movable link
On 2-3；Fixed seat 9 is installed between two parties in the upper surface of the oscillating platform 5 front portion, the fixed seat 9 and transducer 8 are affixed,
The transducer 8 includes the vertically disposed ultrasonic transformer 8-1 of swinging axle with oscillating platform, in the input of the ultrasonic transformer 8-1
Provided with ultrasonic piezoelectric vibrator 10, perpendicular chopper 7 is connected with the output end of the ultrasonic transformer 8-1.
The present invention uses bilateral symmetry, can realize heat error compensation, reduces because wirebonding device is heated not
Error caused by.
In the present embodiment, in order to realize the measurement of bonding force, peace is provided with around the middle part of the ultrasonic transformer 8-1
Dress flange 8-2, the mounting flange 8-2 and the ultrasonic transformer 8-1 are connected by more uniform flexible plate-like spoke 8-3,
There are two flexible plate-like spoke 8-3 and the chopper 7 of arrangement symmetrical above and below flat in the more flexible plate-like spoke 8-3
OK, bonding force measurement metal strain plate is pasted with any one of flexible plate-like spoke 8-3 parallel with the chopper 7
6, the fixed seat 9 uses subdivision structure, and the mounting flange 8-2 is packed in the fixed seat 9.In order to realize displacement
Measurement, the 2-7 of flexible hinge I and the flexible hinge II 2-8 uses unilateral circumferential notch flexible hinge, at any one
Displacement measurement metal strain plate 12 is pasted with the outside of the unilateral circumferential notch flexible hinge.
The operation principle of the present invention：
When applying driving voltage at the both ends of piezoelectric ceramic actuator 4, piezoelectric ceramic actuator 4 will extend and promote bridge type
Front and rear two movable links 2-3 in enlarger 2, front and rear two movable link 2-3 pass through the 2-2 of Liang Ge parallel double rods mechanism II
The 2-5 of flexible hinge III motions are driven with the 2-4 of Liang Ge parallel double rods mechanism I.So as to the small position for exporting piezoelectric ceramic actuator 2
Shifting is amplified, and then pulls the rear portion of oscillating platform 5 to move downward, and oscillating platform 5 drives transducer around two flexible hinges
IV 11 line of centres is to lower swing, so as to realize that chopper 7 moves upwards.When the driving for removing the both ends of piezoelectric ceramic actuator 4
After voltage, piezoelectric ceramic actuator 4 will then revert to former length, and bonding apparatus returns to original position in the presence of flexible hinge elastic force
Put, chopper 7 will move downward and complete wire bonding.Change the pretightning force of piezoelectric ceramic actuator 4 by adjusting pretension bolt 13,
The position of chopper 7 can be adjusted.
When bonding apparatus works, the unilateral circumferential notch flexible hinge in bridge type enlarger 2 can produce plastic deformation,
The displacement measurement metal strain plate 12 pasted above to it using standard displacement transducer is demarcated, you can realizes that para-linkage fills
The measurement and feedback that set moves.When chopper 7 touches processing matrix, the flexibility parallel with chopper 7 in flexible plate-like spoke 8-3
Tabular spoke 8-3 can produce plastic deformation, and the bonding force being pasted onto on the flexible plate-like spoke is surveyed using standard force snesor
Amount metal strain plate 6 is demarcated, you can realizes measurement and the feedback of para-linkage device bonding force.
Although the preferred embodiments of the present invention are described above in conjunction with accompanying drawing, the invention is not limited in upper
The embodiment stated, above-mentioned embodiment is only schematical, be not it is restricted, this area it is common
Technical staff in the case of present inventive concept and scope of the claimed protection is not departed from, may be used also under the enlightenment of the present invention
By make it is many in the form of, these are belonged within protection scope of the present invention.
