CN105331320B - A kind of epoxyn of low viscosity high activity - Google Patents

A kind of epoxyn of low viscosity high activity Download PDF

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Publication number
CN105331320B
CN105331320B CN201510858684.3A CN201510858684A CN105331320B CN 105331320 B CN105331320 B CN 105331320B CN 201510858684 A CN201510858684 A CN 201510858684A CN 105331320 B CN105331320 B CN 105331320B
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resin
parts
epoxyn
curing agent
dgre
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CN105331320A (en
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张澜
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SUZHOU SIRGEL SPECIALTY RESINS CO Ltd
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SUZHOU SIRGEL SPECIALTY RESINS CO Ltd
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  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses a kind of epoxyn of low viscosity high activity, including component have bisphenol A epoxide resin E51, DGRE resin, 4,4 ' MDA epoxy resin, fatty amines curing agent, the epoxy hardeners of H 4, accelerator and zinc oxide, by bisphenol A epoxide resin E51, DGRE resin and 4,4 ' MDA epoxy resin are mixed and heated, the epoxy hardeners of H 4 are added to stir, cooling adds fatty amines curing agent, accelerator and zinc oxide, stirs and uses.Through the above way, the adhesive of the present invention is the epoxy-resin systems for having low-viscosity and excellent mechanical performances, the selection of curing agent and inorganic filler can effectively improve the tensile strength and shear strength of resin, each component compatibility is good in the curing process, curing reaction is complete, can the fast reaction within the scope of a wider temperature, reach the effect of adhesive quick-drying.

