CN111352805A - Method and device for dynamically adjusting maximum early warning temperature of chip - Google Patents
Method and device for dynamically adjusting maximum early warning temperature of chip Download PDFInfo
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3003—Monitoring arrangements specially adapted to the computing system or computing system component being monitored
- G06F11/3013—Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system is an embedded system, i.e. a combination of hardware and software dedicated to perform a certain function in mobile devices, printers, automotive or aircraft systems
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/32—Monitoring with visual or acoustical indication of the functioning of the machine
- G06F11/324—Display of status information
- G06F11/327—Alarm or error message display
Abstract
The invention discloses a method and a device for dynamically adjusting the maximum early warning temperature of a chip, which are used for acquiring a chip environment temperature value by using a standby state so as to obtain the maximum early warning temperature value in the current operating environment, thereby realizing the temperature control of the chip and ensuring that the performance of the chip is not lost. The method comprises the following steps: when a system where the chip is located enters a standby state, determining whether the chip is cooled; after the chip is cooled, acquiring an environmental temperature value of the chip; when the system operates again, acquiring the process angle Corner information and the working voltage information of the chip; and obtaining the highest early warning temperature value according to the Corner information, the working voltage information and the environment temperature value.
Description
Technical Field
The invention relates to the technical field of chips, in particular to a method and a device for dynamically adjusting the maximum early warning temperature of a chip.
Background
As System-on-a-Chip (SOC) becomes larger and larger, the power consumption problem is more and more severe, and the temperature inside the Chip easily reaches the process limit temperature, which may cause System breakdown and even Chip burnout.
The existing chip maximum early warning Temperature setting mode is generally set according to a Process limit Temperature, and the one-off mode still has the risk of over-Temperature failure for different Process Voltage Temperature (PVT) chips. Because the chip temperature may not be maintained or reduced by setting at the highest early warning temperature at a higher ambient temperature, a higher voltage, a larger process Corner (Corner) of leakage current such as ff, and the like, the rising trend of the chip temperature cannot be controlled at all; at a low ambient temperature, a low voltage, a small process Corner (Corner) with small leakage such as ss, and the like, the chip may have enough temperature margin at the highest early warning temperature to continue to rise and maintain a temperature controllable state, and at this time, because the chip reaches the early warning temperature value too early, the chip performs the operations of turning off, reducing the voltage and reducing the frequency, and the operation at this time causes performance loss. Therefore, the existing chip maximum early warning temperature setting mode can cause the temperature of the chip to be uncontrollable and the performance of the chip to be lost.
Disclosure of Invention
The invention aims to provide a method and a device for dynamically adjusting the highest early warning temperature of a chip, which are used for acquiring a chip environment temperature value by using a standby state so as to obtain the highest early warning temperature value in the current operating environment, thereby realizing the temperature control of the chip and ensuring that the performance of the chip is not lost.
The invention provides a method for dynamically adjusting the highest early warning temperature of a chip, which comprises the following steps:
when a system where the chip is located enters a standby state, determining whether the chip is cooled;
after the chip is cooled, acquiring an environmental temperature value of the chip;
when the system operates again, acquiring the Corner information and the working voltage information of the chip;
and obtaining the highest early warning temperature value according to the Corner information, the working voltage information and the environment temperature value.
Further, determining whether the chip is cool includes:
acquiring the standby time of a standby state;
judging whether the standby time exceeds the preset standby time or not;
if the standby time does not exceed the preset standby time, determining that the chip is not cooled;
if the standby time exceeds the preset standby time, sampling from a temperature sensor according to a preset time period to obtain a sampling value sequence, wherein the temperature sensor is used for monitoring the junction temperature of the chip in real time;
and when the numerical deviation between n continuous sampling values of the sampling value sequence is smaller than a deviation threshold value, determining that the chip is cooled, wherein n is a positive integer greater than or equal to 2.
