CN105293940A - Manufacturing method for forming holes in base plate - Google Patents
Manufacturing method for forming holes in base plate Download PDFInfo
- Publication number
- CN105293940A CN105293940A CN201510710361.XA CN201510710361A CN105293940A CN 105293940 A CN105293940 A CN 105293940A CN 201510710361 A CN201510710361 A CN 201510710361A CN 105293940 A CN105293940 A CN 105293940A
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- substrate
- protective layer
- manufacture method
- present
- forming hole
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Abstract
The invention discloses a manufacturing method for forming holes in a base plate. The manufacturing method comprises the steps that firstly, the base plate is supplied and provided with at least one reserve area used for allowing the subsequent at least one hole to be formed; secondly, protection layers are formed on the reserve areas, and then chemical strengthening is performed on the base plate. Due to the fact that chemical strengthening is performed in an ion exchange mode to form a stress layer on an area which is not covered with the protection layers, hole drilling can be performed on the reserve areas through a general simple hole drilling process to successfully manufacture the holes in the base plate. According to the method, the expensive cost and complex procedures of the commonly-seen hole drilling process and subsequent processing are effectively reduced, and therefore the application benefit is effectively promoted.
Description
Technical field
The invention relates to that one carries out the method for Drilling operation, particularly a kind of utilization is formed with protective layer, in advance on the glass substrate to form the manufacture method of hole on substrate.
Background technology
Along with the hard and fragile material such as glass a large amount of be used in the electronic products such as intelligent mobile phone, and then drive relevant Processing Technology Development, the intermetallic composite coating mode in past cannot meet present glass processing demand completely, especially the processing technology such as cutting, sliver, CNC processing, grinding, polishing of glass.In order to catch up with development trend and the demand condition of current product, production unit and processing units all have to pass through multiple test and adjustment, to meet industry at present for the multiple demands of glass processing design.
For example, as shown in Figure 1, it mainly includes step S1 to S6 to the processing procedure of one chip glass contact panel (OneGlassSolution, OGS), first, first by glass mother after chemical enhanced, side enter relevant contact panel processing procedure.Afterwards, glass mother is cut into small pieces by recycling cutting (Cutting), uses edge strengthening technology, use maintenance strength of glass after grinding (Grinding).The main advantage of this kind of processing procedure is for effectively using high precision gold-tinted processing procedure, to reach narrow frame design demand and high efficiency production.But, it should be noted that, current industry has still met with many difficulties point on the processing procedure of OGS, such as: owing to waiting processing procedure through cutting and grinding, the edge strength of face glass will be made to be destroyed, and in order to maintain the certain intensity of substrate or even promote its intensity, current each glassworks is all devoted to the strengthening degree of depth (DepthofLayer, DOL) continuing to promote face glass.
But, this problem that will another one caused to can not be ignored, namely when the strengthening degree of depth (DOL) of glass substrate rises to the grade of 40 microns (μm) or more, because the degree of depth of strengthening is too high, cause the stress of glass substrate inside too high simultaneously, then will make glass substrate follow-up carry out Drilling operation time, usually produce to have to prolong and split or the generation of the problem such as fragmentation.In order to solve this problem, current industry can adopt ultrasonic wave spindle (UltrasonicSpindle), acid etching to cut the mode such as (HFCutting) or laser cutting (LaserCutting) to carry out Drilling operation for chemically reinforced glass, occurs to evade the common fragmentation problem of the substrate that falls to commonly see.But, though these methods above-mentioned in order to carry out Drilling operation, can all have board price too high, such as, up to up to ten million unit, and must particular device be limited to, and not there is the problem of versatility.
In addition, utilize hydrofluoric acid (HF) to carry out cutting and also have environmentally safe with the danger in environmental consciousness and doubt, obviously also do not meet the requirement of current industry, and cannot be used widely.
Edge is; in order to solve numerous disappearances that prior art has; can improving of the above-mentioned disappearance of the present inventor's thoughts; and according to the correlation experience be engaged in for many years in this respect, concentrate one's attention on observe and study it, and coordinate the utilization of scientific principle; and a kind of modern design is proposed and effective the present invention improving above-mentioned disappearance; it discloses a kind of utilization to be formed with protective layer on the glass substrate in advance, and to carry out the method for follow-up boring setting, its concrete framework and embodiment will be specified in down.
