CN105321877A - Tape expansion device - Google Patents
Tape expansion device Download PDFInfo
- Publication number
- CN105321877A CN105321877A CN201510333920.XA CN201510333920A CN105321877A CN 105321877 A CN105321877 A CN 105321877A CN 201510333920 A CN201510333920 A CN 201510333920A CN 105321877 A CN105321877 A CN 105321877A
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- Prior art keywords
- ring
- unit
- cutting belt
- cutting
- shaped frame
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- 238000001514 detection method Methods 0.000 claims abstract description 13
- 230000011218 segmentation Effects 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 230000007423 decrease Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 47
- 238000000034 method Methods 0.000 description 9
- 239000002313 adhesive film Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本发明提供带扩张装置，具有：框架保持单元，其具有保持环状框架的环状保持面；扩张部件，其直径小于环状框架的内径且大于晶片的直径，作用于在保持于该框架保持单元的环状保持面上的环状框架安装的切割带并使其扩张；扩张部件工作单元，其使扩张部件在垂直于该框架保持单元的环状保持面的方向上工作；驱动负荷检测单元，其检测扩张部件工作单元的驱动负荷；控制单元，其根据来自驱动负荷检测单元的检测信号判定切割带的断裂；以及显示单元，其显示控制单元的判定结果，控制单元在使扩张部件工作单元工作并扩张切割带的情况下，根据来自驱动负荷检测单元的检测信号，在随着切割带的扩张而驱动负荷上升的情况下驱动负荷降低时，判定为切割带断裂。
The present invention provides a belt expansion device, which has: a frame holding unit, which has an annular holding surface for holding a ring-shaped frame; an expansion member, whose diameter is smaller than the inner diameter of the ring-shaped frame and larger than the diameter of the wafer, and acts to hold the ring-shaped frame. Ring-shaped frame-mounted cutting strip on the ring-shaped retaining surface of the unit and expands it; expansion member working unit, which operates the expanding member in a direction perpendicular to the ring-shaped retaining surface of the frame-holding unit; drive load detection unit , which detects the driving load of the expansion member operating unit; the control unit, which judges the breakage of the cutting tape according to the detection signal from the driving load detection unit; When the dicing tape is operated and expanded, it is determined that the dicing tape is broken when the driving load decreases while the driving load increases with the expansion of the dicing tape based on the detection signal from the driving load detection unit.
Description
Technical field
The present invention relates to the band extension fixture for expanding cutting belt, this cutting belt is pasted with the wafer forming multiple device on the region marked off by many segmentation preset lines, and its peripheral part is installed on ring-shaped frame.
Background technology
In semiconductor device manufacturing process, be formed cancellate segmentation preset lines on the surface of the semiconductor wafer roughly in circular plate shape and mark off multiple region, the region that this marks off is formed the device of IC, LSI etc.And, by along segmentation preset lines dividing semiconductor wafer, thus produce each device.
As the method for the machined object of the wafers such as dividing semiconductor wafer, existing following technology is able to practical, the focal point of pulse laser light wafer to permeability is positioned inside, and along segmentation preset lines to wafer illumination, upgrading layer is formed along segmentation preset lines in the inside of wafer, then dilator has the cutting belt of wafer and gives tension force to wafer, thus along segmentation preset lines segmentation wafer (for example, referring to patent documentation 1) that intensity reduces owing to forming metamorphic layer.
Such as the following Patent Document 2 discloses a kind of band extension fixture for expanding cutting belt, this cutting belt is pasted with wafer, and its peripheral part is installed on ring-shaped frame.This band extension fixture has: framework holding unit, and it keeps the ring-shaped frame being installed with the cutting belt being pasted with wafer; And band expansion elements, it makes the cutting belt expansion being installed on the ring-shaped frame kept on this framework holding unit, rely on band expansion elements expansion cutting belt and give tension force to wafer, thus along being each device owing to forming segmentation preset lines that metamorphic layer and intensity reduces by wafer separation.
