CN105304606A - Electronic device with two planar type inductors - Google Patents
Electronic device with two planar type inductors Download PDFInfo
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- CN105304606A CN105304606A CN201410283184.7A CN201410283184A CN105304606A CN 105304606 A CN105304606 A CN 105304606A CN 201410283184 A CN201410283184 A CN 201410283184A CN 105304606 A CN105304606 A CN 105304606A
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Abstract
The invention discloses an electronic device comprising a first planar type inductor and a second planar type inductor. The first planar type inductor at least comprises a first annular structure and a second annular structure that are connected and used for producing a first magnetic field with a first direction and a second magnetic field with a second direction respectively; the first direction is different from the second direction; the second planar type inductor at least comprises a third annular structure and a fourth annular structure that are connected and used for producing a third magnetic field with a third direction and a fourth magnetic field with a fourth direction respectively; and the third direction is different from the fourth direction, wherein at least one parts of the first annular structure and the third annular structure are overlapped to form a first overlapped region; and the first overlapped region is overlapped with at least one parts of the second annular structure and the fourth annular structure to form a second overlapped region. According to the electronic device, the size of chips can be reduced and the hardware costs can be lowered.
Description
Technical field
Embodiment disclosed by the present invention relates to a kind of electronic installation, and espespecially one has one first plane formula inductance and one second plane formula inductance, and the electronic installation that local is overlapping each other.
Background technology
Inductance is passive component common in Circuits System, can in order to filtering, choked flow and storage power etc.For example, inductance can be used to carry out storage power, and the energy size that can store and inductance value are directly proportional in DC-to-DC converter, in order to meet needed for system, required inductance value is usually larger.Again such as, two inductance can be used to be coupled mutually to form transformer (transformer).
But, area in integrated circuits shared by inductance wants large many compared to other element, therefore, area required when being necessary to find a kind of new inductor structure to reduce implementation inductance, namely improves the inductance value that inductance element unit are is contributed.
Summary of the invention
According to embodiments of the invention, disclose one and there is one first plane formula inductance and one second plane formula inductance, and the electronic installation that local is overlapping is each other to solve the problem.
According to the present invention one first embodiment, disclose a kind of electronic installation, include one first plane formula inductance and one second plane formula inductance.Wherein this first plane formula inductance at least comprises the first ring columnar structure and one second ring-shaped structure that are connected, have one first magnetic field of a first direction in order to produce and have one second magnetic field of a second direction respectively, wherein this first direction is different from the direction of this second direction.This second plane formula inductance at least comprises one the 3rd ring-shaped structure and one the 4th ring-shaped structure that are connected, respectively in order to produce have a third direction one the 3rd magnetic field with there is one the 4th magnetic field of a fourth direction, wherein this third direction is different from the direction of this fourth direction.Wherein this first ring columnar structure forms one first overlapping region with the overlapping at least partially of the 3rd ring-shaped structure, forms one second overlapping region with this second ring-shaped structure with the overlapping at least partially of the 4th ring-shaped structure.
Chip area required when one of them advantage system of the present invention can reduce implementation inductance, namely improves the inductance value that inductance element unit are is contributed, and then reduces hardware cost.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of one first embodiment of electronic installation of the present invention.
Fig. 2 A is the schematic diagram of one second embodiment of electronic installation of the present invention.
Fig. 2 B is the schematic diagram of one the 3rd embodiment of electronic installation of the present invention.
Fig. 2 C is the schematic diagram of one the 4th embodiment of electronic installation of the present invention.
Fig. 2 D is the schematic diagram of one the 5th embodiment of electronic installation of the present invention.
Fig. 3 A is the schematic diagram of one the 6th embodiment of electronic installation of the present invention.
Fig. 3 B is the schematic diagram of one the 7th embodiment of electronic installation of the present invention.
Fig. 4 is the frequency response chart for the coupled systemes numerical value of the electronic installation using unsymmetrical plan formula inductance composition respectively when different overlapping region size.
Fig. 5 is the schematic diagram of one the 8th embodiment of electronic installation of the present invention.
Fig. 6 is the frequency response chart of the inductance value of 8 fonts and non-8 font planar inductors.
