CN105278712A - Covering plate and manufacturing method thereof - Google Patents
Covering plate and manufacturing method thereof Download PDFInfo
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- CN105278712A CN105278712A CN201410329521.1A CN201410329521A CN105278712A CN 105278712 A CN105278712 A CN 105278712A CN 201410329521 A CN201410329521 A CN 201410329521A CN 105278712 A CN105278712 A CN 105278712A
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- sidewall
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- mother substrate
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 194
- 238000005728 strengthening Methods 0.000 claims abstract description 75
- 238000000034 method Methods 0.000 claims description 56
- 238000005530 etching Methods 0.000 claims description 51
- 238000005034 decoration Methods 0.000 claims description 43
- 239000007787 solid Substances 0.000 claims description 34
- 238000000227 grinding Methods 0.000 claims description 30
- 238000005498 polishing Methods 0.000 claims description 30
- 239000012528 membrane Substances 0.000 claims description 16
- 230000015572 biosynthetic process Effects 0.000 claims description 10
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- 239000002689 soil Substances 0.000 claims description 6
- 208000002173 dizziness Diseases 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 4
- 238000007688 edging Methods 0.000 claims description 4
- 238000001459 lithography Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 abstract description 68
- 238000005520 cutting process Methods 0.000 abstract description 9
- 239000011521 glass Substances 0.000 description 23
- 239000000463 material Substances 0.000 description 18
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical compound [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 description 13
- 230000006870 function Effects 0.000 description 12
- 229910001414 potassium ion Inorganic materials 0.000 description 12
- 239000010408 film Substances 0.000 description 10
- 238000000059 patterning Methods 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 230000001458 anti-acid effect Effects 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 230000012447 hatching Effects 0.000 description 5
- 239000012788 optical film Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000005361 soda-lime glass Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000005368 silicate glass Substances 0.000 description 3
- 239000005341 toughened glass Substances 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- HVBSAKJJOYLTQU-UHFFFAOYSA-N 4-aminobenzenesulfonic acid Chemical compound NC1=CC=C(S(O)(=O)=O)C=C1 HVBSAKJJOYLTQU-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 2
- 230000006399 behavior Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229960000443 hydrochloric acid Drugs 0.000 description 2
- 235000011167 hydrochloric acid Nutrition 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 240000001439 Opuntia Species 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000008485 antagonism Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
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- -1 hydrofluorite Chemical compound 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
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- 238000012163 sequencing technique Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229950000244 sulfanilic acid Drugs 0.000 description 1
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Abstract
The invention provides a covering plate and a manufacturing method thereof. A plurality of concave holes are formed on a mother substrate. The surface of the concave hole is subjected to first strengthening treatment, so that an ion strengthening layer is formed on the surface of the concave hole. And cutting the mother substrate into a plurality of unit substrates corresponding to the unit regions, wherein each concave hole is positioned in one of the unit substrates, and the concentration of the strengthening ions of the ion strengthening layer on the surface of each concave hole is greater than that of the strengthening ions of one side wall of each unit substrate.
Description
Technical field
The invention relates to a kind of overlay and its manufacture method, and relate to a kind of overlay of being made by mother substrate and its manufacture method especially.
Background technology
Along with the continuous evolution of science and technology, electronic installation is thinning increasingly, therefore, is generally strengthening substrate, such as overlay at the outermost glass substrate of electronic installation.Overlay needs to have specific mechanism design sometimes, such as shrinkage pool, and shrinkage pool is such as perforation or blind hole.But, when strengthening substrate forms this kind of shrinkage pool, probably make the physical strength of the overlay of electronic installation weaken.
Summary of the invention
The invention provides a kind of overlay and its manufacture method, overlay has desirable physical strength, can the physical strength of efficient hardening glass substrate.
The manufacture method of overlay of the present invention, comprises the following steps.A mother substrate is formed multiple shrinkage pool and corresponding dimpled surface.One first intensive treatment is carried out to the dimpled surface of shrinkage pool, to make dimpled surface to be formed with an ion strengthening layer.Corresponding to cellular zone, mother substrate is cut into multiple cell substrate.Each cell substrate is formed with a cell, and each shrinkage pool is positioned at one of them cell substrate, one first strengthening ion concentration of its intermediate ion strengthening layer is greater than one second strengthening ion concentration of a sidewall of each cell substrate.
The manufacture method of overlay of the present invention, the first intensive treatment optionally comprises following several step.One ion strengthening step, carries out chemical ion exchanger on the surface of mother substrate or dimpled surface, to form an ion strengthening layer.Before this ion strengthening layer of formation, carry out an etching step with an etching solution, be formed with an etched surfaces to make dimpled surface.Carry out a grinding and polishing step before etching step or after etching step, make the surfaceness of dimpled surface reduce or the surfaceness of etched surfaces is reduced.Make the surface of this mother substrate form another etched surfaces with etching step, and also can comprise in grinding and polishing step grinding and polishing is carried out to the surface of this mother substrate, reduce to make the surfaceness of the etched surfaces of mother substrate.
The manufacture method of overlay of the present invention, comprises the following steps.After mother substrate is cut into multiple cell substrate, one second intensive treatment is carried out to each cell substrate.Second intensive treatment comprises carries out an etching step with an etching solution, is formed with an etched surfaces to make the sidewall of each cell substrate.Second intensive treatment also can comprise carries out a grinding and polishing (polish) step, and the surfaceness of this sidewall is reduced.
The manufacture method of overlay of the present invention, comprises the following steps.Multiple cellular zones of mother substrate form multiple cell, and method comprises application step, deposition step, print steps, lithography step or above-mentioned combination, and wherein cell can be touch control component, display element or both integrated elements.And selectivity is after this etching step, the sidewall of each cell substrate is formed a solid gum (solidglue), and edging moulding (grindandshapethesolidglue) is carried out to this solid gum, make the profile of solid gum meet design requirement.
The manufacture method of overlay of the present invention, comprises the following steps.After mother substrate is cut into multiple cell substrate, also comprise and carry out a lead angle step, make the profile of unit substrate sidewall have C type lead angle or R angle.
The manufacture method of overlay of the present invention, comprises the following steps.Optionally form a decoration element in unit substrate, if unit substrate is provided with cell, then this decoration element is formed on each cell.This decoration element can be the decorative layer of patterning, is arranged on cell substrate or the periphery of cell with the circuit trace of shaded portions.
