CN105278647B - A kind of chip temperature control manages method and system - Google Patents
A kind of chip temperature control manages method and system Download PDFInfo
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- CN105278647B CN105278647B CN201510682959.2A CN201510682959A CN105278647B CN 105278647 B CN105278647 B CN 105278647B CN 201510682959 A CN201510682959 A CN 201510682959A CN 105278647 B CN105278647 B CN 105278647B
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Abstract
The present invention provides a kind of chip temperature control management system, a built-in warm frequency test cell in the system, reading system loading conditions, when decision-making system is under idle state, the continuous frequency that voltage to frequency administrative unit is required to improve central processing unit, and from temperature sensor real-time sampling temperature, that targetedly establishes frequency and the correspondence of temperature compares table.The temperature frequency test cell is only run once, and the frequency of generation is stored in the table that compares of vs. temperature in disk.After subsequent frequencies voltage management unit obtains temperature value, correspondence is read from disk, voltage to frequency administrative unit to be instructed to carry out frequency reducing.So as to increase the stability of temperature control mechanism and flexibility, good productivity effect is obtained.
Description
Technical field
The present invention relates to chip controls technical field more particularly to a kind of chip temperature control management method and system.
Background technology
Lead to wafer damage to solve the problem of that prolonged periods are operated under high-frequency high-voltage running environment, it is embedded
Formula movement device chip all carries temperature control mechanism.As shown in Figure 1, existing technology is exactly for chip for the processing of temperature control mechanism
The corresponding threshold value of preset temperature and frequency, that is to say, that when the temperature of central processing unit is more than certain threshold value, voltage to frequency management
Unit will reduce the frequency that chip is run, according to preset scheme to reach adjusting temperature.So it there is here
One problem, there is the factors such as the deviation of technique with a batch of chip, fever when causing them to work under identical frequency
Amount is different, then above-mentioned threshold value can not just be unified.So the prior art corresponds to temperature threshold for compatibility and stability
Set of frequency it is very low, then, can causing property loss of energy for the preferable chip of technique.It especially also needs to consider phase same core
Piece is in the machine of different complete machine version types, even since the difference of complete machine thermal diffusivity leads to same chips in different complete machines
In heat dispersal situations it is also different.
A kind of " electronic device and the cooling control method for the device " is disclosed in the prior art, sees Publication No.：
CN103163997A, publication date are：The Chinese patent of 2013-06-19, the electronic device, including an ontology, a chip, a control
Device processed, one first OPTICAL SENSORS and a display panel.Ontology has a first surface and a second surface.Chip is set with controller
It is placed in ontology.First OPTICAL SENSORS is set on first surface, and display panel is set on second surface.First OPTICAL SENSORS
An extraneous light signal is collected, when extraneous light signal is less than a setting value, controller compares knot according to the extraneous light signal
Fruit reduces the working frequency of chip to reduce the calorific value of electronic device.Although the invention is also the work frequency by reducing chip
Rate is that extraneous light signal comparison result is judged used by the invention to reduce the calorific value of electronic device, and
The invention can not achieve for different chips, different complete machine dynamic adjustment temperature control administrative mechanisms.
Invention content
One of the technical problem to be solved in the present invention is to provide a kind of chip temperature control management system, can be directed to difference
Chip, different complete machine dynamic adjustment temperature control administrative mechanisms, high-frequency high-voltage running environment is operated in so as to solve prolonged periods
Under, the problem of leading to wafer damage.
What one of problem of the present invention was realized in：A kind of chip temperature control manages system, including warm frequency test cell, frequency
Voltage management unit, central processing unit and temperature sensor；The temperature frequency test cell, voltage to frequency administrative unit, center
Processor, temperature sensor are sequentially connected,
The temperature frequency test cell is run at different frequencies by central processing unit, and is read respectively using temperature sensor
The temperature of central processing unit under a frequency, generation current chip and the central processing unit running frequency under plate grade environment and temperature number
The control table of value；
Voltage to frequency administrative unit improves the running frequency of central processing unit, and from described right after chip normal operation
According to the temperature inquired in table corresponding to the frequency that central processing unit is run at this time under the chip and plate grade environment, while judge temperature
Whether the temperature value that degree sensor obtains at this time is more than to inquire the temperature obtained in control table, is then to control central processing unit
The frequency of next gear is selected to be run, it is no, then without operation.