Further, obtaining the ambient temperature information value of the chip includes:
and calculating the average value of the continuous n sampling values to obtain the temperature value of the chip, and taking the temperature value as the environmental temperature value.
Further, according to the Corner information, the working voltage information and the environmental temperature value, the highest early warning temperature value is obtained, which includes:
inquiring a preset corresponding table according to the Corner information, the working voltage information and the environmental temperature value to obtain a highest early warning temperature value;
or the like, or, alternatively,
and carrying out weight assignment calculation on the Corner information, the working voltage information and the environment temperature value to obtain the highest early warning temperature value.
Further, after obtaining the ambient temperature value of the chip, the method further includes:
storing the environmental temperature value to an early warning temperature calibration register and a flash memory;
according to the Corner information, the working voltage information and the environmental temperature value, before obtaining the highest early warning temperature value, still include:
when the system operates again, judging that the system is in standby starting or the complete machine is restarted;
if the system is in standby starting, reading an environmental temperature value stored in an early warning temperature calibration register;
and if the system is the restart of the whole machine, reading the environmental temperature value stored in the flash memory.
The second aspect of the present invention provides a device for dynamically adjusting the maximum early warning temperature of a chip, comprising:
the cooling judgment module is used for determining whether the chip is cooled or not when a system where the chip is located enters a standby state;
the first acquisition module is used for acquiring the ambient temperature value of the chip after the chip is cooled;
the second acquisition module is used for acquiring the Corner information and the working voltage information of the chip when the system operates again;
and the processing module is used for obtaining the highest early warning temperature value according to the Corner information, the working voltage information and the environment temperature value.
Further, the cooling judgment module comprises:
the timing unit is used for acquiring the standby time of the standby state;
a standby judging unit for judging whether the standby time exceeds the preset standby time;
the cooling judgment unit is used for determining that the chip is not cooled when the standby time does not exceed the preset standby time;
the sampling unit is used for sampling from the temperature sensor according to a preset time period to obtain a sampling value sequence when the standby time exceeds the preset standby time, and the temperature sensor is used for monitoring the junction temperature of the chip in real time;
and the cooling judgment unit is also used for determining the cooling of the chip when the numerical deviation between n continuous sampling values in the sampling value sequence is smaller than a deviation threshold value, wherein n is a positive integer greater than or equal to 2.
Further, in the above-mentioned case,
the first obtaining module is specifically configured to perform average value calculation on n consecutive sampling values to obtain a temperature value of the chip, and the temperature value is used as an environmental temperature value.
Further, in the above-mentioned case,
the processing module is used for inquiring a preset corresponding table to obtain the highest early warning temperature value according to the Corner information, the working voltage information and the environment temperature value;
or the like, or, alternatively,
and the processing module is used for carrying out weight assignment calculation on the Corner information, the working voltage information and the environment temperature value to obtain the highest early warning temperature value.
Further, the apparatus further comprises: a storage module and a starting module;
the storage module is used for storing the ambient temperature value to the early warning temperature calibration register and the flash memory;
the starting module is used for judging whether the system is in standby starting or the complete machine is restarted when the system operates again;
the second acquisition module is also used for reading the environmental temperature value stored by the early warning temperature calibration register if the system is in standby starting;
and the second acquisition module is also used for reading the environmental temperature value stored by the flash memory if the system is restarted for the whole machine.
