CN105335776A - Method for making metro coins - Google Patents
Method for making metro coins Download PDFInfo
- Publication number
- CN105335776A CN105335776A CN201510619807.8A CN201510619807A CN105335776A CN 105335776 A CN105335776 A CN 105335776A CN 201510619807 A CN201510619807 A CN 201510619807A CN 105335776 A CN105335776 A CN 105335776A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- metro
- coins
- making
- iron coin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention discloses a method for making metro coins. The method comprises the following steps: step 1, providing a circuit board, mounting wafers on the circuit board, adhesively fixing the mounted wafers by using resin, and performing heating curing; step 2, selecting lead wires with the diameters of 0.1-0.3 mm, and performing circuit connection on the circuit board by using a special welding wire machine; step 3, adhesively fixing a circuit by using the resin and performing heating curing; step 4, putting the circuit board with the cured wafers into a plastic housing to perform metro coin forming and injection molding; and step 5, checking and packaging finished metro coins. According to the method, the processes of applying tin paste to the circuit board and mounting patch elements on the circuit board are omitted, and the thickness caused by the application of the tin paste and the mounting of the patch elements is removed, so that the circuit board is connected with a novel process, the thickness of the circuit board is effectively reduced, the metro coins become thinner, the material loss is reduced, the production cost is reduced, and the production efficiency is improved.
Description
Technical field
The present invention relates to field of intelligent cards, more particularly, relate to the method for making of a kind of ground iron coin.
Background technology
Along with the variation of people's trip, the payment function of trip bill simplifies and miniaturization and environmental protection are more and more come more to receive an acclaim and favor.Subway ticket develops into the thin slice of papery from early stage intelligent cards, more can reclaim, the ground iron coin of reusable plasthetics replaces gradually, at present, ground iron coin with produce simple, volume is little, easy to carry, damage resistance is high, can reuse again and used by most MTR, as the rapid transit subway etc. in Tianjin Underground, Guangzhou Underground, Line of Nanjing Subway, the Taibei.
In prior art, the method for grown place iron coin generally comprises following steps:
1, on the wiring board of 0.3mm, tin cream is applied;
2, on the wiring board of 0.3mm, surface mount elements is installed;
3, the wiring board installing surface mount elements is entered hot-air through nonwoven;
4, in the circuit board wafer be installed and carry out solidus connection;
5, mounted wafer resin is cured;
6, the wiring board of the wafer that is cured is put into plastic casing and carry out ground iron coin injection molding;
7, finished product inspection, packaging.
Can see, in above-mentioned step 1-3, need to use tin cream, and need to use SMD components, so this process is unfavorable for environmental protection and is unfavorable for the sheet of ground iron coin.Therefore need to improve the method for making of existing ground iron coin.
Summary of the invention
In order to overcome the deficiencies in the prior art, the object of the present invention is to provide the method for making of a kind of ground iron coin, this method for making can without the mode of tin welding, and the volume of electric elements can be reduced, become thinner to make ground iron coin, the loss of effective minimizing material, and reduce production cost, enhance productivity.
The technical solution adopted for the present invention to solve the technical problems is: the method for making of a kind of ground iron coin, and it comprises the following steps:
The first step, a wiring board is provided and in the circuit board wafer is installed, the adhesion of mounted wafer resin is fixed and is heating and curing;
Second step, choose the wire of 0.1-0.3 mm dia, with special bonding equipment, wiring board is carried out circuit and connect;
3rd step, the adhesion of circuit resin is fixed and is heating and curing;
4th step, the wiring board of the wafer that is cured is put into plastic casing carry out ground iron coin injection molding;
5th step, iron coin finished product inspection, packaging.
As preferred technical scheme, the diameter of selected wire is 0.2 millimeter.
As preferred technical scheme, the diameter of selected wire is 0.13 millimeter.
The invention has the beneficial effects as follows: after adopting process of the present invention, relative to existing technology, eliminate process wiring board applying and tin cream and wiring board is installed surface mount elements, also eliminate the thickness that coating tin cream brings with installation surface mount elements, therefore, adopt new technique connection line plate, effectively reduce the thickness of wiring board, make ground iron coin become thinner, decrease the loss of material, and reduce production cost, improve production efficiency.
Accompanying drawing explanation
Below in conjunction with drawings and embodiments, the invention will be further described.
Fig. 1 is technological process block-diagram of the present invention.
Embodiment
With reference to Fig. 1, the method for making of the present invention a kind of ground iron coin, comprises the following steps:
The first step, a wiring board is provided and ground iron coin wafer is installed in the circuit board, the adhesion of mounted wafer resin is fixed and is heating and curing;
Second step, choose the wire of 0.1-0.3 mm dia, with special bonding equipment, wiring board is carried out circuit and connect;
3rd step, the adhesion of circuit resin is fixed and is heating and curing;
4th step, the wiring board of the wafer that is cured is put into plastic casing carry out ground iron coin injection molding;
5th step, iron coin finished product inspection, packaging.
As preferred technical scheme, the diameter of selected wire is 0.2 millimeter.
As preferred technical scheme, the diameter of selected wire is 0.13 millimeter.Ground iron coin can be made like this to become thinner.