Further, the plate grade environment is formed by three elements, and three elements are：The corresponding circuit board of chip, chip
The outer casing mold of temperature and chip during operation；The temperature of the chip operation is to be acquired acquisition, core by sensor
The corresponding circuit board of piece and outer casing mold are had determined that after chip is formed.
Further, after the temperature frequency test cell operation, it whether there is central processing unit running frequency in reading disk
Table is compareed with temperature value, is then to be directly entered chip normal operating condition, voltage to frequency administrative unit brings into operation；
No, then the temperature frequency test cell is run by central processing unit at different frequencies, to obtain control table.
The second technical problem to be solved by the present invention is to provide a kind of chip temperature control management method, can be directed to different
Chip, different complete machine dynamic adjustment temperature control administrative mechanisms, high-frequency high-voltage running environment is operated in so as to solve prolonged periods
Under, the problem of leading to wafer damage.
What the two of problem of the present invention were realized in：A kind of chip temperature control management method, the method need to provide a Wen Pin
Test cell, a voltage to frequency administrative unit, a central processing unit and a temperature sensor；
The method is specially：
The temperature frequency test cell is run at different frequencies by central processing unit, and is read respectively using temperature sensor
The temperature of central processing unit under a frequency；
The temperature frequency test cell generation current chip and the central processing unit running frequency under plate grade environment and temperature number
The control table of value；
Voltage to frequency administrative unit improves the running frequency of central processing unit after chip normal operation；
Voltage to frequency administrative unit is inquired central processing unit under the chip and plate grade environment and is run at this time from control table
Frequency corresponding to temperature, judge temperature value that temperature sensor obtains at this time whether be more than in control table inquiry obtain
Temperature is that the frequency that central processing unit is then controlled to select next gear is run, no, then without operation.
Further, the judgement of the plate grade environment is specially：The plate grade environment is formed by three elements, three elements
For：The outer casing mold of temperature and chip when the corresponding circuit board of chip, chip operation；The temperature of the chip operation is logical
It crosses sensor and is acquired acquisition, the corresponding circuit board of chip and outer casing mold are had determined that after chip is formed.
Further, the temperature frequency test cell is run at different frequencies by central processing unit, and is passed using temperature
Sensor reads the temperature of central processing unit under each frequency, further includes before：After the temperature frequency test cell operation, reading disk
In with the presence or absence of central processing unit running frequency and temperature value compare table, be then to be directly entered " the voltage to frequency pipe
Unit is managed, the running frequency of central processing unit is improved after chip normal operation " the step of；It is no, then enter " the temperature frequency test
Unit is run at different frequencies by central processing unit, and reads central processing unit under each frequency using temperature sensor
Temperature, " the step of.
The invention has the advantages that：A built-in warm frequency test cell, is reading system load shape in the system of the present invention
Condition when decision-making system is under idle state, constantly requires voltage to frequency administrative unit to improve the frequency of central processing unit, and
From temperature sensor real-time sampling temperature, that targetedly establishes frequency and the correspondence of temperature compares table.Temperature frequency is surveyed
Examination unit is only run once, and the frequency of generation is stored in the table that compares of vs. temperature in disk.Subsequent frequencies voltage
After administrative unit obtains temperature value, correspondence is read from disk, voltage to frequency administrative unit to be instructed to carry out frequency reducing.From
And stability and the flexibility of temperature control mechanism are increased, obtain good productivity effect.
Description of the drawings
Fig. 1 manages structure diagram for the temperature control of prior art chip.
Fig. 2 is the structure diagram of management system of the present invention.
Fig. 3 is the flow diagram of the method for the present invention.
Specific embodiment
It please refers to shown in Fig. 2, a kind of chip temperature control of the invention management system, including warm frequency test cell 20, frequency electricity
Press administrative unit 21, central processing unit 22 and temperature sensor 23；The temperature frequency test cell 20, voltage to frequency administrative unit
21st, central processing unit 22, temperature sensor 23 are sequentially connected,
The temperature frequency test cell 20 allows central processing unit 22 to run at different frequencies, and utilizes temperature sensor 23
Read the temperature (numerical value after stablizing) of central processing unit 22 under each frequency, generation current chip and the center under plate grade environment
22 running frequency of processor compares table with temperature value；It is to enter standby mould when warm frequency test cell 20 reads system mode
Formula then shows to start adaptive testing at this time.