Summary of the invention
For solving prior art Problems existing, one of the present invention object is to provide a kind of manufacture method forming hole on substrate, it is that the mode of carrying out Drilling operation for existing substrate does an improvement, this modification method contributes to the present invention and effectively saves the manufacturing cost of processing procedure of commonly seeing, production process, complexity with operating equipment, significantly to promote its engineering method benefit.
The another object of the present invention is to provide a kind of manufacture method forming hole on substrate; it utilizes on substrate, be pre-formed with a protective layer; make substrate after chemical enhanced; the region of matcoveredn protection does not have the formation of stressor layers; therefore general boring processing procedure mode can be directly used to complete the making of follow-up hole; utilize this kind of method; not only can reach saving in consumptive material and cost of manufacture, more efficiently solve the generation that existing substrate fragmentation may occur or prolongs problems such as splitting.
An object again of the present invention is to provide a kind of manufacture method forming hole on substrate, outside this method not only can be applied for the field of the contact panel products such as existing chemically reinforced glass or thinning glass, more have for other product needing to carry out Drilling operation, all the present invention can be applied, confirm through practice, the method utilizing the present invention disclosed can have the effect of the large and high efficiency of production capacity concurrently, virtually improve the present invention can the category of application, and promote its industrial applicability.
Therefore the present invention discloses a kind of manufacture method forming hole on substrate, its step comprises: first provide a substrate, and substrate has at least one trough, arranges for follow-up at least one hole; Afterwards, trough is formed with a protective layer, and carries out chemical enhanced processing procedure for this substrate; Finally, boring processing procedure is carried out in the trough with this protective layer, to produce at least one hole on substrate.
According to the embodiment of the present invention, wherein, the material of substrate such as can be a chemically reinforced glass or a thinning glass.
According to the embodiment of the present invention, wherein, protective layer the mode of evaporation or sputter to be formed on trough.Further, the material of protective layer such as can be the material of a resistance to acid.
According to the embodiment of the present invention, wherein, carrying out more comprising in chemical enhanced step to substrate utilizing an ion-exchange method, a stressor layers is formed with the region on substrate without this protective layer covering.In one embodiment, this ion-exchange method such as can comprise and being immersed in a potassium nitrate solution by this substrate, and this step can be carried out under a hot environment, forms described stressor layers to utilize ion-exchange.
Wherein, for selecting of protective layer material, according to one of the present invention embodiment, then the material of protective layer should be the metal of a resistance to acid, alloy or plastics; Preferably, the material of protective layer such as can be the material of anti-saltpetre; More preferably, the material of protective layer such as can be copper or aluminium.
Edge this; based on the manufacture method disclosed by the present invention; substrate has the region that described protective layer is protected; effectively can stop the formation of its stressor layers; therefore deposit in case what there is no a stressor layers, can directly use general boring processing procedure mode to carry out the manufacture of follow-up hole, in this; not only effectively realize the benefit that the present invention saves commonly see consumptive material and making board cost etc., more successfully solve the generation that existing substrate fragmentation easily occurs or prolongs problems such as splitting.
Under to coordinate by specific embodiment appended by graphicly to illustrate in detail, when the effect being easier to understand the object of the present invention, technology contents, feature and reached.
Accompanying drawing explanation
Fig. 1 is the required schematic diagram through processing station of processing procedure of prior art one one chip glass contact panel.
Fig. 2 is the flow chart of steps of the manufacture method forming hole according to the embodiment of the present invention on substrate.
Fig. 3 A is the top view with the substrate of trough according to the embodiment of the present invention.
Fig. 3 B has according to the embodiment of the present invention top view that protective layer is covered in the substrate on trough.
Fig. 4 is for carrying out the configuration diagram of chemical enhanced processing procedure according to the embodiment of the present invention.
Fig. 5 A and 5B figure is the schematic diagram for an existing ion-exchange step.
Fig. 6 is for have according to the embodiment of the present invention schematic diagram that the protective layer substrate be covered on trough carries out ion-exchange step.
Fig. 7 A is the top view with the substrate of protective layer covering trough according to the embodiment of the present invention.
Fig. 7 B is the side schematic view according to Fig. 7 A.
Fig. 8 A is the top view carrying out boring processing procedure according to the substrate of Fig. 7 A.
Fig. 8 B is the side schematic view according to Fig. 8 A.