Patent documentation 1 Japanese Unexamined Patent Publication 2005-223285 publication
Patent documentation 2 Japanese Unexamined Patent Publication 2010-27666 publication
And, in above-mentioned band extension fixture, cutting belt may be made to rupture when expanding cutting belt, if cutting belt fracture state under by carrying wafers to subsequent processing, then in subsequent processing by can be at random in device by the device separated separately, there is the problem of the unfavorable condition producing operation interruption etc.
In addition, form the cutting slot of prescribed depth (being equivalent to the degree of depth of the fine finishining thickness of device) along segmentation preset lines from the surface of wafer, after this grinding skin is formed with the back side of the wafer of cutting slot, to protrude from this back side making cutting slot and by wafer separation for after each device, at the back side of wafer, adhesive film is installed, and dilator invests the cutting belt of adhesive film side, along device, adhesive film is ruptured, also can produce the problems referred to above in this case.
Summary of the invention
The present invention completes in view of the foregoing, its major technique problem is, there is provided a kind of when expanding cutting belt, can the band extension fixture of detecting broken when cutting belt ruptures, this cutting belt is pasted with the wafer forming multiple device on the region marked off by many segmentation preset lines, and its peripheral part is installed on ring-shaped frame.
In order to solve above-mentioned major technique problem, the invention provides a kind of band extension fixture for expanding cutting belt, this cutting belt is pasted with wafer, and the peripheral part of this cutting belt is installed on ring-shaped frame, wherein, this wafer defines multiple device on the region marked off by many segmentation preset lines, and the feature of this band extension fixture is to have:
Framework holding unit, it has the ring-type holding surface keeping ring-shaped frame;
Expanding part, its diameter is less than the internal diameter of ring-shaped frame and is greater than the diameter of wafer, and acts on cutting belt that the ring-shaped frame in the ring-type holding surface being held in this framework holding unit installs and make it expand;
Expanding part working cell, it makes this expanding part carry out work in the vertical direction that the ring-type holding surface with this framework holding unit is vertical;
Drive cutting load testing unit, it detects the driving load of this expanding part working cell;
Control unit, it judges the fracture of cutting belt according to the detection signal from this driving cutting load testing unit; And
Display unit, it shows the result of determination that this control unit judges,
When this control unit expands cutting belt making this expanding part working cell carry out work, according to the detection signal from this driving cutting load testing unit, when driving load to reduce when driving load to rise in the expansion along with cutting belt, be judged to be that cutting belt ruptures.
Band extension fixture of the present invention has: framework holding unit, and it has the ring-type holding surface keeping ring-shaped frame; Expanding part, its diameter is less than the internal diameter of ring-shaped frame and is greater than the diameter of wafer, acts on cutting belt that the ring-shaped frame in the ring-type holding surface being held in this framework holding unit installs and makes it expand; Expanding part working cell, it makes this expanding part work on the direction of the ring-type holding surface perpendicular to framework holding unit; Drive cutting load testing unit, it detects the driving load of this expanding part working cell; Control unit, it judges the fracture of cutting belt according to the detection signal from this driving cutting load testing unit; And display unit, it shows the result of determination of this control unit, control unit is when making expanding part working cell work and expand cutting belt, according to the detection signal carrying out self-driven cutting load testing unit, when driving load to reduce when driving load to rise in the expansion along with cutting belt, be judged to be that cutting belt ruptures, therefore operator relies on display unit to confirm result of determination.Therefore, it is possible to prevent carrying wafers cutting belt ruptured to subsequent processing in advance, the unfavorable condition of subsequent processing can be eliminated.
Accompanying drawing explanation
Fig. 1 is the stereogram of the band extension fixture according to the present invention's formation.
Fig. 2 is the profile of the band extension fixture shown in Fig. 1.
Fig. 3 is the stereogram of the expanding part working cell of the band extension fixture shown in pie graph 1.
Fig. 4 is the key diagram of the band expansion process of the band extension fixture shown in Fig. 1.
Fig. 5 is the curve chart of the relation representing the expanded height of expanding part and the driving torque of expanding part working cell.
