CN105315670A - High-heat-conductivity electronic encapsulation composite and preparing method thereof - Google Patents
High-heat-conductivity electronic encapsulation composite and preparing method thereof Download PDFInfo
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- CN105315670A CN105315670A CN201510822074.8A CN201510822074A CN105315670A CN 105315670 A CN105315670 A CN 105315670A CN 201510822074 A CN201510822074 A CN 201510822074A CN 105315670 A CN105315670 A CN 105315670A
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Abstract
The invention discloses a high-heat-conductivity electronic encapsulation composite. The high-heat-conductivity electronic encapsulation composite is prepared from, by weight, 20-50 parts of silicon oil, 5-15 parts of natural rubber, 2-3 parts of boehmite, 3-6 parts of nanometer aluminum nitride, 0.5-2.5 parts of a catalyst and 1-3 parts of a coupling agent. The invention further discloses a preparing method of the high-heat-conductivity electronic encapsulation composite. The electronic encapsulation composite is good in stability and heat conductivity and excellent in shock resistance, the abrasion resistance and corrosion resistance are greatly improved, and the preparing method is simple and low in cost.
Description
Technical field:
The present invention relates to Embedding Material technical field, be specifically related to a kind of high liquid thermal conductive encapsulated matrix material.
Background technology:
Embedding is exactly the technique each integral part reasonable Arrangement of formation electrical part, assembling, bonding, connection and environment isolation and protection etc. operated by specified requirement; thus make electron device can prevent the intrusion of moisture, dust and obnoxious flavour; slow down vibrations simultaneously, prevent the damage of external force and the effect of stable element inner parameter.Such as, the circuit card used out of doors needs to carry out embedding process to it, to prevent moisture, salt fog, condensation to the corrosion of circuit; In order to improve performance at sea in working electronic equipment all transformers all require embedding process; At airborne, space industry, some circuit card needs to carry out local stiffening or overall package; In order to avoid the phenomenon that some cable socket solder joint occurs corrosion or fractures, also need to encapsulate it, etc.Along with developing rapidly of embedding device high performance in current electronic applications and High Density Packaging Technology, Embedding Material is had higher requirement.
The raising of appliance power requires that potting compound has good heat conduction and insulating property simultaneously.If because heat can not conduct in time, easily form localized hyperthermia, and then components and parts, assembly may be damaged, thus the reliability of influential system and normal workweek phase.Therefore, the heat conductivility how improving electronic encapsulation material becomes important study hotspot.
Chinese patent (201410727916.7) discloses a kind of high heat conduction ambient cure organic silicon potting adhesive, by by wait weight part A, B two component mix; Wherein component A include vinyl silicone oil, platinum catalyst, long chain organic silanes modification alumina powder jointed; B component includes vinyl silicone oil, containing hydrogen silicone oil I, containing hydrogen silicone oil II, inhibitor, silane coupling agent.Long chain organic silanes modification alumina powder jointed.The ambient cure organic silicon potting adhesive that this invention provides both had had high performance-price ratio, high thermal conductivity, possessed again the features such as suitable viscosity, good mobility and snappiness.But its hardness is little, corrosion-resistant, wear no resistance.
Summary of the invention:
The object of this invention is to provide a kind of high-thermal conductivity electronic packaging material, its good heat conductivity, corrosion-resistant, wear resistance good, modest viscosity, snappiness is good.
Another object of the present invention is to provide the preparation method of this high-thermal conductivity electronic packaging material.
For achieving the above object, the present invention is by the following technical solutions:
A kind of high liquid thermal conductive encapsulated material, with parts by weight, comprises following component:
Silicone oil 20-50 part, natural rubber 5-15 part,
Boehmite 2-3 part, nano aluminum nitride 3-6 part,
Catalyzer 0.5-2.5 part, coupling agent 1-3 part.
Preferred as technique scheme, a kind of high liquid thermal conductive encapsulated material, with parts by weight, comprises following component:
Silicone oil 50 parts, natural rubber 12 parts,
Boehmite 2.5 parts, nano aluminum nitride 5 parts,
Catalyzer 1 part, coupling agent 2 parts.
Preferred as technique scheme, described silicone oil is one or both mixing in vinyl silicone oil, containing hydrogen silicone oil.
Preferred as technique scheme, the size of described nano aluminum nitride is 10-20nm.
Preferred as technique scheme, described catalyzer is the catalyzer of methyl vinyl silicone coordination.
Preferred as technique scheme, the preparation method of the catalyzer of described methyl vinyl silicone coordination is: in the reaction flask with reflux condensing tube and thermometer, add six hydration Platinic chlorides and tetramethyl divinyl siloxanes, reflux at 120-150 DEG C 1-2h, crosses and filter precipitation after being cooled to room temperature; With distilled water, filtrate is washed till neutrality repeatedly, dehydrates with Calcium Chloride Powder Anhydrous and get final product.