The inventive method, eliminates the mode of tin cream welding, and reduces the volume of electric elements, to make ground iron coin become thinner, effectively reduces spillage of material, to reduce production cost.Special bonding equipment described in the inventive method, refer to the specialized equipment being suitable for the inner pin interconnection welding technology application of special electronics component package production chips, it has automatic thread supplying device, automatically bonding wire head, automatic welding wire cutter, manually or automatically XY mobile platform, this kind of special bonding equipment is the technology that current custom is known, does not repeat at this.The inventive method introduces the special bonding equipment described in using, and more improve production efficiency, cut the waste bonding wire starting material, effectively make use of remaining bonding wire material, has saved material cost, reduced production cost.
The special bonding equipment of the present invention, connection line plate, is heating and curing with the resin adhesion of fluid state again, makes original wiring board (containing element) become 0.5mm from 0.9mm.And do not re-use tradition to the influential scolding tin mode of environment, and employing is that up-to-date TC nation determines, more environmental protection.
In addition, the present invention is not limited to above-mentioned embodiment, as long as it reaches technique effect of the present invention with substantially identical means, all should belong to protection scope of the present invention.
Claims (3)
1. the method for making of kind of ground iron coin, is characterized in that comprising the following steps:
The first step, a wiring board is provided and ground iron coin wafer is installed in the circuit board, the adhesion of mounted wafer resin is fixed and is heating and curing;
Second step, choose the wire of 0.1-0.3 mm dia, with special bonding equipment, wiring board is carried out circuit and connect;
3rd step, the adhesion of circuit resin is fixed and is heating and curing;
4th step, the wiring board of the wafer that is cured is put into plastic casing carry out ground iron coin injection molding;
5th step, iron coin finished product inspection, packaging.
2. the method for making of iron coin according to claim 1ly, is characterized in that: the diameter of selected wire is 0.2 millimeter.
3. the method for making of iron coin according to claim 1ly, is characterized in that: the diameter of selected wire is 0.13 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510619807.8A CN105335776A (en) | 2015-09-25 | 2015-09-25 | Method for making metro coins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510619807.8A CN105335776A (en) | 2015-09-25 | 2015-09-25 | Method for making metro coins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105335776A true CN105335776A (en) | 2016-02-17 |
Family
ID=55286291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510619807.8A Pending CN105335776A (en) | 2015-09-25 | 2015-09-25 | Method for making metro coins |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105335776A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0343030A1 (en) * | 1988-05-09 | 1989-11-23 | Bull Cp8 | Flexible printed circuit, particularly for electronic microcircuit cards, and card incorporating this circuit |
| CN1232293A (en) * | 1998-02-17 | 1999-10-20 | 日本电气株式会社 | Structure and method for mounting electronic part |
| US5973599A (en) * | 1997-10-15 | 1999-10-26 | Escort Memory Systems | High temperature RFID tag |
| US20110018715A1 (en) * | 2009-07-23 | 2011-01-27 | System Integration Technology Korea Co., Ltd | Rfid tag-embedded casino chip |
| CN201993796U (en) * | 2011-04-13 | 2011-09-28 | 北京意诚信通智能卡股份有限公司 | Coin-shaped IC card dedicated for rail transit |
| CN202159364U (en) * | 2011-07-04 | 2012-03-07 | 成都兴同达微电子科技有限公司 | Electronic tag |
| EP2348461B1 (en) * | 2010-01-15 | 2012-06-06 | Assa Abloy AB | RFID tag for high temperature environment |
| CN103262100A (en) * | 2010-11-11 | 2013-08-21 | 天使游戏纸牌股份有限公司 | Token coin for play and system for determining authenticity of token coin for play |
| CN203312286U (en) * | 2013-04-22 | 2013-11-27 | 深圳市实佳电子有限公司 | All card payment smart card carrying belt |
| CN104182784A (en) * | 2013-05-23 | 2014-12-03 | 江苏富纳电子科技有限公司 | Metro coin for radio frequency identification |
-
2015
- 2015-09-25 CN CN201510619807.8A patent/CN105335776A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0343030A1 (en) * | 1988-05-09 | 1989-11-23 | Bull Cp8 | Flexible printed circuit, particularly for electronic microcircuit cards, and card incorporating this circuit |
| US5973599A (en) * | 1997-10-15 | 1999-10-26 | Escort Memory Systems | High temperature RFID tag |
| CN1232293A (en) * | 1998-02-17 | 1999-10-20 | 日本电气株式会社 | Structure and method for mounting electronic part |
| US20110018715A1 (en) * | 2009-07-23 | 2011-01-27 | System Integration Technology Korea Co., Ltd | Rfid tag-embedded casino chip |
| EP2348461B1 (en) * | 2010-01-15 | 2012-06-06 | Assa Abloy AB | RFID tag for high temperature environment |
| CN103262100A (en) * | 2010-11-11 | 2013-08-21 | 天使游戏纸牌股份有限公司 | Token coin for play and system for determining authenticity of token coin for play |
| CN201993796U (en) * | 2011-04-13 | 2011-09-28 | 北京意诚信通智能卡股份有限公司 | Coin-shaped IC card dedicated for rail transit |
| CN202159364U (en) * | 2011-07-04 | 2012-03-07 | 成都兴同达微电子科技有限公司 | Electronic tag |
| CN203312286U (en) * | 2013-04-22 | 2013-11-27 | 深圳市实佳电子有限公司 | All card payment smart card carrying belt |
| CN104182784A (en) * | 2013-05-23 | 2014-12-03 | 江苏富纳电子科技有限公司 | Metro coin for radio frequency identification |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160217 |