TW201546005A - Cover plate and method of fabricating the same - Google Patents

Abstract

A method of fabricating cover plate including the following steps is provided. A plurality of concaves is formed on a mother substrate. A first strengthening treatment is performed on the concave surfaces of the concaves to form an ion strengthened layer thereon. The mother substrate is cut into a plurality of unit substrates corresponding unit area. Each concave is located within one of the unit substrates. A firs concentration of a strengthening ion in the ion strengthened layer is greater than a second concentration of the strengthening ion of the sidewall of each unit substrate.

Description

Cover plate and manufacturing method thereof

The present invention relates to a cover sheet and a method of manufacturing the same, and more particularly to a cover sheet made of a mother substrate and a method of manufacturing the same.

As technology continues to evolve, electronic devices are becoming thinner. Therefore, the glass substrate at the outermost portion of the electronic device is usually a reinforced substrate, such as a cover plate. The cover sheet sometimes needs to have a specific mechanical design, such as a recessed hole, such as a perforation or a blind hole. However, when such a recessed hole is formed on the reinforced substrate, it is likely that the mechanical strength of the cover sheet of the electronic device is weakened.

The invention provides a method for manufacturing a cover sheet, which can effectively strengthen the mechanical strength of the glass substrate.

The invention provides a cover plate with touch or display function and has ideal mechanical strength.

The method for fabricating the cover sheet of the present invention comprises the following steps. On a mother base A plurality of recessed holes and corresponding recessed hole surfaces are formed in the plate. A first strengthening treatment is performed on the surface of the recessed hole of the recessed hole so that an ion-enhancing layer is formed on the surface of the recessed hole. The mother substrate is cut into a plurality of unit substrates corresponding to the unit regions. An element unit is formed on each of the unit substrates, and each of the recessed holes is located in one of the unit substrates, wherein a first enhanced ion concentration of the ion-enhancing layer is greater than a second enhanced ion concentration of a sidewall of each unit substrate.

In the method of fabricating the cover sheet of the present invention, the first strengthening treatment may optionally include the following steps. In an ion strengthening step, a chemical ion exchange process is performed on the surface of the mother substrate or the surface of the recess to form an ion strengthening layer. An etching step is performed with an etching solution before the formation of the ion strengthening layer to form an etching surface on the surface of the recess. A polishing polishing step is performed before or after the etching step to reduce the surface roughness of the surface of the recess or to reduce the surface roughness of the etched surface. The same etching step causes the surface of the mother substrate to form another etching surface, and the polishing and polishing step may further include grinding and polishing the surface of the mother substrate to reduce the surface roughness of the etching surface of the mother substrate.

The method for fabricating the cover sheet of the present invention comprises the following steps. After the mother substrate is cut into a plurality of unit substrates, a second strengthening treatment is performed on each of the unit substrates. The second strengthening treatment includes performing an etching step with an etching solution such that an sidewall of each unit substrate is formed with an etching surface. The second strengthening treatment may also include performing a polishing step to reduce the surface roughness of the sidewall sidewalls.

The method for fabricating the cover sheet of the present invention comprises the following steps. Forming a plurality of component units on a plurality of unit regions of the mother substrate, the method comprising a coating step and a deposition step The step of printing, the step of lithography etching, or a combination of the above, wherein the component unit can be a touch element, a display element, or an integrated component of both. And after selectively performing the etching step, a solid glue is formed on the sidewall of each unit substrate, and the solid glue is grind and shape the solid glue to make the outline of the solid glue Meet the design needs.

The method for fabricating the cover sheet of the present invention comprises the following steps. After the mother substrate is cut into a plurality of unit substrates, a step of conducting a corner is further performed so that the contour of the side wall of each unit substrate has a C-shaped or R-angle.

The method for fabricating the cover sheet of the present invention comprises the following steps. A decorative element is selectively formed on each unit substrate, and if each unit substrate is provided with an element unit, the decorative element is formed on each element unit. The decorative element may be a patterned decorative layer disposed on the unit substrate or the periphery of the component unit to shield portions of the circuit traces.

The method for fabricating the cover sheet of the present invention further comprises forming an outer cover decorative layer around each unit substrate, and the outer cover decorative layer covers a portion of the side wall.

In an embodiment of the invention, before the mother substrate is cut into the unit substrate, at least one corresponding recessed hole is formed for each of the unit substrates, and the mother substrate is subjected to a first strengthening treatment. The first strengthening treatment further includes performing an etching step to contact an etching liquid (for example, a hydrofluoric acid-containing solution) on the surface of the mother substrate and the surface of the concave hole, and then performing an ion strengthening step to be concave on the surface of the mother substrate. An ion strengthening layer is formed on the surface of the pores. After the mother substrate is cut into the unit substrate, a second strengthening treatment is performed on each of the unit substrates. The second strengthening treatment includes an etching step to make an etching solution (for example) For example, a solution containing a hydrofluoric acid contacts the sidewall of the unit substrate. The second strengthening treatment includes selectively performing a polishing polishing step before or after the etching step to reduce the surface roughness of the sidewall. The first strengthening treatment further includes selectively performing a polishing step on the surface of the recess before or after the etching step.

In an embodiment of the invention, a solid glue is further disposed on the sidewall to cover at least a portion of the sidewall.

In an embodiment of the invention, the method of forming the element unit includes a coating step, a deposition step, a printing step, a lithography etching step, or a combination thereof.

