CN107297830A - A kind of diamond compound slice - Google Patents
A kind of diamond compound slice Download PDFInfo
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- CN107297830A CN107297830A CN201710748125.6A CN201710748125A CN107297830A CN 107297830 A CN107297830 A CN 107297830A CN 201710748125 A CN201710748125 A CN 201710748125A CN 107297830 A CN107297830 A CN 107297830A
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- lamination
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- layer
- titanium
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- 239000010432 diamond Substances 0.000 title claims abstract description 39
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 39
- 150000001875 compounds Chemical class 0.000 title claims abstract description 29
- 239000002131 composite material Substances 0.000 claims abstract description 23
- 238000005219 brazing Methods 0.000 claims abstract description 13
- 238000003475 lamination Methods 0.000 claims description 78
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 62
- 229910021389 graphene Inorganic materials 0.000 claims description 62
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 53
- 229910052802 copper Inorganic materials 0.000 claims description 53
- 239000010949 copper Substances 0.000 claims description 53
- 239000010936 titanium Substances 0.000 claims description 42
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 40
- 229910052719 titanium Inorganic materials 0.000 claims description 40
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 23
- 229910052804 chromium Inorganic materials 0.000 claims description 20
- 239000011651 chromium Substances 0.000 claims description 20
- 229910052746 lanthanum Inorganic materials 0.000 claims description 17
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 17
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 12
- 239000007789 gas Substances 0.000 claims description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 13
- 238000003754 machining Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 71
- 229910000858 La alloy Inorganic materials 0.000 description 42
- 239000002585 base Substances 0.000 description 38
- DRIUWMIAOYIBGN-UHFFFAOYSA-N lanthanum titanium Chemical compound [Ti][La] DRIUWMIAOYIBGN-UHFFFAOYSA-N 0.000 description 29
- 239000011159 matrix material Substances 0.000 description 29
- 229910045601 alloy Inorganic materials 0.000 description 22
- 239000000956 alloy Substances 0.000 description 22
- 238000013461 design Methods 0.000 description 21
- 238000010438 heat treatment Methods 0.000 description 20
- 239000003513 alkali Substances 0.000 description 18
- 238000004140 cleaning Methods 0.000 description 18
- 238000003825 pressing Methods 0.000 description 18
- 238000001291 vacuum drying Methods 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 3
- 239000004567 concrete Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910001096 P alloy Inorganic materials 0.000 description 2
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000010438 granite Substances 0.000 description 2
- 239000004579 marble Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910017813 Cu—Cr Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- ZTXONRUJVYXVTJ-UHFFFAOYSA-N chromium copper Chemical compound [Cr][Cu][Cr] ZTXONRUJVYXVTJ-UHFFFAOYSA-N 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 239000011049 pearl Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/12—Saw-blades or saw-discs specially adapted for working stone
- B28D1/121—Circular saw blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
Abstract
The present invention relates to a kind of diamond compound slice, belong to the technical field of diamond machining tool.The diamond compound slice of the present invention, a kind of diamond compound slice, it is characterised in that：The composite base plate is fixed together by two relative thin plates by brazing layer, and the space between brazing layer is formed with multiple internal heat dissipating passages, the composite base plate is circle, and the center of internal heat dissipating passage from the circular composite base plate extends to circumferencial direction, and the heat emission hole for being communicated to the internal heat dissipating passage is provided with least one thin plate.The diamond compound slice of the present invention can force air to realize the effect of quick heat radiating by internal heat dissipating passage at a high speed, so as to be prevented effectively from the thermal deformation of diamond compound slice under high-speed cutting operating condition.
Description
Technical field
The present invention relates to the technical field of diamond machining tool, it is more particularly related to which a kind of diamond is multiple
Close section.
Background technology
Current market, diamond tool is widely used to marble, granite, concrete, pitch, ceramics, glass, pearl
The cutting and repairing processing of the hard materials such as gem and jade；Cutting efficiency is improved constantly, spillage of material is reduced, diamond tool is improved
Service life be direction that market is pursued jointly.Diamond tool generally includes diamond segment and matrix, and matrix thickness is determined
Deposit diamond tool bit thickness, matrix thickness is thicker, and joint-cutting is wider during cutting, and cutting efficiency is lower, and spillage of material is bigger, economical
Benefit is poorer, and matrix thickness is thinning, and cutter head is thinning, and cutting efficiency lifting, spillage of material declines；But matrix it is thinning after will cause
Matrix rigidly declines in itself, bears load-carrying ability reduction, beat is produced during cutting, and then lose cutting power.Therefore how to solve
Certainly the contradiction between matrix thickness and rigidity, in the case of matrix rigid is ensured, produces thinner dry diamond section always
It is the problem for perplexing people.