Drawing reference numeral illustrates:
12 troughs
22 protective layers
24 holes
40a preheating Xu cold trap
40b preheating Xu cold trap
42a effect casket
42b effect casket
46 change strong stove
50 potassium ions
52 sodium ions
100 substrates
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
More than have about description of contents of the present invention, be in order to demonstrate and to explain spirit of the present invention and principle with following embodiment, and provide patent claim of the present invention further to explain.Feature for the present invention, implementation and effect, hereby coordinate and to be graphicly described in detail as follows do preferred embodiment.
Existingly carry out Drilling operation for substrate to solve, and the cost causing boring and cutting facility is too huge with complexity, and the problem of the easy fragmentation of substrate, the present invention be directed to these numerous disappearances, and propose a kind of effectively modification method.This improvement is for one can utilize the protective layer being formed with a shielding in advance on the glass substrate, is beneficial to follow-up manufacture method of carrying out boring setting.According to the embodiment of the present invention, this kind forms the manufacture method of hole on substrate, and its flow chart of steps please refer to shown in Fig. 2, comprising having: step S202, step S204, step S206 and step S208.In order to technology contents of the present invention and following explanation more preferably can be understood, see also the schematic diagram of structure shown in Fig. 3 A, Fig. 3 B, Fig. 4, Fig. 5 A, Fig. 5 B, Fig. 6, Fig. 7 A, Fig. 7 B, Fig. 8 A and Fig. 8 B, the present invention will carry out detailed being described as follows accordingly.
First, as described in step S202, first the present invention provides a substrate 100, and according to the embodiment of the present invention, the material of this substrate 100 such as can be a kind of chemically reinforced glass (ChemicalStrengthGlass) or thinning glass.Further, the setting of conveniently follow-up boring this substrate 100 is be designed with at least one trough 12, arranges for follow-up at least one hole (hole).
Afterwards, as described in step S204, the present invention continues form a protective layer (Passivationlayer) 22 on this trough 12.Wherein, the generation type of this protective layer 22 such as can pass through the mode such as evaporation or sputter and is formed on this trough 12; Fig. 3 A and Fig. 3 B is the top view disclosing one embodiment of the invention; top view can obviously be found out thus; protective layer 22 is successfully covered on the trough 12 of substrate 100, using the use as a shielding.
Afterwards, as shown in step S206, the substrate 100 that the present invention is then coated with protective layer 22 protection for this carries out a chemical enhanced program, the configuration diagram of its processing procedure, refers to shown in graphic Fig. 4.As shown in the figure, two preheatings Xu cold trap 40a, 40b are connected with effect casket (cassette) 42a, 42b separately, and preheating Xu cold trap 40a is more connected to the strong stove 46 of a change, with via the strong stove 46 of change the energy that provides carry out chemical enhanced.Specifically, according to the embodiment of the present invention, when carrying out chemical enhanced processing procedure for substrate, it immerses in a potassium nitrate solution by the substrate of required use, and under a hot environment, such as, between 400 DEG C ~ 500 DEG C, preferably is 440 DEG C ~ 480 DEG C, utilizes the mode of ion-exchange to carry out chemical enhanced.Please refer to shown in graphic Fig. 5 A and Fig. 5 B, it discloses the schematic diagram of an existing ion-exchange step, graphicly can obviously to find out for two thus, after substrate immerses potassium nitrate solution, because saltpetre is under high temperature process, ion-exchange can be carried out via potassium ion 50 and sodium ion 52, and form stressor layers by this.Therefore; as shown in graphic Fig. 6; the main purpose of the present invention; be be in advance on substrate 100 for boring is set position (i.e. trough 12) on be coated with protective layer 22; utilize protective layer 22 as a shielding, avoid by this substrate 100 carries out ion-exchange for the position (i.e. trough 12) arranging boring and forms stressor layers.In other words; according to the embodiment of the present invention; when adopting said method; the stressor layers then formed because of ion-exchange; its only can be formed not there is this protective layer 22 covering on the substrate 100 region on; as for, the region (i.e. trough 12) of matcoveredn 22 shielding, namely can not have the generation of stressor layers.
Edge this, form effect of stressor layers to reach as mentioned above shielding ion-exchange, the material of protective layer 22 used herein namely need through the kind design added with select.For example, in order to the ion-exchange of barrier major part (not only saltpetre type), then the material of protective layer 22 should elect a kind of material of resistance to acid as, and it preferably, such as can be the metal of resistance to acid, alloy or plastics, such as: can the material of anti-saltpetre; More preferably, then the etching solution such as copper or aluminium is chosen as.