In an embodiment of the invention, after the mother substrate is cut into the unit substrate, the method further includes performing a lead angle step such that the contour of the sidewall has a C-shaped or R-angle.

In an embodiment of the invention, an outer decorative layer is formed around the unit substrate, and the outer decorative layer covers a portion of the side wall. For example, when a solid glue is disposed on a side wall of the unit substrate, the solid glue is regarded as an extension of the side wall, and the outer decorative layer covers a portion of the solid glue. Further, for example, when the side surface of the unit substrate has an etched surface but no solid glue is provided, the overcoat decorative layer covers a portion of the etched surface. Even when there is an etched surface on the side wall of the unit substrate and there is an etched surface of the solid glue covering portion, the overcoat decorative layer covers a portion of the solid glue.

In an embodiment of the invention, a functional film is formed on each unit substrate, and the functional film and the component unit are located on opposite sides of the unit substrate, and the functional film has at least anti-reflection, anti-fouling, anti-glare and waterproof functions. one of them. The functional film may be a single layer optical film layer or a multilayer optical film layer stacked, and is not limited.

In the manufacturing method of the touch panel according to the embodiment of the present invention, after the mother substrate is cut into the unit substrate, a thinning step is further performed to thin the respective unit substrates. For example, an etching step and a polishing polishing step are performed on the surface of the unit substrate.

A cover sheet of the present invention includes a unit substrate. The unit substrate includes a sidewall, a first surface, a second surface, and at least one recess. The sidewall is coupled between the first surface and the second surface, and the sidewall surrounds the first surface and the second surface. The recess has a recessed surface, wherein the surface of the recess is formed with an ion strengthening layer. The enhanced ion concentration of the ion-enhancing layer is greater than the enhanced ion concentration of the sidewall.

The cover plate of the present invention includes an element unit disposed on the first surface, wherein the component unit can provide at least one of a touch function or a display function, that is, the component unit can be a touch component or a display component. One or both of the integrated components. In addition, a decorative element can also be selectively disposed on the unit substrate or the element unit. Further, when the decorative element is disposed on the unit substrate, the decorative element may be disposed between the element unit and the unit substrate; or the element unit may be disposed on another substrate, and the substrate is further bonded to the unit substrate. The decorative element may be a patterned decorative layer disposed on the unit substrate or at least a portion of the perimeter of the component unit to shield portions of the circuit traces. The patterned decorative layer can be a photosensitive material (such as a photoresist) or an ink material. The patterned decorative layer may be a single layer of the foregoing material or a plurality of layers of the foregoing materials, and the color is not limited, and may be stacked or mixed with any of the above materials of a single color material or a plurality of colors.

In an embodiment of the invention, at least one of the side walls of the unit substrate or the surface of the recess has a plurality of micro-concave adjacent to each other. More Preferably, at least 70% of the micro-concave surface in a predetermined unit area of the side wall of the unit substrate or the surface of the recessed hole has a size of each micro-concave surface ranging from 2 micrometers (μm) to 150 micrometers (μm). For example, an irregularly shaped micro-concave surface, from the side of the micro-concave profile, from the side of the micro-concave contour to the maximum or approximate maximum value of the micro-concave contour, as long as it conforms to 2 micrometers (μm) to 150 micrometers (μm) The range can be counted. More preferably, the size of the micro-concave surface is between 10 μm and 40 μm. When the size of the micro concave surface falls within the above range, the representative meaning is that the etching depth of the etching liquid to the glass just removes most or all of the depth of the small crack caused by the cutting, without excessive etching, for example, the etching depth is controlled at 5 μm. It is a good choice between 50μm.

In an embodiment of the invention, the cover plate further comprises a solid glue disposed on the sidewall of the unit substrate, and the sidewall may further have an etched surface or a polished surface as described above.

In an embodiment of the invention, the outline of the side wall of the unit substrate has a C-shaped guide angle or an R angle. Likewise, the sidewall may now further have an etched surface or have a polished surface.

In an embodiment of the invention, the cover plate further includes an outer cover layer disposed around the unit substrate, and the outer cover layer covers a portion of the side wall. For example, the outline of the side wall of the unit substrate has a C-shaped lead angle or an R angle, and a solid glue is disposed on the side wall, and the solid glue is regarded as an extension of the side wall, so that the outer decorative layer covers the part of the solid glue. . For another example, when the outline of the side wall of the unit substrate has a C-shaped lead angle or an R angle, and has an etched surface on the side wall, the outer cover is covered with a decorative layer. The cover etches a portion of the surface. Furthermore, the side wall of the unit substrate may also have an etched surface and an etched surface of the solid glue covering portion, at which time the overlying decorative layer covers a portion of the solid glue.

In an embodiment of the invention, the cover plate further includes a functional film disposed on the second surface. The functional film may have, for example, at least one of anti-reflection, anti-fouling, anti-glare, and water-repellent functions. The functional film may be a single-layer optical film layer or a plurality of optical film layers stacked, and is not limited. For example, the functional film having an anti-reflection function may be formed by stacking a plurality of optical film layers having different refractive indexes.

Based on the above, in the cover plate of the embodiment of the present invention and the manufacturing method thereof, the surface of the concave hole of the cover plate is strengthened by forming an ion-enhancing layer, and even the etching liquid may be used to form the concave layer before forming an ion-enhancing layer. The surface of the hole is reinforced. Therefore, the cover plate produced by the manufacturing method of the embodiment of the present invention or the cover plate having the touch/display function has ideal mechanical strength.