The content of the invention
In order to solve above-mentioned technical problem of the prior art, it is combined and cuts it is an object of the invention to provide a kind of diamond
Piece.
A kind of diamond compound slice, it is characterised in that：The composite base plate passes through brazing layer by two relative thin plates
It is fixed together, and the space between brazing layer is formed with multiple internal heat dissipating passages, and the composite base plate is circle, and
The center of internal heat dissipating passage from the circular composite base plate extends to circumferencial direction, and the company of being provided with least one thin plate
Pass to the heat emission hole of the internal heat dissipating passage.
Further, formed on described two thin plates beforehand through compacting by titanium alloy layer and graphene composite material layer shape
Into lamination, the lamination of two thin plates is aligned in soldering under vacuum or argon gas protective condition and forms the brazing layer.
Further, the thickness of the titanium alloy layer is 0.02 ~ 0.08mm, and the thickness of the graphene composite material layer is
0.15 ~ 0.25mm, and the thickness of graphene composite material layer is at least 3 times of the titanium alloy layer.
Further, in the titanium alloy layer, the content of titanium accounts for 70 ~ 90wt%, and the content of lanthanum accounts for 10 ~ 30wt%；Institute
The content for stating graphene in graphene composite material layer is 12 ~ 20wt%, and the content of copper is 60 ~ 65wt%, the content of chromium for 20 ~
25wt%。
Diamond compound slice of the present invention has the advantages that：
The diamond compound slice of the present invention can force air logical by internal heat dissipating at a high speed under high-speed cutting operating condition
Road can realize the effect of quick heat radiating, so as to be prevented effectively from the thermal deformation of diamond compound slice.
Brief description of the drawings
Fig. 1 is the structural representation of the diamond compound slice of the present invention.
Fig. 2 is cross section structure schematic diagrams of the Fig. 1 along A directions.
Fig. 3 is thin plate braze-welded structure schematic diagram.
Fig. 4 is the structural representation of another form of diamond compound slice of the invention.
Fig. 5 is cross section structure schematic diagrams of the Fig. 4 along B directions.
Fig. 6 is the structural representation of the diamond compound slice of another form of the invention.
Fig. 7 is cross section structure schematic diagrams of the Fig. 6 along C directions.
Embodiment
Diamond compound slice of the present invention is further elaborated below with reference to specific embodiment, to help
Those skilled in the art has more complete, accurate and deep understanding to inventive concept of the invention, technical scheme.
As shown in Figure 1, diamond compound slice of the invention, including circular base 10, circular base 10, which has, to be located at
The side circumferential surface of matrix border, the chip area that the side circumferential surface extends inwards along circular base center of circle direction.It is circular
The center of matrix 10 is machined with mounting hole 18, and mounting hole 18 is used to match and install rotation driving axle（Not shown in figure）, rotation
Drive shaft is in power（Such as motor）Driving under drive diamond compound slice to carry out cutwork.In the present invention, in order to
Solve heat dissipation problem of the diamond compound slice in high-speed cutting and prevent the thermal deformation of circular base, as shown in Fig. 2 described
Circular base 10 is fixed together by relative two thin plates 11,12 by welding 13, and the sky between the weld layer 13
Between be formed with multiple internal heat dissipating passages 15, specifically mounting hole of the internal heat dissipating passage 15 from the center of circular base
18 extend to circumferencial direction, and the heat emission hole 20 for being communicated to the internal heat dissipating passage 15 is provided with thin plate 11,12.As schemed
Shown in 3, the welding region on described two thin plates 11,12 is formed by titanium alloy layer 16 and graphene composite wood beforehand through compacting
The lamination 18 of the formation of the bed of material 17, the lamination 18 of two thin plates is alignd and clamped using fixture, is then protected in vacuum or argon gas
Under the conditions of heating carry out soldering can be formed the present invention composite base plate.Thus, the present invention passes through discontinuous weld layer（Or
It can be described as the welding of non-full filled）And make to form multiple internal heat dissipatings therebetween by designing the inner space between weld layer
Passage, and the heat emission hole 20 connected with extraneous air is internally opened up on heat dissipation channel, so that the circular base has
There are the effect by air forced heat radiation, especially diamond compound slice in the case of high speed rotary cutting, pass through radiating
Hole suck air and in the internal heat dissipating passage high speed forced flow so as to will cut friction produce amount of heat
Take out of, so that diamond compound slice is forced also obtain good radiating effect under conditions of cooling in no liquid.