The manufacture method of overlay of the present invention, covers decorative layer outside the surrounding's formation one being also included in unit substrate, and covers the local that decorative layer covers this sidewall outward.
In an embodiment of the present invention, before mother substrate is cut into cell substrate, corresponding at least one shrinkage pool is produced to each cell substrate, and the first intensive treatment is carried out to mother substrate.First intensive treatment also comprises carries out an etching step, with the surface and the dimpled surface that make an etching solution (such as hydrofluoric acid containing solution) contact mother substrate, carry out an ion strengthening step afterwards, to form an ion strengthening layer on the surface of mother substrate or dimpled surface.After mother substrate is cut into cell substrate, also one second intensive treatment is carried out to each cell substrate.Second intensive treatment comprises an etching step, to make the sidewall of an etching solution (such as hydrofluoric acid containing solution) osculating element substrate.Second intensive treatment comprises selectivity before carrying out etching step or carry out a grinding and polishing step afterwards, and the surfaceness of sidewall is reduced.First intensive treatment also comprises selectivity and carry out a grinding and polishing (polish) step to this dimpled surface before carrying out etching step or afterwards.
In an embodiment of the present invention, above-mentioned sidewall is also arranged a solid gum to be covered to the sidewall of small part.
In an embodiment of the present invention, the method for above-mentioned forming element unit comprises application step, deposition step, print steps, lithography step or above-mentioned combination.
In an embodiment of the present invention, above-mentioned mother substrate is cut into cell substrate after, also comprise and carry out a lead angle step, make the profile of sidewall have C type lead angle or R angle.
In an embodiment of the present invention, also around each cell substrate, cover decorative layer outside formation one, and cover the local that decorative layer covers sidewall outward.Such as, when being provided with solid gum on the sidewall of cell substrate, solid gum is considered as being the extension of sidewall, covers the local that decorative layer covers this solid gum now outward.When not being provided with solid gum, the local that decorative layer covers etched surfaces is covered outward when such as there is again etched surfaces on the sidewall of cell substrate.When even there is etched surfaces on the sidewall of cell substrate and have the etched surfaces of solid gum cover part, cover the local that decorative layer covers this solid gum outward.
In an embodiment of the present invention, also on each cell substrate, form a functional membrane, and functional membrane and cell are positioned at the relative both sides of cell substrate, this functional membrane have antireflection, anti-soil, anti-dizzy, water-proof function at least one of them.Functional membrane can be the optical film of individual layer or the optical film of multilayer is stacking to be formed, and is not limited.
In the manufacture method of the contact panel of one embodiment of the invention, after mother substrate cuts into cell substrate, also carry out a thinning step with each cell substrate of thinning.Such as an etching step and a grinding and polishing step are carried out to cell substrate surface.
A kind of overlay of the present invention, comprises a cell substrate.Cell substrate comprises a sidewall, a first surface, a second surface and at least one shrinkage pool.Sidewall is connected between first surface and second surface, and side wall ring is around first surface and second surface.Shrinkage pool has a dimpled surface, and wherein dimpled surface is formed with an ion strengthening layer.The strengthening ion concentration of ion strengthening layer is greater than the strengthening ion concentration of sidewall.
A kind of overlay of the present invention, comprise a cell, on the first surface, wherein cell can provide one of them kind of touch-control or Presentation Function, and namely cell can be wherein a kind of or both integrated elements of touch control component or display element in configuration.In addition, a decoration element also can selectivity be arranged on cell substrate or cell.Further illustrate, when decoration element is arranged on cell substrate, decoration element can be arranged between cell and cell substrate; Or cell can be arranged on another substrate, it is bonded to each other that this substrate gives cell substrate again.This decoration element can be the decorative layer of patterning, is arranged on cell substrate or at least part of region of the periphery of cell with the circuit trace of shaded portions.The decorative layer of patterning can be photosensitive material (such as photoresistance) or ink material.The decorative layer of patterning can be the previous materials of individual layer or the previous materials of multilayer is stacking to be formed, and color is not limited, can arbitrary monochromatic material also can the previous materials of multiple color stacking or mixed.
In an embodiment of the present invention, said units substrate sidewall or dimpled surface at least one of them has the contiguous nick face (micro-concave) of multiple continuous phase.Preferably, preset in unit area at one of cell substrate sidewall or dimpled surface, at least account for the nick face of 70% quantity, the size in its each nick face is to 150 microns (μm) between 2 microns (μm).Such as one erose nick face, under microscope is visual, get diagonal straight line work as from the side of nick facial contour to the maximal value of opposite side or near maximum value, as long as can count in the scope meeting 2 microns (μm) to 150 microns (μm).More preferably, the size in nick face is between 10 μm to 40 μm.Size when nick face drops on above-mentioned interval, the meaning of representative is that etching solution exactly removes major part or whole the degree of depth of cutting the little slight crack caused well to the etch depth of glass, do not have over etching, it is good selection that such as etch depth controls between 5 μm to 50 μm.
In an embodiment of the present invention, above-mentioned overlay also comprises a solid gum, is arranged on the sidewall of cell substrate, now sidewall can as aforementioned be further there is an etched surfaces or there is a polished surface.
In an embodiment of the present invention, the profile of said units substrate sidewall has C type lead angle or R angle.Similarly, now sidewall further can have an etched surfaces or have a polished surface.
In an embodiment of the present invention, above-mentioned overlay covers decorative layer outside also comprising one, is arranged on around cell substrate, and covers the local that decorative layer covers sidewall outward.The profile of the sidewall of such as cell substrate has C type lead angle or R angle, and is provided with solid gum on this sidewall, and now solid gum is considered as being the extension of sidewall, can cover the local of this solid gum because covering decorative layer in addition.Again such as when the profile of the sidewall of cell substrate has C type lead angle or R angle, and on this sidewall, there is etched surfaces, cover the local that decorative layer covers etched surfaces outward.Moreover, the sidewall of cell substrate also can have etched surfaces and have the etched surfaces of solid gum cover part, covering the local that decorative layer covers this solid gum now outward.