The above described features and advantages of the invention will be apparent from the following description.

1~5‧‧‧ Panel device

10~90‧‧‧Steps

100‧‧‧ mother substrate

102, 102'‧‧‧ first surface

102A, 104A, 112A‧‧‧ ion strengthening layer

104, 104'‧‧‧ second surface

110‧‧‧ recessed hole

112, 112'‧‧‧ recessed surface

120‧‧‧unit substrate

122, 122’, 122A, 122B‧‧‧ side walls

124‧‧‧Blank area

302‧‧‧ openings

310‧‧‧Decorative components

320, 320A, 320B‧‧‧ component units

322, 324‧‧‧electrode series

400‧‧‧Overlay decorative layer

410‧‧‧ functional film

600‧‧‧Solid glue

D‧‧‧distance

D1‧‧‧ first direction

D2‧‧‧ second direction

F‧‧‧Area

G‧‧‧ micro concave

I-I', II-II', III-III', IV-IV'‧‧‧

M‧‧‧ alignment mark

S3‧‧‧ strip electrode

S4‧‧‧ rectangular electrode

S5‧‧‧ comb electrode

W1, W2‧‧‧ size

1 is a flow chart showing the manufacture of a panel device according to an embodiment of the present invention.

FIG. 2A is a schematic top view of step 10 according to an embodiment of the invention.

Fig. 2B is a schematic cross-sectional view taken along line I-I' of Fig. 2A.

3A and 3B are schematic diagrams showing the step 20 of another embodiment of the present invention.

3C is a schematic cross-sectional view of the mother substrate directly subjected to the ion strengthening step after the processing of the recessed holes.

4A is a top plan view of the mother substrate after performing step 30 according to an embodiment of the invention.

4B is a schematic cross-sectional view taken along line II-II" of FIG. 4A.

Fig. 4C is a schematic cross-sectional view taken along line III-III' of Fig. 4A.

FIG. 5A is a top plan view of the unit substrate after performing step 40 in the manufacturing method according to an embodiment of the invention. FIG.

Fig. 5B is a schematic cross-sectional view taken along line IV-IV' of Fig. 5A.

FIG. 6 is a partial cross-sectional view showing the unit substrate after performing step 50 in the manufacturing method according to the embodiment of the present invention.

Figure 7 is a partial cross-sectional view showing a panel device in accordance with an embodiment of the present invention.

8 and 9 are schematic views of various touch elements.

FIG. 10 is a partial cross-sectional view showing a panel device according to another embodiment of the present invention.

11 to 13 are partial cross-sectional views showing a panel device according to another embodiment of the present invention.

FIG. 14 is a flow chart showing the manufacture of a panel device according to another embodiment of the present invention.

The manufacturing method of this embodiment includes steps 10 to 50 shown in FIG. Step 10 is to form a plurality of recessed holes on the mother substrate, wherein the mother substrate may be a rigid substrate such as a glass substrate. For example, the material of the mother substrate may be soda glass. (soda-lime glass), boro-silicate glass, alumino-silicate glass, and the like. In addition, the formation of the recessed holes is mainly achieved by mechanical processing.

After the recess is completed on the mother substrate, the embodiment further performs step 20 to perform a first strengthening process on the mother substrate. This step not only strengthens the original surface of the mother substrate, but also strengthens the surface of the recessed hole. In this way, the device fabricated by the mother substrate can have a desired mechanical strength. The first strengthening treatment may be at least one of an etching step, a polishing and polishing step, and an ion strengthening step, and the order of the etching step and the polishing and polishing step may be interchanged. For example, the polishing step is performed after the polishing step, and usually the ion strengthening step is placed last. Next, in step 30, the desired element unit can be selectively fabricated on the strengthened mother substrate, and step 40 is performed to cut the mother substrate into a plurality of independent unit substrates corresponding to the element unit. At this time, the prototype of the panel device has been substantially completed. Thereafter, in order to further increase the mechanical strength of the panel device, step 50 may be further performed to perform a second strengthening process on the individual unit substrates. Referring to FIG. 2A, the step of step 10 is to form a plurality of recessed holes 110 on the mother substrate 100. The recessed holes 110 may be perforated, grooved, etc., and are described herein with perforations. At this time, in order to provide the reference point of the alignment in the subsequent process, at least one alignment mark M may be formed on the mother substrate 100, wherein the number, contour, size and position of the recessed hole 110 and the alignment mark N are only exemplified. It is not intended to limit the invention. As can be seen from FIG. 2B, the mother substrate 100 has a first surface 102, a second surface 104, and a recessed surface 112 defining a recess 110 after the recess 110 is formed. Since the recessed hole 110 is machined The resulting structure has a relatively rough surface of the recessed surface 112. Such a rough surface tends to cause stress concentration, and thus damage or chipping of the mother substrate 100 may occur by the recessed surface 112.

In order to improve the stress concentration that may occur with the recessed surface 112, step 20 disclosed in FIG. 1 may be performed. According to the step of FIG. 2, after the processing of the recessed holes 110 is completed, the first strengthening treatment may be at least one of performing an etching step, a polishing and polishing step, an ion strengthening step, and the like. For example, only the ion strengthening step may be performed, or the etching step may be performed first, or the ion strengthening step may be performed first, or the polishing and polishing step may be performed first, followed by the ion strengthening step, or the etching step, the polishing and polishing step, and the ion strengthening step may be sequentially performed. The selection and combination of steps are not limited in the present invention.

