CN105258087A - Heat dissipation self-acceleration efficiency improving technology - Google Patents
Heat dissipation self-acceleration efficiency improving technology Download PDFInfo
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- CN105258087A CN105258087A CN201410338511.4A CN201410338511A CN105258087A CN 105258087 A CN105258087 A CN 105258087A CN 201410338511 A CN201410338511 A CN 201410338511A CN 105258087 A CN105258087 A CN 105258087A
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Abstract
The invention discloses a heat dissipation self-acceleration efficiency improving technology and belongs to the technical field of LED lighting. The heat dissipation self-acceleration efficiency improving technology is characterized in that the shape, height and gap ratio of a radiator grid plate are set reasonably, and air circulation is formed effectively. Activated carbon or graphene particles are bonded to a metal radiator through heat conducting binders such as hydroxy acrylic resin, so that the contact interface of the radiator and air is enlarged, and a micro-channel is formed to absorb outside air to carry out exchange with inside heat. Since carbon materials are bonded to the surface of the radiator and the surface of the radiator thus becomes rough and uneven, flowing air sweeps across the surface to form turbulent flow disturbance, the heat exchange rate of the micro-channel is increased, and the interface barrier breaking dissipation capability of the heat of the radiator is improved.
Description
(1) technical field
The present invention relates to the technology that the heat radiation of a kind of Radiator in Natural Convection Heat promotes usefulness, belong to technical field of LED illumination.
(2) background technology
The equipment of Electrical and Electronic industry all affects stability and the reliability of operating mode because of heating when working, especially large-power semiconductor device, and the impact raised by temperature is more responsive, endangers larger.By effective heat dissipation technology, ensureing thermal balance stable state during devices function, is the basic condition of electrical application technology.In powerful situation, industrial with active forcing functions radiating mode, and LED illumination should not adopt because of the reason such as efficiency and reliability.
Three bottleneck difficult problems " light efficiency, heat radiation, reliability " of LED illumination application technology are all because LED illuminator thermal capacity volume is little, ability to bear is raised to temperature weak, when heat dissipation capacity is less than caloric value, gathers temperature and be elevated to a certain degree, light efficiency is declined, even damages.This is the intrinsic physical characteristic of semiconductor devices, and the basic fundamental of solution is heat radiation, and make heat-sinking capability during semiconductor light emitting body running be greater than caloric value, operating temperature rise controls the temperature range at device steady operation.
LED illumination lamp uses aluminum profile heat radiator usually, and heat is dispersed in air.How to improve the ability that heat crosses over gas-solid interface, obtaining higher radiating effect, is the problem that this patent will solve.The present invention proposes heat radiation from short Synergistic technique, improves radiating efficiency, meets the needs of LED illumination heat radiation.
(3) summary of the invention
The operation principle of semiconductor lighting, the red-hot luminescence or the gas discharge that are different from conventional lamp cause light, the temperature only tens degree that during LED work, device itself can bear, differ less with environment temperature, main by heat exchange pattern, by heat-conducting medium, heat is passed to radiator, again by radiator heat diffusion in air, radiating effect will be strengthened in the process that heat spreads in two-stage, mainly reduce the resistance to heat of heat-conducting medium and improve heat to the penetrating ability of air contact interface barrier, by the method for technology, allow the barrier at breakthrough interface of heat rapid, high volume, be dispersed in air.
The Fundamentals increasing conduct heat away ability have three:
The contact area of factor 1, increase radiator and air, namely expands the area at interface.Radiator causes grid dentation to be one of basic mode, but not enough, by spreader surface process, with the adhesive with thermal conductivity, matter material with carbon element particulate is sticked to spreader surface, and especially other materials of surface area ratio of activated carbon or Graphene are much bigger, and carbonaceous material has thermal conductivity, be equivalent to the contact interface of radiator and air to increase many, play the effect expanding interface.
Graphene thermal conductivity factor is very high, but its thin layer is attached in spreader surface securely is not but easy thing.Acrylic copolymer has good film forming, and the film formed has the performances such as good elasticity, toughness, transparency, gloss, nondiscolouring.Vigor water-based acrylic resin syrup (formal name used at school is hydroxy acid copolymer or hydroxy acrylate copolymer), its hydrophilic group can be adsorbed on solid particles surface and forms shell, make particle conductively-closed get up and can not flocculate, give dispersion with stability.Therefore, use water-soluble acrylic copolymer, can by active carbon or Graphene solid particle dispersions, be suspended in water, both played film forming agent, rise again dispersant use, adhere to securely on a heat sink after spraying.
As required, various dispersant and adhesion promoter can also be added.
Factor 2, improve the air flow condition at interface, larger air heats ascending air is produced when working for making radiator, height and the gap ratio of setting radiator screen are no more than four times, and make normal operation position, what air heats can be made naturally to increase forms circulation between screen surface, and drive the air flowing at interface, carbon granules molecule is stacking on heat spreader metals surface under the effect of adhesive, form micro channel, the air and the internal heat energy that absorb outside are changed.Spreader surface becomes coarse owing to adhering to carbonaceous material, uneven, and the air of flowing skims over the disturbance forming turbulent flow, adds short microchannel heat exchange rate, and what improve the heat breakthrough interface barrier of radiator disperses ability.
The solid at factor 3, interface and the temperature difference of gas larger, the disturbance forming turbulent flow is larger, the ability that heat breaks through interface is stronger, with the high material (aluminium, copper or hot pipe technique etc.) of capacity of heat transmission heat with the interface contacted with air that is transferred to of low thermal resistance, and the temperature difference (consider rationally arrange the shape and structure of radiator) of radiator thermal source to interface may be reduced.Improve the temperature difference of the two kinds of materials in interface, increase turbulence prediction energy, make the speed of distribute heat higher.
