CN105345195A - Method for brazing aluminum or aluminum alloy and other metals - Google Patents
Method for brazing aluminum or aluminum alloy and other metals Download PDFInfo
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- CN105345195A CN105345195A CN201510874581.6A CN201510874581A CN105345195A CN 105345195 A CN105345195 A CN 105345195A CN 201510874581 A CN201510874581 A CN 201510874581A CN 105345195 A CN105345195 A CN 105345195A
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- aluminum
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- aluminum alloy
- pressure
- solder bonding
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 47
- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 37
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 35
- 239000002184 metal Substances 0.000 title claims abstract description 35
- 238000005219 brazing Methods 0.000 title claims abstract description 17
- 150000002739 metals Chemical class 0.000 title abstract 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000010949 copper Substances 0.000 claims abstract description 35
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000007789 gas Substances 0.000 claims abstract description 34
- 229910052802 copper Inorganic materials 0.000 claims abstract description 33
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 25
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000001257 hydrogen Substances 0.000 claims abstract description 25
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 25
- 239000002245 particle Substances 0.000 claims abstract description 25
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 24
- 229910052786 argon Inorganic materials 0.000 claims abstract description 17
- 238000005229 chemical vapour deposition Methods 0.000 claims abstract description 9
- 238000000151 deposition Methods 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims abstract description 5
- 230000008021 deposition Effects 0.000 claims abstract description 5
- 230000001105 regulatory effect Effects 0.000 claims abstract description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 40
- 229910000679 solder Chemical group 0.000 claims description 29
- 239000003595 mist Substances 0.000 claims description 16
- 238000004062 sedimentation Methods 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 14
- 230000005496 eutectics Effects 0.000 abstract description 9
- 239000011229 interlayer Substances 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 239000002131 composite material Substances 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 9
- 229910001250 2024 aluminium alloy Inorganic materials 0.000 description 8
- 239000000047 product Substances 0.000 description 5
- 239000008187 granular material Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000007792 gaseous phase Substances 0.000 description 3
- 238000010406 interfacial reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000036632 reaction speed Effects 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- RZJQYRCNDBMIAG-UHFFFAOYSA-N [Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Zn].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn] Chemical class [Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Zn].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn] RZJQYRCNDBMIAG-UHFFFAOYSA-N 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention provides a method for brazing aluminum or aluminum alloy and other metals, relates to the field of material welding, and aims at solving the problem that the eutectic reaction of aluminum and copper is strong and difficult to control during a current process of brazing aluminum or aluminum alloy and other metals in a copper particle intermediate layer, and thus the mechanical property of a brazing joint is low. The method comprises the following steps: 1, feeding copper particles in a chemical vapor deposition device, and charging mixed gas of hydrogen and argon; 2, depositing under a certain temperature, and regulating the gas flow rate after the deposition is finished; 3, feeding a prepared graphene reinforced copper particle interlayer composite material between the aluminum or aluminum alloy and other metals, transferring into a vacuum brazing furnace to braze, and then slowly cooling until the room temperature is reached, so as to finish the brazing. The invention is applicable to the method for brazing the aluminum or aluminum alloy and other metals.
Description
Technical field
The present invention relates to material welding field.
Background technology
Aluminium is metal distributed more widely in the earth's crust, in the age of current industrial raw materials demand day by day, is identified as one of the most promising metal.Aluminum or aluminum alloy has high specific stiffness and specific strength, good conduction and thermal conductivity, and the series of advantages such as good corrosion resistance are huge at the application potential of the high-technology fields such as space flight, aviation, automobile, manufacturing industry.Therefore, aluminum or aluminum alloy has become with the research of the solder technology of other metal the Focal point and difficult point welding research category, and wherein soldering is one of main method of aluminum or aluminum alloy and other metal solder.