In an embodiment of the present invention, above-mentioned overlay also comprises a functional membrane, and configuration on a second surface.Functional membrane can such as have antireflection, anti-soil, anti-dizzy, water-proof function at least one of them.Functional membrane can be the optical film of individual layer or the optical film of multilayer is stacking to be formed, and do not limited, the functional membrane such as possessing anti-reflection function can be form by the optical film of multilayer different refractivity is stacking.
Based on above-mentioned, in the overlay of the embodiment of the present invention and its manufacture method, the dimpled surface of overlay strengthened to form an ion strengthening layer, even before formation one ion strengthening layer, first can also carry out intensive treatment with etching solution to dimpled surface.Therefore, overlay out made by the manufacture method of the embodiment of the present invention or the overlay with touch-control/Presentation Function can have desirable physical strength.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate accompanying drawing to be described in detail below.
Accompanying drawing explanation
Fig. 1 is the Making programme figure of the face equipment of one embodiment of the invention;
Fig. 2 A is depicted as the schematic top plan view that one embodiment of the invention carries out step 10;
Fig. 2 B is the diagrammatic cross-section of Fig. 2 A Vertical Centre Line I-I ';
Fig. 3 A and Fig. 3 B is the schematic diagram of the step 20 of another embodiment of the present invention;
Fig. 3 C directly carries out the cross-sectional schematic of the mother substrate of ion strengthening step after being the processing of shrinkage pool;
Fig. 4 A is the schematic top plan view of the mother substrate after one embodiment of the invention carry out step 30;
Fig. 4 B is the hatching line II-II of Fig. 4 A " diagrammatic cross-section;
Fig. 4 C is the diagrammatic cross-section of Fig. 4 A Vertical Centre Line III-III ';
Fig. 5 A is in the manufacture method of one embodiment of the invention, the schematic top plan view of the cell substrate after carry out step 40;
Fig. 5 B is the diagrammatic cross-section of the hatching line IV-IV ' of Fig. 5 A;
Fig. 6 is in the manufacture method of one embodiment of the invention, the partial cutaway schematic of the cell substrate after carry out step 50;
Fig. 7 is the partial cutaway schematic of the face equipment of one embodiment of the invention;
Fig. 8 and Fig. 9 is the schematic diagram of multiple touch control component;
Figure 10 is the partial cutaway schematic of the face equipment of another embodiment of the present invention;
Figure 11 to Figure 13 is depicted as the partial cutaway schematic of the face equipment of other embodiments of the invention;
Figure 14 is the Making programme figure of the face equipment of another embodiment of the present invention.
Description of reference numerals:
1 ~ 5: face equipment;
10 ~ 90: step;
100: mother substrate;
102,102 ': first surface;
102A, 104A, 112A: ion strengthening layer;
104,104 ': second surface;
110: shrinkage pool;
112,112 ': dimpled surface;
120: cell substrate;
122,122 ', 122A, 122B: sidewall;
124: clear area;
302: opening;
310: decoration element;
320,320A, 320B: cell;
322,324: conduction tandem;
400: cover decorative layer outward;
410: functional membrane;
600: solid gum;
D: distance;
D1: first direction;
D2: second direction;
F: region;
G: nick face;
I-I ', II-II ', III-III ', IV-IV ': hatching line;
M: alignment mark;
S3: strip shaped electric poles;
S4: rectangular electrode;
S5: comb electrode;
W1, W2: size.
Embodiment
Fig. 1 is the Making programme figure of the face equipment of one embodiment of the invention, and the manufacture method of the present embodiment comprises the step 10 shown in Fig. 1 to step 50.Step 10 is on mother substrate, form multiple shrinkage pool, and wherein mother substrate can be the hard substrate of glass substrate one class.For example, the material of mother substrate can be soda-lime glass (soda-limeglass), boron glass (boro-silicateglass), aluminum silicate glass (alumo-silicateglass) etc.In addition, the generation type of shrinkage pool mainly adopts machining mode to realize.
After mother substrate completes shrinkage pool, the present embodiment carries out step 20 pair mother substrate further and carries out the first intensive treatment.This step not only can be strengthened the original surface of mother substrate, can also strengthen dimpled surface.Thus, device out made by mother substrate can have desirable physical strength.First intensive treatment can be one of them kind of etching step, grinding and polishing step, ion strengthening step three, and the sequencing of etching step and grinding and polishing step can exchange.Such as, carry out etching step again after first grinding and polishing step, and ion strengthening step is placed in finally usually.Then, in step 30, the alternative mother substrate crossed in intensive treatment makes required cell, then carries out step 40 mother substrate will be cut into multiple independently cell substrate corresponding to cell.Now, the blank of face equipment roughly completes.Afterwards, in order to promote the physical strength of face equipment further, step 50 can be carried out further to carry out the second intensive treatment to independently cell substrate.Fig. 2 A is depicted as the schematic top plan view that one embodiment of the invention carries out step 10, please refer to Fig. 2 A, and the step of step 10 is on mother substrate 100, form multiple shrinkage pool 110, and wherein shrinkage pool 110 can be the structures such as perforation, groove, and is described with perforation herein.Now, in order to provide the reference point of contraposition in successive process, can form at least one alignment mark M on mother substrate 100, wherein the quantity of shrinkage pool 110 and alignment mark N, profile, size are only the use illustrated with position, and are not used to restriction the present invention.Fig. 2 B is the diagrammatic cross-section of Fig. 2 A Vertical Centre Line I-I ', and from Fig. 2 B, mother substrate 100 has first surface 102, second surface 104 and defines the dimpled surface 112 of shrinkage pool 110 after being formed with shrinkage pool 110.Because shrinkage pool 110 is the structures be made via machining, the surface of dimpled surface 112 is quite coarse.Such rough surface often causes the generation of stress concentration phenomenon, therefore mother substrate 100 breakage or crackedly may to be occurred by dimpled surface 112.
In order to improve the contingent stress concentration phenomenon of dimpled surface 112, the step 20 disclosed by Fig. 1 can be carried out.According to the step of Fig. 2, after completing the processing of shrinkage pool 110, the first intensive treatment can be that one of them of carrying out the steps such as etching step, grinding and polishing step, ion strengthening step is planted.Such as only carry out ion strengthening step, or first carrying out etching step carries out ion strengthening step again, or first carrying out grinding and polishing step carries out ion strengthening step again, also can be sequentially carry out etching step, grinding and polishing step, ion strengthening step, the selection of above-mentioned steps not be limited in the present invention with combination.