3A is a schematic cross-sectional view of the mother substrate 100 after the etching step of performing the first strengthening treatment, in which the first surface 102', the second surface 104' and the recessed surface 112' are partially etched after contact with the etching liquid. (Removal), etching methods such as dry etching or wet etching. For example, the dry etching medium may be, for example, a fluorine-containing gas or a plasma, and the wet etching medium may be, for example, a hydrofluoric acid (HF)-containing solution or a fluorine-containing solution, wherein the fluorine-containing solution may include sulfamic acid, Ammonium persulfate, nonionic surfactant, hydrochloric acid, acetic acid, surfactant, pure water (DI water), nitric acid, fluoride salt, fluorine compound, hydrofluoric acid, sulfuric acid At least one or more of the above components, such as phosphoric acid, are matched with each other. Thus, the surface structure of the first surface 102', the second surface 104', and the recessed surface 112' has a plurality of micro-concave surfaces G to form an etched surface. The purpose of etching the recessed surface 112' is to remove the small cracks caused by the cutting to the function of strengthening the glass surface and to improve the glass's ability to resist bending. The etching of the first surface 102' and the second surface 104' can, by the way, achieve the function of thinning the thickness of the glass. Preferably, at least 70% of the number of the micro concave surfaces G in a predetermined unit area (for example, 0.09 mm ² ) of the side wall of the unit substrate or the surface of the recessed hole is between 2 micrometers (μm) and 150 micrometers (μm). More preferably, the size of the micro-concave surface is between 10 μm and 40 μm.

Then, the first surface 102' and the second surface 104' of the mother substrate 100 after the etching process may be polished and polished to polish and polish the first surface 102' and the second surface 104', and the recessed surface 112' It can be optionally polished and polished as needed, but not limited to this. In other embodiments, the first strengthening treatment can also perform polishing and polishing directly on the surface of the recessed hole 112' without etching, and can also remove or reduce the crack caused by the cutting to the function of strengthening the surface of the glass. It can improve the ability of glass to resist bending.

Then, the mother substrate 100 after the polishing or etching treatment may be subjected to an ion strengthening step to form a cross section as shown in FIG. 3B, wherein the ions in the ion strengthening layers 102A, 104A and 112A are polished or etched. The surface diffuses into the interior of the mother substrate 100. At this time, the ions diffused into the mother substrate 100 increase the compressive stress of the recessed surface 112', thereby also increasing the strength of the recessed surface 112'.

3A and 3B show an embodiment in which the first strengthening treatment is performed together with at least two of the steps of etching, grinding polishing, and ion strengthening. But in its The ion strengthening step can also be directly performed after the processing of the recessed holes 110 of FIGS. 2A and 2B is completed in his embodiment. That is, the etching step or the polishing step of FIG. 3A is optionally omitted. 3C is a schematic cross-sectional view of the mother substrate directly subjected to the ion strengthening step after the processing of the recessed holes. In FIG. 3C, the mother substrate 100 is subjected to an ion strengthening step after the completion of the processing of the recessed holes 110, and thus the first surface 102, the second surface 104, and the recessed surface 112 are each formed with ion strengthening layers 102A, 104A, and 112A. Here, the recessed surface 112' is rougher than the recessed surface 112' of FIG. 3B, but due to the presence of the ion-enhancing layer 112A, the recessed surface 112' is not easily broken or broken, so that the mother substrate 100 has an ideal mechanical strength. .

In the ion strengthening step of the mother substrate in the embodiment of the present invention, the mother substrate 100 on which the recessed holes 110 are formed is immersed in an ion-enhanced tank in which the ion-enhancing liquid is accommodated. For example, when the material of the mother substrate 100 is the above-described soda-lime glass, the ion-enhancing liquid is, for example, a potassium nitrate solution. The potassium ions having a larger ionic radius may be diffused from the surface of the mother substrate 100 to the inside to replace a part of the sodium ions in the mother substrate 100. Therefore, the ion-enhancing layers 102A, 104A, and 112A are denser than the original material of the mother substrate 100, and can provide a high compressive stress on the glass surface, thereby effectively strengthening the mechanical strength of the glass surface.

In this context, the depth of the ion-enhancing layer refers to the average depth at which potassium ions diffuse from the surface of the glass into the interior of the glass, and the preferred definition refers to the maximum of potassium ions in these regions when a plurality of regions are divided over the entire surface of the glass. The average of the depth of diffusion. The depth of the ion-enhanced layer can generally be known by the instrument detecting the presence or absence of potassium ions. Because even under the same process, the depth of ion diffusion may vary. The situation exists, so the average of the diffusion depth will be taken as the criterion for determining the depth of the ion strengthening layer.

That is, in one embodiment, the depth of the ion-enhancing layer may be defined as the depth at which the concentration of potassium ions (K+) is measured from the glass surface toward the inside at a plurality of measurement points to obtain the corresponding concentration, and these The value obtained by taking the measured depth to obtain the average value. Usually, the potassium ion distribution is the highest in the surface layer, and then gradually decreases to zero or the background value inside the glass. Therefore, the depth measured by each measuring point is substantially the distance from the glass surface to the position where the potassium ion distribution is decremented to zero or decremented to the background value, wherein the background value refers to the potassium ion in the raw material contained in the glass manufacturing. concentration.