At present, aluminum or aluminum alloy and the main Problems existing of other solder bonding metal comprise because aluminium and other metallic atom spread comparatively fast, easily separate out the larger eutectic phase alloy of fragility, cause strength of joint to reduce in the liquid phase in process of setting center tap district.In order to improve the performance of aluminum or aluminum alloy and other solder bonding metal joint, connect to the high-quality realizing aluminum or aluminum alloy and other metal mainly through optimizing soldering intermediate layer or utilizing reinforcement to strengthen the methods such as solder performance at present.In numerous intermediate layer materials, be widely studied because pulverous copper particle can be added in other solder arbitrarily always.But it should be noted that once aluminum bronze eutectic reaction in brazing process, very acutely, reaction speed is fast, and wayward, its product has the large feature of low melting point fragility, can reduce the mechanical property of soldered fitting.
Graphene, as a kind of novel nano material, obtains investigation and application widely in composite/solder.Due to the two-dimension plane structure that it is special, compared with other material, the excellent in mechanical performance of Graphene, its fracture strength of multi-layer graphene structure of independent support can reach 42N/m, strong tension degree reaches 130GPa, and Young's modulus up to 1100GPa, and has the chemical property of stabilizer pole, itself and the various active such as titanium, aluminium element do not react, and are a kind of desirable composite/composite soldering reinforcements.
Summary of the invention
The present invention will solve in the process of existing copper particle interlayer soldering aluminum or aluminum alloy and other metal, because aluminum bronze eutectic reaction is violent and be difficult to control and cause the problem of soldered fitting poor mechanical property, and provide a kind of method of aluminum or aluminum alloy and other solder bonding metal.
A method for aluminum or aluminum alloy and other solder bonding metal, specifically carry out according to following steps:
One, copper particle is placed in chemical vapor deposition unit, being evacuated to pressure is 10
-5below Pa, closing vavuum pump, take gas flow as the mist that 20sccm ~ 100sccm passes into hydrogen and argon gas, regulates pressure in chemical vapor deposition unit to be 10
5pa;
In described hydrogen and the mist of argon gas, the percentage by volume of hydrogen is 17%;
Two, be 10 at pressure
5under Pa, with programming rate be 5 DEG C/min ~ 10 DEG C/min, by temperature to 800 DEG C ~ 900 DEG C, and being incubated 30min ~ 60min at temperature is 800 DEG C ~ 900 DEG C, is then 10 at pressure
5under Pa, with programming rate be 10 DEG C/min ~ 20 DEG C/min, by temperature to 920 DEG C ~ 1020 DEG C, pass into methane, the gas flow regulating methane is 5sccm ~ 15sccm, is then 10 at pressure
5pa and temperature are deposit under the condition of 920 DEG C ~ 1020 DEG C, sedimentation time is 5min ~ 15min, after deposition terminates, stop passing into methane, then the gas flow of the mist of hydrogen and argon gas is adjusted to 100sccm ~ 200sccm by 20sccm ~ 100sccm, finally temperature is cooled to room temperature, namely obtains Graphene/copper Particles dispersed intermediate layer;
In described hydrogen and the mist of argon gas, the percentage by volume of hydrogen is 17%;
Three, Graphene/copper Particles dispersed intermediate layer is placed between aluminum or aluminum alloy and the junction to be welded of other metal material,
And be positioned in vacuum brazing furnace, 3 × 10 are evacuated to vacuum brazing furnace
-3pa ~ 8 × 10
-3pa, is then incubated 5min ~ 15min at temperature is 540 DEG C ~ 600 DEG C, is finally that temperature is cooled to room temperature by 540 DEG C ~ 600 DEG C by 5 DEG C/min with cooling rate, namely completes the method for aluminum or aluminum alloy and other solder bonding metal.
The square ratio juris of a kind of aluminum or aluminum alloy of the present invention and other solder bonding metal is: utilize the iris action of copper particle surface Graphene effectively to control reaction speed, and then alleviate the violent interfacial reaction of aluminum or aluminum alloy and copper, reduce eutectic product, improve the mechanical property of soldered fitting.
The invention has the beneficial effects as follows:
1, the present invention adopts chemical gaseous phase depositing process, can prepare few layer graphene that defect is few, quality is high in copper granular material surface original position.
2, the present invention has iris action at the Graphene of copper granular material surface growth in situ, greatly alleviates the violent interfacial reaction of aluminum or aluminum alloy and copper, reduces eutectic product, improves the mechanical property of soldered fitting.