Fig. 3 A and Fig. 3 B is the schematic diagram of the step 20 of another embodiment of the present invention, Fig. 3 A is expressed as the diagrammatic cross-section of the mother substrate 100 after the etching step carrying out the first intensive treatment, wherein first surface 102 ', via after the contact of etching solution, all some is etched (removing) second surface 104 ' with dimpled surface 112 ', etching mode such as dry ecthing or wet etching mode.For example, dry ecthing medium such as can be fluoro-gas or plasma, wet etching medium such as can be the solution of hydrofluoric acid containing (HF) or fluorine-containing solution, wherein fluorine-containing solution can comprise sulfanilic acid (sulfamicacid), ammonium persulfate (ammoniumpersulfate), non-ionic surfactant (nonionicsurfactant), hydrochloric acid (hydrochloricacid), acetic acid, surfactant, deionized water (DIwater), nitric acid, villiaumite, fluorine compounds, hydrofluorite, sulfuric acid, the at least one such as phosphoric acid or multiple above-mentioned composition are arranged in pairs or groups mutually.Therefore, first surface 102 ', second surface 104 ' have many nick face G with the surface structure of dimpled surface 112 ' and form etched surfaces.The object etched dimpled surface 112 ' is to remove cutting the little slight crack caused the function reaching tempered glass surface, improving the ability of glass counter-bending (bending).The function of thinning thickness of glass then can be reached in passing to first surface 102 ' and the etching of second surface 104 '.Preferably, presetting at one of cell substrate sidewall or dimpled surface the size that (such as 0.09mm2) in unit area at least account for the nick face G of 70% quantity is to 150 microns (μm) between 2 microns (μm), more preferably, the size in nick face is between 10 μm to 40 μm.
Then, first surface 102 ' and the second surface 104 ' of the mother substrate 100 after etch processes can carry out grinding and polishing, with by smooth to first surface 102 ' and second surface 104 ' grinding and polishing, dimpled surface 112 ' then optionally carries out grinding and polishing according to need, but not as limit.In other embodiments, first intensive treatment also can directly be carried out grinding and polishing at dimpled surface 112 ' and not need etching, also can remove cutting the little slight crack (crack) caused or reduce the function reaching tempered glass surface, the resistant to bending ability of glass can be improved equally.
Then, mother substrate 100 after grinding and polishing or etch processes can carry out ion strengthening step to form section as shown in Figure 3 B, and the ion in its intermediate ion strengthening layer 102A, 104A and 112A is all enter towards mother substrate 100 internal divergence by through grinding and polishing or the surface after etching.Now, the ion diffusing into mother substrate 100 improves the compressive stress (compressivestress) of dimpled surface 112', also therefore improves the intensity of dimpled surface 112'.
Fig. 3 A and Fig. 3 B represent the first intensive treatment be comprise etch, embodiment that grinding and polishing performs together with at least two kinds that ion strengthens these steps.Also can directly carry out ion after but completing the processing of the shrinkage pool 110 of Fig. 2 A and Fig. 2 B in other examples and strengthen step.That is, Fig. 3 A etching step or grinding and polishing step is alternative abridged.Fig. 3 C directly carries out the cross-sectional schematic of the mother substrate of ion strengthening step after being the processing of shrinkage pool.In fig. 3 c, namely mother substrate 100 carries out ion strengthening step after completing shrinkage pool 110 and processing, and therefore first surface 102, second surface 104 are formed with ion strengthening layer 102A, 104A and 112A separately with dimpled surface 112.At this, dimpled surface 112' is more coarse relative to the dimpled surface 112' of Fig. 3 B, but due to the existence of ion strengthening layer 112A, and dimpled surface 112' is not easy cracked or breakage and makes mother substrate 100 have desired mechanical strength.
In the embodiment of the present invention, the ion strengthening step of so-called mother substrate the mother substrate 100 being formed with shrinkage pool 110 is immersed in the ion being equipped with ion forced fluid to strengthen in groove.Such as: when the material of mother substrate 100 is above-mentioned soda-lime glass (soda-limeglass), ion forced fluid is such as potassium nitrate solution.The potassium ion that ionic radius is larger internally can be spread by the surface of mother substrate 100, in order to replace the part sodion in mother substrate 100.Therefore, ion strengthening layer 102A, 104A, 112A are more fine and close compared to the original material of mother substrate 100, can provide the compressive stress that glass surface is higher, the physical strength on effective tempered glass surface.
In this article, the degree of depth of ion strengthening layer refers to that potassium ion diffuses into the mean depth of inside glass from glass surface, and preferably defines and refer to when the full surface of glass marks off multiple region, the mean value of potassium ion maximum diffusion depth in that region.Whether the degree of depth of ion strengthening layer generally can detect potassium ion by instrument exists and learns.Even if due under same processing procedure, the ion diffuse degree of depth may have deep mixed situation to be existed, the standard therefore will the mean value of diffusion depth being taked as the degree of depth of judgement ion strengthening layer herein.
That is, in one embodiment, the degree of depth of ion strengthening layer may be defined as and measure the concentration of potassium ion (K+) to obtain degree of depth during corresponding concentration by glass surface towards inside on multiple gauge point, and these are put the value that obtains of the degree of depth averaged that measures.Usually, potassium ion distribution scenario is that position, top layer is the highest, is then gradually decremented to zero or background value to inside glass.Therefore the degree of depth that each gauge point measures is essentially glass surface and distributes to potassium ion and be decremented to zero or be decremented to the distance of position of background value, the concentration of potassium ion in raw material contained when wherein background value refers to glass manufacture.
Such as, time in glass composition originally namely containing potassium ion, in its raw material, namely the concentration of potassium ion may be defined as background value.In other words, due to ion strengthening layer be exchange ion (such as potassium ion) by exchanging/mechanism such as diffusion enter the degree of depth of glass define.The CONCENTRATION DISTRIBUTION of exchange ion can slowly be reduced to zero or background value from glass baseplate surface toward center, and therefore whether ion strengthening layer exists and can detect the existence of exchange ion by instrument and learn.In addition, so-called mean depth can be the mean value of ion strengthening layer in the degree of depth of multiple gauge point here.Preferably, mean depth is that the mean value of the maximum diffusion depth of exchange ion in glass in each measurement region defined.