For example, when potassium is contained in the original composition of the glass, the concentration of potassium ions in the raw material can be defined as the background value. In other words, since the ion-enhancing layer is defined by the depth at which exchange ions (such as potassium ions) enter the glass by means of exchange/diffusion. The concentration distribution of the exchanged ions is slowly reduced from the surface of the glass substrate to the center or to the background value, so the presence or absence of the ion-enhancing layer can be known by the presence of the exchange ion detected by the instrument. In addition, the average depth referred to herein may be an average value of the depths of the ion strengthening layer at a plurality of measurement points. Preferably, the average depth is defined as the average of the maximum diffusion depth of the exchange ions in each measurement region within the glass.

In practice, the same ion-enhancement process may form a slightly different ion-enhancing layer, so the depth of the ion-enhancing layer at several different locations can be detected here and the average value can be taken. For example, five different points on the strengthened glass substrate are selected, and the diffusion depth of the potassium ions is detected by an instrument, and then the five values of the measurement are averaged, and the average value represents the whole surface ion strengthening layer. Average depth T Or d. Further, the ion exchange behavior of the potassium ion-substituted sodium ion is merely illustrative and not intended to limit the present invention, and other ion exchange behaviors capable of producing an effect of improving strength can be applied to various embodiments of the present invention. Further, the above-mentioned glass material is not particularly limited, and examples thereof include materials such as soda lime silicate glass and aluminosilicate glass.

After the mother substrate 100 completes the above-described first strengthening treatment, step 30 may be selectively performed to form the element unit on the mother substrate 100. Hereinafter, the description of the subsequent steps will be made by taking the mother substrate 100 of FIG. 3B as an example. 4A and 4B, the mother substrate 100 has a plurality of unit regions R independent of each other, and a plurality of decorative elements 310 and a plurality of element units 320 are formed in the unit regions R. The decorative element 310 and the element unit 320 are disposed, for example, on the first surface 102', and each decorative element 310 has a frame pattern. The method of decorating element 310 and component unit 320 includes a coating step, a deposition step, a printing step, a lithography etching step, or a combination thereof. The component unit 320 can provide at least one of a touch or display function, that is, the component unit 320 can be one of the touch component or the display component or an integrated component of the two. Specifically, the component unit 320 of the present embodiment is described by taking a capacitive touch element as an example, but the invention is not limited thereto. In another embodiment, the component unit 320 can be disposed on a substrate (not shown) that is then attached to a cover sheet fabricated by the method of the present invention. For example, the component unit 320 (capacitive touch element) is disposed on the color filter substrate of the liquid crystal display panel, and then attached to the cover plate fabricated by the method of the present invention; or the component unit 320 (capacitive touch element) ) is disposed on a package substrate having an excitation light diode display panel, and then attached to The cover plate made by the method of the invention; or the component unit 320 (capacitive touch element) can be disposed on a thin plastic/glass substrate (thickness less than 0.25 mm), and then attached to the cover made by the method of the invention. On the board. The above is only an example, and the invention is not limited thereto.

The decorative element 310 may be a patterned decorative layer composed of at least one layer of ink, resin or other opaque or light absorbing material, for example, disposed around each of the capacitive touch elements to shield the traces, and the central portion is transparent. The open area is as shown in Fig. 4A. . Thus, although FIG. 4B is only schematically depicted as a layer of decorative elements 310, in particular embodiments, the decorative elements 310 can be of a multi-layered construction. The patterned decorative layer can be a photosensitive material (such as a photoresist) or an ink material. The patterned decorative layer may be a single layer of the foregoing material or a plurality of layers of the foregoing materials, and the color is not limited, and may be stacked or mixed with any of the above materials of a single color material or a plurality of colors.

Further, Fig. 4C is a schematic cross-sectional view taken along line III-III' in Fig. 4A. When the component unit 320 is formed on the mother substrate 100, since the mother substrate 100 has been formed with the recessed holes 110, the decorative component 310 can be provided with a corresponding concave by the patterning process or by the aid of the printing fixture. The opening 302 of the aperture 110. Moreover, it is considered that the manufacturing tolerance is at most 350 μm, and the size W1 of the recessed hole 110 is smaller than the dimension W2 of the opening 302, wherein the distance d between the edge of the opening 302 and the recessed hole 110 may be 0 μm to 700 μm. For example, when the decorative element is a photoresist layer and a yellow lithography process is employed, the distance from the edge of the opening 302 to the recess 110 is from 0 μm to 250 μm. For example, when the decorative element is at least one layer of the ink stack structure and is printed or coated, The distance from the edge of the port 302 to the recessed hole 110 is 200 μm to 700 μm.

After the fabrication of the component unit 320 is completed, step 40 may be performed to cut the mother substrate 100 into a plurality of individual unit substrates 120 corresponding to the unit regions R. As shown in FIG. 5A and FIG. 5B, the unit substrate 120 is provided with an element unit 320 and a decorative element 310 on the first surface 102, and the unit substrate 120 has a recessed hole 110. At the same time, since the mother substrate 100 is cut into the unit substrate 120 after the component unit 320 and the decorative component 310 are completed, the sidewall 122 of the unit substrate 120 after cutting, most of the sidewall 122 has a rather rough surface without ions. Strengthen the layer. In the present embodiment, referring to FIG. 5B, the central portion of the surface of the side wall 122 is such that no ion strengthening layer exists, and the surface of the side wall 122 near the upper and lower surfaces of the unit substrate 120 may still have a slight ion strengthening layer.