3, the method for the present invention's employing is simple, efficient, is convenient to suitability for industrialized production.
The present invention is used for a kind of method of aluminum or aluminum alloy and other solder bonding metal.
Accompanying drawing explanation
Fig. 1 is the scanning electron microscopic picture of 2024 aluminium alloy interfaces of Graphene enhancing copper particle interlayer soldering prepared by embodiment.
Detailed description of the invention
Technical solution of the present invention is not limited to following cited detailed description of the invention, also comprises any combination between each detailed description of the invention.
Detailed description of the invention one: a kind of aluminum or aluminum alloy described in present embodiment and the method for other solder bonding metal, specifically carry out according to following steps:
One, copper particle is placed in chemical vapor deposition unit, being evacuated to pressure is 10
-5below Pa, closing vavuum pump, take gas flow as the mist that 20sccm ~ 100sccm passes into hydrogen and argon gas, regulates pressure in chemical vapor deposition unit to be 10
5pa;
In described hydrogen and the mist of argon gas, the percentage by volume of hydrogen is 17%;
Two, be 10 at pressure
5under Pa, with programming rate be 5 DEG C/min ~ 10 DEG C/min, by temperature to 800 DEG C ~ 900 DEG C, and being incubated 30min ~ 60min at temperature is 800 DEG C ~ 900 DEG C, is then 10 at pressure
5under Pa, with programming rate be 10 DEG C/min ~ 20 DEG C/min, by temperature to 920 DEG C ~ 1020 DEG C, pass into methane, the gas flow regulating methane is 5sccm ~ 15sccm, is then 10 at pressure
5pa and temperature are deposit under the condition of 920 DEG C ~ 1020 DEG C, sedimentation time is 5min ~ 15min, after deposition terminates, stop passing into methane, then the gas flow of the mist of hydrogen and argon gas is adjusted to 100sccm ~ 200sccm by 20sccm ~ 100sccm, finally temperature is cooled to room temperature, namely obtains Graphene/copper Particles dispersed intermediate layer;
In described hydrogen and the mist of argon gas, the percentage by volume of hydrogen is 17%;
Three, Graphene/copper Particles dispersed intermediate layer is placed between aluminum or aluminum alloy and the junction to be welded of other metal material,
And be positioned in vacuum brazing furnace, 3 × 10 are evacuated to vacuum brazing furnace
-3pa ~ 8 × 10
-3pa, is then incubated 5min ~ 15min at temperature is 540 DEG C ~ 600 DEG C, is finally that temperature is cooled to room temperature by 540 DEG C ~ 600 DEG C by 5 DEG C/min with cooling rate, namely completes the method for aluminum or aluminum alloy and other solder bonding metal.
Present embodiment adopts chemical gaseous phase depositing process, proposes a kind of method that Graphene strengthens copper particle auxiliary aluminum and other solder bonding metal.The introducing of Graphene, controls reaction speed, reduces eutectic product, and the high-quality realizing joint connects.
The beneficial effect of present embodiment is:
1, present embodiment adopts chemical gaseous phase depositing process, can prepare few layer graphene that defect is few, quality is high in copper granular material surface original position.
2, present embodiment has iris action at the Graphene of copper granular material surface growth in situ, greatly alleviates the violent interfacial reaction of aluminum or aluminum alloy and copper, reduces eutectic product, improves the mechanical property of soldered fitting.
3, the method for present embodiment employing is simple, efficient, is convenient to suitability for industrialized production.
Detailed description of the invention two: present embodiment and detailed description of the invention one unlike: other metal material described in step 3 is aluminium, copper or aluminium alloy.Other is identical with detailed description of the invention one.
Detailed description of the invention three: one of present embodiment and detailed description of the invention one or two unlike: be 10 at pressure in step 2
5under Pa, being 10 DEG C/min with programming rate, by temperature to 800 DEG C, and being incubated 40min at temperature is 800 DEG C, is then 10 at pressure
5under Pa, be 10 DEG C/min with programming rate, by temperature to 980 DEG C.Other is identical with detailed description of the invention one or two.