In fact, with a little different ion strengthening layer of ion strengthening processing procedure possibility Formation Depth, therefore by detecting the degree of depth of the ion strengthening layer of several diverse location, then its mean value can be got at this.Such as, choose 5 diverse location points on the glass substrate after strengthening, detect the diffusion depth of potassium ion with instrument, then five numerical value measured are asked on average, and represent mean depth T or the d of whole ion strengthening layer with this mean values.In addition, the ion-exchange behavior of aforementioned potassium ion displacement sodion is only illustrative and is not used to limit the present invention, and other can produce the ion-exchange behavior of the effect improving intensity, all can be applied to each embodiment of the present invention.Moreover above-mentioned glass material does not limit especially, it such as comprises the material such as soda lime glass, alumina silicate glass.
After mother substrate 100 completes above-mentioned first intensive treatment, optionally can carry out step 30 with forming element unit on mother substrate 100.The explanation of subsequent step is carried out below for the mother substrate 100 of Fig. 3 B.Fig. 4 A is the schematic top plan view of the mother substrate after one embodiment of the invention carry out step 30, Fig. 4 B is the hatching line II-II of Fig. 4 A " diagrammatic cross-section; from Fig. 4 A and Fig. 4 B; on mother substrate, 100 have multiple cellular zone R independent of each other, and are formed with multiple decoration element 310 and multiple cell 320 in the R of these cellular zones.Decoration element 310 and cell 320 are such as configured on first surface 102 ', and each decoration element 310 has frame-type pattern.The method of decoration element 310 and cell 320 comprises application step, deposition step, print steps, lithography step or above-mentioned combination.Cell 320 touch-control or Presentation Function can be provided one of them plant, namely cell 320 can be the wherein a kind of of touch control component or display element or the integrated element that both have concurrently.Specifically, the cell 320 of the present embodiment is described for capacitive touch control element, but the present invention is not as limit.In another embodiment, cell 320 can arrange (not shown) on a substrate, and this substrate is fitted on the overlay of employing the inventive method making again.Such as cell 320 (capacitive touch control element) is arranged on the colored optical filtering substrates of a display panels, then is fitted on the overlay of employing the inventive method making; Also can be that cell 320 (capacitive touch control element) is arranged on one and has on the base plate for packaging of exciting light diode display panel, then be fitted in adopt the inventive method to make overlay on; Also can be that cell 320 (capacitive touch control element) is arranged on a thin plastic cement/glass substrate (thickness is less than 0.25mm), then be fitted on the overlay of employing the inventive method making.Above are only citing, the present invention is not as limit.
The patterning decorative layer that decoration element 310 can be made up of the ink of at least one deck, resin or other light tight or light absorbents, such as be located at the surrounding of each capacitive touch control element to cover cabling, and middle body has light openings district, as shown in Figure 4 A.Therefore, although Fig. 4 B only schematically draws one deck decoration element 310, in a particular embodiment, decoration element 310 can be sandwich construction.The decorative layer of patterning can be photosensitive material (such as photoresistance) or ink material.The decorative layer of patterning can be the previous materials of individual layer or the previous materials of multilayer is stacking to be formed, and color is not limited, can arbitrary monochromatic material also can the previous materials of multiple color stacking or mixed.
In addition, Fig. 4 C is the diagrammatic cross-section of Fig. 4 A Vertical Centre Line III-III '.When making cell 320 is on mother substrate 100, because mother substrate 100 has been formed with shrinkage pool 110, decoration element 310 by the carrying out of patterning process or assisting by printing apparatus, and can be provided with the opening 302 that correspond to shrinkage pool 110.Further, consider making that tolerance is maximum 350 μm, the size W1 of shrinkage pool 110 is less than the size W2 of opening 302, and the distance d between the edge of its split shed 302 and shrinkage pool 110 can be 0 μm to 700 μm.Such as when decoration element is a photoresist layer and adopt gold-tinted micro-photographing process, the edge of opening 302 is 0 μm to 250 μm to the distance of shrinkage pool 110.Be such as ink stacked structure at least more than one deck when decoration element and adopt printing or coating process, the edge of opening 302 is 200 μm to 700 μm to the distance of shrinkage pool 110.
After cell 320 completes, can carry out step 40, correspond to these cellular zones R and mother substrate 100 is cut into multiple independently cell substrate 120.Fig. 5 A is in the manufacture method of one embodiment of the invention, the schematic top plan view of the cell substrate after carry out step 40, Fig. 5 B is the diagrammatic cross-section of the hatching line IV-IV ' of Fig. 5 A, from Fig. 5 A and Fig. 5 B, cell substrate 120 is provided with a cell 320 and a decoration element 310 on first surface 102, and cell substrate 120 has shrinkage pool 110.Simultaneously, after cell 320 and decoration element 310 complete, mother substrate 100 just cuts into cell substrate 120, and after skiving, to the sidewall 122 of cell substrate 120 major part of sidewall 122 have quite coarse surface and do not have ion strengthening layer.With the present embodiment, with reference to figure 5B, the face center region of sidewall 122 does not have ion strengthening layer, and the surface of sidewall 122 also may retain ion strengthening layer slightly near the part of cell substrate 120 upper and lower surface.
Therefore, the present embodiment then can carry out the second intensive treatment of step 50.So, as shown in Figure 6, Fig. 6 is in the manufacture method of one embodiment of the invention, the partial cutaway schematic of the cell substrate after carry out step 50, and the sidewall 122 ' of cell substrate 120 will become comparatively level and smooth, and the phenomenon that stress is concentrated not easily occurs.Wherein, in the present embodiment, the second intensive treatment comprise an etching step, a grinding and polishing step or above-mentioned both.