Therefore; look into shown in Fig. 7 A and Fig. 7 B; when on substrate 100 used herein, success is coated with described protective layer 22 in advance; so; if graphic Fig. 1 is shownschematically as described in step S208; then the present invention directly can carry out a boring processing procedure (as shown in the direction of arrow in Fig. 8 A and Fig. 8 B), successfully to produce at least one hole 24 on the substrate 100 on the trough 12 with this protective layer 22 shielding.According to the embodiment of the present invention; owing to utilizing the manufacture method disclosed by the present invention; it is pre-formed matcoveredn as shielding on substrate; effectively can stop the formation of chemical enhanced middle stressor layers; therefore deposit in case what there is no a stressor layers, general boring processing procedure mode directly can be used to carry out the manufacture of follow-up boring for the trough of substrate.So, according to other embodiments of the present invention, then certainly also can the mode such as choice for use ultrasound (ultrasonic) to carry out cut to substrate and to grind, form boring by this.On the whole, above for embodiment be only technological thought and means used that the present invention is described, the content that its object enables the personage of this area understand the present invention is also implemented according to this, when can not with the scope of the claims of restriction the present invention, the skill personage haveing the knack of this area, from change or the modification that can make an equalization according to disclosed embodiment, so must be encompassed in the scope of the claims of the present invention.
Be with; in sum; one disclosed by the present invention forms the manufacture method of hole on substrate; it is through the mode be combined with existing processing procedure; utilize and be pre-formed matcoveredn on substrate; successfully reach reduction to commonly see the object of expensive cost of boring processing procedure, it also avoid substrate of commonly seeing simultaneously and easily produce fragmentation or prolong the probability problem such as split and occur.In other words, the present invention is in conjunction with existing processing procedure, need not additionally increase Making programme and man-hour, more need not increase on extra board equipment, successfully reaches the effect effectively forming boring on substrate.Compared to prior art, the method that the present invention is disclosed, obviously there is preferably cost benefit and capacity efficiency, there is splendid industry development in fact with wide in the potentiality of development, not only effectively can realize the benefit that the present invention saves commonly see consumptive material and making board cost etc., more successfully solve the generation that existing substrate fragmentation easily occurs or prolongs problems such as splitting.
On the other hand, one disclosed by the present invention forms the manufacture method of hole on substrate, outside it not only can be applied for the field of the glass substrates such as existing chemically reinforced glass, thinning glass or contact panel product, more have for other product needing to carry out special external form processing, the disclosed engineering method of the present invention all can be utilized to carry out it.In other words, the present invention can the category of application, obviously grows up significantly and expand compared to prior art, will with higher industrial applicability and development potentiality.Therefore, method disclosed by the present invention provides a kind of innovation and technique means not seen before really, the object of obvious the present invention and effect are obviously better than prior art, and the disclosed technical characteristic of the present invention, Method means and effect of reaching are different from current programme significantly, reality is non-can not complete person easily for being familiar with this operator, therefore has patent requirement.
The many embodiments of the above are only technological thought and feature that the present invention is described, the content that its object enables the person skilled in the art understand the present invention is also implemented according to this, when can not with the scope of the claims of restriction the present invention, namely the equalization generally done according to disclosed spirit changes or modifies, and must be encompassed in the scope of the claims of the present invention.
Claims (11)
1. on substrate, form a manufacture method for hole, it is characterized in that, comprising:
One substrate is provided, and this substrate has at least one trough, arrange for follow-up at least one hole;
This trough is formed a protective layer;
Carry out chemical enhanced to this substrate; And
This trough with this protective layer is carried out a boring processing procedure, to produce this at least one hole on the substrate.
2. the manufacture method forming hole on substrate as claimed in claim 1, it is characterized in that, this substrate is a chemically reinforced glass or thinning glass.
3. the manufacture method forming hole on substrate as claimed in claim 1, it is characterized in that, this protective layer is formed on this trough with evaporation or sputtering way.
4. the manufacture method forming hole on substrate as claimed in claim 1, it is characterized in that, this protective layer is the material that can be resistance to acid.
5. the manufacture method forming hole on substrate as claimed in claim 1; it is characterized in that; carrying out more comprising in chemical enhanced step to this substrate utilizing an ion-exchange method, form a stressor layers with the region on the substrate without this protective layer covering.
6. the manufacture method forming hole on substrate as claimed in claim 5, it is characterized in that, this ion-exchange method comprises this substrate to immerse in a potassium nitrate solution.
