CN105331320A - Low-viscosity high-activity epoxy resin adhesive - Google Patents
Low-viscosity high-activity epoxy resin adhesive Download PDFInfo
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- CN105331320A CN105331320A CN201510858684.3A CN201510858684A CN105331320A CN 105331320 A CN105331320 A CN 105331320A CN 201510858684 A CN201510858684 A CN 201510858684A CN 105331320 A CN105331320 A CN 105331320A
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Abstract
The invention discloses an low-viscosity high-activity epoxy resin adhesive which comprises the following components: bisphenol A epoxy resin E51, DGRE resin, 4,4'-diaminodiphenylmethane epoxy resin, fatty amine curing agents, an H-4 epoxy curing agent, an accelerant and zinc oxide; the bisphenol A epoxy resin E51, the DGRE resin and the 4,4'-diaminodiphenylmethane epoxy resin are mixed and heated, then, the H-4 epoxy curing agent is added to uniformly mix, and the fatty amine curing agents, the accelerant and the zinc oxide are added after cooling, and are stirred for use. In this way, the low-viscosity high-activity epoxy resin adhesive is an epoxy resin system with low viscosity and good mechanical property; by selecting the curing agents and an inorganic filler, tensile strength and shear strength of the resin can be effectively improved; in a curing process, each component is good in compatibility and complete in curing reaction and can quickly react within a wider temperature range to achieve the effect of quickly drying the adhesive.
Description
Technical field
The present invention relates to polymeric material field, particularly relate to the highly active epoxyn of a kind of low viscosity.
Background technology
Tackiness agent is also called tackiness agent, and it is can by two article good bond composition together.The natural adhesive that people commonly use has the history of more than one thousand years, but uses synthetic adhesive to be but less than the time of 100 years, and the new world of bonding technique has been opened up in the birth of synthetic adhesive.Now, synthetic adhesive is not only used for the non-metallic material such as bonding paper, fabric, timber and glass, also can the metallic substance such as bonding iron and steel, aluminium and copper.At present, many industrial production sectors comprise shipbuilding, machinery, electronic apparatus until the aspect such as repairing and medical science of aerospace, agricultural, communications and transportation, civil construction, cultural relics and historic sites, and synthetic adhesive obtains to be applied more and more widely.Synthetic adhesive is prepared by the method for chemosynthesis, and character and utilization is all better than natural adhesive.Synthetic adhesive of a great variety, form different, general basic components is resin, then is aided with other components and obtains.The salient features of tackiness agent is determined by resin, then relies on the cooperation of auxiliary material, also needs the tackiness agent of various performance to apply now on the market.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of epoxyn, has low viscosity and highly active advantage.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of low viscosity highly active epoxyn, the component comprised has bisphenol A epoxide resin E51, DGRE resin, 4, 4 '-diaminodiphenylmethane epoxy resin, fatty amines solidifying agent, H-4 epoxy hardener, promotor and zinc oxide, by described bisphenol A epoxide resin E51, described DGRE resin and described 4, 4 '-diaminodiphenylmethane epoxy resin mixes and heats, add H-4 epoxy hardener again to stir, cooling adds fatty amines solidifying agent, promotor and zinc oxide, stir and use.
In a preferred embodiment of the present invention, described DGRE resin is that Resorcinol and epoxy chloropropane hybrid reaction obtain.
In a preferred embodiment of the present invention, described fatty amines solidifying agent be in diethylenetriamine, triethylene tetramine, quadrol, hexanediamine one or more.
In a preferred embodiment of the present invention, the amine value of described H-4 epoxy hardener is 200 ~ 240mgKOH/g.
In a preferred embodiment of the present invention, the temperature after described heating is 110-140 DEG C, and the temperature after described cooling is 70-85 DEG C.
In a preferred embodiment of the present invention, the component of described epoxyn is: in mass parts, bisphenol A epoxide resin E5125-30 part, DGRE resin 20-30 part, 4,4 '-diaminodiphenylmethane epoxy resin 23-32 parts, fatty amines solidifying agent 10-15 part, H-4 epoxy hardener 7-9 part, promotor 2-4 part, zinc oxide 0.5-1.5 part.