When carrying out the etching step of sidewall 122, first can paste antiacid film (not shown) to protect cell 320 and second surface 104 ' on cell substrate 120.When cell 320 is coated between cell substrate 120 and antiacid film, carry out etching step, wherein etching mode can carry out as the dry ecthing of the first intensive treatment or wet etching mode.Now, the surface of sidewall 122 ' forms etched surfaces, and this etched surfaces, as the magnification region F shown in earlier figures 3A, has many nick faces.In a default unit area of the sidewall 122 ' of cell substrate 120, (such as 0.09mm2) at least accounts for the size of the nick face G of 70% quantity is to 150 microns (μm) between 2 microns (μm), more preferably, the size in nick face is between 10 μm to 40 μm, and the degree of depth is approximately 6 μm to 12 μm.In addition, the average surface roughness of the sidewall 122 before sidewall etch is approximately by 1.0 μm to 3 μm, and the average surface roughness of sidewall 122 ' after etching is approximately by 0.03 μm to 0.8 μm.
In this step, the second surface 104 ' of cell substrate 120 can be selected paste antiacid film or do not paste antiacid film.When second surface 104 ' does not paste antiacid film, second surface 104 ' also can touch etchant and by thinning for the thickness of cell substrate 120.Cell substrate 120 can be thinned to one second thickness by one first thickness originally, and the second thickness is not more than 0.3mm.In addition, step 50 also can be carry out a grinding and polishing step, and the surfaceness of sidewall 122 is diminished.In other embodiments, step 50 can be carry out etching step again after first oppose side wall 122 carries out grinding and polishing step.Or step 50 can be carry out grinding and polishing step again after first oppose side wall 122 carries out etching step.
After decoration element 310 and cell 320 complete, just carry out the cutting of mother substrate 100, the border of decoration element 310 and cell 320 and the border of cell substrate 120 are separated by a distance to form a clear area 124.Therefore, as shown in Figure 7, Fig. 7 is the partial cutaway schematic of the face equipment of one embodiment of the invention, and the present embodiment can cover decorative layer 400 further with finished surface panel assembly 1 around cell substrate 120 outside formation one, and covers the local that decorative layer 400 covers sidewall 122 ' outward.Thus, the element (decoration element 310 with cover decorative layer 400 outward) that the periphery of face equipment 1 can possess decoration functions by these provides the decorative effect of needs.
At this, the vertical view of face equipment 1 as shown in Figure 5A and sectional view as shown in Figure 7, second surface 104 ' can be formed with a functional membrane 410, wherein the generation type of functional membrane 410 can be arranged with the method such as plated film mode or laminating type.One functional membrane 410 can be anti-reflecting layer, anti-soil layer, water barrier or Bewildering resistance layer etc., and can be the rete of independent function or the stacking of multiple functional film layer, and can provide antireflection, water resistant gas, anti-soil, the anti-function such as dizzy.For example, the film stack that anti-reflecting layer can be multilayer refractive index different forms, or anti-soil and anti-dizzy two-layer stacking composite bed, but not as limit.In addition, though cell substrate 120 is only provided with a shrinkage pool 110, the present invention is not as limit.In other examples, single cell substrate 120 can be provided with multiple shrinkage pool 110.When face equipment 1 is applied to electronic product, shrinkage pool 110 can as power of hearing hole, bellmouth orifice, key hole, element storage tank or other structures.In the present embodiment, owing to being provided with decoration element 310, therefore face equipment 1 can as the overlay of electronic installation, and decoration element 310 can be used to cover the component not wanting to be easily seen by the user or is used for forming specific pattern.
The explanation of each step is all only the use illustrated above, and in other embodiments, each step of Fig. 1 can have other embodiment.
For example, with the formation of the cell of step 30, please also refer to Fig. 4 A, multiple cells 320 that mother substrate 100 is formed include the complex conduction tandem 322 being parallel to first direction D1 and the complex conduction tandem 324 being parallel to second direction D2.In the present embodiment, tandem 322 of conducting electricity is interlaced and insulated from each other with conduction tandem 324.In other examples, tandem 322 of conducting electricity can be replaced by the conductive pattern of strip with conduction tandem 324.Or cell 320 can be made by simple layer conductive layer.For example, Fig. 8 and 9 is the schematic diagram of multiple touch control component.Multiple strip shaped electric poles S3 that cell 320A can go out as shown in Figure 8 formed, and wherein the width of each strip shaped electric poles S3 is reduced to the other end gradually by one end.Certainly, cell 320B also can be made up of multiple rectangular electrode S4 illustrated in fig. 9 and comb electrode S5.It is worth mentioning that, the design of above-mentioned various cell 320,320A, 320B only illustrates, and the embodiment of touch control component 320 described in non-limiting the present invention, 320A, 320B.
In addition, cell 320,320A, 320B also can also include many wires directly not illustrating out or the sensory pattern, bonding pad structure etc. that are arranged on decoration element 310, to realize the function of Signal transmissions and touch-control sensing.The present embodiment is sequentially produced on mother substrate 100 for decoration element 310 and cell 320 to be described, but the present invention is not as limit.In other examples, after the cell 320 (such as capacitive touch control element) that can complete on mother substrate 100, just decoration element 310 is set on cell 320.Even, in one embodiment, can complete cell 320 (such as capacitive touch control element) and just arrange decoration element 310 on cell 320 after mother substrate 100 is cut into multiple cell substrate on mother substrate 100.Under such embodiment, decoration element 310 can first make on a film, is then covered in above cell 320 by the film being formed with decoration element 310 by an adhesive coating.In other words, in such alternate embodiment, namely mother substrate 100 can form the face equipment 2 as shown in Figure 10 (partial cutaway schematic of the face equipment that Figure 10 is another embodiment of the present invention) after cutting into multiple cell substrate 120, and face equipment 2 is essentially a contact panel.Further, face equipment 2 can not have decoration element but be directly configured on cell substrate 120 by cell 320 and form.
Figure 11 to Figure 13 is depicted as the partial cutaway schematic of the face equipment of other embodiments of the invention, please also refer to Figure 11, face equipment 3, haply similar in appearance to face equipment 1, can be only cell substrate 120 to be described, but face equipment 3 also includes solid gum 600 herein.That is; when making face equipment 3; after having carried out step 10 described by Fig. 1 to step 50, be also solidified into solid gum 600 with the force providing sidewall more than 122 ' one deck and protect antagonism external as impact etc. at upper coating one glue-line of sidewall 122 '.This solid gum 600 can adopt photo-curable resin, thermoset resin or other can be produced on material on sidewall 122 '.Such as adopt the photo-curable resin irradiating UV light Post RDBMS in the present embodiment.In addition, cover decorative layer 400 outward to be just produced on cell substrate 120 after solid gum 600 completes.Therefore, covering decorative layer 400 outward may cover solid gum 600 partly, increases the tack of solid gum 600 and sidewall 122 ' further.Finally, edging can be carried out to this solid gum 600 more moulding, make the profile of solid gum meet design requirement, as shown in Figure 12 or Figure 13.