7. the manufacture method forming hole on substrate as claimed in claim 6, it is characterized in that, the step this substrate being immersed this potassium nitrate solution is carried out under a hot environment, forms this stressor layers to utilize ion-exchange.
8. the manufacture method forming hole on substrate as claimed in claim 6, is characterized in that, the material of this protective layer can be the metal of resistance to acid, alloy or plastics.
9. the manufacture method forming hole on substrate as claimed in claim 8, is characterized in that, the material of this protective layer is for can the material of anti-saltpetre.
10. the manufacture method forming hole on substrate as claimed in claim 9, it is characterized in that, the material of this protective layer can be copper or aluminium.
11. manufacture method forming hole on substrate as claimed in claim 1, is characterized in that, this boring processing procedure more comprises through a ultrasound to carry out cutting to this substrate and to grind.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510710361.XA CN105293940A (en) | 2015-10-27 | 2015-10-27 | Manufacturing method for forming holes in base plate |
| TW104136607A TWI587949B (en) | 2015-10-27 | 2015-11-06 | A method of manufacturing a hole on a substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510710361.XA CN105293940A (en) | 2015-10-27 | 2015-10-27 | Manufacturing method for forming holes in base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105293940A true CN105293940A (en) | 2016-02-03 |
Family
ID=55191880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510710361.XA Pending CN105293940A (en) | 2015-10-27 | 2015-10-27 | Manufacturing method for forming holes in base plate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105293940A (en) |
| TW (1) | TWI587949B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110035982A (en) * | 2016-11-30 | 2019-07-19 | 康宁股份有限公司 | The system and method that ion exchange is carried out to glassware |
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| US20050150253A1 (en) * | 2004-01-12 | 2005-07-14 | Asia Optical Co., Inc. | Method and the device for making high precision coating of insert for glass molding |
| CN202968381U (en) * | 2012-12-06 | 2013-06-05 | 芜湖东旭光电科技有限公司 | Cooling device applied to formation of liquid crystal glass base plate |
| CN103336643A (en) * | 2013-06-19 | 2013-10-02 | 业成光电（深圳）有限公司 | Touch panel |
| CN104445901A (en) * | 2014-11-28 | 2015-03-25 | 业成光电（深圳）有限公司 | Cutting method for forming cutting channel protection on base plate and surface plate structure of base plate |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03168641A (en) * | 1989-11-28 | 1991-07-22 | Fujitsu Ltd | Photomask |
| TWI251913B (en) * | 2004-10-27 | 2006-03-21 | Phoenix Prec Technology Corp | Fabrication method for semiconductor package structure |
| US20060229004A1 (en) * | 2005-04-11 | 2006-10-12 | Kazumasa Ohnishi | Cutting or grinding machine |
| KR20150120939A (en) * | 2012-11-29 | 2015-10-28 | 코닝 인코포레이티드 | Sacrificial cover layers for laser drilling substrates and methods thereof |
| CN103048270B (en) * | 2012-12-20 | 2015-04-08 | 武汉理工大学 | Method for preparing high-sensitivity probe of fiber Bragg grating hydrogen sensor |
| CN103033860A (en) * | 2012-12-29 | 2013-04-10 | 西南大学 | Method for making square aperture plane micro-lens array with high filling coefficient |
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2015
- 2015-10-27 CN CN201510710361.XA patent/CN105293940A/en active Pending
- 2015-11-06 TW TW104136607A patent/TWI587949B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050150253A1 (en) * | 2004-01-12 | 2005-07-14 | Asia Optical Co., Inc. | Method and the device for making high precision coating of insert for glass molding |
| CN202968381U (en) * | 2012-12-06 | 2013-06-05 | 芜湖东旭光电科技有限公司 | Cooling device applied to formation of liquid crystal glass base plate |
| CN103336643A (en) * | 2013-06-19 | 2013-10-02 | 业成光电（深圳）有限公司 | Touch panel |
| CN104445901A (en) * | 2014-11-28 | 2015-03-25 | 业成光电（深圳）有限公司 | Cutting method for forming cutting channel protection on base plate and surface plate structure of base plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110035982A (en) * | 2016-11-30 | 2019-07-19 | 康宁股份有限公司 | The system and method that ion exchange is carried out to glassware |
| CN110035982B (en) * | 2016-11-30 | 2022-07-08 | 康宁股份有限公司 | System and method for ion exchanging glass articles |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI587949B (en) | 2017-06-21 |
| TW201714687A (en) | 2017-05-01 |
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