Wherein, description of reference numerals is as follows:
102、104、202A、204A、202B、204B、202C、
204C, 202D, 204D, 302A, 304A, 302B, 304B plane formula inductance
106,206A, 206B, 206C, 206D, 306A, 306B, 500 electronic installations
1022、1024、1042、1044、2022A、2024A、
2042A, 2044A, 2022B, 2024B, 2042B, 2044B ring-shaped structure
502,504 subelements
Embodiment
Fig. 1 is the schematic diagram of one first embodiment of electronic installation of the present invention.The wherein inductance that is made up of a plane formula inductance 102 and a plane formula inductance 104 of an electronic installation 106.Plane formula inductance 102 is positioned at one first conductor layer, and include a first ring columnar structure 1022 and one second ring-shaped structure 1024 and produce one first magnetic field with a first direction and one second magnetic field with a second direction respectively, such as this first direction for the plane that formed perpendicular to first ring columnar structure 1022 and by this plane below up; And this second direction for the plane that formed perpendicular to the second ring-shaped structure 1024 and by this plane top down.Plane formula inductance 102 has an inductance value H
102.On the other hand, plane formula inductance 104 is positioned at one second conductor layer being different from one first conductor layer, and include a first ring columnar structure 1042 and one second ring-shaped structure 1044 and produce one the 3rd magnetic field with a third direction and one the 4th magnetic field with a fourth direction respectively, such as this third direction for the plane that formed perpendicular to first ring columnar structure 1042 and by this plane below up; And this fourth direction for the plane that formed perpendicular to the second ring-shaped structure 1044 and by this plane top down.Wherein this first direction is identical with the direction of this third direction, and this second direction is identical with the direction of this fourth direction.Wherein, the opening of first ring columnar structure 1022 is towards drawing right, and the opening of this second ring-shaped structure 1024 is above drawing, and the opening of the 3rd ring-shaped structure 1042 is towards drawing right, and the opening of the 4th ring-shaped structure 1044 is below drawing.This plane formula inductance 104 has an inductance value H
104.The present invention uses plane formula inductance 102 and plane formula inductance 104 to be coupled to each other and is stackingly combined into electronic installation (inductance) 106.Wherein, end points and the end points of the 3rd ring-shaped structure 1042 of first ring columnar structure 1022 can bore a hole (VIA) be connected to make plane formula inductance 102 and plane formula inductance 104 jointly form an inductance (that is electronic installation 106).The plane domain that first ring columnar structure 1042 and second ring-shaped structure 1044 of the plane domain that first ring columnar structure 1022 and second ring-shaped structure 1024 of plane formula inductance 102 are formed and plane formula inductance 104 are formed is completely overlapping, with an inductance value H of the increase electronic installation (inductance) 106 of trying one's best
106.Make inductance value H
106be greater than inductance value H respectively
102and inductance value H
104, to reach the object of the inductance value increasing unit are.Specifically, Using such method coiling carrys out the framework obtained in conjunction with two class 8 font planar inductors, can reach the unit are inductance value larger than known spiral framework.In addition, because first ring columnar structure 1022 is contrary with the magnetic direction of the second ring-shaped structure 1024 and the 4th ring-shaped structure 1044 with the magnetic direction of the 3rd ring-shaped structure 1042, electromagnetic interference (EMI) can therefore be reduced.
Fig. 2 A is the schematic diagram of one second embodiment of electronic installation of the present invention.The wherein transformer that is made up of a plane formula inductance 202A and a plane formula inductance 204A of an electronic installation 206A.Plane formula inductance 202A is positioned at one first conductor layer, and include a first ring columnar structure 2022A and one second ring-shaped structure 2024A and produce one first magnetic field and one second magnetic field of different directions respectively, such as this first magnetic direction for the plane that formed perpendicular to first ring columnar structure 2022A and by this plane below up; And this second magnetic direction for the plane that formed perpendicular to the second ring-shaped structure 2024A and by this plane top down.Plane formula inductance 202A has an inductance value H
202A.On the other hand, plane formula inductance 204A is positioned at one second conductor layer being different from one first conductor layer, and include a first ring columnar structure 2042A and one second ring-shaped structure 2044A and produce one first magnetic field and one second magnetic field of different directions respectively, such as this first magnetic direction for the plane that formed perpendicular to first ring columnar structure 2042A and by this plane below up; And this second magnetic direction for the plane that formed perpendicular to the second ring-shaped structure 2044A and by this plane top down.Plane formula inductance 204A has an inductance value H204A.The present invention uses plane formula inductance 202A and plane formula inductance 204A to overlie one another to be combined into electronic installation (transformer) 206A.Wherein coupled systemes numerical value K
206Athe first ring columnar structure 2022A of size plane formula inductance 202A and the plane domain that formed of the first ring columnar structure 2042A of the plane domain that formed of the second ring-shaped structure 2024A and plane formula inductance 204A and the second ring-shaped structure 2044A between the size of overlapping region decide.In practice, first ring columnar structure 2022A and the second ring-shaped structure 2024A is not defined in and is embodied on same crystal grain (die).In certain embodiments, three-dimensional stacked structure can be used to fill (3DStackPackaging), namely first ring columnar structure 2022A and the second ring-shaped structure 2024A can lay respectively at upper crystal grain and lower crystal grain (or contrary design), and centre is filled with dielectric medium (under-fill) material.Other embodiment can also have similar design.