Description

A kind of epoxyn of low viscosity high activity
Technical field
The present invention relates to polymeric material field, more particularly to a kind of epoxyn of low viscosity high activity.
Background technology
Adhesive is also known as adhesive, and it is composition that can be by two article good bonds together.What people commonly used The history of the existing more than one thousand years of natural adhesive, but but it is less than the time of 100 years using synthetic adhesive, synthetic adhesive It is born and has opened up the new world of bonding technique.Now, synthetic adhesive is not only used to be bonded paper, fabric, timber and glass etc. Nonmetallic materials, it can also be bonded the metal materials such as steel, aluminium and copper.At present, many industrial production sectors include shipbuilding, machinery, Electronic apparatus is until aerospace, agricultural, communications and transportation, civil construction, the repairing of cultural relics and historic sites and medical science etc., synthetic adhesive More and more extensive application is obtained.Synthetic adhesive is prepared by the method for chemical synthesis, in performance and purposes all Better than natural adhesive.The species of synthetic adhesive is various, and composition is different, and general basic components are resins, then are aided with other groups Get.The main performance of adhesive is determined by resin, then the cooperation by auxiliary material, is also required to various property now on the market The adhesive of energy is applied.
The content of the invention
The present invention solves the technical problem of a kind of epoxyn is provided, there is low viscosity and high activity Advantage.
In order to solve the above technical problems, one aspect of the present invention is:A kind of low viscosity high activity is provided Epoxyn, including component have bisphenol A epoxide resin E51, DGRE resin, 4,4 '-MDA epoxy Resin, fatty amines curing agent, H-4 epoxy hardeners, accelerator and zinc oxide, by the bisphenol A epoxide resin E51, described DGRE resins and described 4,4 '-MDA epoxy resin is mixed and heated, and it is equal to add the stirring of H-4 epoxy hardeners Even, cooling adds fatty amines curing agent, accelerator and zinc oxide, stirs and uses.
In a preferred embodiment of the present invention, the DGRE resins are that resorcinol obtains with epoxychloropropane hybrid reaction Arrive.
In a preferred embodiment of the present invention, the fatty amines curing agent is diethylenetriamine, triethylene tetramine, second It is one or more in diamines, hexamethylene diamine.
In a preferred embodiment of the present invention, the amine value of the H-4 epoxy hardeners is 200 ~ 240mgKOH/g.
In a preferred embodiment of the present invention, the temperature after the heating is 110-140 DEG C, the temperature after the cooling For 70-85 DEG C.
In a preferred embodiment of the present invention, the component of the epoxyn is:In terms of mass parts, bisphenol-A Epoxy resin E51 25-30 parts, DGRE resin 20-30 parts, 4,4 '-MDA epoxy resin 23-32 parts, fat Amine curing agent 10-15 parts, H-4 epoxy hardener 7-9 parts, accelerator 2-4 parts, zinc oxide 0.5-1.5 parts.
The beneficial effects of the invention are as follows:The epoxyn of the low viscosity high activity of the present invention, is with low-viscosity With the epoxy-resin systems of excellent mechanical performances, the selection of curing agent and inorganic filler can effectively improve resin tensile strength and Shear strength, each component compatibility is good in the curing process, and curing reaction is complete, can be fast within the scope of a wider temperature Speed reaction, reach the effect of adhesive quick-drying.
Embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation Example is only the part of the embodiment of the present invention, rather than whole embodiments.It is common based on the embodiment in the present invention, this area All other embodiment that technical staff is obtained under the premise of creative work is not made, belong to the model that the present invention protects Enclose.
Embodiment one:
A kind of epoxyn of low viscosity high activity is provided, including component have bisphenol A epoxide resin E51, DGRE resins, 4,4 '-MDA epoxy resin, fatty amines curing agent, H-4 epoxy hardeners, accelerator and oxygen Change zinc.The component of the epoxyn is:In terms of mass parts, 25 parts of bisphenol A epoxide resin E51, DGRE resins 20 Part, 32 parts of 4,4 '-MDA epoxy resin, 15 parts of fatty amines curing agent, 9 parts of H-4 epoxy hardeners, promote Enter 2 parts of agent, 0.5 part of zinc oxide.
By the bisphenol A epoxide resin E51, the DGRE resins and 4,4 '-MDA epoxy resin Temperature is mixed and heated as 110 DEG C, H-4 epoxy hardeners is added and stirs, temperature is cooled to as 70 DEG C, adds fat Amine curing agent, accelerator and zinc oxide, stir and use.Wherein described DGRE resins are that resorcinol mixes with epoxychloropropane Close what reaction obtained.The fatty amines curing agent is the mixture of diethylenetriamine and triethylene tetramine.The H-4 epoxies are consolidated The amine value of agent is 240mgKOH/g.
Embodiment two:
A kind of epoxyn of low viscosity high activity is provided, including component have bisphenol A epoxide resin E51, DGRE resins, 4,4 '-MDA epoxy resin, fatty amines curing agent, H-4 epoxy hardeners, accelerator and oxygen Change zinc.The component of the epoxyn is:In terms of mass parts, 30 parts of bisphenol A epoxide resin E51, DGRE resins 30 Part, 23 parts of 4,4 '-MDA epoxy resin, 10 parts of fatty amines curing agent, 7 parts of H-4 epoxy hardeners, promote Enter 4 parts of agent, 1.5 parts of zinc oxide.
By the bisphenol A epoxide resin E51, the DGRE resins and 4,4 '-MDA epoxy resin Temperature is mixed and heated as 140 DEG C, H-4 epoxy hardeners is added and stirs, temperature is cooled to as 85 DEG C, adds fat Amine curing agent, accelerator and zinc oxide, stir and use.Wherein described DGRE resins are that resorcinol mixes with epoxychloropropane Close what reaction obtained.The fatty amines curing agent is the mixture of ethylenediamine and hexamethylene diamine.The amine of the H-4 epoxy hardeners It is worth for 200mgKOH/g.
Embodiment three:
A kind of epoxyn of low viscosity high activity is provided, including component have bisphenol A epoxide resin E51, DGRE resins, 4,4 '-MDA epoxy resin, fatty amines curing agent, H-4 epoxy hardeners, accelerator and oxygen Change zinc.The component of the epoxyn is:In terms of mass parts, 27 parts of bisphenol A epoxide resin E51, DGRE resins 25 Part, 28 parts of 4,4 '-MDA epoxy resin, 13 parts of fatty amines curing agent, 8 parts of H-4 epoxy hardeners, promote Enter 3 parts of agent, 1 part of zinc oxide.
By the bisphenol A epoxide resin E51, the DGRE resins and 4,4 '-MDA epoxy resin Temperature is mixed and heated as 125 DEG C, H-4 epoxy hardeners is added and stirs, temperature is cooled to as 80 DEG C, adds fat Amine curing agent, accelerator and zinc oxide, stir and use.Wherein described DGRE resins are that resorcinol mixes with epoxychloropropane Close what reaction obtained.The fatty amines curing agent is triethylene tetramine.The amine value of the H-4 epoxy hardeners is 225mgKOH/g。
The beneficial effects of the invention are as follows:
First, the epoxyn of the low viscosity high activity is the asphalt mixtures modified by epoxy resin for having low-viscosity and excellent mechanical performances Resin system;
2nd, the selection of epoxy adhesive cures agent and the inorganic filler of the low viscosity high activity can effectively improve tree The tensile strength and shear strength of fat, each component compatibility is good in the curing process, and curing reaction is complete;
3rd, the epoxyn of the low viscosity high activity can be quick anti-within the scope of a wider temperature Answer, reach the effect of adhesive quick-drying.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair The equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in other related technology necks Domain, it is included within the scope of the present invention.