Fig. 6 represents that the wafer being formed with metamorphic layer along segmentation preset lines is attached at the stereogram of the state of the upper surface of the cutting belt of installing on ring-shaped frame.
Label declaration
2: band extension fixture, 3: framework holding unit, 31: cylindric holding member, 311: ring-type holding surface, 32: base plate, 33: clamp, 4: expanding part, 5: expanding part working cell, 51: brace table, 52: cylindric connecting member, 53: guide rod, 54: electronic motor, 55: external thread rod, 6: drive cutting load testing unit, 61: torque dynamometer, 7: control unit, 8: display unit, F: ring-shaped frame, T: cutting belt.
Embodiment
Below, the preferred implementation of the band extension fixture formed according to the present invention is described in detail with reference to accompanying drawing.
Fig. 6 illustrates the wafer 10 attached at the upper surface being installed on the cutting belt T be made up of synthetic resin film on ring-shaped frame F.This wafer 10 is that clathrate is formed with many segmentation preset lines 101 at surperficial 10a, and is formed with device 102 on the multiple regions marked off by many segmentation preset lines 101.The focal point of pulse laser light wafer 10 to the wavelength of permeability is positioned the inside of this wafer 10, and along segmentation preset lines 101, this laser beam is irradiated to this wafer 10, form the upgrading layer 103 as break origins in the inside of wafer continuously along segmentation preset lines.In addition, upgrading layer 103 can be formed by laser processing disclosed in above-mentioned patent documentation 1.In addition, above-mentioned cutting belt T in the illustrated embodiment, is that the thickener of the allyl resin class of the surperficial coating thickness about 5 μm of the film-like substrate be made up of polyvinyl chloride (PVC) of 100 μm obtains at thickness.
Fig. 1 illustrates the stereogram of the band extension fixture formed according to the present invention, and Fig. 2 illustrates the important part amplification profile of the band extension fixture shown in Fig. 1.Band extension fixture 2 shown in Fig. 1 and Fig. 2 has and keeps the framework holding unit 3 of above-mentioned ring-shaped frame F, expands and be held in the expanding part 4 of the cutting belt T that the ring-shaped frame F on this framework holding unit 3 installs and expanding part working cell 5 that this expanding part 4 is worked.Framework holding unit 3 has cylindric holding member 31 and base plate 32, the upper surface of cylindric holding member 31 and ring-type holding surface 311.Be equipped with 4 clamps 33 in the upper end of holding member 31 cylindric as constructed as above, these 4 clamps 33 are for the ring-shaped frame F of fixed placement in ring-type holding surface 311.
The diameter of above-mentioned expanding part 4 be less than ring-shaped frame F internal diameter and slightly larger than the diameter of wafer 10, and it acts on the cutting belt T that the ring-shaped frame F in the ring-type holding surface 311 being held in cylindric holding member 31 installs, make cutting belt T upper work in the direction (above-below direction in Fig. 2) of the ring-type holding surface 311 of the holding member 31 perpendicular to cylindrical shape by means of expanding part working cell 5.
Expanding part working cell 5 is disposed on the base plate 32 of formation framework holding unit 3.Referring to Fig. 2 and Fig. 3, this brace table 51 is described.
Expanding part working cell 5 in illustrated execution mode is configured to be had: brace table 51, and it supports above-mentioned expanding part 4; Cylindric connecting member 52, it links the upper surface of this brace table 51 and the lower surface of above-mentioned expanding part 4; 3 guide rods 53 (only illustrating 2 in figs. 2 and 3), its be disposed in form framework holding unit 3 base plate 32 on and insert, for guiding the movement on the direction of the ring-type holding surface 311 at the holding member 31 perpendicular to cylindrical shape (being above-below direction in Fig. 2) to brace table 51 being formed at being directed in hole 511 of above-mentioned brace table 51; Conductance motor 54, it makes brace table 51 carry out work; And external thread rod 55, the output shaft of itself and this electronic motor 54 links, and this external thread rod 55 screws togather with the internal thread (not shown) be arranged on the axle center of brace table 51.Expanding part working cell 5 as constructed as above is when making conductance motor 54 to a direction rotary actuation, via external thread rod 55, brace table 51 (i.e. expanding part 4) is moved to the top in Fig. 2, when making conductance motor 54 to another direction rotary actuation, via external thread rod 55, brace table 51 (i.e. expanding part 4) is moved to the below in Fig. 2.