Therefore, the method for dynamically adjusting the maximum early warning temperature of the chip obtains the environmental temperature value after the chip is cooled in the standby state, does not occupy the performance of actual work of the chip, and can ensure that the temperature of the chip is consistent with the environmental temperature; when the system operates again, the highest early warning temperature value is obtained by utilizing the Corner information, the working voltage information and the environmental temperature value of the chip, and the dynamic adjustment of the highest early warning temperature value is realized. Compared with the existing chip maximum early warning temperature setting mode, the temperature can be controlled under high environment temperature, high voltage and ff Corner as much as possible; no loss of performance is caused at lower ambient temperatures, lower voltages and ss corners. Therefore, the temperature of the chip is controllable, and the performance of the chip is guaranteed not to be lost.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed in the prior art and the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic flow chart illustrating an embodiment of a method for dynamically adjusting a maximum early warning temperature of a chip according to the present invention;
FIG. 2 is a schematic flow chart illustrating another embodiment of a method for dynamically adjusting the maximum early warning temperature of a chip according to the present invention;
FIG. 3 is a schematic flow chart illustrating a method for dynamically adjusting the maximum early warning temperature of a chip according to another embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an embodiment of a device for dynamically adjusting the maximum early warning temperature of a chip according to the present invention;
FIG. 5 is a schematic structural diagram of another embodiment of the apparatus for dynamically adjusting the maximum early warning temperature of a chip according to the present invention;
fig. 6 is a schematic structural diagram of another embodiment of the device for dynamically adjusting the maximum early warning temperature of the chip according to the present invention.
Detailed Description
The core of the invention is to provide a method and a device for dynamically adjusting the highest early warning temperature of a chip, which utilizes a standby state to obtain the environmental temperature value of the chip, thereby obtaining the highest early warning temperature value in the current operating environment, realizing the temperature control of the chip and ensuring that the performance of the chip is not lost. .
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention provides a method for dynamically adjusting a maximum early warning temperature of a chip, including:
101. when a system where the chip is located enters a standby state, determining whether the chip is cooled;
in this embodiment, before a system in which a chip is located enters a standby state, the system runs one or more programs or functions, and the chip needs to provide a data processing function in the running process to generate heat, so that the temperature of the chip is higher than an ambient temperature.
102. After the chip is cooled, acquiring an environmental temperature value of the chip;
in this embodiment, after the chip is cooled, since the temperature of the chip is substantially equal to the ambient temperature, the temperature value of the chip can be obtained by the temperature sensor for monitoring the temperature of the chip, and the temperature value of the chip is the ambient temperature value.
103. When the system operates again, acquiring the Corner information and the working voltage information of the chip;
in this embodiment, when the system is running again, the Corner information and the operating voltage information of the chip are obtained, the Corner information is determined by the manufacturing process variation of the chip, the Corner information is generally stored in a One Time Programmable (OTP) memory in advance in a CP or FT test stage, and the operating voltage information is the operating voltage of the current chip.
104. And obtaining the highest early warning temperature value according to the Corner information, the working voltage information and the environment temperature value.
In this embodiment, according to the Corner information, the operating voltage information, and the environmental temperature value, the highest early warning temperature value of the chip in the current operating environment can be determined, and the highest early warning temperature value is used as the highest early warning temperature of the system.
In the embodiment of the invention, the environmental temperature value is obtained after the chip is cooled in the standby state, the actual working performance of the chip is not occupied, and the consistency of the temperature of the chip and the environmental temperature can be ensured; when the system operates again, the highest early warning temperature value is obtained by utilizing the Corner information, the working voltage information and the environmental temperature value of the chip, and the dynamic adjustment of the highest early warning temperature value is realized. Compared with the existing chip maximum early warning temperature setting mode, the method can ensure that the temperature is controllable under high environment temperature, high voltage and Corner with large ff leakage as much as possible; the performance loss is not caused under the conditions of lower ambient temperature, lower voltage, small leakage current such as ss and the like. Therefore, the temperature of the chip is controllable, and the performance of the chip is guaranteed not to be lost.
In the embodiment shown in fig. 1, the detailed processes of determining the cooling of the chip, and obtaining the ambient temperature information and the maximum early warning temperature value are not described, and are specifically set forth below by the embodiment.
As shown in fig. 2, an embodiment of the present invention provides a method for dynamically adjusting a maximum early warning temperature of a chip, including:
201. when a system where a chip is located enters a standby state, acquiring standby time of the standby state;
in this embodiment, when the system enters the standby state, a timer (counter) in the Power Management Unit (PMU) starts to count time, so that the counter can obtain the standby time.