It can further improve heat dispersion, the inside by arranging the design of trend to weld layer in the present invention
Heat dissipation channel can radiate to extend to circumferencial direction in a linear fashion from the center of circular base, for example, can be along circle
Outside the several of circumferencial direction radiation in direction of base diameter or radius, dozens of even hundreds of linear internal heat dissipatings lead to
Road（Not shown in figure）, usually the height of the weld layer be 0.2 ~ 1.0mm, and in order to reduce the gross thickness of circular base with
Cutting effect is improved, the highly preferred of the weld layer is 0.2 ~ 0.5mm, and usually by the gap between adjacent weld layer
It is designed as 1.5 ~ 5mm（The width of weld layer is also simultaneously 1.5 ~ 5mm）, preferably 1.5 ~ 2.5mm（The width of weld layer is also simultaneously
For 1.5 ~ 2.5mm）And then width can be obtained for 1.5 ~ 5mm, preferably 1.5 ~ 2.5mm internal heat dissipating passage.Need explanation
, these size designs are general scenarios in the preferred case, and claimed technical scheme is not by above-mentioned
The limitation of concrete numerical value.In addition, the internal heat dissipating passage can also be form of arcs, for example can be the peace from circular base
What is originated near dress hole radiates the helix of extension to circumferencial direction in a spiral manner, can preferably use double helix internal heat dissipating
The arrangement form of passage, the internal heat dissipating passage of spiral form can have longer Internal contiguous pathway, in high-speed cutting rotation
Turn under conditions of result in compared to inside linear pattern by more excellent radiating effect.Preferably, each internal heat dissipating
Passage connects at least two heat emission holes, and one of heat emission hole, close to the center of circular base, another heat emission hole is close
The outward flange of circular base, so can facilitate air to flow rapidly into and flow out, and the inner space closed due to it is outside
Air insulated does not have radiating effect substantially.By research experiment, if the heat emission hole near excircle is designed to than circle
The diameter of heat emission hole near shape matrix center mounting hole is bigger, then can further improve radiating effect.In addition, along cylindrical
Near week, the length direction of heat emission hole is arranged perpendicularly to diametric form and multiple internal heat dissipating passages are crossed together
Form, then advantageously can improve the radiating effect near circular base excircle in improving radiating effect.In addition, described
Heat emission hole can be disposed therein on a thin plate, can also be respectively provided with heat emission hole on two thin plates.Fig. 1 and Fig. 2 descriptions
It is the diamond compound slice of an embodiment of the invention, the embodiment is to be respectively provided with to be communicated on two thin plates
The diamond compound slice of the radiating well format of internal heat dissipating passage.Fig. 4 and Fig. 5 describe another specific embodiment party of the invention
The diamond compound slice of formula, in this embodiment at least two heat emission holes of each internal heat dissipating passage connection, and wherein
One heat emission hole close to the center of circular base, another heat emission hole close to the outward flange of circular base, and heat emission hole from its
In a thin plate cross internal heat dissipating passage and penetrate another thin plate.Fig. 6 and Fig. 7 describe another specific implementation of the present invention
The diamond compound slice of mode, heat emission hole therein is provided only on one of thin plate.Above-mentioned accompanying drawing illustrate only straight line
The passage of type, but the present invention is not limited thereto, from the point of view of radiating effect is improved, for example, can pass through the cloth to weld layer
And if form the internal heat dissipating passage of spiral, the internal heat dissipating passage of Double-spiral can also be arranged to.In the present invention, it is described
The shape of heat emission hole is simultaneously unrestricted, for example, can be circle, ellipse, rectangle, square or other shapes, and in this hair
In bright, the size of the heat emission hole is simultaneously unrestricted, and it can be less than the width of internal heat dissipating passage, can also be more than the inside
The width of heat dissipation channel, the heat emission hole can also cross two or more disconnected internal heat dissipating passages.In order to anti-
The chip for only cutting generation enters the slot of internal heat dissipating passage, in the present invention the heat emission hole preferred elongated type, for example may be used
Using be width as 0.2 ~ 0.5mm, and length（Or arc length）For 1 ~ 10mm long and narrow hole, long and narrow hole can be rectangle, or
For arc.For less than 0.2mm, especially less than 0.1mm cutting chip is even if into can also lead in internal heat dissipating passage
Cross compulsory air flow and discharge.