Band extension fixture 2 in illustrated execution mode has the driving cutting load testing unit 6 of the driving load detecting expanding part working cell 5.Driving cutting load testing unit 6 shown in Fig. 2 and Fig. 3 is made up of the torque dynamometer 61 of the load torque detecting electronic motor 54, and the load torque of electronic motor 54 is sent to the control unit 7 shown in Fig. 2 by this torque dynamometer 61.Result of determination according to the fracture of the load torque signal determining cutting belt T from torque dynamometer 61, and is shown in display unit 8 by control unit 7.In addition, as torque dynamometer, such as, Ono Sokki Co Ltd can be used to manufacture the torque detector of the magnetic-type phase difference mode of selling.
Band extension fixture 2 in illustrated execution mode is as above formed, and illustrates that it acts on referring to Fig. 4.
First, as shown in (a) of Fig. 4, the ring-type holding surface 311 of the holding member 31 of the cylindrical shape of the framework holding unit 3 of formation band extension fixture 2 places the ring-shaped frame F be used for across cutting belt T supporting wafers 10.And, by means of clamp 33, ring-shaped frame F is fixed on cylindric holding member 31 (framework maintenance operation).Now, expanding part 4 and expanding part working cell 5 are located in the reference position shown in (a) of Fig. 4.At this reference position place, the upper surface of expanding part 4 is positioned as the height identical with the ring-type holding surface 311 of the holding member 31 of cylindrical shape.Therefore, the region being pasted with wafer 10 of the cutting belt T that the ring-shaped frame F in the ring-type holding surface 311 being positioned over holding member 31 installs becomes the state of the upper surface being positioned over expanding part 4.
Then, make the conductance motor 54 of expanding part working cell 5 to a direction rotary actuation.Its result, external thread rod 55 rotates to a direction and brace table 51 and expanding part 4 are moved upward as shown in (b) of Fig. 4, and therefore cutting belt T is expanded.Therefore, drag force radially acts on the wafer 10 attached on cutting belt T.As above when drag force radially acts on wafer 10, the intensity of wafer 10 can reduce according to the metamorphic layer 103 formed along segmentation preset lines 101, therefore wafer 10 ruptures along metamorphic layer 103, is split into each device 102 (band expansion process).
In above-mentioned band expansion process, from the torque dynamometer 61 as driving cutting load testing unit 6 of the driving load detecting expanding part working cell 5, the load torque signal of electronic motor 54 is sent to control unit 7.The load torque of the electronic motor 54 sent from torque dynamometer 61 as shown in solid line Fig. 5, along with the expanded height (height between the holding surface 311 of the ring-type of the holding member 31 of expanding part 4 and cylindrical shape) of expanding part 4 uprises and rises.But if state cutting belt T fracture in the way of band expansion process on the implementation, then, as shown in double dot dash line in Fig. 5, the load torque of electronic motor 54 can reduce.When in the way of out tape expansion process, the load torque of electronic motor 54 rises, load torque (driving load) reduces, control unit 7 is judged to be that cutting belt T ruptures, and result of determination is shown in display unit 8.In addition, when being judged to be that cutting belt T ruptures, result of determination is shown in display unit 8 by preferred control unit 7, and carries out alarm display at siren etc.
As above, when the load torque of the electronic motor 54 in the way of out tape expansion process of the band extension fixture 2 in illustrated execution mode rises, load torque (driving load) reduces, control unit 7 is judged to be that cutting belt T ruptures, and result of determination is shown in display unit 8, therefore operator can confirm cutting belt T fracture, thus the carrying wafers ruptured by cutting belt T can be prevented in advance to subsequent processing, the unfavorable condition of subsequent processing can be eliminated.