In fig. 12, the composition component of face equipment 4 is approximately identical to face equipment 3, but when carrying out the cutting of step 40, the further oppose side wall 122 of face equipment 4 carries out lead angle step and has C type lead angle to make the profile of sidewall 122A.In addition, in fig. 13, the composition component of face equipment 5 is approximately identical to face equipment 3, but when carrying out the cutting of step 40, the further oppose side wall 122 of face equipment 3 carries out lead angle step and has R angle to make the profile of sidewall 122B.
In another embodiment, the manufacture method of face equipment can following steps.Figure 14 is the Making programme figure of the face equipment of another embodiment of the present invention, please refer to Figure 14, step 60, and mother substrate is formed multiple shrinkage pool; Step 70, cuts into multiple cell substrate by mother substrate; Step 80, carries out intensive treatment; And step 90, forming element unit on cell substrate.In this embodiment, after carrying out intensive treatment, just carry out the formation of cell, therefore intensive treatment can comprise ion strengthening step make dimpled surface can be formed with ion strengthening layer.Ion strengthening the carrying out of step and the description of ion strengthening layer with reference to foregoing teachings, and separately can not repeat.In the present embodiment, between step 60 and step 70, after namely shrinkage pool is formed and mother substrate not yet cut before, additionally can carry out a pre-intensive treatment, wherein intensive treatment can comprise etching step the roughness of dimpled surface to be reduced in advance.In addition, in the present embodiment, cell substrate just makes cell after cutting forming, so the border of cell can trim the border in cell substrate, and can not have the clear area 124 shown in Fig. 6.
In sum, the manufacture method of the overlay of the embodiment of the present invention is after having made shrinkage pool, just carried out the strengthening of substrate and the step of other elements making.Therefore, although overlay or contact panel are formed with shrinkage pool, dimpled surface had been reinforced and had had ion strengthening layer and the concentrated phenomenon of stress is less likely to occur.That is, overlay or contact panel can have desirable physical strength.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (33)
1. a manufacture method for overlay, is characterized in that, comprising:
A mother substrate is formed multiple shrinkage pool and corresponding multiple dimpled surface;
One first intensive treatment is carried out to the dimpled surface of those shrinkage pools, is formed with an ion strengthening layer to make those dimpled surface;
Multiple cellular zones of this mother substrate form multiple cell; And
Corresponding to those cellular zones, this mother substrate is cut into multiple cell substrate, respectively this cell substrate is configured with a cell and there is a sidewall, and respectively this shrinkage pool is positioned at a wherein cell substrate, wherein one first strengthening ion concentration of this ion strengthening layer of those dimpled surface is greater than one second strengthening ion concentration of this sidewall.
2. the manufacture method of overlay according to claim 1, is characterized in that, this first intensive treatment carries out an etching step with an etching solution before being also included in and forming this ion strengthening layer, is formed with an etched surfaces to make respectively this dimpled surface.
3. the manufacture method of overlay according to claim 2, is characterized in that, this first intensive treatment carries out a grinding and polishing step after being also included in this etching step, and the surfaceness of this etched surfaces of respectively this shrinkage pool is reduced.
4. the manufacture method of overlay according to claim 3, it is characterized in that, this etching step makes the surface of this mother substrate form another etched surfaces, this grinding and polishing step comprises carries out grinding and polishing to this another etched surfaces of this mother substrate, reduces to make the surfaceness of this another etched surfaces of this mother substrate.
5. the manufacture method of overlay according to claim 1, is characterized in that, this first intensive treatment carries out a grinding and polishing step to those dimpled surface before being also included in and forming this ion strengthening layer, reduces to make the surfaceness of respectively this dimpled surface.
6. the manufacture method of overlay according to claim 1, is characterized in that, is also included in after this mother substrate is cut into those cell substrates, carries out one second intensive treatment to each this cell substrate.
7. the manufacture method of overlay according to claim 6, is characterized in that, this second intensive treatment comprises carries out an etching step with an etching solution, is formed with an etched surfaces to make this sidewall of respectively this cell substrate.
8. the manufacture method of overlay according to claim 7, is characterized in that, after this second intensive treatment is also included in this etching step, this sidewall of each this cell substrate forms a solid gum.
9. the manufacture method of overlay according to claim 8, is characterized in that, this second intensive treatment also comprises that to carry out edging to this solid gum moulding.
10. the manufacture method of overlay according to claim 6, is characterized in that, this second intensive treatment comprises carries out a grinding and polishing step, and the surfaceness of this sidewall is reduced.
The manufacture method of 11. overlays according to claim 1, is characterized in that, the method forming those cells comprises application step, deposition step, print steps, lithography step or above-mentioned combination.
The manufacture method of 12. overlays according to claim 1, is characterized in that, after this mother substrate is cut into those cell substrates, also comprises and carries out a lead angle step, makes the profile of this sidewall have C type lead angle or R angle.
The manufacture method of 13. overlays according to claim 12, is characterized in that, covers decorative layer outside the surrounding's formation one being also included in respectively this cell substrate, and this covers the local that decorative layer covers this sidewall outward.
The manufacture method of 14. overlays according to claim 1, is characterized in that, be also included in and respectively this cell substrate form a functional membrane, and this functional membrane and this cell is positioned at the relative both sides of this cell substrate.
The manufacture method of 15. overlays according to claim 1, is characterized in that, also comprises formation one decoration element at each this cell.