In the prior art, for the stone materials such as marble, granite, concrete or construction material cutting, finishing is used
Diamond compound slice generally select 65Mn steel as matrix.The present invention is on the basis of radiating effect is improved, Ke Yixuan
Thin plate is selected, further to improve cutting ability and finishing effect.Due to austenitic stainless steels thermal coefficient of expansion such as 304 steel
It is larger and price is higher, thus be not preferred ground in the present invention, preferred ferritic stainless steels of the thin plate in the present invention,
Conventional 405,409,430,434 stainless steels can be for example selected, the thin plate is more preferably 430 thin plates in the present invention.430
Series stainless steel by add Ti etc. can reduce C content so that can with improve machinability, but Ti be active metal member
Element, rises and is oxidized easily and forms thick and continuous oxide-film in stainless steel surfaces, so as to be unfavorable for follow-up be welded and fixed
Technique, and it is not only expensive using conventional silver brazing technique, and also high temperature resistance and cutting performance are poor.In the present invention
In, described two 430 type thin plates are preferably fixed by soldering processes and in the soldering interlayer formation internal heat dissipating passage of formation.For
Improve the welding region on the weld strength of 430 thin plates, described two thin plates 11,12 and formed beforehand through compacting and closed by titanium lanthanum
Layer gold 16 and the lamination 18 of the formation of copper graphene alloy-layer 17, the lamination 18 of two thin plates is alignd and clamped using fixture, so
Heating carries out soldering under vacuum or argon gas protective condition afterwards（Brazing temperature is 1020 ~ 1100 DEG C, and soaking time is 5 ~ 20min）
, wherein the thickness of the titanium alloy layer is 0.02 ~ 0.08mm, the thickness of graphene composite material layer for 0.15 ~
0.25mm, and the thickness of graphene composite material layer is at least 3 times of the titanium alloy layer.The content of titanium accounts for 70 ~
90wt%, the content of lanthanum accounts for 10 ~ 30wt%；The content of graphene is 12 ~ 20wt% in graphene composite material layer, copper
Content is 60 ~ 65wt%, and the content of chromium is 20 ~ 25wt%.Weld layer between 430 thin plates can be caused using above-mentioned welding method
（Brazing layer）Average shear strength for 350MPa or so, if using argon atmosphere average shear strength can improve to
More than 370MPa, and the section microexamination of brazing layer is can be found that brazing layer be not greater than more than 0.1 μm of crackle with
And the defect such as stomata.
Embodiment 1
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium lanthanum alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on titanium lanthanum alloy bar
Copper graphene alloy bar carries out extruding using operated pressing tool and forms the titanium lanthanum alloy layer that thickness is 0.05mm（Lanthanum accounts for 12.5wt%, titanium
Account for 87.5wt%）It is 0.20mm copper graphene alloy-layer with thickness (graphene accounts for 13wt%, and copper accounts for 65wt%, and chromium accounts for 22wt%)
Lamination, the width of lamination is 3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and fill
Assigned in weld jig, it is subsequently placed in vacuum drying oven, is evacuated to 10-3Below Pa, then with 1 ~ 10 DEG C/min programming rate
It is heated to 500 DEG C to preheat 3 ~ 5 minutes, is then heated to 1050 DEG C with 10 DEG C/min programming rate, is then incubated 20 minutes, so
Stop heating afterwards and be furnace-cooled to less than 100 DEG C taking-ups.
Embodiment 2
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium lanthanum alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on titanium lanthanum alloy bar
Copper graphene alloy bar carries out extruding using operated pressing tool and forms the titanium lanthanum alloy layer that thickness is 0.03mm（Lanthanum accounts for 12.5wt%, titanium
Account for 87.5wt%）It is 0.22mm copper graphene alloy-layer with thickness (graphene accounts for 16wt%, and copper accounts for 60wt%, and chromium accounts for 24wt%)
Lamination, the width of lamination is 3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and fill
Assigned in weld jig, it is subsequently placed in vacuum drying oven, is evacuated to 10-3Below Pa, then with 1 ~ 10 DEG C/min programming rate
It is heated to 500 DEG C to preheat 3 ~ 5 minutes, is then heated to 1050 DEG C with 10 DEG C/min programming rate, is then incubated 20 minutes, so
Stop heating afterwards and be furnace-cooled to less than 100 DEG C taking-ups.
Embodiment 3
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium lanthanum alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on titanium lanthanum alloy bar
Copper graphene alloy bar carries out extruding using operated pressing tool and forms the titanium lanthanum alloy layer that thickness is 0.05mm（Lanthanum accounts for 23.5wt%, titanium
Account for 76.5wt%）It is 0.20mm copper graphene alloy-layer with thickness (graphene accounts for 18wt%, and copper accounts for 63wt%, and chromium accounts for 19wt%)
Lamination, the width of lamination is 3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and fill
Assigned in weld jig, it is subsequently placed in vacuum drying oven, is evacuated to 10-3Below Pa, then with 1 ~ 10 DEG C/min programming rate
It is heated to 500 DEG C to preheat 3 ~ 5 minutes, is then heated to 1050 DEG C with 10 DEG C/min programming rate, is then incubated 20 minutes, so
Stop heating afterwards and be furnace-cooled to less than 100 DEG C taking-ups.