Voltage to frequency administrative unit 21 improves the running frequency of central processing unit 22, and from institute after chip normal operation
It states in control table and inquires the temperature corresponding to the frequency that central processing unit 22 is run at this time under the chip and plate grade environment, simultaneously
Judge whether the temperature value that temperature sensor 23 obtains at this time is more than to inquire the temperature obtained in control table, is, then in controlling
Central processor 22 select the frequency of next gear run (this avoid improve 22 frequency to A of central processing unit after again horse
On B is reduced to by temperature control), it is no, then without operation.
In the present invention, the plate grade environment is formed by three elements, and three elements are：The corresponding circuit board of chip, core
The outer casing mold of temperature and chip when piece is run；The temperature of the chip operation is to be acquired acquisition by sensor,
The corresponding circuit board of chip and outer casing mold are had determined that after chip is formed.The outer casing mold influences the thermal diffusivity of chip.
After the temperature frequency test cell 20 is run, it whether there is 22 running frequency of central processing unit and temperature in reading disk
The control table of numerical value is then to be directly entered chip normal operating condition, and voltage to frequency administrative unit 21 brings into operation；It is no, then
The temperature frequency test cell 20 allows central processing unit 22 to run at different frequencies, to obtain control table.
It please refers to described in Fig. 3, a kind of chip temperature control management method, the method need to provide a warm frequency test cell, a frequency
Rate voltage management unit, a central processing unit and a temperature sensor；
The method is specially：
Step S31, described temperature frequency test cell is run at different frequencies by central processing unit, and utilizes temperature sensing
Device reads the temperature of central processing unit under each frequency；
Step S32, described temperature frequency test cell generation current chip and the central processing unit running frequency under plate grade environment
Table is compareed with temperature value；
Step S33, voltage to frequency administrative unit improves the running frequency of central processing unit after chip normal operation；
Step S34, voltage to frequency administrative unit inquires central processing unit under the chip and plate grade environment from control table
The temperature corresponding to frequency run at this time,
Step S35, judge whether the temperature value that temperature sensor obtains at this time is more than to inquire the temperature obtained in control table
Degree is then to enter step S36, the frequency of the next gear of central processing unit selection is controlled to be run, no, then enters step
S37, without operation.
In the present invention, the plate grade environment is formed by three elements, and three elements are：The corresponding circuit board of chip, core
The outer casing mold of temperature and chip when piece is run；The temperature of the chip operation is to be acquired acquisition by sensor,
The corresponding circuit board of chip and outer casing mold are had determined that after chip is formed.
The temperature frequency test cell is run at different frequencies by central processing unit, and is read respectively using temperature sensor
The temperature of central processing unit, further includes before under a frequency：After the temperature frequency test cell operation, it whether there is in reading disk
Central processing unit running frequency compares table with temperature value, be then be directly entered " the voltage to frequency administrative unit,
The running frequency of central processing unit is improved after chip normal operation " the step of；It is no, then enter " during the temperature frequency test cell allows
Central processor is run at different frequencies, and the temperature of central processing unit under each frequency is read using temperature sensor, "
Step.
The foregoing is merely presently preferred embodiments of the present invention, all equivalent changes done according to scope of the present invention patent with
Modification should all belong to the covering scope of the present invention.
Claims (4)
1. a kind of chip temperature control manages system, it is characterised in that：Including warm frequency test cell, voltage to frequency administrative unit, center
Processor and temperature sensor；The temperature frequency test cell, voltage to frequency administrative unit, central processing unit, temperature sensor
It is sequentially connected,
The temperature frequency test cell is run at different frequencies by central processing unit, and reads each frequency using temperature sensor
The temperature of central processing unit under rate, central processing unit running frequency and temperature value under generation current chip and plate grade environment
Compare table；The plate grade environment is formed by three elements, and three elements are：When the corresponding circuit board of chip, chip operation
The outer casing mold of temperature and chip；The temperature of the chip operation is to be acquired acquisition by sensor, and chip is corresponding
Circuit board and outer casing mold are had determined that after chip is formed；
Voltage to frequency administrative unit improves the running frequency of central processing unit, and from the table of comparisons after chip normal operation
The temperature corresponding to the frequency that central processing unit is run at this time under the chip and plate grade environment is inquired in lattice, while judges that temperature passes
Whether the temperature value that sensor obtains at this time is more than to inquire the temperature obtained in control table, is then central processing unit to be controlled to select
The frequency of next gear is run, no, then without operation.
2. a kind of chip temperature control management system according to claim 1, it is characterised in that：The temperature frequency test cell operation
Afterwards, with the presence or absence of current chip and the table of comparisons of central processing unit running frequency and temperature value under plate grade environment in reading disk
Lattice are then to be directly entered chip normal operating condition, and voltage to frequency administrative unit brings into operation；No, then the temperature frequency is tested single
Member allows central processing unit operation at different frequencies, to obtain control table.