Detailed description of the invention four: one of present embodiment and detailed description of the invention one to three unlike: be 10 at pressure in step 2
5under Pa, being 7 DEG C/min with programming rate, by temperature to 900 DEG C, and being incubated 50min at temperature is 900 DEG C, is then 10 at pressure
5under Pa, be 10 DEG C/min with programming rate, by temperature to 960 DEG C.Other is identical with detailed description of the invention one to three.
Detailed description of the invention five: one of present embodiment and detailed description of the invention one to four unlike: be 10 at pressure in step 2
5under Pa, being 5 DEG C/min with programming rate, by temperature to 850 DEG C, and being incubated 45min at temperature is 850 DEG C, is then 10 at pressure
5under Pa, be 10 DEG C/min with programming rate, by temperature to 940 DEG C.Other is identical with detailed description of the invention one to four.
Detailed description of the invention six: one of present embodiment and detailed description of the invention one to five unlike: passing into methane in step 2, regulate the gas flow of methane to be 5sccm, is then 10 at pressure
5pa and temperature are deposit under the condition of 920 DEG C, and sedimentation time is 15min.Other is identical with detailed description of the invention one to five.
Detailed description of the invention seven: one of present embodiment and detailed description of the invention one to six unlike: passing into methane in step 2, regulate the gas flow of methane to be 10sccm, is then 10 at pressure
5pa and temperature are deposit under the condition of 950 DEG C, and sedimentation time is 10min.Other is identical with detailed description of the invention one to six.
Detailed description of the invention eight: one of present embodiment and detailed description of the invention one to seven unlike: then at temperature is 560 DEG C, be incubated 5min in step 3.Other is identical with detailed description of the invention one to seven.
Detailed description of the invention nine: one of present embodiment and detailed description of the invention one to eight unlike: then at temperature is 570 DEG C, be incubated 10min in step 3.Other is identical with detailed description of the invention one to eight.
Detailed description of the invention ten: one of present embodiment and detailed description of the invention one to nine unlike: then at temperature is 580 DEG C, be incubated 15min in step 3.Other is identical with detailed description of the invention one to nine.
Following examples are adopted to verify beneficial effect of the present invention:
Embodiment:
A kind of aluminum or aluminum alloy described in the present embodiment and the method for other solder bonding metal, namely a kind of Graphene strengthens the method that copper particle assists 2024 aluminium alloy brazings, specifically carries out according to following steps:
One, copper particle is placed in chemical vapor deposition unit, being evacuated to pressure is 10
-5below Pa, closing vavuum pump, take gas flow as the mist that 100sccm passes into hydrogen and argon gas, regulates pressure in chemical vapor deposition unit to be 10
5pa;
In described hydrogen and the mist of argon gas, the percentage by volume of hydrogen is 17%;
Two, be 10 at pressure
5under Pa, being 10 DEG C/min with programming rate, by temperature to 850 DEG C, and being incubated 30min at temperature is 850 DEG C, is then 10 at pressure
5under Pa, being 7 DEG C/min with programming rate, by temperature to 920 DEG C, passing into methane, regulate the gas flow of methane to be 5sccm, is then 10 at pressure
5pa and temperature are deposit under the condition of 920 DEG C, sedimentation time is 5min, after deposition terminates, stop passing into methane, then the gas flow of the mist of hydrogen and argon gas is adjusted to 120sccm by 100sccm, finally temperature is cooled to room temperature, namely obtains Graphene/copper Particles dispersed intermediate layer;
In described hydrogen and the mist of argon gas, the percentage by volume of hydrogen is 17%;
Three, Graphene/copper Particles dispersed intermediate layer is placed between 2024 aluminium alloys and the junction to be welded of 2024 aluminium alloys, and is positioned in vacuum brazing furnace, 5 × 10 are evacuated to vacuum brazing furnace
-3pa, is then incubated 5min at temperature is 550 DEG C, is finally that temperature is cooled to room temperature by 550 DEG C by 5 DEG C/min with cooling rate, obtains 2024 aluminium alloys that Graphene strengthens the soldering of copper particle interlayer.