The invention has the beneficial effects as follows: the highly active epoxyn of low viscosity of the present invention, it is the epoxy-resin systems with low-viscosity and excellent mechanical performances, solidifying agent and mineral filler choose tensile strength and the shearing resistance that effectively can improve resin, each component compatibility is good in the curing process, curing reaction is complete, can rapid reaction in a wide temperature range, reach the effect of tackiness agent quick-drying.
Embodiment
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment one:
There is provided a kind of low viscosity highly active epoxyn, the component comprised has bisphenol A epoxide resin E51, DGRE resin, 4,4 '-diaminodiphenylmethane epoxy resin, fatty amines solidifying agent, H-4 epoxy hardener, promotor and zinc oxide.The component of described epoxyn is: in mass parts, bisphenol A epoxide resin E5125 part, DGRE resin 20 parts, 4,4 '-diaminodiphenylmethane epoxy resin 32 parts, 15 parts, fatty amines solidifying agent, H-4 epoxy hardener 9 parts, promotor 2 parts, 0.5 part, zinc oxide.
By described bisphenol A epoxide resin E51, described DGRE resin and described 4,4 '-diaminodiphenylmethane epoxy resin mixes and is heated to temperature is 110 DEG C, add H-4 epoxy hardener again to stir, cooling to temperature is 70 DEG C, add fatty amines solidifying agent, promotor and zinc oxide, stir and use.Wherein said DGRE resin is that Resorcinol and epoxy chloropropane hybrid reaction obtain.Described fatty amines solidifying agent is the mixture of diethylenetriamine and triethylene tetramine.The amine value of described H-4 epoxy hardener is 240mgKOH/g.
Embodiment two:
There is provided a kind of low viscosity highly active epoxyn, the component comprised has bisphenol A epoxide resin E51, DGRE resin, 4,4 '-diaminodiphenylmethane epoxy resin, fatty amines solidifying agent, H-4 epoxy hardener, promotor and zinc oxide.The component of described epoxyn is: in mass parts, bisphenol A epoxide resin E5130 part, DGRE resin 30 parts, 4,4 '-diaminodiphenylmethane epoxy resin 23 parts, 10 parts, fatty amines solidifying agent, H-4 epoxy hardener 7 parts, promotor 4 parts, 1.5 parts, zinc oxide.
By described bisphenol A epoxide resin E51, described DGRE resin and described 4,4 '-diaminodiphenylmethane epoxy resin mixes and is heated to temperature is 140 DEG C, add H-4 epoxy hardener again to stir, cooling to temperature is 85 DEG C, add fatty amines solidifying agent, promotor and zinc oxide, stir and use.Wherein said DGRE resin is that Resorcinol and epoxy chloropropane hybrid reaction obtain.Described fatty amines solidifying agent is the mixture of quadrol and hexanediamine.The amine value of described H-4 epoxy hardener is 200mgKOH/g.
Embodiment three:
There is provided a kind of low viscosity highly active epoxyn, the component comprised has bisphenol A epoxide resin E51, DGRE resin, 4,4 '-diaminodiphenylmethane epoxy resin, fatty amines solidifying agent, H-4 epoxy hardener, promotor and zinc oxide.The component of described epoxyn is: in mass parts, bisphenol A epoxide resin E5127 part, DGRE resin 25 parts, 4,4 '-diaminodiphenylmethane epoxy resin 28 parts, 13 parts, fatty amines solidifying agent, H-4 epoxy hardener 8 parts, promotor 3 parts, 1 part, zinc oxide.
By described bisphenol A epoxide resin E51, described DGRE resin and described 4,4 '-diaminodiphenylmethane epoxy resin mixes and is heated to temperature is 125 DEG C, add H-4 epoxy hardener again to stir, cooling to temperature is 80 DEG C, add fatty amines solidifying agent, promotor and zinc oxide, stir and use.Wherein said DGRE resin is that Resorcinol and epoxy chloropropane hybrid reaction obtain.Described fatty amines solidifying agent is triethylene tetramine.The amine value of described H-4 epoxy hardener is 225mgKOH/g.