202. Judging whether the standby time exceeds the preset standby time, if so, executing step 204; if not, go to step 203;
in this embodiment, before the system in which the chip is located enters the standby state, the system runs one or more programs or functions, during operation, the chip needs to provide data processing functions to generate heat, resulting in a temperature of the chip higher than ambient temperature, although only a few circuits of the chip are in a power supply state and the CPU and other functional modules are powered off during the standby period, the leakage power consumption of the chip is small, the dynamic power consumption is also small, the heat generated by the chip basically cannot cause the chip to be higher than the ambient temperature, however, the heat generated before the standby needs time to dissipate, so the chip needs time to cool, and the standby time for cooling the chip is generally about 30 minutes, and then the preset standby time is set to 30 minutes, but the preset standby time may be other times in practical application, and is not limited. If the standby time is not longer than 30 minutes, it indicates that the chip is definitely not cooled, then step 203 is executed; when the standby time exceeds 30 minutes, if the chip is overloaded before standby, the chip may not be completely cooled, and therefore further judgment is needed, and step 204 is executed;
203. determining that the chip is not cooled;
204. sampling from a temperature sensor according to a preset time period to obtain a sampling value sequence;
in this embodiment, the temperature sensor is configured to monitor the junction temperature of the chip in real time, when the standby time of the chip exceeds a preset standby time, the temperature value of the chip may be obtained by the temperature sensor that monitors the temperature of the chip, and a sampling value sequence may be obtained by sampling from the temperature sensor according to a preset time period, where the preset time period may be 1 minute at each time interval, and then the temperature value of the chip obtained by sampling is the sampling value sequence with a period of 1 minute.
205. When the numerical deviation between n continuous sampling values of the sampling value sequence is smaller than a deviation threshold value, determining that the chip is cooled;
in this embodiment, in order to avoid incomplete cooling after the standby time of the chip exceeds the preset standby time, the cooling needs to be determined according to the sample value sequence, specifically, it may be determined that a numerical deviation between consecutive n sample values of the sample value sequence is smaller than a deviation threshold, n is a positive integer greater than or equal to 2, if n is 5 and the deviation threshold is 5%, as long as the numerical deviation between consecutive 5 sample values is smaller than 5%, it indicates that the chip has no trend of continuing cooling, and indicates that the chip is cooled.
206. Calculating the average value of the continuous n sampling values to obtain the temperature value of the chip, and taking the temperature value as an environment temperature value;
in this embodiment, after the chip is determined to be cooled, an average value of n consecutive sampling values is calculated to obtain a temperature value of the chip, and the temperature value is used as an environmental temperature value.
207. When the system operates again, acquiring the Corner information and the working voltage information of the chip;
in this embodiment, when the system is re-operated, the chip's Corner information and operating voltage information are obtained, the Corner information is determined by the manufacturing process variation of the chip, the Corner information is stored in the OTP in advance, and the operating voltage information is the current operating voltage of the chip.
208. And obtaining the highest early warning temperature value according to the Corner information, the working voltage information and the environment temperature value.
In this embodiment, after acquiring the Corner information and the operating voltage information, the highest early warning temperature value is obtained according to the Corner information, the operating voltage information, and the environmental temperature value, which may specifically be:
1. obtaining the highest early warning temperature value by inquiring a preset corresponding table;
the method comprises the steps of carrying out test training in advance, establishing a relation table of the chip for the Corner information, various working voltage information and various environmental temperature values and the highest early warning temperature value, namely, presetting a corresponding table, and determining the corresponding highest early warning temperature value according to the working voltage information, the environmental temperature value and the Corner information in the current operating environment.
2. And carrying out weight assignment calculation on the Corner information, the working voltage information and the environment temperature value to obtain the highest early warning temperature value.