Above, describe the present invention according to execution mode, but the present invention is not limited only to execution mode, various distortion can be carried out in the scope of purport of the present invention.Such as, in the above-described embodiment, show the example of the torque dynamometer 61 of the load torque of the electronic motor 54 of driving cutting load testing unit 6 use detection as the driving load detecting expanding part working cell 5, but as driving cutting load testing unit also can use the galvanometer detecting and be supplied to the load current value of the power of electronic motor 54.
In addition, in the above-described embodiment, the drive source shown as expanding part working cell 5 uses the example of electronic motor 54, but also can use the cylinder mechanism of air cylinder etc., in this case, as driving cutting load testing unit, the strain gauge of detection load loading can be arranged between the base plate 32 forming framework holding unit 3 and cylinder mechanism.
And then, in the above-described embodiment, show and use band extension fixture of the present invention to have the cutting belt T of the wafer 10 forming metamorphic layer 103 along segmentation preset lines 101 dilator, thus be the example of each device along the segmentation preset lines 101 being formed with metamorphic layer 103 by wafer separation, but band extension fixture of the present invention can also be used for following situation, namely from wafer surface, the cutting slot of prescribed depth (being equivalent to the degree of depth of the fine finishining thickness of device) is formed along segmentation preset lines, then grinding is formed with the back side of the wafer of cutting slot on surface, make cutting slot be exposed to this back side and be each device by wafer separation, then at the back side of wafer, adhesive film is installed, and dilator invests the cutting belt of adhesive film side, along device, adhesive film is ruptured.
Claims (1)
1. for expanding a band extension fixture for cutting belt, this cutting belt is pasted with wafer, and the peripheral part of this cutting belt is installed on ring-shaped frame, wherein, this wafer is formed with multiple device on the region marked off by many segmentation preset lines, and the feature of this band extension fixture is to have:
Framework holding unit, it has the ring-type holding surface keeping ring-shaped frame;
Expanding part, its diameter is less than the internal diameter of ring-shaped frame and is greater than the diameter of wafer, and acts on cutting belt that the ring-shaped frame in the ring-type holding surface being held in this framework holding unit installs and make it expand;
Expanding part working cell, it makes this expanding part carry out work in the vertical direction that the ring-type holding surface with this framework holding unit is vertical;
Drive cutting load testing unit, it detects the driving load of this expanding part working cell;
Control unit, it judges the fracture of cutting belt according to the detection signal from this driving cutting load testing unit; And
Display unit, it shows the result of determination that this control unit judges,
When expanding cutting belt making this expanding part working cell carry out work, according to the detection signal from this driving cutting load testing unit, when driving load to reduce when driving load to rise in the expansion along with cutting belt, this control unit is judged to be that cutting belt ruptures.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014132955A JP6280459B2 (en) | 2014-06-27 | 2014-06-27 | Tape expansion unit |
| JP2014-132955 | 2014-06-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105321877A true CN105321877A (en) | 2016-02-10 |
| CN105321877B CN105321877B (en) | 2019-08-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510333920.XA Active CN105321877B (en) | 2014-06-27 | 2015-06-16 | Band extension fixture |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6280459B2 (en) |
| KR (1) | KR102214367B1 (en) |