Fig. 1 is the scanning electron microscopic picture of 2024 aluminium alloy interfaces of Graphene enhancing copper particle interlayer soldering prepared by embodiment.Can be obtained by figure, adopt Graphene to strengthen copper particle and do intermediate layer, eutectic reaction product A l
2cu phase is evenly distributed in the scope that weld seam is narrower, becomes chain form arrangement.2024 aluminium alloy connectors shearing strength at room temperature more traditional intermediate layer material soldering 2024 aluminium alloy connector that Graphene prepared by the present embodiment strengthens the soldering of copper particle interlayer improves 40%, reaches 71.2MPa.
Claims (10)
1. a method for aluminum or aluminum alloy and other solder bonding metal, is characterized in that a kind of method of aluminum or aluminum alloy and other solder bonding metal is carried out according to following steps:
One, copper particle is placed in chemical vapor deposition unit, being evacuated to pressure is 10
-5below Pa, closing vavuum pump, take gas flow as the mist that 20sccm ~ 100sccm passes into hydrogen and argon gas, regulates pressure in chemical vapor deposition unit to be 10
5pa;
In described hydrogen and the mist of argon gas, the percentage by volume of hydrogen is 17%;
Two, be 10 at pressure
5under Pa, with programming rate be 5 DEG C/min ~ 10 DEG C/min, by temperature to 800 DEG C ~ 900 DEG C, and being incubated 30min ~ 60min at temperature is 800 DEG C ~ 900 DEG C, is then 10 at pressure
5under Pa, with programming rate be 10 DEG C/min ~ 20 DEG C/min, by temperature to 920 DEG C ~ 1020 DEG C, pass into methane, the gas flow regulating methane is 5sccm ~ 15sccm, is then 10 at pressure
5pa and temperature are deposit under the condition of 920 DEG C ~ 1020 DEG C, sedimentation time is 5min ~ 15min, after deposition terminates, stop passing into methane, then the gas flow of the mist of hydrogen and argon gas is adjusted to 100sccm ~ 200sccm by 20sccm ~ 100sccm, finally temperature is cooled to room temperature, namely obtains Graphene/copper Particles dispersed intermediate layer;
In described hydrogen and the mist of argon gas, the percentage by volume of hydrogen is 17%;
Three, Graphene/copper Particles dispersed intermediate layer is placed between aluminum or aluminum alloy and the junction to be welded of other metal material, and is positioned in vacuum brazing furnace, 3 × 10 are evacuated to vacuum brazing furnace
-3pa ~ 8 × 10
-3pa, is then incubated 5min ~ 15min at temperature is 540 DEG C ~ 600 DEG C, is finally that temperature is cooled to room temperature by 540 DEG C ~ 600 DEG C by 5 DEG C/min with cooling rate, namely completes the method for aluminum or aluminum alloy and other solder bonding metal.
2. the method for a kind of aluminum or aluminum alloy according to claim 1 and other solder bonding metal, is characterized in that other metal material described in step 3 is aluminium, copper or aluminium alloy.
3. the method for a kind of aluminum or aluminum alloy according to claim 1 and other solder bonding metal, to is characterized in that in step 2 at pressure being 10
5under Pa, being 10 DEG C/min with programming rate, by temperature to 800 DEG C, and being incubated 40min at temperature is 800 DEG C, is then 10 at pressure
5under Pa, be 10 DEG C/min with programming rate, by temperature to 980 DEG C.
4. the method for a kind of aluminum or aluminum alloy according to claim 1 and other solder bonding metal, to is characterized in that in step 2 at pressure being 10
5under Pa, being 7 DEG C/min with programming rate, by temperature to 900 DEG C, and being incubated 50min at temperature is 900 DEG C, is then 10 at pressure
5under Pa, be 10 DEG C/min with programming rate, by temperature to 960 DEG C.
5. the method for a kind of aluminum or aluminum alloy according to claim 1 and other solder bonding metal, to is characterized in that in step 2 at pressure being 10
5under Pa, being 5 DEG C/min with programming rate, by temperature to 850 DEG C, and being incubated 45min at temperature is 850 DEG C, is then 10 at pressure
5under Pa, be 10 DEG C/min with programming rate, by temperature to 940 DEG C.