And a weight calculation formula is established in advance, and when calculation is carried out, weight assignment is carried out on the Corner information, the working voltage information and the environment temperature value respectively, and then the weight calculation formula is substituted into the weight calculation formula, so that the highest early warning temperature value is obtained.
Referring to fig. 3, based on the embodiments shown in fig. 1 and fig. 2, an embodiment of the present invention provides a method for dynamically adjusting a maximum early warning temperature of a chip, including:
301. when a system where a chip is located enters a standby state, acquiring standby time of the standby state;
please refer to step 201 in the embodiment shown in fig. 2 for details.
302. Judging whether the standby time exceeds the preset standby time, if so, executing step 304; if not, go to step 303;
please refer to step 202 in the embodiment shown in fig. 2 for details.
303. Determining that the chip is not cooled;
304. sampling from a temperature sensor according to a preset time period to obtain a sampling value sequence;
refer to step 204 in the embodiment shown in FIG. 2 for details.
305. When the numerical deviation between n continuous sampling values of the sampling value sequence is smaller than a deviation threshold value, determining that the chip is cooled;
please refer to step 205 in the embodiment shown in fig. 2 for details.
306. Calculating the average value of the continuous n sampling values to obtain the temperature value of the chip, and taking the temperature value as an environment temperature value;
please refer to step 206 in the embodiment shown in fig. 2 for details.
307. Storing the environmental temperature value to an early warning temperature calibration register and a flash memory;
in this embodiment, after the ambient temperature value is obtained, in order to obtain the ambient temperature value when the subsequent system operates again, the ambient temperature value needs to be stored in the early warning temperature calibration register and the flash memory, and the early warning temperature calibration register continues in the standby state until the standby state is started, so that only the early warning temperature calibration register needs to be registered. The flash memory is used for preventing the system from being shut down after entering a standby state, and the data of the register is lost, so that the data need to be stored in the flash memory, and the environment temperature value can be obtained from the flash memory when the whole system is restarted.
308. When the system operates again, acquiring the Corner information and the working voltage information of the chip;
please refer to step 207 in the embodiment shown in fig. 2 for details.
309. Judging whether the system is in standby starting or complete machine restarting, if the system is in standby starting, executing step 310; if the system is a complete machine restart, execute step 311;
in this embodiment, with reference to the description of step 307, after the standby, the system may be restarted in a standby mode or may be restarted as a complete machine, and for different starting modes, the obtaining modes of the environmental temperature value are different. Therefore, it is necessary to determine the system restart mode first.
310. Reading an environmental temperature value stored in an early warning temperature calibration register;
in this embodiment, when the system is started in a standby mode, the ambient temperature value is directly read from the re-warning temperature calibration register.
311. Reading an environmental temperature value stored in a flash memory;
in this embodiment, when the system is restarted for the complete machine, the ambient temperature value is read from the flash memory.
312. Obtaining a highest early warning temperature value according to the Corner information, the working voltage information and the environment temperature value;
please refer to step 208 in the embodiment shown in fig. 2 for details.
313. When the chip reaches the highest early warning temperature, partial modules are turned off, and the partial modules reduce voltage, reduce working frequency and the like, so that the temperature of the chip is reduced, the temperature is controllable, and the chip is in a virtuous cycle of temperature.
According to the embodiment of the invention, the reading mode of the environmental temperature values under the condition of different restarting modes when the system operates again is added, so that the problem that the acquired environmental temperature values are lost due to shutdown of the system when the system is in standby is avoided.
In the above embodiment, a method for dynamically adjusting the maximum early warning temperature of the chip is described in detail, and a device for dynamically adjusting the maximum early warning temperature of the chip for executing the method is described below.