Embodiment 4
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium lanthanum alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on titanium lanthanum alloy bar
Copper graphene alloy bar carries out extruding using operated pressing tool and forms the titanium lanthanum alloy layer that thickness is 0.03mm（Lanthanum accounts for 23.5wt%, titanium
Account for 76.5wt%）It is 0.22mm copper graphene alloy-layer with thickness (graphene accounts for 18wt%, and copper accounts for 62wt%, and chromium accounts for 20wt%)
Lamination, the width of lamination is 3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and fill
Assigned in weld jig, it is subsequently placed in vacuum drying oven, is evacuated to 10-3Below Pa, then with 1 ~ 10 DEG C/min programming rate
It is heated to 500 DEG C to preheat 3 ~ 5 minutes, is then heated to 1050 DEG C with 10 DEG C/min programming rate, is then incubated 20 minutes, so
Stop heating afterwards and be furnace-cooled to less than 100 DEG C taking-ups.
Embodiment 5
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium lanthanum alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on titanium lanthanum alloy bar
Copper graphene alloy bar carries out extruding using operated pressing tool and forms the titanium lanthanum alloy layer that thickness is 0.08mm（Lanthanum accounts for 15.0wt%, titanium
Account for 85.0wt%）It is 0.25mm copper graphene alloy-layer with thickness (graphene accounts for 19wt%, and copper accounts for 61wt%, and chromium accounts for 20wt%)
Lamination, the width of lamination is 3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and fill
Assigned in weld jig, it is subsequently placed in vacuum drying oven, is evacuated to 10-3Below Pa, then with 1 ~ 10 DEG C/min programming rate
It is heated to 500 DEG C to preheat 3 ~ 5 minutes, is then heated to 1050 DEG C with 10 DEG C/min programming rate, is then incubated 20 minutes, so
Stop heating afterwards and be furnace-cooled to less than 100 DEG C taking-ups.
Embodiment 6
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium lanthanum alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on titanium lanthanum alloy bar
Copper graphene alloy bar carries out extruding using operated pressing tool and forms the titanium lanthanum alloy layer that thickness is 0.05mm（Lanthanum accounts for 12.5wt%, titanium
Account for 87.5wt%）It is 0.20mm copper graphene alloy-layer with thickness (graphene accounts for 14wt%, and copper accounts for 65wt%, and chromium accounts for 21wt%)
Lamination, the width of lamination is 3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and fill
Assigned in weld jig, it is subsequently placed in vacuum drying oven, is evacuated to 10-3Pa, is subsequently filled Ar gas to 100Pa, then with 1 ~ 10
DEG C/min programming rate is heated to 500 DEG C and preheats 3 ~ 5 minutes, is then heated to 1050 DEG C with 10 DEG C/min programming rate,
Then 20 minutes are incubated, then stop heating and be furnace-cooled to less than 100 DEG C taking-ups.
Embodiment 7
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium lanthanum alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on titanium lanthanum alloy bar
Copper graphene alloy bar carries out extruding using operated pressing tool and forms the titanium lanthanum alloy layer that thickness is 0.03mm（Lanthanum accounts for 12.5wt%, titanium
Account for 87.5wt%）It is 0.22mm copper graphene alloy-layer with thickness (graphene accounts for 19wt%, and copper accounts for 66wt%, and chromium accounts for 25wt%)
Lamination, the width of lamination is 3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and fill
Assigned in weld jig, it is subsequently placed in vacuum drying oven, is evacuated to 10-3Pa, is subsequently filled Ar gas to 100Pa, then with 1 ~ 10
DEG C/min programming rate is heated to 500 DEG C and preheats 3 ~ 5 minutes, is then heated to 1050 DEG C with 10 DEG C/min programming rate,
Then 20 minutes are incubated, then stop heating and be furnace-cooled to less than 100 DEG C taking-ups.
Embodiment 8
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium lanthanum alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on titanium lanthanum alloy bar
Copper graphene alloy bar carries out extruding using operated pressing tool and forms the titanium lanthanum alloy layer that thickness is 0.05mm（Lanthanum accounts for 23.5wt%, titanium
Account for 76.5wt%）It is 0.20mm copper graphene alloy-layer with thickness (graphene accounts for 15wt%, and copper accounts for 60wt%, and chromium accounts for 25wt%)
Lamination, the width of lamination is 3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and fill
Assigned in weld jig, it is subsequently placed in vacuum drying oven, it is evacuated to 10-3Pa, is subsequently filled Ar gas to 100Pa, then with 1 ~ 10
DEG C/min programming rate is heated to 500 DEG C and preheats 3 ~ 5 minutes, is then heated to 1050 DEG C with 10 DEG C/min programming rate,
Then 20 minutes are incubated, then stop heating and be furnace-cooled to less than 100 DEG C taking-ups.