6. the method for a kind of aluminum or aluminum alloy according to claim 1 and other solder bonding metal, is characterized in that passing into methane in step 2, regulates the gas flow of methane to be 5sccm, is then 10 at pressure
5pa and temperature are deposit under the condition of 920 DEG C, and sedimentation time is 15min.
7. the method for a kind of aluminum or aluminum alloy according to claim 1 and other solder bonding metal, is characterized in that passing into methane in step 2, regulates the gas flow of methane to be 10sccm, is then 10 at pressure
5pa and temperature are deposit under the condition of 950 DEG C, and sedimentation time is 10min.
8. the method for a kind of aluminum or aluminum alloy according to claim 1 and other solder bonding metal, is characterized in that then at temperature is 560 DEG C, being incubated 5min in step 3.
9. the method for a kind of aluminum or aluminum alloy according to claim 1 and other solder bonding metal, is characterized in that then at temperature is 570 DEG C, being incubated 10min in step 3.
10. the method for a kind of aluminum or aluminum alloy according to claim 1 and other solder bonding metal, is characterized in that then at temperature is 580 DEG C, being incubated 15min in step 3.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510874581.6A CN105345195B (en) | 2015-12-02 | 2015-12-02 | A kind of method of aluminum or aluminum alloy and other solder bonding metals |
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|---|---|---|---|
| CN201510874581.6A CN105345195B (en) | 2015-12-02 | 2015-12-02 | A kind of method of aluminum or aluminum alloy and other solder bonding metals |
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| CN105345195B CN105345195B (en) | 2017-06-23 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107297830A (en) * | 2017-08-28 | 2017-10-27 | 惠安县文雕石业有限公司 | A kind of diamond compound slice |
| CN108620767A (en) * | 2018-05-08 | 2018-10-09 | 哈尔滨工业大学 | A kind of composite soldering and preparation method thereof for being brazed quartzy short fiber reinforced silicon dioxide composite material and Invar alloys |
| CN109593993A (en) * | 2018-12-24 | 2019-04-09 | 苏州大学 | A kind of welding method of aluminium base graphene composite material and preparation method thereof, welding point and aluminium alloy |
| CN114425622A (en) * | 2022-01-28 | 2022-05-03 | 荣成市宏程新材料有限公司 | Powder metallurgy composite material and preparation method thereof |
| CN115338375A (en) * | 2022-08-23 | 2022-11-15 | 安徽佳晟金属科技有限公司 | Production method of copper-aluminum composite plate strip material |
| CN117483895A (en) * | 2023-10-26 | 2024-02-02 | 北京科技大学 | Brazing preparation process of graphene/metal composite heat-spreading plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107297830A (en) * | 2017-08-28 | 2017-10-27 | 惠安县文雕石业有限公司 | A kind of diamond compound slice |
| CN108620767A (en) * | 2018-05-08 | 2018-10-09 | 哈尔滨工业大学 | A kind of composite soldering and preparation method thereof for being brazed quartzy short fiber reinforced silicon dioxide composite material and Invar alloys |
| CN108620767B (en) * | 2018-05-08 | 2020-05-12 | 哈尔滨工业大学 | Preparation method of composite solder for brazing quartz short fiber reinforced silicon dioxide composite material and Invar alloy |
| CN109593993A (en) * | 2018-12-24 | 2019-04-09 | 苏州大学 | A kind of welding method of aluminium base graphene composite material and preparation method thereof, welding point and aluminium alloy |
| CN114425622A (en) * | 2022-01-28 | 2022-05-03 | 荣成市宏程新材料有限公司 | Powder metallurgy composite material and preparation method thereof |
| CN115338375A (en) * | 2022-08-23 | 2022-11-15 | 安徽佳晟金属科技有限公司 | Production method of copper-aluminum composite plate strip material |
| CN115338375B (en) * | 2022-08-23 | 2023-11-17 | 安徽安坤新材科技有限公司 | Production method of copper-aluminum composite board strip material |
| CN117483895A (en) * | 2023-10-26 | 2024-02-02 | 北京科技大学 | Brazing preparation process of graphene/metal composite heat-spreading plate |
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