As shown in fig. 4, an embodiment of the present invention provides a device for dynamically adjusting a maximum early warning temperature of a chip, including:
a cooling judgment module 401, configured to determine whether a chip is cooled when a system in which the chip is located enters a standby state;
a first obtaining module 402, configured to obtain an ambient temperature value of the chip after the chip is cooled;
a second obtaining module 403, configured to obtain the information of the chip's Corner and operating voltage when the system is restarted;
and the processing module 404 is configured to obtain a highest early warning temperature value according to the Corner information, the working voltage information, and the environmental temperature value.
In the embodiment of the invention, after the cooling judgment module 401 determines that the chip in the standby state is cooled, the first acquisition module 402 acquires the ambient temperature value, so that the actual working performance of the chip is not occupied, and the consistency between the temperature of the chip and the ambient temperature can be ensured; when the system operates again, the processing module 404 obtains the highest early warning temperature value by using the chip's Corner information and operating voltage information obtained by the second obtaining module 403 and the environmental temperature value obtained by the first obtaining module 402, thereby implementing dynamic adjustment of the highest early warning temperature value. Compared with the existing chip maximum early warning temperature setting mode, the temperature can be controlled under the Corner with higher environmental temperature, higher voltage, larger electric leakage (ff) and the like as much as possible; the performance loss is not caused under the conditions of lower environmental temperature, lower voltage, small leakage current (ss) and the like and Corner. Therefore, the temperature of the chip is controllable, and the performance of the chip is guaranteed not to be lost.
Optionally, in combination with the embodiment shown in fig. 4, as shown in fig. 5, in some embodiments of the present invention, the cooling determination module 401 includes:
a timing unit 501, configured to obtain a standby time of a standby state;
a standby judging unit 502 for judging whether the standby time exceeds a preset standby time;
a cooling judgment unit 503, configured to determine that the chip is not cooled when the standby time does not exceed the preset standby time;
the sampling unit 504 is configured to obtain a sampling value sequence from a temperature sensor according to a preset time period when the standby time exceeds a preset standby time, where the temperature sensor is configured to monitor the junction temperature of the chip in real time;
the cooling determination unit 503 is further configured to determine that the chip is cooled when a numerical deviation between n consecutive sample values of the sample value sequence is smaller than a deviation threshold, where n is a positive integer greater than or equal to 2. .
In the embodiment of the present invention, when the system enters the standby state, the counter in the PMU starts to count time, so that the timing unit 501 can obtain the standby time from the counter. Before a system where a chip is located enters a standby state, the system runs one or more programs or functions, the chip needs to provide a data processing function in the running process so as to generate heat, and the temperature of the chip is higher than the ambient temperature, although only a very small part of circuits of the chip are in a power supply state during the standby period, a CPU (central processing unit) and other functional modules are powered off, the leakage power consumption of the chip is very small, the dynamic power consumption is also very small, the heat generated by the chip per se basically cannot cause the chip to be higher than the ambient temperature, but the heat generated before the standby requires time to dissipate, so the chip needs time to cool, the standby time for cooling the general chip is about 30 minutes, the preset standby time is set to be 30 minutes, and the preset standby time in practical application can be other times without limitation. When the standby judging unit 502 judges that the standby time does not exceed 30 minutes, the cooling judging unit 503 determines that the chip is certainly not cooled; when the standby time is judged to exceed 30 minutes by the standby judging unit 502, if the chip is overloaded before standby and is not cooled completely, it needs to be further determined whether the chip is cooled, the sampling unit 504 samples from the temperature sensor according to a preset time period to obtain a sampling value sequence, the temperature sensor is used for monitoring the junction temperature of the chip in real time, and when the numerical deviation between n consecutive sampling values of the sampling value sequence is smaller than a deviation threshold value, the cooling judging unit 503 determines that the chip is cooled.
Alternatively, in conjunction with the embodiment shown in fig. 5, in some embodiments of the invention,
the first obtaining module 402 is specifically configured to perform average calculation on n consecutive sampling values to obtain a temperature value of the chip, and use the temperature value as an environmental temperature value.