Therefore, the present embodiment can proceed to the second enhancement process of step 50. Thus, as shown in Fig. 6, the side wall 122' of the unit substrate 120 will be relatively smooth, and stress concentration is less likely to occur. Wherein, in the embodiment, the second strengthening treatment comprises an etching step, a polishing polishing step or both.

When the etching step of the sidewall 122 is performed, an acid-resistant film (not shown) may be pasted on the unit substrate 120 to protect the element unit 320 and the second surface 104'. When the element unit 320 is coated between the unit substrate 120 and the acid-resistant film, an etching step is performed, wherein the etching method can be performed by dry etching or wet etching in the first strengthening treatment. At this time, the surface of the side wall 122' forms an etched surface having a plurality of micro-concave surfaces as in the enlarged area F shown in FIG. 3A described above. The size of the micro concave surface G in a predetermined unit area (for example, 0.09 mm ² ) of the side wall 122 ′ of the unit substrate 120 is from 2 μm to 150 μm, more preferably The size of the micro concave surface is between 10 μm and 40 μm, and the depth is approximately 6 μm to 12 μm. In addition, the average surface roughness of the side wall 122 before sidewall etching is about 1.0 μm to 3 μm, and the average surface roughness of the side wall 122' after etching is about 0.03 μm to 0.8 μm.

In this step, the second surface 104' of the unit substrate 120 may be attached with or without an acid-resistant film. When the second surface 104' is not attached to the acid-resistant film, the second surface 104' is also exposed to the etchant to thin the thickness of the unit substrate 120. The unit substrate 120 may be thinned from a first thickness to a second thickness, and the second thickness is no more than 0.3 mm. In addition to this, step 50 may also be a polishing and polishing step to reduce the surface roughness of the side wall 122. In other embodiments, step 50 may be performed by first performing an abrasive polishing step on sidewalls 122. Alternatively, step 50 may be performed by performing an etching step on the sidewall 122 before performing a polishing and polishing step.

Since the cutting of the mother substrate 100 is performed after the decorative component 310 and the component unit 320 are completed, the boundary of the decorative component 310 and the component unit 320 is spaced apart from the boundary of the unit substrate 120 to form a blank area 124. Therefore, as shown in FIG. 7, the present embodiment may further form an outer decorative layer 400 around the unit substrate 120 to complete the panel device 1, and the outer decorative layer 400 covers a portion of the side wall 122'. In this way, the periphery of the panel device 1 can provide the desired decorative effect by these decorative elements (decorative elements 310 and outer decorative layers 400).

Here, the upper view of the panel device 1 is as shown in FIG. 5A and the cross-sectional view is as shown in FIG. 7. As shown, a functional film 410 may be formed on the second surface 104', and the manner in which the functional film 410 is formed may be set by a coating method or a bonding method. The functional film 410 can be an anti-reflective layer, an anti-fouling layer, a waterproof layer or an anti-glare layer, etc., and can be a separately functional film layer or a stack of a plurality of functional film layers, and can provide anti-reflection, moisture resistance, and anti-reflection. Stain, anti-glare and other functions. For example, the anti-reflection layer may be a stacked layer of a plurality of layers having different refractive indices, or a composite layer of two layers of anti-fouling and anti-glare, but not limited thereto. In addition, although only one recessed hole 110 is provided in the unit substrate 120, the present invention is not limited thereto. In other embodiments, a plurality of recessed holes 110 may be disposed on a single unit substrate 120. When the panel device 1 is applied to an electronic product, the recessed hole 110 can function as an ear sound hole, a horn hole, a button hole, a component accommodating groove, or the like. In the present embodiment, since the decorative member 310 is provided, the panel device 1 can serve as a cover for the electronic device, and the decorative member 310 can be used to shield members that are not intended to be seen by the user or to form a specific pattern.

The above description of each step is for illustrative purposes only. In other embodiments, the steps of FIG. 1 may have other embodiments.

For example, referring to FIG. 4A, the plurality of element units 320 formed on the mother substrate 100 include a plurality of conductive series 322 parallel to the first direction D1 and parallel to the element unit of step 30. The plurality of conductive series 324 of the second direction D2. In the present embodiment, the conductive series 322 and the conductive series 324 are interdigitated and insulated from each other. In other embodiments, the conductive series 322 and the conductive series 324 may be replaced by elongated conductive patterns. Alternatively, component unit 320 can be fabricated from a single layer of conductive layer. For example, Figures 8 and 9 are schematic representations of various touch elements. Figure. The element unit 320A may be constituted by a plurality of strip electrodes S3 illustrated in FIG. 8, wherein the width of each strip electrode S3 gradually decreases from one end to the other end. Of course, the element unit 320B may also be composed of a plurality of rectangular electrodes S4 and comb electrodes S5 as shown in FIG. It is to be noted that the design of the various component units 320, 320A, and 320B described above is merely illustrative, and does not limit the embodiments of the touch elements 320, 320A, and 320B described in the present invention.