The invention has the beneficial effects as follows:
One, the highly active epoxyn of described low viscosity is the epoxy-resin systems with low-viscosity and excellent mechanical performances;
Two, the highly active epoxy adhesive cures agent of described low viscosity and mineral filler choose tensile strength and the shearing resistance that effectively can improve resin, each component compatibility is good in the curing process, and curing reaction is complete;
Three, the highly active epoxyn of described low viscosity can rapid reaction in a wide temperature range, reaches the effect of tackiness agent quick-drying.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (6)
1. the highly active epoxyn of low viscosity, it is characterized in that, the component comprised has bisphenol A epoxide resin E51, DGRE resin, 4,4 '-diaminodiphenylmethane epoxy resin, fatty amines solidifying agent, H-4 epoxy hardener, promotor and zinc oxide, by described bisphenol A epoxide resin E51, described DGRE resin and described 4,4 '-diaminodiphenylmethane epoxy resin mixes and heats, add H-4 epoxy hardener again to stir, cooling adds fatty amines solidifying agent, promotor and zinc oxide, stirs and uses.
2. the highly active epoxyn of low viscosity according to claim 1, is characterized in that, described DGRE resin is that Resorcinol and epoxy chloropropane hybrid reaction obtain.
3. the highly active epoxyn of low viscosity according to claim 1, is characterized in that, described fatty amines solidifying agent be in diethylenetriamine, triethylene tetramine, quadrol, hexanediamine one or more.
4. the highly active epoxyn of low viscosity according to claim 1, is characterized in that, the amine value of described H-4 epoxy hardener is 200 ~ 240mgKOH/g.
5. the highly active epoxyn of low viscosity according to claim 1, is characterized in that, the temperature after described heating is 110-140 DEG C, and the temperature after described cooling is 70-85 DEG C.
6. the highly active epoxyn of low viscosity according to claim 1, it is characterized in that, the component of described epoxyn is: in mass parts, bisphenol A epoxide resin E5125-30 part, DGRE resin 20-30 part, 4,4 '-diaminodiphenylmethane epoxy resin 23-32 parts, fatty amines solidifying agent 10-15 part, H-4 epoxy hardener 7-9 part, promotor 2-4 part, zinc oxide 0.5-1.5 part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510858684.3A CN105331320B (en) | 2015-12-01 | 2015-12-01 | A kind of epoxyn of low viscosity high activity |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510858684.3A CN105331320B (en) | 2015-12-01 | 2015-12-01 | A kind of epoxyn of low viscosity high activity |
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| CN105331320A true CN105331320A (en) | 2016-02-17 |
| CN105331320B CN105331320B (en) | 2018-01-23 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1087367A (en) * | 1992-11-02 | 1994-06-01 | 洛德公司 | Structural adhesive composition with high temperature resistance |
| CN101914267A (en) * | 2010-08-12 | 2010-12-15 | 蓝星(北京)化工机械有限公司 | High-performance epoxy resin composition for pulling and extrusion and preparation method thereof |
| CN103403110A (en) * | 2011-03-07 | 2013-11-20 | 阿克佐诺贝尔国际涂料股份有限公司 | Cargo tank coating |
-
2015
- 2015-12-01 CN CN201510858684.3A patent/CN105331320B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1087367A (en) * | 1992-11-02 | 1994-06-01 | 洛德公司 | Structural adhesive composition with high temperature resistance |
| CN101914267A (en) * | 2010-08-12 | 2010-12-15 | 蓝星(北京)化工机械有限公司 | High-performance epoxy resin composition for pulling and extrusion and preparation method thereof |
| CN103403110A (en) * | 2011-03-07 | 2013-11-20 | 阿克佐诺贝尔国际涂料股份有限公司 | Cargo tank coating |
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| CN105331320B (en) | 2018-01-23 |
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