In the embodiment of the present invention, the temperature sensor is used to monitor the junction temperature of the chip in real time, and after it is determined that the chip is cooled, the first obtaining module 402 performs average calculation on n consecutive sampling values to obtain a temperature value of the chip, and the temperature value is used as an environmental temperature value.
Alternatively, in conjunction with the embodiment shown in fig. 5, in some embodiments of the invention,
the processing module 404 is configured to query a preset mapping table according to the Corner information, the working voltage information, and the ambient temperature value to obtain a highest early warning temperature value;
or the like, or, alternatively,
and the processing module 404 is configured to perform weight assignment calculation on the Corner information, the working voltage information, and the environmental temperature value to obtain a highest early warning temperature value.
In this embodiment of the present invention, the obtaining of the highest early warning temperature value by the processing module 404 may specifically be:
(1) obtaining the highest early warning temperature value by inquiring a preset corresponding table;
the testing training is performed in advance, a relationship table, namely a preset correspondence table, is established for the chip's Corner information, various operating voltage information, various environmental temperature values and the highest early warning temperature value, and the processing module 404 can determine the corresponding highest early warning temperature value according to the operating voltage information, the environmental temperature value and the Corner information in the current operating environment.
(2) And carrying out weight assignment calculation on the Corner information, the working voltage information and the environmental temperature value to obtain the highest early warning temperature value.
A weight calculation formula is established in advance, and when the processing module 404 performs calculation, after weight assignment is performed on the Corner information, the working voltage information and the environmental temperature value respectively, the weight calculation formula is substituted into the weight calculation formula, so that the highest early warning temperature value is obtained.
Optionally, in combination with the embodiment shown in fig. 5, as shown in fig. 6, in some embodiments of the present invention, the apparatus further includes: a storage module 601 and a starting module 602;
the storage module 601 is configured to store the ambient temperature value to the early warning temperature calibration register and the flash memory;
the starting module 602 is configured to determine that the system is in a standby state or the whole machine is restarted when the system is restarted;
the second obtaining module 603 is further configured to, if the system is in standby start, read an ambient temperature value stored in the early warning temperature calibration register;
the second obtaining module 403 is further configured to, if the system is a whole computer restart, read an environmental temperature value stored in the flash memory.
In the embodiment of the present invention, after the ambient temperature value is obtained, in order to obtain the ambient temperature value when the subsequent system operates again, the storage module 601 needs to store the ambient temperature value to the early warning temperature calibration register and the flash memory, and the early warning temperature calibration register is in the standby state and continues until the standby state is started, so that only the early warning temperature calibration register needs to be registered. The flash memory is used for preventing the system from being shut down after entering a standby state, and the data of the register is lost, so that the data need to be stored in the flash memory, and the environment temperature value can be obtained from the flash memory when the whole system is restarted. When the start module 602 determines that the system is in standby start, the second obtaining module 403 directly reads the ambient temperature value from the re-warning temperature calibration register; when the starting module 602 determines that the system is a complete machine restart, the second obtaining module 403 reads the ambient temperature value from the flash memory. The ambient temperature value reading mode under the condition of different restarting modes when the system operates again is added, so that the problem that the obtained ambient temperature value is lost due to shutdown of the system in standby is solved.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A method for dynamically adjusting the maximum early warning temperature of a chip is characterized by comprising the following steps:
when a system where a chip is located enters a standby state, determining whether the chip is cooled;
after the chip is cooled, acquiring an environmental temperature value of the chip;
when the system operates again, acquiring process angle Corner information and working voltage information of the chip;
and obtaining the highest early warning temperature value according to the Corner information, the working voltage information and the environment temperature value.