Preferred as technique scheme, the mass ratio of described six hydration platinic acid and tetramethyl divinyl siloxanes is 1:4-5.
Preferred as technique scheme, described coupling agent is one or more mixing in γ-(methacryloxypropyl) propyl trimethoxy silicane, 1,3-divinyl tetramethyl disiloxane, vinyl three ('beta '-methoxy oxyethyl group) silane.
A preparation method for high liquid thermal conductive encapsulated material, comprises the following steps:
By silicone oil, natural rubber mixing and stirring, at 60-90 DEG C, high-speed kneading 20-50min, add boehmite, nano aluminum nitride, coupling agent, utilize high speed dispersion mulser to disperse 20-30min, after vacuumizing and defoaming, add catalyzer, vacuum defoamation again, obtains high liquid thermal conductive encapsulated material.
The present invention has following beneficial effect:
The present invention is in electronic encapsulation material, add boehmite and nano aluminum nitride, its by coupling agent modified can stable dispersion in the polymer, make the electronic encapsulation material good heat conductivity prepared, wear resistance, corrosion resistance nature improve greatly, excellent shock resistance.
Embodiment:
For a better understanding of the present invention, below by embodiment, the present invention is further described, and embodiment, only for explaining the present invention, can not form any restriction to the present invention.
Embodiment 1
A kind of high liquid thermal conductive encapsulated material, with parts by weight, comprises following component:
Silicone oil 20 parts, natural rubber 5 parts,
Boehmite 2 parts, nano aluminum nitride 3 parts,
Catalyzer 0.5 part, coupling agent 1 part.
Its preparation method comprises the following steps:
By silicone oil, natural rubber mixing and stirring, at 60 DEG C, high-speed kneading 20min, add boehmite, nano aluminum nitride, coupling agent, utilize high speed dispersion mulser to disperse 20min, after vacuumizing and defoaming, add catalyzer, vacuum defoamation again, obtains high liquid thermal conductive encapsulated material.
Embodiment 2
A kind of high liquid thermal conductive encapsulated material, with parts by weight, comprises following component:
Silicone oil 50 parts, natural rubber 15 parts,
Boehmite 3 parts, nano aluminum nitride 6 parts,
Catalyzer 2.5 parts, coupling agent 3 parts.
Its preparation method comprises the following steps:
By silicone oil, natural rubber mixing and stirring, at 90 DEG C, high-speed kneading 50min, add boehmite, nano aluminum nitride, coupling agent, utilize high speed dispersion mulser to disperse 30min, after vacuumizing and defoaming, add catalyzer, vacuum defoamation again, obtains high liquid thermal conductive encapsulated material.
Embodiment 3
A kind of high liquid thermal conductive encapsulated material, with parts by weight, comprises following component:
Silicone oil 30 parts, natural rubber 7 parts,
Boehmite 2.2 parts, nano aluminum nitride 4 parts,
Catalyzer 0.8 part, coupling agent 1.6 parts.
Its preparation method comprises the following steps:
By silicone oil, natural rubber mixing and stirring, at 70 DEG C, high-speed kneading 30min, add boehmite, nano aluminum nitride, coupling agent, utilize high speed dispersion mulser to disperse 25min, after vacuumizing and defoaming, add catalyzer, vacuum defoamation again, obtains high liquid thermal conductive encapsulated material.
Embodiment 4
A kind of high liquid thermal conductive encapsulated material, with parts by weight, comprises following component:
Silicone oil 35 parts, natural rubber 8 parts,
Boehmite 2.5 parts, nano aluminum nitride 4.6 parts,
Catalyzer 1.1 parts, coupling agent 1.9 parts.
Its preparation method comprises the following steps:
By silicone oil, natural rubber mixing and stirring, at 80 DEG C, high-speed kneading 40min, add boehmite, nano aluminum nitride, coupling agent, utilize high speed dispersion mulser to disperse 30min, after vacuumizing and defoaming, add catalyzer, vacuum defoamation again, obtains high liquid thermal conductive encapsulated material.
Embodiment 5
A kind of high liquid thermal conductive encapsulated material, with parts by weight, comprises following component:
Silicone oil 40 parts, natural rubber 10 parts,
Boehmite 2.9 parts, nano aluminum nitride 5 parts,
Catalyzer 1.3 parts, coupling agent 2.6 parts.
