CN105283975B - 用于离子装置的磁铁以及离子装置 - Google Patents

用于离子装置的磁铁以及离子装置 Download PDF

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Publication number
CN105283975B
CN105283975B CN201480033457.0A CN201480033457A CN105283975B CN 105283975 B CN105283975 B CN 105283975B CN 201480033457 A CN201480033457 A CN 201480033457A CN 105283975 B CN105283975 B CN 105283975B
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China
Prior art keywords
coolant fluid
magnet
annular
core element
ion
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CN201480033457.0A
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English (en)
Chinese (zh)
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CN105283975A (zh
Inventor
斯卡特·巴洛克拉夫
詹姆士·S·贝福
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Varian Semiconductor Equipment Associates Inc
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Varian Semiconductor Equipment Associates Inc
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002—Details
    • H01J37/3007—Electron or ion-optical systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/06—Electromagnets; Actuators including electromagnets
    • H01F7/20—Electromagnets; Actuators including electromagnets without armatures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
    • H01J37/1472—Deflecting along given lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
    • H01J37/1472—Deflecting along given lines
    • H01J37/1474—Scanning means
    • H01J37/1475—Scanning means magnetic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/10—Liquid cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15—Means for deflecting or directing discharge
    • H01J2237/152—Magnetic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15—Means for deflecting or directing discharge
    • H01J2237/152—Magnetic means
    • H01J2237/1526—For X-Y scanning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/303—Electron or ion optical systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31701—Ion implantation

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Accelerators (AREA)
  • Physical Vapour Deposition (AREA)
  • Hall/Mr Elements (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
CN201480033457.0A 2013-06-14 2014-06-13 用于离子装置的磁铁以及离子装置 Active CN105283975B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361835089P 2013-06-14 2013-06-14
US61/835,089 2013-06-14
US13/966,611 US9177708B2 (en) 2013-06-14 2013-08-14 Annular cooling fluid passage for magnets
US13/966,611 2013-08-14
PCT/US2014/042321 WO2014201363A1 (en) 2013-06-14 2014-06-13 Annular cooling fluid passage for magnets

Publications (2)

Publication Number Publication Date
CN105283975A CN105283975A (zh) 2016-01-27
CN105283975B true CN105283975B (zh) 2018-05-04

Family

ID=52018423

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480033457.0A Active CN105283975B (zh) 2013-06-14 2014-06-13 用于离子装置的磁铁以及离子装置

Country Status (6)

Country Link
US (2) US9177708B2 (https=)
JP (1) JP6429407B2 (https=)
KR (1) KR102161231B1 (https=)
CN (1) CN105283975B (https=)
TW (1) TWI624856B (https=)
WO (1) WO2014201363A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9177708B2 (en) * 2013-06-14 2015-11-03 Varian Semiconductor Equipment Associates, Inc. Annular cooling fluid passage for magnets
US10486232B2 (en) * 2015-04-21 2019-11-26 Varian Semiconductor Equipment Associates, Inc. Semiconductor manufacturing device with embedded fluid conduits
KR102500059B1 (ko) 2017-11-07 2023-02-14 갈리움 엔터프라이지즈 피티와이 엘티디 매립된 활성화된 p-(Al,In)GaN 층
CN110300487A (zh) * 2019-07-12 2019-10-01 兰州科近泰基新技术有限责任公司 一种多通道冷却真空四极磁铁装置
US10971327B1 (en) * 2019-12-06 2021-04-06 Applied Materials, Inc. Cryogenic heat transfer system
CN111601449B (zh) * 2020-05-28 2023-01-10 兰州科近泰基新技术有限责任公司 真空内超大型四极透镜的制造方法
US12100541B2 (en) * 2020-09-14 2024-09-24 Intel Corporation Embedded cooling channel in magnetics
JP2024046847A (ja) * 2022-09-26 2024-04-05 株式会社ダイヘン 高電圧電気部品

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CN1813322A (zh) * 2003-06-26 2006-08-02 伊顿动力品质公司 混合空芯/磁芯电感器
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JP2007207755A (ja) * 2006-01-31 2007-08-16 Axcelis Technologies Inc 超伝導磁石を有するイオン注入機
CN101802980A (zh) * 2007-09-27 2010-08-11 瓦里安半导体设备公司 制造硅绝缘体晶圆的单晶圆植入机
CN201796681U (zh) * 2010-03-02 2011-04-13 Abb公司 电子装置的线圈结构
CN201820573U (zh) * 2010-04-26 2011-05-04 廊坊英博电气有限公司 带有冷却风道的谐波滤波电抗器
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CN1160287A (zh) * 1995-10-19 1997-09-24 易通公司 离子注入器中离子束形成的方法和装置
CN1813322A (zh) * 2003-06-26 2006-08-02 伊顿动力品质公司 混合空芯/磁芯电感器
CN1979749A (zh) * 2005-12-05 2007-06-13 北京中科信电子装备有限公司 均匀磁场平行束透镜系统
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CN201796681U (zh) * 2010-03-02 2011-04-13 Abb公司 电子装置的线圈结构
CN201820573U (zh) * 2010-04-26 2011-05-04 廊坊英博电气有限公司 带有冷却风道的谐波滤波电抗器
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Also Published As

Publication number Publication date
KR20160021204A (ko) 2016-02-24
US9177708B2 (en) 2015-11-03
US20140367583A1 (en) 2014-12-18
JP2016521913A (ja) 2016-07-25
CN105283975A (zh) 2016-01-27
KR102161231B1 (ko) 2020-10-05
TWI624856B (zh) 2018-05-21
US9852882B2 (en) 2017-12-26
JP6429407B2 (ja) 2018-11-28
US20160027610A1 (en) 2016-01-28
WO2014201363A1 (en) 2014-12-18
TW201506979A (zh) 2015-02-16

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