Embodiment 9
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium lanthanum alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on titanium lanthanum alloy bar
Copper graphene alloy bar carries out extruding using operated pressing tool and forms the titanium lanthanum alloy layer that thickness is 0.03mm（Lanthanum accounts for 23.5wt%, titanium
Account for 76.5wt%）It is 0.22mm copper graphene alloy-layer with thickness (graphene accounts for 19wt%, and copper accounts for 61wt%, and chromium accounts for 20wt%)
Lamination, the width of lamination is 3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and fill
Assigned in weld jig, it is subsequently placed in vacuum drying oven, is evacuated to 10-3Pa, is subsequently filled Ar gas to 100Pa, then with 1 ~ 10
DEG C/min programming rate is heated to 500 DEG C and preheats 3 ~ 5 minutes, is then heated to 1050 DEG C with 10 DEG C/min programming rate,
Then 20 minutes are incubated, then stop heating and be furnace-cooled to less than 100 DEG C taking-ups.
Embodiment 10
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium lanthanum alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on titanium lanthanum alloy bar
Copper graphene alloy bar carries out extruding using operated pressing tool and forms the titanium lanthanum alloy layer that thickness is 0.08mm（Lanthanum accounts for 15.0wt%, titanium
Account for 85.0wt%）It is 0.25mm copper graphene alloy-layer with thickness (graphene accounts for 20wt%, and copper accounts for 60wt%, and chromium accounts for 20wt%)
Lamination, the width of lamination is 3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and fill
Assigned in weld jig, it is subsequently placed in vacuum drying oven, is evacuated to 10-3Pa, is subsequently filled Ar gas to 100Pa, then with 1 ~ 10
DEG C/min programming rate is heated to 500 DEG C and preheats 3 ~ 5 minutes, is then heated to 1050 DEG C with 10 DEG C/min programming rate,
Then 20 minutes are incubated, then stop heating and be furnace-cooled to less than 100 DEG C taking-ups.
Comparative example 1
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium lanthanum alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on titanium lanthanum alloy bar
Copper graphene alloy bar carries out extruding using operated pressing tool and forms the titanium lanthanum alloy layer that thickness is 0.10mm（Lanthanum accounts for 12.5wt%, titanium
Account for 87.5wt%）It is 0.20mm copper graphene alloy-layer with thickness (graphene accounts for 20wt%, and copper accounts for 60wt%, and chromium accounts for 20wt%)
Lamination, the width of lamination is 3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and fill
Assigned in weld jig, it is subsequently placed in vacuum drying oven, is evacuated to 10-3Below Pa, then with 1 ~ 10 DEG C/min programming rate
It is heated to 500 DEG C to preheat 3 ~ 5 minutes, is then heated to 1050 DEG C with 10 DEG C/min programming rate, is then incubated 20 minutes, so
Stop heating afterwards and be furnace-cooled to less than 100 DEG C taking-ups.
Comparative example 2
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium bar is arranged on thin plate according to the internal channel structure form of design, copper graphene alloy is then arranged on titanium bar
Bar carries out extruding using operated pressing tool and forms the copper graphene alloy that titanium alloy layer and thickness that thickness is 0.05mm are 0.20mm
The lamination of layer (graphene accounts for 20wt%, and copper accounts for 60wt%, and chromium accounts for 20wt%), the width of lamination is 3mm.The 430 of lamination will be formed with
The lamination of thin plate is relative and adjusts good position and is close to set and is assemblied in weld jig, is subsequently placed in vacuum drying oven, vacuumizes
To 10-3Below Pa, is then heated to 500 DEG C with 1 ~ 10 DEG C/min programming rate and preheats 3 ~ 5 minutes, then with 10 DEG C/min's
Programming rate is heated to 1050 DEG C, is then incubated 20 minutes, then stops heating and is furnace-cooled to less than 100 DEG C taking-ups.
Comparative example 3
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.CTB alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on CTB alloy bar
Copper graphene alloy bar carries out extruding using operated pressing tool and forms the titanium graphene composite material layer that thickness is 0.05mm（Copper is accounted for
21.0wt%, titanium accounts for 79.0wt%）(graphene accounts for 20wt%, and copper accounts for 60wt%, chromium with the copper graphene alloy-layer that thickness is 0.20mm
Account for 20wt%) lamination, the width of lamination is 3mm.The lamination that 430 thin plates of lamination will be formed with is relative and to adjust good position tight
It is sticked and puts and be assemblied in weld jig, be subsequently placed in vacuum drying oven, is evacuated to 10-3Below Pa, then with 1 ~ 10 DEG C/min
Programming rate be heated to 500 DEG C preheat 3 ~ 5 minutes, 1050 DEG C, Ran Houbao are then heated to 10 DEG C/min programming rate
Temperature 20 minutes, then stops heating and is furnace-cooled to less than 100 DEG C taking-ups.