| CN (1) | CN105321877B (en) |
| TW (1) | TWI648777B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110047769A (en) * | 2018-01-17 | 2019-07-23 | 株式会社迪思科 | Evaluation method and expanding unit with characteristic |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6814662B2 (en) * | 2017-03-01 | 2021-01-20 | 株式会社ディスコ | Cutting equipment |
| JP6941022B2 (en) * | 2017-10-06 | 2021-09-29 | 株式会社ディスコ | Expansion method and expansion device |
| JP7125650B2 (en) * | 2018-03-27 | 2022-08-25 | 株式会社東京精密 | Wafer dividing apparatus and method |
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| US20060243710A1 (en) * | 2003-05-22 | 2006-11-02 | Tokyo Seimitsu Co., Ltd. | Dicing device |
| CN101383277A (en) * | 2007-09-05 | 2009-03-11 | 株式会社迪思科 | Extension method and extension device |
| CN102136454A (en) * | 2009-12-18 | 2011-07-27 | 株式会社迪思科 | Wafer dividing apparatus and laser processing apparatus |
| CN102473617A (en) * | 2009-07-08 | 2012-05-23 | 古河电气工业株式会社 | Adhesive sheet for wafer attachment and method for processing wafer using the same |
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| JP3176645B2 (en) * | 1991-04-18 | 2001-06-18 | 株式会社日立製作所 | Method for manufacturing semiconductor integrated circuit device |
| JP4402974B2 (en) | 2004-02-09 | 2010-01-20 | 株式会社ディスコ | Wafer division method |
| JP2005251986A (en) | 2004-03-04 | 2005-09-15 | Disco Abrasive Syst Ltd | Wafer separation detecting method and apparatus thereof |
| JP4736379B2 (en) * | 2004-09-07 | 2011-07-27 | 日立化成工業株式会社 | Manufacturing method of semiconductor element with adhesive sheet, adhesive sheet, and dicing tape integrated adhesive sheet |
| JP4630692B2 (en) * | 2005-03-07 | 2011-02-09 | 株式会社ディスコ | Laser processing method |
| JP2007067365A (en) | 2005-08-05 | 2007-03-15 | Alps Electric Co Ltd | Method for manufacturing electronic device |
| US7368929B2 (en) * | 2006-01-18 | 2008-05-06 | Electroglas, Inc. | Methods and apparatuses for improved positioning in a probing system |
| KR100804891B1 (en) * | 2006-02-14 | 2008-02-20 | 엘에스전선 주식회사 | Dicing die adhesive film and semiconductor packaging method using same |
| US7858902B2 (en) * | 2007-02-13 | 2010-12-28 | Disco Corporation | Wafer dividing method and laser beam processing machine |
| JP5170880B2 (en) * | 2008-03-24 | 2013-03-27 | 古河電気工業株式会社 | Wafer processing tape |
| JP5345348B2 (en) | 2008-07-15 | 2013-11-20 | 株式会社ディスコ | Breaking method and breaking device |
| JP5313036B2 (en) * | 2009-05-11 | 2013-10-09 | 株式会社ディスコ | How to expand adhesive tape |
| JP2012049402A (en) | 2010-08-27 | 2012-03-08 | Toshiba Corp | Manufacturing device of semiconductor device, semiconductor device pickup method, and semiconductor device manufacturing method |
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2014
- 2014-06-27 JP JP2014132955A patent/JP6280459B2/en active Active
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- 2015-05-06 TW TW104114459A patent/TWI648777B/en active
- 2015-06-16 CN CN201510333920.XA patent/CN105321877B/en active Active
- 2015-06-24 KR KR1020150089601A patent/KR102214367B1/en active IP Right Grant
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| US20060243710A1 (en) * | 2003-05-22 | 2006-11-02 | Tokyo Seimitsu Co., Ltd. | Dicing device |
| CN101383277A (en) * | 2007-09-05 | 2009-03-11 | 株式会社迪思科 | Extension method and extension device |
| CN102473617A (en) * | 2009-07-08 | 2012-05-23 | 古河电气工业株式会社 | Adhesive sheet for wafer attachment and method for processing wafer using the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110047769A (en) * | 2018-01-17 | 2019-07-23 | 株式会社迪思科 | Evaluation method and expanding unit with characteristic |
| CN110047769B (en) * | 2018-01-17 | 2024-03-19 | 株式会社迪思科 | Belt characteristic evaluation method and expansion device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI648777B (en) | 2019-01-21 |
| TW201604945A (en) | 2016-02-01 |
| JP2016012636A (en) | 2016-01-21 |
| KR20160001666A (en) | 2016-01-06 |
| CN105321877B (en) | 2019-08-16 |
| KR102214367B1 (en) | 2021-02-08 |
| JP6280459B2 (en) | 2018-02-14 |
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