Claims (3)
1. a kind of driving type piezoelectric actuator wirebonding device, it is characterised in that including pedestal and the oscillating platform being disposed there above；
Left and right two root posts and bridge type enlarger, the bridge type enlarger are provided between the oscillating platform and the pedestal
Structure is centrally disposed between two columns；The upper surface that the lower end of the column is fixed on the pedestal is anterior, described vertical
The upper end of post is connected by flexible hinge IV with the lower surface front portion of the oscillating platform；
The bridge type enlarger includes front and rear two movable links be arrangeding in parallel, and the movable link is hung down with the pedestal
Directly；The upper end of two movable links is connected by exporting crossover, and the lower end of two movable links passes through fixed crossover
Connection；The output crossover includes the output connecting rod for being disposed therein portion, and the both ends of the output connecting rod are respectively parallel double by one
Linkage I is connected with the upper end of front and rear two movable links, and the parallel double rods mechanism I is connected using flexible hinge I
Formed, two parallel double rods mechanisms I are in be arranged symmetrically before and after "eight" shape；Pass through flexibility on the outside of the output connecting rod
Hinge III is connected with the lower surface rear portion of the oscillating platform；The fixed crossover includes the fixation connecting rod for being disposed therein portion,
The both ends of the fixed connecting rod are respectively connected by a parallel double rods mechanism II with the lower end of front and rear two movable links, described
Parallel double rods mechanism II is formed using the connection of flexible hinge II, and two parallel double rods mechanisms II are described parallel with two
I arrangement symmetrical above and below of double-lever mechanism, the fixed connecting rod and the pedestal are affixed；Set between front and rear two movable links
There is piezoelectric ceramic actuator, the piezoelectric ceramic actuator is provided with pretension bolt, and the pretension bolt is connected to any one institute
State in movable link；
Fixed seat is installed between two parties in the upper surface of oscillating platform front portion, the fixed seat and transducer are affixed, described to change
Energy device includes the vertically disposed ultrasonic transformer of swinging axle with the oscillating platform, and excess sound pressure is provided with the input of the ultrasonic transformer
Electric tachometer indicator, perpendicular chopper is connected with the output end of the ultrasonic transformer.
2. driving type piezoelectric actuator wirebonding device according to claim 1, it is characterised in that at the middle part of the ultrasonic transformer
Surrounding is provided with mounting flange, and the mounting flange is connected with the ultrasonic transformer by more uniform flexible plate-like spokes, more
Have that two flexible plate-like spokes of arrangement symmetrical above and below are parallel with the chopper in flexible plate-like spoke described in root, with institute
State and bonding force measurement metal strain plate is pasted with the parallel any one of flexible plate-like spoke of chopper；The fixed seat is adopted
With subdivision structure, the mounting flange is packed in the fixed seat.
3. driving type piezoelectric actuator wirebonding device according to claim 1 or 2, it is characterised in that the He of flexible hinge I
The flexible hinge II uses unilateral circumferential notch flexible hinge, in any one of unilateral circumferential notch flexible hinge
Outside is pasted with displacement measurement metal strain plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510683370.4A CN105355571B (en) | 2015-10-20 | 2015-10-20 | Driving type piezoelectric actuator wirebonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510683370.4A CN105355571B (en) | 2015-10-20 | 2015-10-20 | Driving type piezoelectric actuator wirebonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105355571A CN105355571A (en) | 2016-02-24 |
| CN105355571B true CN105355571B (en) | 2018-02-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510683370.4A Active CN105355571B (en) | 2015-10-20 | 2015-10-20 | Driving type piezoelectric actuator wirebonding device |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107452644B (en) * | 2016-05-31 | 2020-11-20 | 上海微电子装备（集团）股份有限公司 | Split type chip carrier plate carrying and bonding device |
| CN107378527B (en) * | 2017-08-18 | 2019-06-11 | 天津大学 | A kind of micro- oscillating platform of driving type piezoelectric actuator two freedom decoupling |
| CN107481767B (en) * | 2017-09-11 | 2023-01-24 | 河南理工大学 | Driving assembly and flexible precision positioning platform |
| CN107621222B (en) * | 2017-09-26 | 2023-11-03 | 上海市计量测试技术研究院 | Vibrating wire type strain gauge calibrating device |
| CN112935174B (en) * | 2021-01-26 | 2022-11-29 | 中南大学 | Method for compensating precision machining error of ultrasonic cold swing rolling forming straight gear |
| CN113539906B (en) * | 2021-07-26 | 2024-01-26 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Bonding head system and bonding machine |
| CN114388407B (en) * | 2021-12-24 | 2023-02-17 | 凌波微步半导体设备(常熟)有限公司 | Bonding head device and bonding machine |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1773688A (en) * | 2005-10-24 | 2006-05-17 | 中国电子科技集团公司第四十五研究所 | Light high-stiffness XY working platform and bonding head |
| CN103311157A (en) * | 2012-03-15 | 2013-09-18 | 先进科技新加坡有限公司 | Apparatus for mounting a transducer in a wire bonder |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7137543B2 (en) * | 2004-07-28 | 2006-11-21 | Kulicke And Soffa Industries, Inc. | Integrated flexure mount scheme for dynamic isolation of ultrasonic transducers |
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2015
- 2015-10-20 CN CN201510683370.4A patent/CN105355571B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1773688A (en) * | 2005-10-24 | 2006-05-17 | 中国电子科技集团公司第四十五研究所 | Light high-stiffness XY working platform and bonding head |
| CN103311157A (en) * | 2012-03-15 | 2013-09-18 | 先进科技新加坡有限公司 | Apparatus for mounting a transducer in a wire bonder |
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| CN105355571A (en) | 2016-02-24 |
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