CN105321805A - High-pressure hole flushing device - Google Patents
High-pressure hole flushing device Download PDFInfo
- Publication number
- CN105321805A CN105321805A CN201510496660.8A CN201510496660A CN105321805A CN 105321805 A CN105321805 A CN 105321805A CN 201510496660 A CN201510496660 A CN 201510496660A CN 105321805 A CN105321805 A CN 105321805A
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- CN
- China
- Prior art keywords
- pressure
- washing fluid
- flushing device
- high pressure
- porous material
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02101—Cleaning only involving supercritical fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention relates to a high-pressure hole flushing method and device. According to the method and the device, when a process residue on a hole material is cleaned by a supercritical fluid, firstly, the fluid is injected into a hole in a low pressure state; and then reaction pressure is gradually increased to high pressure for generating the supercritical fluid from low pressure, so that the internal pressure and the external pressure of the hole material can be balanced; and the target of reducing the impact of the pressure to the hole material is reached.
Description
Technical field
The present invention relates to high pressure hole flushing device and device thereof, particularly relate to a kind of in time utilizing the residue of supercritical fluid cleaning porous material, reduce the high pressure of supercritical fluid to the method for the impact of porous material and the device that uses thereof.
Background technology
Temperature and pressure is called supercritical fluid higher than the fluid of critical value simultaneously.Supercritical fluid has the character of many uniquenesses, and the character such as such as viscosity, density, diffusion coefficient, solvability, some character is close to gas, and some character is then close with liquid.Supercritical fluid had both had low viscosity and the high diffusivity coefficient of gas, had again high density and the solvability of liquid, thus had good flowing, heat transfer and permeance property.
In semiconductor technology now, supercritical fluid can be applicable to develop photoresist layer, the process residue formed in dielectric film and clean wafers etc.At present, when utilizing the process residue on supercritical fluid cleaning wafer, be all directly utilize the supercritical fluid of high pressure to clean.
When utilizing the supercritical fluid cleaning of high pressure to be attached to process residue on wafer or impurity, the low dielectric constant films that wafer is made up of porous material also can be cleaned.Due to, have quite a lot of hole in porous material, the pressure of adding supercritical fluid is very large.Therefore, time directly with supercritical fluid cleaning porous material, porous material is subject to suddenly the extruding of high-pressure supercritical fluid and after impacting, porous material can allow supercritical fluid crush most probably, even causes hole material breaks.Thus, process degree and conforming product rate can be subject to quite serious impact.
Summary of the invention
In view of above-mentioned known utilize supercritical fluid cleaning porous material film time, the pressure of supercritical fluid is quite high, and supercritical fluid dash forward the impacting with high pressure that comes can the porous material film of crush texture fragility, even make porous material film produce and break and damage.
Therefore, one of main purpose of the present invention is providing high pressure hole flushing device exactly, it is when utilizing treatment with supercritical fluid porous material film, under low pressure operates a period of time in advance, and then makes reaction pressure be forced into the high pressure producing supercritical fluid gradually from low pressure.Thus, fluid molecule compared with under the state of low pressure, can penetrate in the hole of porous material film, and fills up hole gradually.So, significantly can improve the resistivity of porous material film to follow-up high-pressure supercritical fluid, and then can effectively avoid porous material film to be subject to the impact of high-pressure supercritical fluid and impaired.
Another object of the present invention is exactly providing a kind of device cleaning porous material, at least comprise variable compression pump and programmable end point determination assembly, wherein variable compression pump can change the incident pressure of supercritical fluid, and programmable end point determination assembly can provide the detection of the different terminal of array in cleaning process.Therefore, the flexibility ratio of cleaning can be promoted.
Object of the present invention realizes by following measure:
According to above-described object, the present invention more provides high pressure hole flushing device, comprises the following steps: to provide a washing fluid to continue to the very first time at a first pressure, with in the hole of the molecule infiltration to this porous material that make this washing fluid; Heat this washing fluid; And under the second pressure, provide washing fluid to continue to for the second time, wherein this second pressure is greater than this first pressure, and this washing fluid forms a break bounds fluid under this second pressure; ; And twice cleaning liquid is heterogeneity.
Preferably, it is characterized in that this washing fluid is carbon dioxide.
Preferably, it is characterized in that this washing fluid is selected from one of them of propane, ammonia, isopropyl alcohol, methyl alcohol and water.
Preferably, it is characterized in that this first pressure is between 10psi and 90psi.
Preferably, it is characterized in that the size of this second pressure depends on the kind of this washing fluid.
Preferably, it is characterized in that this second pressure is between 500psi and 5000psi.
Preferably, it is characterized in that this very first time and this second time depend on the size of the hole in the character of this porous material and thickness and this porous material.
Preferably, it is characterized in that this very first time and this second time depend on the kind of this washing fluid.