In addition, the component units 320, 320A, and 320B may further include a plurality of wires not directly drawn or a sensing pattern, a pad structure, and the like disposed on the decorative component 310 for signal transmission and touch sensing. Features. This embodiment is described by taking the decorative component 310 and the component unit 320 sequentially on the mother substrate 100, but the invention is not limited thereto. In other embodiments, the decorative component 310 can be disposed on the component unit 320 after the component unit 320 (eg, a capacitive touch component) is fabricated on the mother substrate 100. Even in an embodiment, the decorative element 310 may be disposed on the element unit 320 after the completed component unit 320 (eg, capacitive touch element) is fabricated on the mother substrate 100 and the mother substrate 100 is cut into a plurality of unit substrates. In such an embodiment, the decorative element 310 can be first formed on a film, and then the film on which the decorative element 310 is formed is attached over the element unit 320 by an adhesive layer. In other words, in such a modified embodiment, the mother substrate 100 is cut into a plurality of unit substrates 120 to form the panel device 2 as shown in FIG. 10, and the panel device 2 is substantially a touch panel. Further, the panel device 2 may be configured such that the component unit 320 is directly disposed on the unit substrate 120 without the decorative element.

Referring first to FIG. 11, the panel device 3 is substantially similar to the panel device 1. Here, only the unit substrate 120 will be described, but the panel device 3 further includes a solid glue 600. That is to say, in the production of the panel device 3, after performing the steps 10 to 50 described in FIG. 1, a layer of glue is applied to the side wall 122' and cured to form a solid glue 600 to provide a layer of the side wall 122'. Protect against external forces such as impact forces. The solid glue 600 may be a photocurable resin, a thermosetting resin or other material which can be formed on the side wall 122'. In the present embodiment, for example, a photocurable resin which is cured by irradiation with UV light is used. In addition, the outer cover decorative layer 400 can be fabricated on the unit substrate 120 after the solid glue 600 is completed. Therefore, the overcoat decorative layer 400 may partially cover the solid glue 600, further increasing the adhesion of the solid glue 600 to the side walls 122'. Finally, the solid glue 600 can be further shaped to make the contour of the solid glue meet the design requirements, as shown in FIG. 12 or FIG.

In Fig. 12, the constituent members of the panel device 4 are substantially the same as those of the panel device 3, but when the cutting of the step 40 is performed, the panel device 4 further performs a corner guiding step on the side wall 122 so that the contour of the side wall 122A has a C-shaped guide angle. In addition, in FIG. 13, the constituent members of the panel device 5 are substantially the same as those of the panel device 3, but when the cutting of the step 40 is performed, the panel device 3 further performs a corner guiding step on the side wall 122 so that the contour of the side wall 122B has an R angle.

In another embodiment, the method of fabricating the panel device may be as follows. Referring to FIG. 14, in step 60, a plurality of recessed holes are formed on the mother substrate; in step 70, the mother substrate is cut into a plurality of unit substrates; in step 80, a strengthening process is performed; and in step 90, the component cells are formed on the unit substrate. In this embodiment, after the strengthening process The formation of the element unit is performed, and thus the strengthening treatment may include an ion strengthening step such that the surface of the recessed hole may be formed with an ion strengthening layer. The progress of the ion strengthening step and the description of the ion strengthening layer can be referred to the foregoing without further elaboration. In this embodiment, a pre-reinforcing process may be additionally performed between step 60 and step 70, that is, after the formation of the recessed holes and before the mother substrate has been cut, wherein the pre-reinforcing process may include an etching step to expose the surface of the recessed holes. The roughness is reduced. In addition, in the present embodiment, the element unit is fabricated after the unit substrate has been cut and formed, so that the boundary of the element unit can be aligned with the boundary of the unit substrate, and the blank area 124 shown in FIG. 6 may not be present.

In summary, the manufacturing method of the cover plate of the embodiment of the present invention is the step of strengthening the substrate and manufacturing other components after the recessed holes are formed. Therefore, although the cover sheet or the touch panel is formed with a recessed hole, the surface of the recessed hole has been reinforced and has an ion-enhancing layer so that stress concentration does not easily occur. That is to say, the cover panel or the touch panel can have ideal mechanical strength.

10~50‧‧‧Steps

Claims (33)