Fig. 2 B is the schematic diagram of one the 3rd embodiment of electronic installation of the present invention.The wherein transformer that is made up of a plane formula inductance 202B and a plane formula inductance 204B of an electronic installation 206B.Plane formula inductance 202B includes the first ring columnar structure 2022B being positioned at one first conductor layer and the one second ring-shaped structure 2024B being positioned at one second conductor layer, and produce one first magnetic field with a first direction respectively and there is second direction one second magnetic field, such as this first direction for the plane that formed perpendicular to first ring columnar structure 2022B and by this plane below up; And this second direction for the plane that formed perpendicular to the second ring-shaped structure 2024B and by this plane top down.Plane formula inductance 202B has an inductance value H202B.On the other hand, plane formula inductance 204B includes the first ring columnar structure 2042B being positioned at this second conductor layer and the one second ring-shaped structure 2044B being positioned at this first conductor layer, and produce respectively and there is one the 3rd magnetic field of a third direction and there is one the 4th magnetic field of a fourth direction, such as this first direction for the plane that formed perpendicular to first ring columnar structure 2042B and by this plane below up; And this second direction for the plane that formed perpendicular to the second ring-shaped structure 2044B and by this plane top down.Plane formula inductance 204B has an inductance value H204B.The present invention uses plane formula inductance 202B and plane formula inductance 204B to overlie one another to be combined into electronic installation (transformer) 206B, and wherein the first ring columnar structure 2022B of plane formula inductance 202B is overlapping with the first ring columnar structure 2042B of plane formula inductance 204B; The second ring-shaped structure 2024B of plane formula inductance 202B is overlapping with the second ring-shaped structure 2044B of plane formula inductance 204B, although therefore plane formula inductance 202B and plane formula inductance 204B all uses two-layer conductor layer, electronic installation (transformer) 206B be combined into still only needs two-layer conductor layer altogether.Wherein coupled systemes numerical value K
206Bthe plane domain that formed by first ring columnar structure 2022B and the second ring-shaped structure 2024B of plane formula inductance 202B of size and the plane domain that formed of the first ring columnar structure 2042B of plane formula inductance 204B and the second ring-shaped structure 2044B between the size of overlapping region decide.
Fig. 2 C is the schematic diagram of one the 4th embodiment of electronic installation of the present invention.Wherein an electronic installation 206C is the transformer be made up of a plane formula inductance 202C and a plane formula inductance 204C.Electronic installation 206C is similar with electronic installation 206A, and difference is only because overlapping region becomes large, a coupled systemes numerical value K of electronic installation 206C
206Csize can be greater than the coupled systemes numerical value K of electronic installation 206A
206A.In addition electronic installation 206C comparatively electronic installation 206A employ more one deck conductor layer be used as coiling use.
Fig. 2 D is the schematic diagram of one the 5th embodiment of electronic installation of the present invention.Wherein an electronic installation 206D is the transformer be made up of a plane formula inductance 202D and a plane formula inductance 204D.Electronic installation 206D is similar with electronic installation 206B, and difference is only that the size of a coupled systemes numerical value K206D of electronic installation 206D can be greater than the coupled systemes numerical value K206B of electronic installation 206B because overlapping region becomes large.In addition electronic installation 206D comparatively electronic installation 206B employ more one deck conductor layer be used as coiling use.
Fig. 3 A is the schematic diagram of one the 6th embodiment of electronic installation of the present invention.Wherein an electronic installation 306A is the transformer be made up of a unsymmetrical plan formula inductance 302A and a unsymmetrical plan formula inductance 304A.Electronic installation 306A is similar with electronic installation 206A, difference is only a first ring columnar structure of the plane formula inductance 302A in electronic installation 306A and the annular number of turns difference of one second ring-shaped structure, makes the magnetic field size of this first ring columnar structure of plane formula inductance 302A and this second ring-shaped structure not identical; And plane formula inductance 304A is also like this.Specifically, this first ring columnar structure in the plane formula inductance 302A in electronic installation 306A with the more annular number of turns partially overlaps in plane formula inductance 304A this first ring columnar structure with the more annular number of turns; And this second ring-shaped structure in plane formula inductance 302A in electronic installation 306A with the less annular number of turns partially overlaps in plane formula inductance 304A this second ring-shaped structure with the less annular number of turns.