3. a kind of chip temperature control management method, it is characterised in that：The method need to provide a warm frequency test cell, a voltage to frequency
Administrative unit, a central processing unit and a temperature sensor；
The method is specially：
The temperature frequency test cell is run at different frequencies by central processing unit, and reads each frequency using temperature sensor
The temperature of central processing unit under rate；
Temperature frequency test cell generation current chip and the central processing unit running frequency under plate grade environment and temperature value
Compare table；The judgement of the plate grade environment is specially：The plate grade environment is formed by three elements, and three elements are：Chip
The outer casing mold of temperature and chip when corresponding circuit board, chip operation；The temperature of the chip operation is to pass through sensing
Device is acquired acquisition, and the corresponding circuit board of chip and outer casing mold are had determined that after chip is formed；
Voltage to frequency administrative unit improves the running frequency of central processing unit after chip normal operation；
Voltage to frequency administrative unit inquires the frequency that central processing unit is run at this time under the chip and plate grade environment from control table
Temperature corresponding to rate judges whether the temperature value that temperature sensor obtains at this time is more than to inquire the temperature obtained in control table
Degree is that the frequency that central processing unit is then controlled to select next gear is run, no, then without operation.
4. a kind of chip temperature control management method according to claim 3, it is characterised in that：During the temperature frequency test cell allows
Central processor is run at different frequencies, and the temperature of central processing unit under each frequency is read using temperature sensor, it
Before further include：After the temperature frequency test cell operation, with the presence or absence of current chip and centre under plate grade environment in reading disk
Reason device running frequency and temperature value compare table, be then be directly entered " the voltage to frequency administrative unit, in chip just
The running frequency of central processing unit is often improved after operation " the step of；It is no, then into " the temperature frequency test cell is by central processing
Device is run at different frequencies, and the temperature of central processing unit under each frequency is read using temperature sensor, " the step of.
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| CN105843363B (en) * | 2016-03-24 | 2018-05-25 | 福州瑞芯微电子股份有限公司 | A kind of chip low power consumption optimization method and device |
| CN109240880A (en) * | 2018-08-27 | 2019-01-18 | 北京比特大陆科技有限公司 | A kind of digital cash digs control method, device and the relevant device of mine machine |
| CN111752334A (en) * | 2019-03-29 | 2020-10-09 | 北京比特大陆科技有限公司 | Method, apparatus and device for increasing chip frequency, medium and program product |
| CN109870463B (en) * | 2019-04-09 | 2020-01-14 | 深圳市阿赛姆电子有限公司 | Electronic chip fault detection device |
| CN111352805A (en) * | 2020-03-24 | 2020-06-30 | 湖南国科微电子股份有限公司 | Method and device for dynamically adjusting maximum early warning temperature of chip |
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| CN201754252U (en) * | 2010-06-25 | 2011-03-02 | 德阳智科电子有限公司 | Intelligent temperature controller |
| CN103376859A (en) * | 2012-04-26 | 2013-10-30 | 华为技术有限公司 | Chip performance control method and device |
| CN104951026A (en) * | 2014-03-25 | 2015-09-30 | 联芯科技有限公司 | Automatic chip over-temperature control method and system based on embedded type temperature sensor |
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| JP3805344B2 (en) * | 2004-06-22 | 2006-08-02 | 株式会社ソニー・コンピュータエンタテインメント | Processor, information processing apparatus and processor control method |
| US8046113B2 (en) * | 2007-07-27 | 2011-10-25 | Hewlett-Packard Development Company, L.P. | System and method for cooling a heat-generating device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201754252U (en) * | 2010-06-25 | 2011-03-02 | 德阳智科电子有限公司 | Intelligent temperature controller |
| CN103376859A (en) * | 2012-04-26 | 2013-10-30 | 华为技术有限公司 | Chip performance control method and device |
| CN104951026A (en) * | 2014-03-25 | 2015-09-30 | 联芯科技有限公司 | Automatic chip over-temperature control method and system based on embedded type temperature sensor |
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Address after: 350000 building, No. 89, software Avenue, Gulou District, Fujian, Fuzhou 18, China Patentee after: Ruixin Microelectronics Co., Ltd Address before: 350000 building, No. 89, software Avenue, Gulou District, Fujian, Fuzhou 18, China Patentee before: Fuzhou Rockchips Electronics Co.,Ltd. |