2. The method of claim 1, wherein said determining whether the chip is cold comprises:
acquiring the standby time of the standby state;
judging whether the standby time exceeds preset standby time or not;
if the standby time does not exceed the preset standby time, determining that the chip is not cooled;
if the standby time exceeds the preset standby time, sampling from a temperature sensor according to a preset time period to obtain a sampling value sequence, wherein the temperature sensor is used for monitoring the junction temperature of the chip in real time;
and when the numerical deviation between n continuous sampling values in the sampling value sequence is smaller than a deviation threshold value, determining that the chip is cooled, wherein n is a positive integer greater than or equal to 2.
3. The method of claim 2, wherein the obtaining the ambient temperature value of the chip comprises:
and calculating the average value of the continuous n sampling values to obtain the temperature value of the chip, and taking the temperature value as an environment temperature value.
4. The method of claim 1, wherein obtaining a highest early warning temperature value from the Corner information, the operating voltage information, and the ambient temperature value comprises:
inquiring a preset corresponding table according to the Corner information, the working voltage information and the environment temperature value to obtain a highest early warning temperature value;
or the like, or, alternatively,
and carrying out weight assignment calculation on the Corner information, the working voltage information and the environment temperature value to obtain the highest early warning temperature value.
5. The method according to any one of claims 1-4, wherein after obtaining the ambient temperature value of the chip, the method further comprises:
storing the environmental temperature value to an early warning temperature calibration register and a flash memory;
before obtaining the highest early warning temperature value according to the Corner information, the working voltage information and the environmental temperature value, the method further comprises the following steps:
when the system operates again, judging that the system is in standby starting or the complete machine is restarted;
if the system is in standby starting, reading the environmental temperature value stored in the early warning temperature calibration register;
and if the system is the complete machine restart, reading the environmental temperature value stored in the flash memory.
6. The utility model provides a device of the highest early warning temperature of dynamic adjustment chip which characterized in that includes:
the cooling judgment module is used for determining whether the chip is cooled or not when a system where the chip is located enters a standby state;
the first acquisition module is used for acquiring the ambient temperature value of the chip after the chip is cooled;
the second acquisition module is used for acquiring the process angle Corner information and the working voltage information of the chip when the system is restarted;
and the processing module is used for obtaining the highest early warning temperature value according to the Corner information, the working voltage information and the environment temperature value.
7. The apparatus of claim 6, wherein the cooling determination module comprises:
the timing unit is used for acquiring the standby time of the standby state;
a standby judging unit for judging whether the standby time exceeds a preset standby time;
a cooling judgment unit, configured to determine that the chip is not cooled when the standby time does not exceed the preset standby time;
the sampling unit is used for sampling from a temperature sensor according to a preset time period to obtain a sampling value sequence when the standby time exceeds the preset standby time, and the temperature sensor is used for monitoring the junction temperature of the chip in real time;
the cooling judgment unit is further configured to determine that the chip is cooled when a numerical deviation between n consecutive sampling values of the sampling value sequence is smaller than a deviation threshold value, where n is a positive integer greater than or equal to 2.
8. The apparatus of claim 7,
the first obtaining module is specifically configured to perform average value calculation on the n consecutive sampling values to obtain a temperature value of the chip, and the temperature value is used as an environmental temperature value.
9. The apparatus of claim 6,
the processing module is used for inquiring a preset corresponding table to obtain the highest early warning temperature value according to the Corner information, the working voltage information and the environment temperature value;
or the like, or, alternatively,
and the processing module is used for carrying out weight assignment calculation on the Corner information, the working voltage information and the environment temperature value to obtain the highest early warning temperature value.
10. The apparatus according to any one of claims 6-9, further comprising: a storage module and a starting module;
the storage module is used for storing the environmental temperature value to an early warning temperature calibration register and a flash memory;
the starting module is used for judging whether the system is in standby starting or the complete machine is restarted when the system operates again;
the second obtaining module is further configured to read the ambient temperature value stored in the early warning temperature calibration register if the system is in standby start;
the second obtaining module is further configured to read the ambient temperature value stored in the flash memory if the system is restarted as a complete machine.
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