Fig. 3 B is the schematic diagram of one the 7th embodiment of electronic installation of the present invention.Wherein an electronic installation 306B is the transformer be made up of a unsymmetrical plan formula inductance 302B and a mirror image (mirrored) unsymmetrical plan formula inductance 304B.Electronic installation 306B is similar with electronic installation 306A, and difference is only that a first ring columnar structure in the plane formula inductance 302B in electronic installation 306B with the more annular number of turns partially overlaps in plane formula inductance 304B a first ring columnar structure with the less annular number of turns; And one second ring-shaped structure in plane formula inductance 302B in electronic installation 306B with the less annular number of turns partially overlaps in plane formula inductance 304B one second ring-shaped structure with the more annular number of turns.Thus, due to the anti-phase negative function that asymmetric mirror-image structure causes, add displacement between plane formula inductance 302B and plane formula inductance 304B compared to the displacement between plane formula inductance 302A and plane formula inductance 304A come larger, according to Ampere's right-handed screw rule (thumbrule), now anti-phase negative function aggravation.Therefore, the coupled systemes numerical value K of electronic installation (transformer) 306B
306Bsize comparatively electronic installation (transformer) 306A come lower.
Fig. 4 is the frequency response chart for the coupled systemes numerical value of the electronic installation using unsymmetrical plan formula inductance composition respectively when different overlapping region size.Wherein a curve C 1 represents the frequency response of the coupled systemes numerical value of the electronic installation (transformer) (configuration mode in similar Fig. 3 A) overlieing one another formed by a unsymmetrical plan formula inductance (8 font planar inductor frameworks and coil number is 2 circles: 1 circle) and another unsymmetrical plan formula inductance (8 font planar inductor frameworks and coil number is 2 circles: 1 circle), and wherein the overlapping degree of this unsymmetrical plan formula inductance and this another unsymmetrical plan formula inductance is maximum (completely overlapping or almost completely overlapping); One curve C 2 represents the frequency response of the coupled systemes numerical value of the electronic installation (transformer) (configuration mode in similar Fig. 3 B) overlieing one another formed by a unsymmetrical plan formula inductance (8 font planar inductor frameworks and coil number is 2 circles: 1 circle) and another mirror image unsymmetrical plan formula inductance (8 font planar inductor frameworks and coil number is 1 circle: 2 circles), and wherein the overlapping degree of this unsymmetrical plan formula inductance and this another unsymmetrical plan formula inductance is maximum (completely overlapping or almost completely overlapping).Can be learnt by curve C 1 and C2, when low frequency (greatly about below 13GHz), under completely overlapping or almost completely overlapping degree, utilize a unsymmetrical plan formula inductance another mirror image unsymmetrical plan formula inductance stacking essence can reduce coupling value, therefore, when target coupling value is lower, same low coupling value effect can be reached with less area.In addition, with the configuration of curve C 1, overlapping degree is reduced to 75% and 50% respectively, curve C 3 and a curve C 5 can be obtained; With the configuration of curve C 2, overlapping degree is reduced to 75% and 50% respectively, curve C 4 and a curve C 6 can be obtained.Can be learnt by the curve C 3 in Fig. 4, C4 and C5, C6, when low frequency (about below 10GHz), when overlapping degree is 75% and 50%, utilize a unsymmetrical plan formula inductance another mirror image unsymmetrical plan formula inductance stacking can essence and reduce coupling value significantly, therefore, when target coupling value is lower, the object of simultaneously placing two inductance or a transformer can be reached with less area.Therefore, different overlapping degrees or area can be utilized to design the coupled systemes numerical value needed for realization.
Fig. 5 is the schematic diagram of one the 8th embodiment of electronic installation of the present invention.One electronic installation 500 is one 8 font planar inductors, includes a part of element 502 being positioned at one first conductor layer and another part element 504 being positioned at one second conductor layer.Wherein subelement 502 and subelement 504 have two laps, i.e. one first crosspoint P1 and one second crosspoint P2.Fig. 6 is the frequency response chart of the inductance value of 8 fonts and non-8 font planar inductors.In figure 6, a curve D 1 is the inductance value of the corresponding different frequency of 8 font planar inductors in Fig. 5; One curve D 2 is inductance value of the corresponding different frequency of planar inductor of non-8 font frameworks, and it has equal area with 8 font planar inductors in Fig. 5.As shown in Figure 6, the object that the inductance value (I) that the electronic installation 500 in Fig. 5 effectively promotes unit are within the scope of certain frequency reduces die size to reach, saves hardware cost.