By the process of corresponding technology and material, realize the effect of above-mentioned three heat radiations from short factors, radiating effect can improve more than 20%.
(4) accompanying drawing explanation
Accompanying drawing is schematic diagram of the present invention.1. be light source chip module.2. be module substrate.3. be aluminum profile heat radiator base plate.4. be radiator screen.5. be heat conduction viscose glue.6. be carbonaceous material particle.
Scheme the screen thickness that Chinese and English letter b is radiator screen and base plate junction, D is the screen thickness of screen away from base plate place, and H is screen height, and L is two screen spacing.In order to reach best radiating effect, the 10 serial aluminium extrusion moldings that radiator material heat conductivility is high, screen surface is in hole strip.And meet the technical requirement of H/L >=4, B/D >=2.
Arrow in figure represents air circulation flow direction.
(5) detailed description of the invention
For 300W suspension type LED lamp.The 300W single light source module one piece of integrated Packaging Technology manufactured 1. (light efficiency is 140lm/w) is fixed on aluminum modules substrate with heat-conducting silicone grease and 2. goes up.Module substrate there is heat pipe groove is installed.Heat pipe hot junction is fixed in groove, and heat pipe cold junction stretches between aluminum profile heat radiator screen from different directions, and is fixed.The screen thickness B=2.5mm of radiator screen and base plate junction, screen is away from the screen thickness D=1mm at base plate place.Screen height H=60mm.Two screen spacing L=10mm.Radiator material 10 serial aluminium extrusion moldings, screen surface is in hole strip.Weight about 10 kilograms.Aluminum profile heat radiator is coated with the coating of carbonaceous material particulate and binding agent composition on the surface, to strengthen heat radiation.Carbonaceous material particulate is made up of active carbon and Graphene, pulverizes, be dispersed in water-borne acrylic resin slurry binder solution, spray or spread upon spreader surface and control suitable thickness through ball mill, becomes heat radiation from short synergy coating.
Obtained light fixture radiating effect is good especially, and the temperature rise of light source module substrate temperature peak is lower than 30 DEG C, thus light decay reduces, and has the very long-life.Light fixture luminous flux reaches 30,000 lm, and light utilization reaches 90%, and light argument is greater than 90 degree.Light irradiates evenly, and through actual measurement vertical range 13 meters of, illumination reaches 160lx.
Claims (4)
1. certainly urge Synergistic technique for LED illumination lamp heat radiation for one kind, its technical characteristic is reasonable set aluminum profile heat radiator screen shape, height and spacing ratio, effective formation heated air circulation, and activated carbon admixed graphite alkene particulate heat radiation synergy coating is bonded in metal heat sink surface, increase the contact interface of radiator and air, and formation microchannel, the air and the internal heat energy that absorb outside are changed, heat radiation efficiency.
2. dispel the heat the composition of synergy coating according to claim 1, and it is characterized in that adhesive is water-borne acrylic resin, formal name used at school is hydroxy acid copolymer, infiltrates grapheme material and adjuvant composition thermoconductive glue, plays adhesion, cohesion in metal surface.
3. dispel the heat the composition of synergy coating according to claim 1, it is characterized in that thermoconductive glue sticks to spreader surface activated carbon and Graphene particulate, and control suitable thickness, form the multiple rete of heat conduction, inside there is the micro channel that carbon particulate is stacking, increase the emission rate of heat.
4. an aluminum profile heat radiator according to claim 1, it is characterized in that radiator grid plate height and gap ratio, the screen thickness B of radiator screen and base plate junction, screen is away from the screen thickness D at base plate place, screen height H, two screen spacing L, meet the technical requirement of H/L >=4, B/D >=2, radiator material 10 serial aluminium extrusion moldings, screen surface is in hole strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410338511.4A CN105258087A (en) | 2014-07-16 | 2014-07-16 | Heat dissipation self-acceleration efficiency improving technology |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410338511.4A CN105258087A (en) | 2014-07-16 | 2014-07-16 | Heat dissipation self-acceleration efficiency improving technology |
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| CN105258087A true CN105258087A (en) | 2016-01-20 |
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| CN201410338511.4A Pending CN105258087A (en) | 2014-07-16 | 2014-07-16 | Heat dissipation self-acceleration efficiency improving technology |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107039575A (en) * | 2017-06-13 | 2017-08-11 | 乐山市同源科技有限公司 | A kind of method for improving LED light photoelectric transformation efficiency |
| CN114838339A (en) * | 2022-04-29 | 2022-08-02 | 佛山电器照明股份有限公司 | Heat dissipation device, design method of heat dissipation device and fish gathering lamp |
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| US20140154941A1 (en) * | 2012-12-05 | 2014-06-05 | Aruna Zhamu | Unitary graphene matrix composites containing carbon or graphite fillers |
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Patent Citations (6)
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| CN101634442A (en) * | 2008-07-22 | 2010-01-27 | 先进开发光电股份有限公司 | Passive cooling module and light emitting diode illumination device using same |
| CN103160179A (en) * | 2011-12-15 | 2013-06-19 | 财团法人工业技术研究院 | Self-assembled coating material, heat dissipating plate and method for manufacturing the same |
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| CN107039575A (en) * | 2017-06-13 | 2017-08-11 | 乐山市同源科技有限公司 | A kind of method for improving LED light photoelectric transformation efficiency |
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