A method for manufacturing a cover plate includes: forming a plurality of recessed holes and corresponding recessed hole surfaces on a mother substrate; performing a first strengthening treatment on the surface of the recessed holes of the recessed holes to make the recesses Forming an ion strengthening layer on the surface of the hole; forming a plurality of element units on the plurality of unit regions of the mother substrate; and cutting the mother substrate into a plurality of unit substrates corresponding to the unit regions, each of the unit substrates being disposed The component unit has a sidewall, and each of the recesses is located in one of the unit substrates, wherein a concentration of the first enhancement ion of the ion-enhancing layer on the surface of the recess is greater than a second enhancement ion concentration of the sidewall. The method for fabricating a cover sheet according to the first aspect of the invention, wherein the first strengthening treatment further comprises: performing an etching step with an etching solution before forming the ion strengthening layer, so that an etching is formed on each surface of the recessed hole; surface. The method for fabricating a cover sheet according to claim 2, wherein the first strengthening treatment further comprises performing a polishing and polishing step after the etching step to reduce surface roughness of the etched surface of each of the recessed holes . The method for fabricating a cover sheet according to claim 3, wherein the etching step forms a surface of the mother substrate to form another etching surface, and the polishing and polishing step comprises grinding and polishing the other etching surface of the mother substrate. So that the surface roughness of the other etched surface of the mother substrate is reduced. The method for fabricating a cover sheet according to claim 1, wherein the first strengthening treatment further comprises: forming the surface of the recessed holes before forming the ion-enhancing layer A polishing polishing step is performed to reduce the surface roughness of each of the recessed surfaces. The method for fabricating a cover sheet according to claim 1, further comprising performing a second strengthening treatment on each of the unit substrates after the mother substrate is cut into the unit substrates. The method of fabricating a cover sheet according to claim 6, wherein the second strengthening treatment comprises performing an etching step with an etching solution such that an sidewall of each of the unit substrates forms an etching surface. The method for fabricating a cover sheet according to claim 7, wherein the second strengthening treatment further comprises forming a solid glue on the sidewall of each of the unit substrates after the etching step. The method for fabricating a cover sheet according to claim 8, wherein the second strengthening treatment further comprises grinding and shape the solid glue. The method of fabricating a cover sheet according to claim 6, wherein the second strengthening treatment comprises performing a polishing step to reduce the surface roughness of the side wall of the side wall. The method for fabricating a cover sheet according to claim 1, wherein the method of forming the element units comprises a coating step, a deposition step, a printing step, a photolithography etching step, or a combination thereof. The method for manufacturing a cover sheet according to the first aspect of the invention, wherein the cutting of the mother substrate into the unit substrates further comprises performing a lead angle step such that the contour of the side wall has a C-shaped guide angle or R angle. The method for fabricating a cover sheet according to claim 12, further comprising forming an outer decorative layer around each of the unit substrates, and the outer decorative layer covers a portion of the side wall. The method for fabricating a cover sheet according to claim 1, further comprising forming a functional film on each of the unit substrates, and the functional film and the element unit are located on opposite sides of the unit substrate. The method for fabricating a cover sheet according to claim 1, further comprising forming a decorative component for each of the component units. A method for fabricating a cover plate includes: forming a plurality of recessed holes and corresponding recessed hole surfaces on a mother substrate; performing an etching step with an etchant to form an etched surface on each of the recessed holes; Performing a strengthening treatment on the surface of the mother substrate and the etching surface to form an ion strengthening layer on the surface of the mother substrate and the etching surface; and cutting the mother substrate into a plurality of unit substrates, each of the unit substrates having a sidewall, each of the recesses being located in each of the unit substrates; and performing a lead angle step such that the sidewall has a C-shaped lead angle or an R-angle, wherein the sidewall has a strengthened ion concentration smaller than the recessed surface Enhanced ion concentration. The method for fabricating a cover sheet according to claim 16, further comprising performing another etching step with another etching solution such that the sidewall of each of the unit substrates is formed with another etching surface, wherein the other The enhanced ion concentration of the etched surface is less than the enhanced ion concentration of the surface of the recessed holes. The method for fabricating a cover sheet according to claim 17, further comprising forming a solid glue on the other etched surface of each of the unit substrates after the another etching step, and selectively The solid glue is edging and shaping. The method for manufacturing a cover sheet according to claim 17 or 18, further comprising: forming a decorative element on each of the unit substrates; and partially covering each of the decorative elements with an outer decorative layer, and The overlying decorative layer covers the etched surface or a portion of the surface of the solid glue. A cover plate comprising: a unit substrate comprising a side wall, a first surface, a second surface and at least one recess, the side wall being connected between the first surface and the second surface, and the side wall surrounding the The first surface and the second surface have a concave surface, wherein the surface of the concave hole is formed with an ion strengthening layer, and the ion strengthening layer has a strengthening ion concentration greater than a strengthening ion concentration of the sidewall. The cover sheet of claim 20, wherein at least one of the side wall and the surface of the recess has a plurality of micro-concave, and a predetermined unit on the side wall or the surface of the recess At least 70% of the micro-concave surfaces in the area, each of the micro-concave surfaces having a size between 2 micrometers (μm) and 150 micrometers (μm). The cover sheet of claim 21, wherein each of the micro concave surfaces has a size between 10 μm and 40 μm. The cover plate as described in claim 22, further comprising a solid A glue is disposed on the side wall. The cover sheet of claim 20, wherein at least one of the side wall and the surface of the recess has a polished surface. The cover sheet of claim 24, further comprising a solid glue disposed on the side wall. The cover sheet of claim 20, wherein the side wall has a profile having a C-shaped guide angle or an R-angle. The cover sheet of claim 20, further comprising a decorative element and an outer decorative layer disposed on the decorative element, the decorative element and the outer decorative layer being disposed around the unit substrate, and The outer decorative layer covers at least the decorative element and a portion of the side wall. The cover plate of claim 27, comprising: a component unit disposed on the first surface to provide at least one of a touch function or a display function. The cover sheet of claim 27, further comprising: a solid glue disposed on the side wall, the side wall having a profile having a C-shaped guide angle or an R angle, and the outer cover decorative layer covering at least the solid The part of the glue. The cover sheet of claim 20, further comprising a functional film disposed on the second surface, the functional film having at least one of anti-reflection, anti-fouling, anti-glare and waterproof functions. The cover plate of claim 27, wherein the decorative element is provided with an opening corresponding to the recessed hole, and the size of the recessed hole is less than or equal to the dimension of the opening Inch, wherein the distance from the edge of the opening to the recess is from 0 μm to 700 μm. The cover sheet of claim 31, wherein the decorative element is a photoresist layer, and an edge of the opening has a distance from the hole to the hole of 0 μm to 250 μm. The cover sheet of claim 31, wherein the decorative element is at least one layer of the ink stack structure, and the distance from the edge of the opening to the recessed hole is from 200 μm to 700 μm.