The manufacture method of 16. 1 kinds of overlays, is characterized in that, comprising:
A mother substrate is formed multiple shrinkage pool and corresponding multiple dimpled surface;
Carry out an etching step with an etching solution, be formed with an etched surfaces to make respectively this dimpled surface;
One intensive treatment is carried out, to make the surface of this mother substrate and this etched surfaces are formed with an ion strengthening layer to the surface of this mother substrate and this etched surfaces;
This mother substrate is cut into multiple cell substrate, respectively this cell substrate has a sidewall, and respectively this shrinkage pool is positioned at each cell substrate; And
Carry out a lead angle step, make the profile of this sidewall have C type lead angle or R angle, wherein the strengthening ion concentration of this sidewall is less than the strengthening ion concentration of those dimpled surface.
The manufacture method of 17. overlays according to claim 16, it is characterized in that, also comprise and carry out another etching step with another etching solution, to make this sidewall of respectively this cell substrate be formed with another etched surfaces, wherein the strengthening ion concentration of this another etched surfaces is less than the strengthening ion concentration of those dimpled surface.
The manufacture method of 18. overlays according to claim 17, is characterized in that, after being also included in this another etching step, this another etched surfaces of each this cell substrate forms a solid gum, and it is moulding optionally to carry out edging to this solid gum.
The manufacture method of 19. overlays according to claim 17 or 18, is characterized in that, also comprise:
Form a decoration element at each this cell substrate; And
Each this decoration element on covering partly cover decorative layer outside one, and this covers the local that decorative layer covers this etched surfaces or the surface of this solid gum outward.
20. 1 kinds of overlays, is characterized in that, comprising:
One cell substrate, comprise a sidewall, a first surface, a second surface and at least one shrinkage pool, this sidewall is connected between this first surface and this second surface, and this side wall ring is around this first surface and this second surface, this shrinkage pool has a dimpled surface, wherein this dimpled surface is formed with an ion strengthening layer, and a strengthening ion concentration of this ion strengthening layer is greater than the strengthening ion concentration of this sidewall.
21. overlays according to claim 20, it is characterized in that, at least one of them has multiple nick face for this sidewall and this dimpled surface, and preset in unit area at one of this sidewall or this dimpled surface, those nick faces of at least 70%, respectively the size in this nick face is between 2 microns to 150 microns.
22. overlays according to claim 21, is characterized in that, respectively the size in this nick face is between 10 microns to 40 microns.
23. overlays according to claim 22, is characterized in that, also comprise a solid gum, arrange on the side wall.
24. overlays according to claim 20, is characterized in that, at least one of them has a polished surface for this sidewall and this dimpled surface.
25. overlays according to claim 24, is characterized in that, also comprise a solid gum, arrange on the side wall.
26. overlays according to claim 20, is characterized in that, the profile of this sidewall has C type lead angle or R angle.
27. overlays according to claim 20, it is characterized in that, also comprise a decoration element and be arranged on outside one on this decoration element and cover decorative layer, this decoration element and this outer decorative layer that covers are arranged on around this cell substrate, and this covers the part that decorative layer at least covers this decoration element and this sidewall outward.
28. overlays according to claim 27, is characterized in that, comprising:
One cell, configuration on the first surface, provides one of them kind of touch-control or Presentation Function.
29. overlays according to claim 27, is characterized in that, also comprise:
One solid gum, arrange on the side wall, the profile of this sidewall has C type lead angle or R angle, and this covers the part that decorative layer at least covers this solid gum outward.
30. overlays according to claim 20, is characterized in that, also comprise a functional membrane, configuration on the second surface, this functional membrane have antireflection, anti-soil, anti-dizzy, water-proof function at least one of them.
31. overlays according to claim 27, it is characterized in that, this decoration element correspond to this shrinkage pool and is provided with an opening, and the size of this shrinkage pool are less than or equal to the size of this opening, and wherein edge to the distance of this shrinkage pool of this opening is 0 micron to 700 microns.
32. overlays according to claim 31, is characterized in that, this decoration element is a photoresist layer, and the edge of this opening is 0 micron to 250 microns to the distance of this shrinkage pool.
33. overlays according to claim 31, is characterized in that, this decoration element is the ink stacked structure at least more than one deck, and the edge of this opening is 200 microns to 700 microns to the distance of this shrinkage pool.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103119906 | 2014-06-09 | ||
| TW103119906A TW201546005A (en) | 2014-06-09 | 2014-06-09 | Cover plate and method of fabricating the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105278712A true CN105278712A (en) | 2016-01-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420382386.2U Expired - Fee Related CN204102096U (en) | 2014-06-09 | 2014-07-11 | Covering plate |
| CN201410329521.1A Pending CN105278712A (en) | 2014-06-09 | 2014-07-11 | Covering plate and manufacturing method thereof |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420382386.2U Expired - Fee Related CN204102096U (en) | 2014-06-09 | 2014-07-11 | Covering plate |
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| TW (1) | TW201546005A (en) |
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| CN106183585A (en) * | 2016-07-15 | 2016-12-07 | 信利光电股份有限公司 | A kind of diagram text manufacture method, cover plate and electronic equipment |
| CN112047643A (en) * | 2019-06-06 | 2020-12-08 | 华为技术有限公司 | Method for strengthening glass |
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| US20110242018A1 (en) * | 2010-04-01 | 2011-10-06 | Kang Sung-Ku | Touch screen panel and fabricating method thereof |
| CN102609135A (en) * | 2011-11-23 | 2012-07-25 | 友达光电股份有限公司 | Method for manufacturing cover plate |
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- 2014-06-09 TW TW103119906A patent/TW201546005A/en unknown
- 2014-07-11 CN CN201420382386.2U patent/CN204102096U/en not_active Expired - Fee Related
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| CN102701596A (en) * | 2007-12-18 | 2012-10-03 | Hoya株式会社 | Cover glass for portable terminal, method for manufacturing cover glass for portable terminal, and portable terminal apparatus |
| US20110242018A1 (en) * | 2010-04-01 | 2011-10-06 | Kang Sung-Ku | Touch screen panel and fabricating method thereof |
| JP2013012283A (en) * | 2011-06-30 | 2013-01-17 | Konica Minolta Advanced Layers Inc | Glass substrate for hdd |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106183585A (en) * | 2016-07-15 | 2016-12-07 | 信利光电股份有限公司 | A kind of diagram text manufacture method, cover plate and electronic equipment |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN204102096U (en) | 2015-01-14 |
| TW201546005A (en) | 2015-12-16 |
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Application publication date: 20160127 |