The invention has the advantages that: high pressure hole flushing device provided by the invention and device thereof, owing to making washing fluid compared with the hole being first full of porous material film under low-pressure state, therefore the structural strength of porous material film can be increased, be conducive to the high pressure washing resisting follow-up supercritical fluid, and then reach the object guaranteeing porous material membrane quality.In addition, also because washing fluid time of there is hole is longer, and make washing fluid have the longer time to dissolve impurity in porous material film and residue, and then significantly can promote the cleaning performance of hole material film.
Embodiment
The present invention discloses high pressure hole flushing device and device thereof, it first under low pressure operates a period of time before cleaning, so as to making the molecule infiltration of washing fluid to the hole in porous material film and being full of hole, then reaction pressure is increased to gradually the high pressure of supercritical fluid formation from low pressure.Therefore, not only can balance hole external and internal pressure, and the ability of the impacting with high pressure of the anti-supercritical fluid of porous material film can be improved, more can increase the action time of washing fluid molecule to the impurity in porous material film, effectively promote cleaning performance.
Once the present invention is further elaborated in conjunction with the embodiments:
The base material being applicable to water or carbon dioxide cleaning is provided, under the first pressure 50psi, provides washing fluid to be water, continue 10 minutes, with in the hole of the molecule infiltration to this porous material that make this washing fluid; Heat this washing fluid; Under the second pressure 1000psi, provide washing fluid carbon dioxide to continue 15 minutes, and this washing fluid form a break bounds fluid under this second pressure.
The above is only preferred embodiments of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (8)
1. high pressure hole flushing device, comprising: provide a washing fluid to continue to the very first time at a first pressure, with in the hole of the molecule infiltration to this porous material that make this washing fluid; Heat this washing fluid; And under the second pressure, provide washing fluid to continue to for the second time, wherein this second pressure is greater than this first pressure, and this washing fluid forms a break bounds fluid under this second pressure; And twice cleaning liquid is heterogeneity.
2. high pressure hole flushing device as claimed in claim 1, is characterized in that this washing fluid is carbon dioxide.
3. high pressure hole flushing device as claimed in claim 1, is characterized in that this washing fluid is selected from one of them of propane, ammonia, isopropyl alcohol, methyl alcohol and water.
4. high pressure hole flushing device as claimed in claim 1, is characterized in that this first pressure is between 10psi and 90psi.
5. high pressure hole flushing device as claimed in claim 1, is characterized in that the size of this second pressure depends on the kind of this washing fluid.
6. high pressure hole flushing device as claimed in claim 1, is characterized in that this second pressure is between 500psi and 5000psi.
7. high pressure hole flushing device as claimed in claim 1, is characterized in that this very first time and this second time depend on the size of the hole in the character of this porous material and thickness and this porous material.
8. high pressure hole flushing device as claimed in claim 1, is characterized in that this very first time and this second time depend on the kind of this washing fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510496660.8A CN105321805A (en) | 2015-08-13 | 2015-08-13 | High-pressure hole flushing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510496660.8A CN105321805A (en) | 2015-08-13 | 2015-08-13 | High-pressure hole flushing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105321805A true CN105321805A (en) | 2016-02-10 |
Family
ID=55248948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510496660.8A Pending CN105321805A (en) | 2015-08-13 | 2015-08-13 | High-pressure hole flushing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105321805A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040050406A1 (en) * | 2002-07-17 | 2004-03-18 | Akshey Sehgal | Compositions and method for removing photoresist and/or resist residue at pressures ranging from ambient to supercritical |
| CN1549307A (en) * | 2003-05-15 | 2004-11-24 | 台湾积体电路制造股份有限公司 | Method for cleaning hole material and apparatus thereof |
| CN1788863A (en) * | 2004-12-15 | 2006-06-21 | 财团法人工业技术研究院 | Method for removing impurity of porous material |
| CN101190438A (en) * | 2006-11-28 | 2008-06-04 | 财团法人工业技术研究院 | Supercritical fluid cleaning method and system thereof |
-
2015
- 2015-08-13 CN CN201510496660.8A patent/CN105321805A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040050406A1 (en) * | 2002-07-17 | 2004-03-18 | Akshey Sehgal | Compositions and method for removing photoresist and/or resist residue at pressures ranging from ambient to supercritical |
| CN1549307A (en) * | 2003-05-15 | 2004-11-24 | 台湾积体电路制造股份有限公司 | Method for cleaning hole material and apparatus thereof |
| CN1788863A (en) * | 2004-12-15 | 2006-06-21 | 财团法人工业技术研究院 | Method for removing impurity of porous material |
| CN101190438A (en) * | 2006-11-28 | 2008-06-04 | 财团法人工业技术研究院 | Supercritical fluid cleaning method and system thereof |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160210 |
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| RJ01 | Rejection of invention patent application after publication |