Comparative example 4
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium chrome alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on titanium chrome alloy bar
Copper graphene alloy bar carries out extruding using operated pressing tool and forms the titanium chrome alloy layer that thickness is 0.05mm（Chromium accounts for 10wt%, and titanium is accounted for
90wt%）It is the folded of 0.20mm copper graphene alloy-layer (graphene accounts for 19wt%, and copper accounts for 61wt%, and chromium accounts for 20wt%) with thickness
Layer, the width of lamination is 3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and assemble
In weld jig, it is subsequently placed in vacuum drying oven, is evacuated to 10-3Below Pa, is then added with 1 ~ 10 DEG C/min programming rate
Hot to 500 DEG C preheat 3 ~ 5 minutes, are then heated to 1050 DEG C with 10 DEG C/min programming rate, are then incubated 20 minutes, then
Stop heating and be furnace-cooled to less than 100 DEG C taking-ups.
Comparative example 5
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Ferro-titanium bar is arranged on thin plate according to the internal channel structure form of design, then arranged on ferro-titanium bar
Copper graphene alloy bar carries out extruding using operated pressing tool and forms the ferro-titanium layer that thickness is 0.05mm（Iron accounts for 10wt%, and titanium is accounted for
90wt%）It is the folded of 0.20mm copper graphene alloy-layer (graphene accounts for 19wt%, and copper accounts for 61wt%, and chromium accounts for 20wt%) with thickness
Layer, the width of lamination is 3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and assemble
In weld jig, it is subsequently placed in vacuum drying oven, is evacuated to 10-3Below Pa, is then added with 1 ~ 10 DEG C/min programming rate
Hot to 500 DEG C preheat 3 ~ 5 minutes, are then heated to 1050 DEG C with 10 DEG C/min programming rate, are then incubated 20 minutes, then
Stop heating and be furnace-cooled to less than 100 DEG C taking-ups.
Comparative example 6
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium lanthanum alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on titanium lanthanum alloy bar
Copper-phosphorus alloy bar carries out extruding using operated pressing tool and forms the titanium lanthanum alloy layer that thickness is 0.05mm（Lanthanum accounts for 23.5wt%, and titanium is accounted for
76.5wt%）With lamination of the thickness for 0.20mm copper-phosphorus alloy layer (phosphorus accounts for 0.5wt%, and copper accounts for 99.5wt%), the width of lamination is
3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and be assemblied in weld jig, so
After be placed in vacuum drying oven, be evacuated to 10-3Below Pa, is then heated to 500 DEG C of preheatings 3 ~ 5 with 1 ~ 10 DEG C/min programming rate
Minute, 1050 DEG C then are heated to 10 DEG C/min programming rate, then 20 minutes are incubated, then stops heating and is furnace-cooled to
Less than 100 DEG C taking-ups.
Comparative example 7
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium lanthanum alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on titanium lanthanum alloy bar
Albronze bar carries out extruding using operated pressing tool and forms the titanium lanthanum alloy layer that thickness is 0.05mm（Lanthanum accounts for 23.5wt%, and titanium is accounted for
76.5wt%）With lamination of the thickness for 0.20mm albronze layer (aluminium accounts for 7.9wt%, and copper accounts for 92.1wt%), the width of lamination is
3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and be assemblied in weld jig, so
After be placed in vacuum drying oven, be evacuated to 10-3Below Pa, is then heated to 500 DEG C of preheatings 3 ~ 5 with 1 ~ 10 DEG C/min programming rate
Minute, 1050 DEG C then are heated to 10 DEG C/min programming rate, then 20 minutes are incubated, then stops heating and is furnace-cooled to
Less than 100 DEG C taking-ups.
Comparative example 8
Thickness is selected to make circular base for 3mm 430 thin plates, a diameter of 200mm of matrix is dried after alkali cleaning degreases
It is standby.Titanium lanthanum alloy bar is arranged on thin plate according to the internal channel structure form of design, then arranged on titanium lanthanum alloy bar
Chromiumcopper bar carries out extruding using operated pressing tool and forms the titanium lanthanum alloy layer that thickness is 0.05mm（Lanthanum accounts for 23.5wt%, and titanium is accounted for
76.5wt%）With lamination of the thickness for 0.20mm Cu-Cr alloy layer (chromium accounts for 9.0wt%, and copper accounts for 910.wt%), the width of lamination is
3mm.The lamination that 430 thin plates of lamination will be formed with is relative and adjust good position and be close to set and be assemblied in weld jig, so
After be placed in vacuum drying oven, be evacuated to 10-3Below Pa, is then heated to 500 DEG C of preheatings 3 ~ 5 with 1 ~ 10 DEG C/min programming rate
Minute, 1050 DEG C then are heated to 10 DEG C/min programming rate, then 20 minutes are incubated, then stops heating and is furnace-cooled to
Less than 100 DEG C taking-ups.