It should be noted, the true form of the ring-shaped structure of the planar inductor in the present invention is not limited to the concrete kenel of the ring-shaped structure of the planar inductor in embodiment.That is the ring-shaped structure of planar inductor can be square, circular or polygon-shaped.In addition, for ring-shaped structure or the configuration of its coiling in different conductor layer of planar inductor, be not also limited with above-described embodiment.
The foregoing is only preferred embodiment of the present invention, all equalizations done according to the present patent application the scope of the claims change and modify, and all should belong to covering scope of the present invention.
Claims (11)
1. an electronic installation, includes:
One first plane formula inductance, at least comprise the first ring columnar structure and one second ring-shaped structure that are connected, have one first magnetic field of a first direction in order to produce and have one second magnetic field of a second direction respectively, wherein this first direction is different from the direction of this second direction; And
One second plane formula inductance, at least comprise one the 3rd ring-shaped structure and one the 4th ring-shaped structure that are connected, respectively in order to produce have a third direction one the 3rd magnetic field with there is one the 4th magnetic field of a fourth direction, wherein this third direction is different from the direction of this fourth direction;
Wherein this first ring columnar structure forms one first overlapping region with the overlapping at least partially of the 3rd ring-shaped structure, forms one second overlapping region with this second ring-shaped structure with the overlapping at least partially of the 4th ring-shaped structure.
2. electronic installation as claimed in claim 1, wherein this first plane formula inductance has one first inductance value, this the second plane formula inductance has one second inductance value, this the first plane formula inductance is coupled to this second plane formula inductance, to form one the 3rd inductance with one the 3rd inductance value, 3rd inductance value is greater than any one in this first inductance value and this second inductance value, and the size of the 3rd inductance value decides according to the size of this first and second overlapping region.
3. electronic installation as claimed in claim 1, wherein this first direction is identical with the direction of this third direction, and this second direction is identical with the direction of this fourth direction.
4. electronic installation as claimed in claim 1, wherein this first plane formula inductance is positioned at one first conductor layer, and this second plane formula inductance is positioned at one second conductor layer.
5. electronic installation as claimed in claim 1, wherein this first ring columnar structure and this second ring-shaped structure lay respectively at one first conductor layer and one second conductor layer, and the 3rd ring-shaped structure and the 4th ring-shaped structure lay respectively at this second conductor layer and this first conductor layer.
6. electronic installation as claimed in claim 1, wherein this first plane formula inductance and this second plane formula inductance form a transformer.
7. electronic installation as claimed in claim 6, wherein this transformer has a coupled systemes numerical value, and the size of this coupled systemes numerical value is decided by the size of this first and second overlapping region.
8. electronic installation as claimed in claim 1, wherein this first ring columnar structure forms a triple-overlapped region with the overlapping at least partially of the 4th ring-shaped structure.
9. electronic installation as claimed in claim 8, wherein this first magnetic field is greater than this second magnetic field, and the 3rd magnetic field is less than the 4th magnetic field.
10. electronic installation as claimed in claim 1, wherein this first ring columnar structure is identical with the opening direction of the 3rd ring-shaped structure, and this second ring-shaped structure is different from the opening direction of the 4th ring-shaped structure.
11. electronic installations as claimed in claim 1, wherein this first plane formula inductance is positioned at different crystal grain from this second plane formula inductance, and uses three-dimensional stacked structure to fill common formation one transformer.
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| CN201410283184.7A CN105304606B (en) | 2014-06-20 | 2014-06-20 | Electronic device with two plane formula inductance |
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| CN201410283184.7A CN105304606B (en) | 2014-06-20 | 2014-06-20 | Electronic device with two plane formula inductance |
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| CN106373744A (en) * | 2016-11-04 | 2017-02-01 | 王奉瑾 | Multi-magnetic circuit winding and transformation device of using same |
| CN106486262A (en) * | 2016-11-04 | 2017-03-08 | 王奉瑾 | A kind of multiphase multiple magnetic circuit transformer |
| CN107437456A (en) * | 2016-05-25 | 2017-12-05 | 台达电子企业管理（上海）有限公司 | Core structure and magnetic element |
| CN108257774A (en) * | 2016-12-07 | 2018-07-06 | 雅达电子国际有限公司 | The method for forming the coil for inductance element |
| CN112234983A (en) * | 2020-10-29 | 2021-01-15 | 华中科技大学 | Broadband VCO based on source damping resistor |
| US11728087B2 (en) | 2016-05-25 | 2023-08-15 | Delta Electronics (Shanghai) Co., Ltd | Core structure and magnetic device |
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| CN112234983A (en) * | 2020-10-29 | 2021-01-15 | 华中科技大学 | Broadband VCO based on source damping resistor |
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