Claims (5)

  1. A kind of 1. epoxyn of low viscosity high activity, it is characterised in that including component have bisphenol A epoxide resin E51, DGRE resin, 4,4 '-MDA epoxy resin, fatty amines curing agent, H-4 epoxy hardeners, accelerator And zinc oxide, by the bisphenol A epoxide resin E51, the DGRE resins and described 4,4 '-MDA epoxy resin It is mixed and heated, adds H-4 epoxy hardeners and stir, cooling adds fatty amines curing agent, accelerator and zinc oxide, Stir and use;
    The component of the epoxyn is:In terms of mass parts, bisphenol A epoxide resin E51 25-30 parts, DGRE resins 20-30 parts, 4,4 '-MDA epoxy resin 23-32 parts, fatty amines curing agent 10-15 parts, H-4 epoxies are consolidated Agent 7-9 parts, accelerator 2-4 parts, zinc oxide 0.5-1.5 parts.
  2. 2. the epoxyn of low viscosity high activity according to claim 1, it is characterised in that the DGRE resins It is that resorcinol obtains with epoxychloropropane hybrid reaction.
  3. 3. the epoxyn of low viscosity high activity according to claim 1, it is characterised in that the fatty amines Curing agent is one or more in diethylenetriamine, triethylene tetramine, ethylenediamine, hexamethylene diamine.
  4. 4. the epoxyn of low viscosity high activity according to claim 1, it is characterised in that the H-4 epoxies The amine value of curing agent is 200 ~ 240mgKOH/g.
  5. 5. the epoxyn of low viscosity high activity according to claim 1, it is characterised in that after the heating Temperature is 110-140 DEG C, and the temperature after the cooling is 70-85 DEG C.
CN201510858684.3A 2015-12-01 2015-12-01 A kind of epoxyn of low viscosity high activity Active CN105331320B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1087367A (en) * 1992-11-02 1994-06-01 洛德公司 Structural adhesive composition with high thermal resistance
CN101914267A (en) * 2010-08-12 2010-12-15 蓝星(北京)化工机械有限公司 High-performance epoxy resin composition for pulling and extrusion and preparation method thereof
CN103403110A (en) * 2011-03-07 2013-11-20 阿克佐诺贝尔国际涂料股份有限公司 Cargo tank coating

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1087367A (en) * 1992-11-02 1994-06-01 洛德公司 Structural adhesive composition with high thermal resistance
CN101914267A (en) * 2010-08-12 2010-12-15 蓝星(北京)化工机械有限公司 High-performance epoxy resin composition for pulling and extrusion and preparation method thereof
CN103403110A (en) * 2011-03-07 2013-11-20 阿克佐诺贝尔国际涂料股份有限公司 Cargo tank coating

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