Its preparation method comprises the following steps:
By silicone oil, natural rubber mixing and stirring, at 90 DEG C, high-speed kneading 35min, add boehmite, nano aluminum nitride, coupling agent, utilize high speed dispersion mulser to disperse 25min, after vacuumizing and defoaming, add catalyzer, vacuum defoamation again, obtains high liquid thermal conductive encapsulated material.
Embodiment 6
A kind of high liquid thermal conductive encapsulated material, with parts by weight, comprises following component:
Silicone oil 50 parts, natural rubber 14 parts,
Boehmite 2.7 parts, nano aluminum nitride 5.6 parts,
Catalyzer 2.2 parts, coupling agent 3 parts.
Its preparation method comprises the following steps:
By silicone oil, natural rubber mixing and stirring, at 75 DEG C, high-speed kneading 45min, add boehmite, nano aluminum nitride, coupling agent, utilize high speed dispersion mulser to disperse 20min, after vacuumizing and defoaming, add catalyzer, vacuum defoamation again, obtains high liquid thermal conductive encapsulated material.
Performance test is carried out to high liquid thermal conductive encapsulated material provided by the invention below.Test result is as shown in table 1:
Table 1
From table 1, electronic encapsulation material good heat conductivity provided by the invention, excellent in mechanical performance.
Claims (9)
1. a high liquid thermal conductive encapsulated material, is characterized in that, with parts by weight, comprises following component:
Silicone oil 20-50 part, natural rubber 5-15 part,
Boehmite 2-3 part, nano aluminum nitride 3-6 part,
Catalyzer 0.5-2.5 part, coupling agent 1-3 part.
2. a kind of high liquid thermal conductive encapsulated material as claimed in claim 1, is characterized in that, with parts by weight, comprise following component:
Silicone oil 50 parts, natural rubber 12 parts,
Boehmite 2.5 parts, nano aluminum nitride 5 parts,
Catalyzer 1 part, coupling agent 2 parts.
3. a kind of high liquid thermal conductive encapsulated material as claimed in claim 1, is characterized in that, described silicone oil is one or both mixing in vinyl silicone oil, containing hydrogen silicone oil.
4. a kind of high liquid thermal conductive encapsulated material as claimed in claim 1, is characterized in that, the size of described nano aluminum nitride is 10-20nm.
5. a kind of high liquid thermal conductive encapsulated material as claimed in claim 1, it is characterized in that, described catalyzer is the catalyzer of methyl vinyl silicone coordination.
6. a kind of high liquid thermal conductive encapsulated material as claimed in claim 5, it is characterized in that, the preparation method of the catalyzer of described methyl vinyl silicone coordination is: in the reaction flask with reflux condensing tube and thermometer, add six hydration Platinic chlorides and tetramethyl divinyl siloxanes, reflux at 120-150 DEG C 1-2h, crosses and filter precipitation after being cooled to room temperature; With distilled water, filtrate is washed till neutrality repeatedly, dehydrates with Calcium Chloride Powder Anhydrous and get final product.
7. a kind of high liquid thermal conductive encapsulated material as claimed in claim 5, is characterized in that, the mass ratio of described six hydration platinic acid and tetramethyl divinyl siloxanes is 1:4-5.
8. a kind of high liquid thermal conductive encapsulated material as claimed in claim 1, it is characterized in that, described coupling agent is one or more mixing in γ-(methacryloxypropyl) propyl trimethoxy silicane, 1,3-divinyl tetramethyl disiloxane, vinyl three ('beta '-methoxy oxyethyl group) silane.
9. the preparation method of a kind of high liquid thermal conductive encapsulated material as described in as arbitrary in claim 1 to 8, is characterized in that, comprise the following steps:
By silicone oil, natural rubber mixing and stirring, at 60-90 DEG C, high-speed kneading 20-50min, add boehmite, nano aluminum nitride, coupling agent, utilize high speed dispersion mulser to disperse 20-30min, after vacuumizing and defoaming, add catalyzer, vacuum defoamation again, obtains high liquid thermal conductive encapsulated material.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109762024A (en) * | 2019-01-15 | 2019-05-17 | 江苏晶华新材料科技有限公司 | A kind of method of platinum water synthesis process deacidification |
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| CN101735619A (en) * | 2009-12-28 | 2010-06-16 | 华南理工大学 | Halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive and preparation method thereof |
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| CN102952403A (en) * | 2011-08-30 | 2013-03-06 | 上海尤耐有机硅材料有限公司 | Additive organosilicon heat-conducting electronic potting adhesive and manufacturing method thereof |
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Cited By (1)
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| CN109762024A (en) * | 2019-01-15 | 2019-05-17 | 江苏晶华新材料科技有限公司 | A kind of method of platinum water synthesis process deacidification |
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