Welding performance in the circular base obtained to embodiment 1 ~ 10 and comparative example 1 ~ 8 is tested, and respectively takes 10
The shear strength at room temperature that test point is measured is as shown in Table 1 and Table 2.
The shear strength of table 1（MPa）
The shear strength of table 2（MPa）
For the ordinary skill in the art, simply the present invention is exemplarily described for specific embodiment, it is clear that
The present invention, which is implemented, to be not subject to the restrictions described above, as long as employing inventive concept and technical scheme of the present invention progress
The improvement of various unsubstantialities, or it is not improved by the present invention design and technical scheme directly apply to other occasions,
Within protection scope of the present invention.
Claims (4)
1. a kind of diamond compound slice, it is characterised in that：The composite base plate is consolidated by two relative thin plates by brazing layer
It is scheduled on together, and the space between brazing layer is formed with multiple internal heat dissipating passages, the composite base plate is circle, and institute
The center for stating internal heat dissipating passage from circular composite base plate extends to circumferencial direction, and connection is provided with least one thin plate
To the heat emission hole of the internal heat dissipating passage.
2. diamond compound slice according to claim 1, it is characterised in that：Beforehand through compacting on described two thin plates
The lamination formed by titanium alloy layer and graphene composite material layer is formed, the lamination of two thin plates is aligned in vacuum or argon gas is protected
Soldering forms the brazing layer under the conditions of shield.
3. diamond compound slice according to claim 2, it is characterised in that：The thickness of the titanium alloy layer be 0.02 ~
0.08mm, the thickness of graphene composite material layer is 0.15 ~ 0.25mm, and the thickness of graphene composite material layer
3 times of at least described titanium alloy layer.
4. diamond compound slice according to claim 2, it is characterised in that：In the titanium alloy layer, the content of titanium
70 ~ 90wt% is accounted for, the content of lanthanum accounts for 10 ~ 30wt%；The content of graphene is 12 ~ 20wt% in graphene composite material layer,
The content of copper is 60 ~ 65wt%, and the content of chromium is 20 ~ 25wt%.
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| US5040341A (en) * | 1989-04-17 | 1991-08-20 | Hiroaki Okinaga | Rotary cutter wheel |
| JP2004188481A (en) * | 2002-12-13 | 2004-07-08 | Hitachi Cable Ltd | Complex-material for brazing and brazing method using the same |
| JP2005052873A (en) * | 2003-08-06 | 2005-03-03 | Hitachi Cable Ltd | Composite material for brazing, and its production method |
| CN103612026A (en) * | 2013-11-08 | 2014-03-05 | 上海龙烁焊材有限公司 | Composite solder flux-cored aluminum welding wire and preparation method thereof |
| CN105345195A (en) * | 2015-12-02 | 2016-02-24 | 哈尔滨工业大学 | Method for brazing aluminum or aluminum alloy and other metals |
| CN106363266A (en) * | 2016-11-22 | 2017-02-01 | 中国航空工业集团公司北京航空材料研究院 | Method for braze-welding core body of tube type radiator by adopting strip-shaped brazing filler metal |
| CN106903454A (en) * | 2017-04-28 | 2017-06-30 | 西安航空学院 | A kind of aluminum steel xenogenesis connects soldering solder |
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2017
- 2017-08-28 CN CN201710748125.6A patent/CN107297830A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5040341A (en) * | 1989-04-17 | 1991-08-20 | Hiroaki Okinaga | Rotary cutter wheel |
| JP2004188481A (en) * | 2002-12-13 | 2004-07-08 | Hitachi Cable Ltd | Complex-material for brazing and brazing method using the same |
| JP2005052873A (en) * | 2003-08-06 | 2005-03-03 | Hitachi Cable Ltd | Composite material for brazing, and its production method |
| CN103612026A (en) * | 2013-11-08 | 2014-03-05 | 上海龙烁焊材有限公司 | Composite solder flux-cored aluminum welding wire and preparation method thereof |
| CN105345195A (en) * | 2015-12-02 | 2016-02-24 | 哈尔滨工业大学 | Method for brazing aluminum or aluminum alloy and other metals |
| CN106363266A (en) * | 2016-11-22 | 2017-02-01 | 中国航空工业集团公司北京航空材料研究院 | Method for braze-welding core body of tube type radiator by adopting strip-shaped brazing filler metal |
| CN106903454A (en) * | 2017-04-28 | 2017-06-30 | 西安航空学院 | A kind of aluminum steel xenogenesis connects soldering solder |
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Application publication date: 20171027 |